CN111351566B - Vibration sensor with monitoring function and vibration signal monitoring method thereof - Google Patents

Vibration sensor with monitoring function and vibration signal monitoring method thereof Download PDF

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CN111351566B
CN111351566B CN201811584600.1A CN201811584600A CN111351566B CN 111351566 B CN111351566 B CN 111351566B CN 201811584600 A CN201811584600 A CN 201811584600A CN 111351566 B CN111351566 B CN 111351566B
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CN111351566A (en
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许郁文
黄肇达
邓礼涛
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Industrial Technology Research Institute ITRI
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    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
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Abstract

A vibration sensor with monitoring function comprises a substrate, a micro-electromechanical vibration sensing chip and a special application integrated circuit chip. The micro-electromechanical vibration sensing chip is arranged on the substrate and used for sensing the vibration born by the object to be tested so as to generate a plurality of vibration signals. The application specific integrated circuit chip is arranged on the substrate and electrically connected to the micro-electromechanical vibration sensing chip, and comprises a sampling module, a conversion module and an analysis module. The sampling module receives the vibration signals, converts the vibration signals into digital signals, and filters the digital signals to generate a plurality of time domain data. The conversion module converts the time domain data into frequency domain data according to a preset quantity value. The analysis module executes a comparison program to compare the frequency domain data with a preset frequency spectrum feature table and sends out a notification signal according to a comparison result of the comparison program. The invention further provides a vibration signal monitoring method.

Description

具监测功能的振动传感器及其振动信号监测方法Vibration sensor with monitoring function and vibration signal monitoring method thereof

技术领域technical field

本发明有关于一种振动传感器,特别是一种具监测功能的振动传感器。本发明还涉及此振动传感器的振动信号监测方法。The invention relates to a vibration sensor, in particular to a vibration sensor with monitoring function. The invention also relates to a vibration signal monitoring method of the vibration sensor.

背景技术Background technique

传感器为智能机械与智能制造的重要装置。其中,振动传感器能侦测待测物的振动信号,例如工具机、马达、滚珠螺杆及进给装置等等。待测物的状态数据则可通过分析上述的振动信号获得。Sensors are important devices for smart machinery and smart manufacturing. Among them, the vibration sensor can detect the vibration signal of the object under test, such as machine tool, motor, ball screw and feeding device, etc. The state data of the object under test can be obtained by analyzing the above vibration signals.

由于振动信号需通过复杂的信号转换及信号分析,故现有的振动传感器并无法直接对获得振动信号的频域数据以进行分析。这些振动信号需要传送至振动传感器外部的监测机台,然后由监测机台内部的微控制器利用信号分析软件执行信号转换及信号分析,以获得待测物的振动状态的信息,因此极度缺乏效率。Since the vibration signal needs to undergo complicated signal conversion and signal analysis, the existing vibration sensors cannot directly analyze the frequency domain data obtained from the vibration signal. These vibration signals need to be transmitted to the monitoring machine outside the vibration sensor, and then the microcontroller inside the monitoring machine uses signal analysis software to perform signal conversion and signal analysis to obtain information about the vibration state of the object under test, so it is extremely inefficient .

此外,由于现有执行信号分析软件的监测机台体积过于庞大,因此极难与现有的振动传感器整合,不易应用于智能机械与智能制造的相关应用领域中。In addition, because the existing monitoring machines that execute signal analysis software are too bulky, it is extremely difficult to integrate with existing vibration sensors, and it is not easy to apply to related application fields of intelligent machinery and intelligent manufacturing.

为了满足不同的监测需求,待测物上可能需要安装多个振动传感器,且需要有较高的取样频率及较宽的频域监测范围,故需要传输大量的数据。因此,现有的振动传感器传送振动信号至振动传感器外部的监测机台时,容易造成数据遗失或使数据传输时间过于长久,而无法对待测物进行即时监测。In order to meet different monitoring requirements, multiple vibration sensors may need to be installed on the object under test, and a higher sampling frequency and a wider frequency domain monitoring range are required, so a large amount of data needs to be transmitted. Therefore, when the existing vibration sensor transmits the vibration signal to the monitoring machine outside the vibration sensor, it is easy to cause data loss or the data transmission time is too long, so that the real-time monitoring of the object under test cannot be performed.

发明内容Contents of the invention

本发明的目的在提供一种具监测功能的振动传感器及其振动信号监测方法,以解决现有的振动传感器及监测机台使用上缺乏效率、无法对待测物进行即时监测及无法应用于智能机械与智能制造的相关应用领域等问题。The purpose of the present invention is to provide a vibration sensor with monitoring function and its vibration signal monitoring method, to solve the lack of efficiency in the use of existing vibration sensors and monitoring machines, the inability to perform real-time monitoring of the object to be measured, and the inability to be applied to intelligent machines Issues related to the application fields of intelligent manufacturing.

