CN113380938A - Ultraviolet LED packaging support without adhesion and ultraviolet LED packaging device - Google Patents
Ultraviolet LED packaging support without adhesion and ultraviolet LED packaging device Download PDFInfo
- Publication number
- CN113380938A CN113380938A CN202110802055.4A CN202110802055A CN113380938A CN 113380938 A CN113380938 A CN 113380938A CN 202110802055 A CN202110802055 A CN 202110802055A CN 113380938 A CN113380938 A CN 113380938A
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- CN
- China
- Prior art keywords
- ultraviolet led
- led packaging
- cover plate
- ceramic substrate
- glass cover
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention discloses an ultraviolet LED packaging support without adhesion, which comprises a ceramic substrate, a conductive circuit arranged on the ceramic substrate and a metal dam, and is characterized in that: the metal box dam comprises four faces, the ceramic substrate is fixed at the bottom of the metal box dam, steps and fences higher than the steps are arranged at the tops of the four faces of the metal box dam, the steps of the four faces are located on the same plane, and the fences of the two opposite faces are higher than the fences of the other two opposite faces. Also discloses an ultraviolet LED packaging device prepared by applying the bracket. According to the invention, the ultraviolet LED packaging support is improved, the glass cover plate and the ultraviolet LED packaging support can be combined without adhesive, and the glass cover plate and the ultraviolet LED packaging support are stable and durable, so that the binding force and the sealing property of the glass cover plate and the ultraviolet LED packaging support are improved; the problem that the ultraviolet LED packaging glass cover plate is easy to fall off due to long-term trouble is thoroughly solved, the reliability of the ultraviolet LED packaging structure is improved, and meanwhile, the production efficiency of the ultraviolet LED packaging device is improved.
Description
Technical Field
The invention belongs to the technical field of semiconductor lighting. And more particularly, to an ultraviolet LED package support without adhesion and an ultraviolet LED package device using the same.
Background
Ultraviolet sterilization is widely concerned because it has no residue, broad spectrum, no drug resistance and can sterilize in a short time. Ultraviolet sterilization is to use ultraviolet rays with proper wavelength (usually 200-280nm) to destroy the molecular structure of deoxyribonucleic acid (DNA) or ribonucleic acid (RNA) in the cells of the microorganism organism, so as to cause the death of growing cells and/or regenerative cells, thereby achieving the effect of sterilization and disinfection. In addition, the ultraviolet has important application value in the fields of medical treatment, printing, biochemical detection, high-density information storage, secret communication and the like.
At present, the packaging support used by the ultraviolet LED packaging device is coated with adhesive for fixing the glass substrate and the support in a sealing connection manner so as to protect the built-in ultraviolet LED chip, but the requirement on the packaging material and the packaging process is extremely high. And has the following problems: only colloid is adhered between the conventional ultraviolet LED packaging support and the glass cover plate, rigid connection is avoided, poor sealing performance is easily caused, the glass cover plate falls off, and the reliability of a product is seriously influenced. Therefore, how to further improve the sealing effect and fundamentally solve the problem that the glass substrate falls off is a technical problem to be overcome in the field.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides the ultraviolet LED packaging support without adhesion, which can realize rigid connection between the glass cover plate and the ultraviolet LED packaging support and enhance the bonding force and the sealing property between the glass cover plate and the ultraviolet LED packaging support.
The technical scheme adopted by the invention is as follows:
the utility model provides a need not sticky ultraviolet LED encapsulation support, includes ceramic substrate, sets up conducting wire, the metal box dam on ceramic substrate, the metal box dam comprises four faces, ceramic substrate fixes in the bottom of metal box dam, and in the four faces of metal box dam, each face top all is equipped with the step and exceeds the rail of step, and the step of four faces is located the coplanar, and the rail of two opposite faces is higher than the rail of two other opposite faces.
Preferably, the ceramic substrate is a planar substrate.
Preferably, the inner wall of the metal box dam is a metal layer plated with an anti-ultraviolet high-reflection material, and the included angle between the inner wall of the metal box dam and the ceramic substrate is 90-160 degrees.
The invention also discloses an ultraviolet LED packaging device which comprises the ultraviolet LED packaging support, an ultraviolet LED chip and a glass cover plate, wherein the ultraviolet LED chip is fixed on the ceramic substrate and can be fixed in an eutectic welding or gluing mode and is electrically connected with the conducting circuit on the ceramic substrate, the glass cover plate is placed on the step of the metal enclosing dam of the ultraviolet LED packaging support, the rails on the two higher surfaces of the metal enclosing dam are bent inwards, and the glass cover plate is fixed on the ultraviolet LED packaging support.
Preferably, the ultraviolet LED chip is a normal chip or a flip chip, the wavelength range is 400nm, the chip length is 5-80mil, and the width is 5-80 mil.
Preferably, the glass cover plate is a plane quartz glass, a plane sapphire, a plane lens or a lens with light condensation or light diffusion.
Preferably, the glass cover plate is placed on the sealing ring.
Preferably, the sealing ring body is made of fluorocarbon rubber, and the surface of the sealing ring body is provided with a nano zinc oxide coating.
According to the invention, an ultraviolet LED chip is connected with a conducting circuit at the bottom of a ceramic substrate in an eutectic or routing mode, a sealing ring is placed at a step at the top of an ultraviolet LED packaging support, a glass cover plate covers the surface of the sealing ring, two raised surface fences at the top of the ultraviolet LED packaging support are downwards and inwards wrapped on two sides of the upper surface of the glass cover plate in a mould pressing mode, and the glass cover plate and the ultraviolet LED packaging support are rigidly fixed.