本发明提出一种具监测功能的振动传感器,其包含基板、微机电振动感测芯片及特殊应用集成电路芯片。微机电振动感测芯片设置基板上,并用于侦测待测物所承受的振动以产生多个振动信号。特殊应用集成电路芯片设置基板上,且电性连接至微机电振动感测芯片,其包含取样模块、转换模块及分析模块。取样模块包含模拟前端单元、模拟数字转换单元及滤波单元。模拟前端单元接收该些振动信号。模拟数字转换单元将该些振动信号转换为多个数字信号。滤波单元对该些数字信号进行滤波以产生多个时域数据。转换模块包含转换单元及时间区间单元。时间区间单元传送预先设定的数量值至转换单元。转换单元将该些时域数据转换为一频域数据且该些时域数据的数量值等于预先设定的数量值。分析模块执行比对程序用以将频域数据与预设频谱特征表比对,并根据比对程序的比对结果发出通知信号。The invention proposes a vibration sensor with monitoring function, which includes a substrate, a micro-electromechanical vibration sensing chip and a special application integrated circuit chip. The microelectromechanical vibration sensing chip is arranged on the substrate, and is used to detect the vibration suffered by the object under test to generate multiple vibration signals. The application-specific integrated circuit chip is arranged on the substrate and electrically connected to the micro-electromechanical vibration sensing chip, which includes a sampling module, a conversion module and an analysis module. The sampling module includes an analog front-end unit, an analog-to-digital conversion unit and a filtering unit. The analog front-end unit receives the vibration signals. The analog-to-digital conversion unit converts these vibration signals into a plurality of digital signals. The filtering unit filters the digital signals to generate time-domain data. The conversion module includes a conversion unit and a time interval unit. The time interval unit transmits a preset quantity value to the conversion unit. The conversion unit converts the time-domain data into frequency-domain data, and the quantity of the time-domain data is equal to a preset quantity. The analysis module executes a comparison program to compare the frequency domain data with the preset spectrum characteristic table, and sends a notification signal according to the comparison result of the comparison program.

本发明提出另一种振动信号监测方法,其包含下列步骤:侦测待测物所承受的振动以产生多个振动信号;接收该些振动信号,并将该些振动信号转换为多个数字信号;对该些数字信号进行滤波以产生多个时域数据;将该些时域数据转换为一频域数据,该些时域数据的数量值等于该预先设定的数量值;以及执行比对程序将频域数据与预设频谱特征表比对,并根据比对程序的比对结果发出通知信号。The present invention proposes another vibration signal monitoring method, which includes the following steps: detecting the vibration of the object to be tested to generate multiple vibration signals; receiving these vibration signals, and converting these vibration signals into multiple digital signals ; Filtering the digital signals to generate a plurality of time-domain data; converting the time-domain data into a frequency-domain data, the quantity value of the time-domain data is equal to the preset quantity value; and performing comparison The program compares the frequency domain data with the preset spectrum characteristic table, and sends a notification signal according to the comparison result of the comparison program.

承上所述,依本发明的实施例的具监测功能的振动传感器及其振动信号监测方法,其可提供下述技术效果:Based on the above, according to the vibration sensor with monitoring function and the vibration signal monitoring method thereof according to the embodiment of the present invention, it can provide the following technical effects:

(1)本发明的一实施例中,具监测功能的振动传感器的特殊应用集成电路芯片能对振动信号的频域数据以进行分析,因此可减少分析时间,使即时监测的效率能提升。(1) In an embodiment of the present invention, the ASIC chip of the vibration sensor with monitoring function can analyze the frequency domain data of the vibration signal, so the analysis time can be reduced and the efficiency of real-time monitoring can be improved.

(2)本发明的一实施例中,具监测功能的振动传感器的特殊应用集成电路芯片不需要将振动信号传送至振动传感器外部的监测机台即可对振动信号的频域数据以进行分析,故不会导致数据遗失且能缩短数据传输时间。(2) In one embodiment of the present invention, the ASIC chip of the vibration sensor with monitoring function can analyze the frequency domain data of the vibration signal without transmitting the vibration signal to the monitoring machine outside the vibration sensor, Therefore, data loss will not be caused and data transmission time can be shortened.

(3)本发明的一实施例中,具监测功能的振动传感器的特殊应用集成电路芯片的转换模块具有特殊的电路结构及运作机制,故特殊应用集成电路芯片的取样模块不需要进行二次取样,使振动传感器能达到提高的效率。(3) In one embodiment of the present invention, the conversion module of the special application integrated circuit chip of the vibration sensor with monitoring function has a special circuit structure and operation mechanism, so the sampling module of the special application integrated circuit chip does not need to perform secondary sampling , so that the vibration sensor can achieve improved efficiency.

(4)本发明的一实施例中,具监测功能的振动传感器的特殊应用集成电路芯片的转换模块具有特殊的电路结构及运作机制,因此能够通过改变特殊应用集成电路芯片的滤波单元的数据更新速率即可调整振动传感器的感测带宽,以适应于具有各种不同振动带宽的待测物,扩大了具监测功能的振动传感器的使用对象。(4) In one embodiment of the present invention, the conversion module of the special application integrated circuit chip of the vibration sensor with monitoring function has a special circuit structure and operation mechanism, so it can be updated by changing the data of the filter unit of the special application integrated circuit chip The sensing bandwidth of the vibration sensor can be adjusted according to the speed, so as to adapt to objects to be measured with various vibration bandwidths, which expands the use objects of the vibration sensor with monitoring function.

(5)本发明的一实施例中,具监测功能的振动传感器的特殊应用集成电路芯片具有整合振动信号感测、振动信号分析的功能及特殊的储存空间管理机制,使储存空间能够更有效地利用,使具监测功能的振动传感器可以更微型化,故能满足智能机械与智能制造的相关应用领域的需求。(5) In one embodiment of the present invention, the application-specific integrated circuit chip of the vibration sensor with monitoring function has the function of integrating vibration signal sensing and vibration signal analysis and a special storage space management mechanism, so that the storage space can be more effectively Utilization makes the vibration sensor with monitoring function more miniaturized, so it can meet the requirements of relevant application fields of intelligent machinery and intelligent manufacturing.

附图说明Description of drawings

图1是本发明的第一实施例的具监测功能的振动传感器的示意图。FIG. 1 is a schematic diagram of a vibration sensor with monitoring function according to a first embodiment of the present invention.

图2是本发明的第一实施例的流程图。Fig. 2 is a flowchart of the first embodiment of the present invention.

图3是本发明的第二实施例的具监测功能的振动传感器的电路图。FIG. 3 is a circuit diagram of a vibration sensor with a monitoring function according to a second embodiment of the present invention.

图4是本发明的第二实施例的具监测功能的振动传感器的特殊应用集成电路芯片的电路图。FIG. 4 is a circuit diagram of an ASIC chip of a vibration sensor with a monitoring function according to a second embodiment of the present invention.

图5是本发明的第二实施例的流程图。Fig. 5 is a flowchart of a second embodiment of the present invention.

图6A是本发明的第二实施例的具监测功能的振动传感器的储存空间管理机制的第一示意图。6A is a first schematic diagram of the storage space management mechanism of the vibration sensor with monitoring function according to the second embodiment of the present invention.

图6B是本发明的第二实施例的具监测功能的振动传感器的储存空间管理机制的第二示意图。6B is a second schematic diagram of the storage space management mechanism of the vibration sensor with monitoring function according to the second embodiment of the present invention.

图6C是本发明的第二实施例的具监测功能的振动传感器的储存空间管理机制的第三示意图。6C is a third schematic diagram of the storage space management mechanism of the vibration sensor with monitoring function according to the second embodiment of the present invention.

图6D是本发明的第二实施例的具监测功能的振动传感器的储存空间管理机制的第四示意图。6D is a fourth schematic diagram of the storage space management mechanism of the vibration sensor with monitoring function according to the second embodiment of the present invention.

符号说明Symbol Description

1、2 振动传感器1, 2 vibration sensor

11 基板11 Substrate

12、22 微机电振动感测芯片12, 22 MEMS vibration sensing chip

13、23 特殊应用集成电路芯片13, 23 Application-specific integrated circuit chips

231 取样模块231 sampling module

2311 模拟前端单元2311 Analog Front End Unit

2312 模拟数字转换单元2312 Analog to Digital Conversion Unit

2313 滤波单元2313 filter unit

232 转换模块232 conversion module

2321 转换单元2321 conversion unit

2322 切换单元2322 switching unit

2323 存储单元2323 storage unit

2324 时间区间单元2324 time interval unit

2325 转换系数单元2325 conversion factor unit

233 分析模块233 analysis module

14、24 存储器元件14, 24 memory components

TD、TD’ 时域数据TD, TD’ time domain data

FD、TD’ 频域数据FD, TD’ frequency domain data

VS 振动信号VS vibration signal

S 通知信号S notification signal

T 预设频谱特征表T Preset Spectrum Characteristic Table

N 预先设定的数量值N preset number value

C 转换系数C conversion factor

P1、P2 储存空间P1, P2 storage space

A1~An、A1’~An’ 频域点A 1 ~A n , A 1 '~A n ' frequency domain points

S21~S25、S51~S58 步骤流程S21~S25, S51~S58 Step flow

具体实施方式Detailed ways

以下将参照相关附图,说明依本发明的具监测功能的振动传感器及其振动信号监测方法的实施例,为了清楚与方便附图说明的目的,附图中的各部件在尺寸与比例上可能会被夸大或缩小地呈现。在以下描述及/或权利要求书中,当提及元件「连接」或「耦合」至另一元件时,其可直接连接或耦合至该另一元件或可存在介入元件;而当提及元件「直接连接」或「直接耦合」至另一元件时,不存在介入元件。为使便于理解,下述实施例中的相同元件以相同的符号标示来说明。The following will refer to the accompanying drawings to illustrate the embodiment of the vibration sensor with monitoring function and the vibration signal monitoring method thereof according to the present invention. For the purpose of clarity and convenience for the description of the accompanying drawings, the dimensions and proportions of the components in the accompanying drawings may be Will be rendered exaggerated or reduced. In the following description and/or claims, when an element is referred to as being "connected" or "coupled" to another element, it may be directly connected or coupled to the other element or there may be intervening elements; When "directly connected" or "directly coupled" to another element, there are no intervening elements present. To facilitate understanding, the same elements in the following embodiments are described with the same symbols.