The invention has the beneficial effects that:
the glass cover plate and the ultraviolet LED packaging support can be combined without adhesive glue, and are stable and durable, so that the binding force and the sealing property of the glass cover plate and the ultraviolet LED packaging support are improved; the problem that the ultraviolet LED packaging glass cover plate is easy to fall off due to long-term trouble is thoroughly solved, the reliability of the ultraviolet LED packaging structure is improved, and meanwhile, the ultraviolet LED packaging production efficiency is improved.
Drawings
Fig. 1 is a schematic structural diagram of an ultraviolet LED package support of the present invention.
Fig. 2 is a schematic structural diagram of the ultraviolet LED packaging device of the present invention before compression molding.
Fig. 3 is a schematic structural diagram of a finished ultraviolet LED packaging device after being molded.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Example 1
The ultraviolet LED packaging support structure is shown in a three-dimensional view in figure 1 and comprises a ceramic substrate 1, an external conducting circuit 2 arranged on the bottom surface of the ceramic substrate, and an internal conducting circuit 21 arranged on the bottom surface of the ceramic substrate, wherein the external conducting circuit 2 is electrically connected with the internal conducting circuit 21, the periphery of a metal dam 3 is thin-walled, and the bottom of the metal dam is embedded on the ceramic substrate 1.
Each side of the top of the four sides of the metal dam is provided with a step 31, the steps of the four sides are positioned on the same plane and are parallel to the bottom ceramic substrate 1, and the outside of the step 31 is provided with fences 32 and 33 higher than the steps.
The top of two opposite surface fences 32 in the four planes of the metal box dam is higher than the other two surface fences 33, and the higher parts can be used for bending. The inner wall of the metal box dam 3 is plated with aluminum copper, and the angle of the inner wall is 90 degrees.
Example 2
An ultraviolet LED packaging device prepared by applying the ultraviolet LED packaging support is shown in figure 2, and the structure of the ultraviolet LED packaging device comprises an ultraviolet LED packaging support 4, an ultraviolet LED chip 5, a sealing ring 6 and a glass cover plate 7.
The sealing ring 6 is made of fluorocarbon rubber, the surface of the sealing ring is provided with a nano zinc oxide coating, and the sealing ring 6 is square and is attached to the step of the ultraviolet LED packaging support 4.
The sealing ring 6 is placed on the step of the ultraviolet LED packaging support 4, and the glass cover plate 7 covers the sealing ring 6.
Putting the whole ultraviolet LED packaging device into a molding press, and enabling the two raised surface fences at the top of the ultraviolet LED packaging support 4 to downwards and inwards wrap the two sides of the upper surface of the glass cover plate 7 in a molding press mode, so as to rigidly fix the glass cover plate on the ultraviolet LED packaging support.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (8)
1. The utility model provides a need not sticky ultraviolet LED encapsulation support, includes ceramic substrate, sets up conducting wire, the metal box dam on ceramic substrate, its characterized in that: the metal box dam comprises four faces, the ceramic substrate is fixed at the bottom of the metal box dam, steps and fences higher than the steps are arranged at the tops of the four faces of the metal box dam, the steps of the four faces are located on the same plane, and the fences of the two opposite faces are higher than the fences of the other two opposite faces.
2. The ultraviolet LED package support structure of claim 1, wherein: the ceramic substrate is a planar substrate.
3. The ultraviolet LED package support structure of claim 1, wherein: the inner wall of the metal box dam is a metal layer plated with an anti-ultraviolet high-reflection material, and the included angle between the inner wall of the metal box dam and the ceramic substrate is 90-160 degrees.
4. An ultraviolet LED packaging device, comprising the ultraviolet LED packaging support, an ultraviolet LED chip and a glass cover plate according to any one of claims 1 to 4, wherein the ultraviolet LED chip is fixed on a ceramic substrate and is electrically connected with a conducting circuit on the ceramic substrate, the glass cover plate is placed on a step of a metal dam of the ultraviolet LED packaging support, rails on two higher surfaces of the metal dam are bent inwards, and the glass cover plate is fixed on the ultraviolet LED packaging support.
5. The ultraviolet LED package device of claim 4, wherein: the ultraviolet LED chip is a normal chip or a flip chip, the wavelength range is 400nm, the chip length is 5-80mil, and the width is 5-80 mil.
6. The ultraviolet LED package device of claim 4, wherein: the glass cover plate is made of plane quartz glass, plane sapphire, plane lens or lens with light gathering or light scattering functions.
7. The ultraviolet LED package device of claim 4, wherein: also comprises a sealing ring, the sealing ring is arranged on the step, the glass cover plate is arranged on the sealing ring,
8. the ultraviolet LED package device of claim 7, wherein: the sealing ring body is made of fluorocarbon rubber, and a nano zinc oxide coating is arranged on the surface of the sealing ring body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110802055.4A CN113380938A (en) | 2021-07-15 | 2021-07-15 | Ultraviolet LED packaging support without adhesion and ultraviolet LED packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110802055.4A CN113380938A (en) | 2021-07-15 | 2021-07-15 | Ultraviolet LED packaging support without adhesion and ultraviolet LED packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113380938A true CN113380938A (en) | 2021-09-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110802055.4A Pending CN113380938A (en) | 2021-07-15 | 2021-07-15 | Ultraviolet LED packaging support without adhesion and ultraviolet LED packaging device |
Country Status (1)
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| CN (1) | CN113380938A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115421333A (en) * | 2022-09-21 | 2022-12-02 | 豪威半导体（上海）有限责任公司 | LCOS (liquid Crystal on silicon) packaging structure and packaging method |
-
2021
- 2021-07-15 CN CN202110802055.4A patent/CN113380938A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115421333A (en) * | 2022-09-21 | 2022-12-02 | 豪威半导体（上海）有限责任公司 | LCOS (liquid Crystal on silicon) packaging structure and packaging method |
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