请参阅图1,其是本发明的第一实施例的具监测功能的振动传感器的示意图。如图所示,振动传感器1包含基板11、微机电振动感测芯片12及特殊应用集成电路芯片13及可选择性使用的存储器元件14。在具监测功能的振动传感器的开发初期,存储器元件14设置于特殊应用集成电路芯片13的外部。存储器元件14针对不同待测物的振动信号,提供不同大小的存储空间来储存振动信号及分析后的数据。然而,在量产具监测功能的振动传感器时,可利用特殊应用集成电路芯片13内的存储单元(图未示)来代替存储器元件14,以缩小振动传感器11的整体体积并简化振动传感器11的组装制程。微机电振动感测芯片12设置基板上,用于侦测待测物所承受的振动以产生多个振动信号。待测物,举例而言,可为工具机、马达、滚珠螺杆、进给装置等各种运作中会产生振动的装置。Please refer to FIG. 1 , which is a schematic diagram of a vibration sensor with monitoring function according to a first embodiment of the present invention. As shown in the figure, the vibration sensor 1 includes a substrate 11 , a MEMS vibration sensing chip 12 , an ASIC chip 13 and an optional memory element 14 . In the early stage of development of the vibration sensor with monitoring function, the memory element 14 is disposed outside the ASIC chip 13 . The memory element 14 provides storage spaces of different sizes for storing vibration signals and analyzed data for vibration signals of different objects under test. However, when producing a vibration sensor with a monitoring function in mass production, the storage unit (not shown) in the application-specific integrated circuit chip 13 can be used to replace the memory element 14, so as to reduce the overall volume of the vibration sensor 11 and simplify the design of the vibration sensor 11. Assembly process. The micro-electromechanical vibration sensing chip 12 is disposed on the substrate, and is used to detect the vibration of the object under test to generate a plurality of vibration signals. The object to be tested, for example, can be a machine tool, a motor, a ball screw, a feeding device and other devices that generate vibration during operation.

存储器元件14可依不同的需求,选择性地设置于基板上11,并用于储存预设频谱特征表及各种参数,例如校正参数、滤波器参数及转换参数等。存储器元件14,举例而言,可为单次可编程存储器、多次可编程存储器、闪存或电子抹除式可复写只读存储器。The memory element 14 can be selectively disposed on the substrate 11 according to different requirements, and is used to store a preset spectrum feature table and various parameters, such as calibration parameters, filter parameters, and conversion parameters. The memory element 14 can be, for example, a one-time programmable memory, a multiple-time programmable memory, a flash memory, or an electronically erasable rewritable read-only memory.

特殊应用集成电路芯片13设置基板11上,且电性连接至微机电振动感测芯片12及存储器元件14。特殊应用集成电路芯片13接收该些振动信号,并将该些振动信号转换为多个数字信号,并对该些数字信号进行滤波以产生多个时域数据。然后,再根据预先设定的数量值N,将一特定数量的时域数据转换为一频域数据。在将一特定数量的时域数据转换为一频域数据时,该特定数量的数量值等于此预先设定的数量值。最后,特殊应用集成电路芯片13执行比对程序并根据比对结果发出通知信号以表示待测物的振动状态的信息。待测物的振动状态的信息,举例而言,可为异常振动警示、频谱特征诊断、健康状态或剩余寿命估测。The ASIC chip 13 is disposed on the substrate 11 and is electrically connected to the MEMS vibration sensing chip 12 and the memory element 14 . The ASIC chip 13 receives the vibration signals, converts the vibration signals into multiple digital signals, and filters the digital signals to generate multiple time-domain data. Then, according to a preset quantity value N, a specific amount of time-domain data is converted into a frequency-domain data. When converting a specific amount of time-domain data into a frequency-domain data, the specific amount is equal to the preset amount. Finally, the ASIC chip 13 executes the comparison program and sends a notification signal to indicate the vibration state information of the object under test according to the comparison result. The vibration status information of the DUT can be, for example, abnormal vibration warning, spectrum feature diagnosis, health status or remaining life estimation.

由上述可知,振动传感器1具有整合频谱转换功能及信号分析功能的特殊应用集成电路芯片13,故振动传感器1能对振动信号的频域数据以进行即时分析,使分析时间大幅减少,故效率能有效地提升。As can be seen from the above, the vibration sensor 1 has a special application integrated circuit chip 13 that integrates the spectrum conversion function and the signal analysis function, so the vibration sensor 1 can analyze the frequency domain data of the vibration signal in real time, so that the analysis time is greatly reduced, so the efficiency can be improved. effectively lift.

请参阅图2,其是本发明的第一实施例的振动传感器1在监测待测物的振动信号的流程图。如图所示,本实施例的振动传感器1的振动信号监测方法包含下列步骤:Please refer to FIG. 2 , which is a flow chart of the vibration sensor 1 monitoring the vibration signal of the object under test according to the first embodiment of the present invention. As shown in the figure, the vibration signal monitoring method of the vibration sensor 1 of the present embodiment includes the following steps:

步骤S21:侦测待测物所承受的振动以产生多个振动信号。Step S21 : Detect the vibration of the object under test to generate a plurality of vibration signals.

步骤S22:接收该些振动信号,并将该些振动信号转换为多个数字信号。Step S22: Receive the vibration signals and convert the vibration signals into a plurality of digital signals.

步骤S23:对该些数字信号进行滤波以产生多个时域数据。Step S23: Filter the digital signals to generate a plurality of time-domain data.

步骤S24:根据预先设定的数量值将该些时域数据转换为一频域数据,该些时域数据的数量值等于该预先设定的数量值。Step S24: Convert the time-domain data into frequency-domain data according to a preset quantity value, and the quantity value of the time-domain data is equal to the preset quantity value.

步骤S25:执行比对程序,将频域数据与预设频谱特征表比对,并根据比对程序的比对结果发出通知信号。Step S25: Execute the comparison program, compare the frequency domain data with the preset spectrum feature table, and send a notification signal according to the comparison result of the comparison program.

请参阅图3及图4,其是本发明的第二实施例的具监测功能的振动传感器的电路图及特殊应用集成电路芯片的电路图。如图3所示,振动传感器2包含微机电振动感测芯片22、特殊应用集成电路芯片23及依不同使用需求而选择性使用的存储器元件24。Please refer to FIG. 3 and FIG. 4 , which are the circuit diagrams of the vibration sensor with monitoring function and the circuit diagram of the special application integrated circuit chip according to the second embodiment of the present invention. As shown in FIG. 3 , the vibration sensor 2 includes a micro-electromechanical vibration sensing chip 22 , an application-specific integrated circuit chip 23 and a memory element 24 selectively used according to different usage requirements.

微机电振动感测芯片22侦测待测物所承受的振动以产生多个振动信号VS。待测物可为各种运作中会产生振动的装置,例如工具机、马达、滚珠螺杆、进给装置等。The MEMS vibration sensing chip 22 detects the vibration of the object under test to generate a plurality of vibration signals VS. The object to be tested can be various devices that generate vibration during operation, such as machine tools, motors, ball screws, feeding devices, etc.

存储器元件24用于储存预设频谱特征表T及各种参数,如校正参数、滤波器参数及转换参数等。在本实施例中,存储器元件为一内建于特殊应用集成电路芯片23中的存储单元。The memory element 24 is used to store the preset spectrum characteristic table T and various parameters, such as calibration parameters, filter parameters and transformation parameters. In this embodiment, the memory element is a memory unit built in the ASIC chip 23 .

微机电振动感测芯片22与特殊应用集成电路芯片23电性连接,以将振动信号传输至特殊应用集成电路芯片23。The MEMS vibration sensing chip 22 is electrically connected to the ASIC chip 23 to transmit the vibration signal to the ASIC chip 23 .

图4举例说明特殊应用集成电路芯片23的电路设计。如图4所示,特殊应用集成电路芯片23包含取样模块231、转换模块232及分析模块233。FIG. 4 illustrates the circuit design of ASIC chip 23 . As shown in FIG. 4 , the ASIC chip 23 includes a sampling module 231 , a converting module 232 and an analyzing module 233 .

取样模块231包含模拟前端单元2311、模拟数字转换单元2312及滤波单元2313。模拟前端单元2311接收该些振动信号VS。模拟前端单元2311,举例而言,可为模拟前端电路或信号接收电路等。模拟数字转换单元2312将该些振动信号转换为多个数字信号。模拟数字转换单元2312,举例而言,可为模拟/数字转换器或离散信号转换器等。而滤波单元2313对该些数字信号进行滤波以产生多个时域数据TD。滤波单元2313,举例而言,可为数字滤波器或噪声滤波器等。The sampling module 231 includes an analog front-end unit 2311 , an analog-to-digital conversion unit 2312 and a filter unit 2313 . The analog front-end unit 2311 receives the vibration signals VS. The analog front-end unit 2311 can be, for example, an analog front-end circuit or a signal receiving circuit. The analog-to-digital conversion unit 2312 converts these vibration signals into a plurality of digital signals. The analog-to-digital conversion unit 2312 can be, for example, an analog/digital converter or a discrete signal converter. The filtering unit 2313 filters the digital signals to generate a plurality of time domain data TD. The filtering unit 2313 can be, for example, a digital filter or a noise filter.

转换模块232包含转换单元2321、切换单元2322,存储单元2323、时间区间单元2324及转换系数单元2325。当滤波单元2313产生该些时域数据TD时,切换单元2322则切换到滤波单元2313以接收该些时域数据TD,并将该些时域数据TD传送至存储单元2323。切换单元2322,举例而言,可为多工器或开关等。The conversion module 232 includes a conversion unit 2321 , a switching unit 2322 , a storage unit 2323 , a time interval unit 2324 and a conversion coefficient unit 2325 . When the filtering unit 2313 generates the time-domain data TD, the switching unit 2322 switches to the filtering unit 2313 to receive the time-domain data TD, and transmits the time-domain data TD to the storage unit 2323 . The switching unit 2322 can be, for example, a multiplexer or a switch.

存储单元2323将该些时域数据TD储存在一存储单元2323中,再将该些时域数据TD传送至转换单元2321。存储单元2323具有特殊的储存空间管理机制;其中,当存储单元2323将该些时域数据TD传送至转换单元2321后,存储单元2323能同时释放储存该些时域数据TD的储存空间,使另一些时域数据TD可存放于此储存空间。例如,存储单元2323可将此储存空间的写保护机制解除或将此储存空间的该些时域数据TD删除,以释放此储存空间,使另一些时域数据TD可存放于此储存空间。存储单元2323,举例而言,可为暂存器或随机存取存储器等。The storage unit 2323 stores the time domain data TD in a storage unit 2323 , and then transmits the time domain data TD to the conversion unit 2321 . The storage unit 2323 has a special storage space management mechanism; wherein, when the storage unit 2323 transmits the time domain data TD to the conversion unit 2321, the storage unit 2323 can simultaneously release the storage space for storing the time domain data TD, so that other Some time domain data TD can be stored in this storage space. For example, the storage unit 2323 can release the write protection mechanism of the storage space or delete the time domain data TD in the storage space to release the storage space, so that other time domain data TD can be stored in the storage space. The storage unit 2323 can be, for example, a register or a random access memory.

时间区间单元2324传送预先设定的数量值N至转换单元2321,而转换系数单元2325传送转换系数C至转换单元2321,上述的预先设定的数量值N等于该些时域数据TD的数量值。在一实施例中,该预先设定的数量值N等于取样模块231设定的取样数量。在另一实施例中,该预先设定的数量值N不等于取样模块231设定的取样数量。转换单元2321则能根据预先设定的数量值N及转换系数C执行时域-频域转换以将该些时域数据TD转换为一频域数据FD。因此,可根据实际状态调整预先设定的数量值N。例如,若此预先设定的数量值N被设定为3,转换单元2321则能根据预先设定的数量值N及转换系数C,将3笔时域数据TD转换为一笔频域数据FD。当转换单元2321产生频域数据FD时,切换单元2322则切换到转换单元2321,并接收频域数据FD,再将频域数据FD传送至存储单元2323。时间区间单元2324,举例而言,可为暂存器或随机存取存储器等。转换系数单元2325,举例而言,可为暂存器或只读存储器等。The time interval unit 2324 transmits a preset quantity value N to the conversion unit 2321, and the conversion coefficient unit 2325 transmits the conversion coefficient C to the conversion unit 2321. The above-mentioned preset quantity value N is equal to the quantity value of the time domain data TD . In one embodiment, the preset number N is equal to the sampling number set by the sampling module 231 . In another embodiment, the preset number N is not equal to the sampling number set by the sampling module 231 . The conversion unit 2321 can perform time domain-frequency domain conversion according to the preset quantity value N and conversion coefficient C to convert the time domain data TD into a frequency domain data FD. Therefore, the preset quantity value N can be adjusted according to the actual state. For example, if the preset number N is set to 3, the conversion unit 2321 can convert three pieces of time-domain data TD into one piece of frequency-domain data FD according to the preset number N and conversion coefficient C . When the converting unit 2321 generates the frequency domain data FD, the switching unit 2322 switches to the converting unit 2321 to receive the frequency domain data FD, and then transmits the frequency domain data FD to the storage unit 2323 . The time interval unit 2324 can be, for example, a register or a random access memory. The conversion factor unit 2325 can be, for example, a register or a read-only memory.

由上述可知,转换模块232具有特殊的电路结构及运作机制,即时间区间单元2324能传送预先设定的数量值N至转换单元2321。在一实施例中,此预先设定的数量值N等于该些时域数据TD的数量值及取样模块231设定的取样数量。在另一实施例中,此预先设定的数量值N等于该些时域数据TD的数量值但不等于取样模块231设定的取样数量。因此,在特殊应用集成电路芯片23中,无需在滤波单元2313与切换单元2322之间设置另一取样模块。换言之,转换模块232在将时域数据转换成频域数据之前无需进行二次取样。因此,本实施例的振动传感器2在将时域数据转换成频域数据时,能降低数据遗失的风险,以达到更正确的分析结果。此外,由于转换模块232具有上述特殊的电路结构及运作机制,振动传感器2的感测带宽能够通过改变滤波单元2313的数据更新速率(Output Data Rate,ODR)而进行调整,以适用于具不同振动带宽的待测物。It can be known from the above that the conversion module 232 has a special circuit structure and operation mechanism, that is, the time interval unit 2324 can transmit a preset quantity value N to the conversion unit 2321 . In an embodiment, the preset quantity N is equal to the quantity of the time domain data TD and the sampling quantity set by the sampling module 231 . In another embodiment, the preset quantity N is equal to the quantity of the time domain data TD but not equal to the sampling quantity set by the sampling module 231 . Therefore, in the ASIC chip 23 , there is no need to arrange another sampling module between the filtering unit 2313 and the switching unit 2322 . In other words, the conversion module 232 does not need to perform sub-sampling before converting the time-domain data into frequency-domain data. Therefore, when the vibration sensor 2 of this embodiment converts time domain data into frequency domain data, the risk of data loss can be reduced, so as to achieve more accurate analysis results. In addition, because the conversion module 232 has the above-mentioned special circuit structure and operation mechanism, the sensing bandwidth of the vibration sensor 2 can be adjusted by changing the data update rate (Output Data Rate, ODR) of the filter unit 2313, so as to be suitable for different vibration conditions. Bandwidth UUT.

存储单元2323将频域数据FD储存在另一储存空间中,再将频域数据FD传送至分析模块233,并同样通过前述的储存空间管理机制进行储存空间管理。例如,当存储单元2323将频域数据FD传送至分析模块233后,存储单元2323能同时释放储存频域数据FD的储存空间,使另一频域数据FD可存放于此储存空间。更详细的说,存储单元2323能分割为至少二个储存空间且该些储存空间的容量由预先设定的数量值N决定,使该些储存空间能够被最有效地利用。例如,存储单元2323可将此储存空间的写保护机制解除或将此储存空间的频域数据FD删除,以释放此储存空间,使另一频域数据FD可存放于此储存空间。由上述可知,振动传感器2能执行特殊的储存空间管理机制,使振动传感器2的存储单元2323能选择性地启动写保护机制或释放一部分的储存空间,使储存空间能够更有效地利用,而无需使用特殊应用集成电路芯片23外部的存储器元件。The storage unit 2323 stores the frequency domain data FD in another storage space, and then transmits the frequency domain data FD to the analysis module 233, and also manages the storage space through the aforementioned storage space management mechanism. For example, after the storage unit 2323 transmits the frequency domain data FD to the analysis module 233, the storage unit 2323 can simultaneously release the storage space for storing the frequency domain data FD, so that another frequency domain data FD can be stored in the storage space. In more detail, the storage unit 2323 can be divided into at least two storage spaces, and the capacity of these storage spaces is determined by a preset number N, so that these storage spaces can be used most effectively. For example, the storage unit 2323 can release the write protection mechanism of the storage space or delete the frequency domain data FD in the storage space to release the storage space, so that another frequency domain data FD can be stored in the storage space. As can be seen from the above, the vibration sensor 2 can implement a special storage space management mechanism, so that the storage unit 2323 of the vibration sensor 2 can selectively activate the write protection mechanism or release a part of the storage space, so that the storage space can be used more effectively without requiring Memory elements external to the ASIC chip 23 are used.

分析模块233执行比对程序,将频域数据FD与预设频谱特征表T比对。计算单元2331根据比对程序的比对结果发出通知信号S。分析模块233,举例而言,可为比较器或逻辑运算单元等。当分析模块233执行比对程序时,会将频域数据FD的频域点A1~An与预设频谱特征表T的频域点A1’~An’比对,并计算并得到频域数据FD的频域点A1~An与预设频谱特征表T的频域点A1’~An’之间的总差距值。当分析模块233确认比对结果是总差距值大于一门坎值时,则设定通知信号S为警示信号。当通知信号S被设定为警示信号时,表示待测物的振动状态已超出可接受的范围。使用者此时应寻找振动状态超出可接受的范围的原因,并改善待测物的振动状态。The analysis module 233 executes a comparison program to compare the frequency domain data FD with the preset spectrum feature table T. The calculation unit 2331 sends out a notification signal S according to the comparison result of the comparison program. The analysis module 233 can be, for example, a comparator or a logic operation unit. When the analysis module 233 executes the comparison program, it will compare the frequency domain points A 1 ˜A n of the frequency domain data FD with the frequency domain points A 1 ˜A n of the preset spectrum characteristic table T, and calculate and obtain The total gap value between the frequency domain points A 1 ˜A n of the frequency domain data FD and the frequency domain points A 1 ′˜A n of the preset spectrum feature table T. When the analysis module 233 confirms that the comparison result is that the total difference value is greater than a threshold value, the notification signal S is set as a warning signal. When the notification signal S is set as a warning signal, it means that the vibration state of the object under test has exceeded an acceptable range. At this time, the user should find out the reason why the vibration state is beyond the acceptable range, and improve the vibration state of the DUT.

由于振动信号通过复杂的频谱转换及信号分析,故现有的振动传感器将这些振动信号传送至振动传感器外部的监测机台。监测机台内部的微控制器借着信号分析软件执行频谱转换及信号分析,以获得待测物的振动状态的信息,故缺乏效率,无法满足实际应用上的需求。然而,根据本发明的实施例,具监测功能的振动传感器具有的特殊应用集成电路芯片能对振动信号的频域数据以进行分析,因此可减少分析时间,使即时监测的效率能大幅提升。Since the vibration signals pass through complex spectrum conversion and signal analysis, the existing vibration sensors transmit these vibration signals to the monitoring machine outside the vibration sensor. The micro-controller inside the monitoring machine uses signal analysis software to perform spectrum conversion and signal analysis to obtain information about the vibration state of the object under test, so it lacks efficiency and cannot meet the needs of practical applications. However, according to the embodiment of the present invention, the ASIC chip of the vibration sensor with monitoring function can analyze the frequency domain data of the vibration signal, so the analysis time can be reduced, and the efficiency of real-time monitoring can be greatly improved.

为了满足不同的监测需求,待测物上可能需要安装多个振动传感器,且需要有较高的取样频率及较宽的频域监测范围。现有的振动传感器的传输系统需要传输大量的数据,故容易导致数据遗失或使数据传输时间过于长久,而无法对待测物进行即时监测。然而,根据本发明的实施例,具监测功能的振动传感器的特殊应用集成电路芯片不需要将振动信号传送至外部的监测机台即可对振动信号的频域数据以进行分析,故不会导致数据遗失且能大幅缩短数据传输时间。In order to meet different monitoring requirements, multiple vibration sensors may need to be installed on the DUT, and a higher sampling frequency and a wider frequency domain monitoring range are required. The existing vibration sensor transmission system needs to transmit a large amount of data, so it is easy to cause data loss or make the data transmission time too long, so that the real-time monitoring of the object under test cannot be performed. However, according to the embodiment of the present invention, the ASIC chip of the vibration sensor with monitoring function can analyze the frequency domain data of the vibration signal without transmitting the vibration signal to an external monitoring machine, so it will not cause Data loss and can drastically reduce data transfer time.

另外,根据本发明的实施例,具监测功能的振动传感器的特殊应用集成电路芯片的转换模块具有特殊的电路结构及运作机制,故特殊应用集成电路芯片不需要另一取样模块进行二次取样,使振动传感器能达到更高的效率。In addition, according to the embodiment of the present invention, the conversion module of the ASIC chip of the vibration sensor with monitoring function has a special circuit structure and operation mechanism, so the ASIC chip does not need another sampling module for secondary sampling, The vibration sensor can achieve higher efficiency.

此外,根据本发明的实施例,具监测功能的振动传感器的特殊应用集成电路芯片的转换模块具有特殊的电路结构及运作机制,因此仅要改变特殊应用集成电路芯片的滤波单元的数据更新速率即可调整振动传感器的感测带宽,以适应于具有各种不同振动带宽的待测物,扩大了具监测功能的振动传感器的使用对象。In addition, according to the embodiment of the present invention, the conversion module of the ASIC chip of the vibration sensor with monitoring function has a special circuit structure and operation mechanism, so only the data update rate of the filter unit of the ASIC chip needs to be changed. The sensing bandwidth of the vibration sensor can be adjusted to adapt to objects to be measured with various vibration bandwidths, thereby expanding the use objects of the vibration sensor with monitoring function.

再者,由于现有执行信号分析软件的监测机台体积过于庞大,故极难与现有的振动传感器整合,故不易应用于智能机械与智能制造的相关应用领域。根据本发明的实施例,具监测功能的振动传感器的特殊应用集成电路芯片具有整合振动信号感测、振动信号分析的功能及特殊的储存空间管理机制,使储存空间能够更有效地利用,使具监测功能的振动传感器可以更微型化,故能满足智能机械与智能制造的相关应用领域的需求。Furthermore, since the existing monitoring machine for executing signal analysis software is too bulky, it is extremely difficult to integrate with the existing vibration sensor, so it is not easy to apply to the related application fields of intelligent machinery and intelligent manufacturing. According to an embodiment of the present invention, the ASIC chip of the vibration sensor with monitoring function has the function of integrating vibration signal sensing and vibration signal analysis and a special storage space management mechanism, so that the storage space can be used more effectively, and the The vibration sensor with monitoring function can be miniaturized, so it can meet the requirements of the relevant application fields of intelligent machinery and intelligent manufacturing.

请参阅图5,其是本发明的第二实施例的流程图。如图所示,本实施例的振动传感器2的振动信号监测方法包含下列步骤:Please refer to FIG. 5 , which is a flowchart of the second embodiment of the present invention. As shown in the figure, the vibration signal monitoring method of the vibration sensor 2 of the present embodiment includes the following steps:

步骤S51:侦测待测物所承受的振动以产生多个振动信号。Step S51 : Detect the vibration of the object under test to generate a plurality of vibration signals.

步骤S52:接收该些振动信号,并将该些振动信号转换为多个数字信号。Step S52: Receive the vibration signals and convert the vibration signals into a plurality of digital signals.

步骤S53:对该些数字信号进行滤波以产生多个时域数据,并将该些时域数据储存于一储存空间。Step S53: Filter the digital signals to generate a plurality of time-domain data, and store the time-domain data in a storage space.

步骤S54:提供预先设定的数量值及转换系数,并根据预先设定的数量值及转换系数将该些时域数据转换为一频域数据,并将频域数据储存于另一储存空间。Step S54: Provide a preset quantity value and conversion coefficient, and convert the time domain data into a frequency domain data according to the preset quantity value and conversion coefficient, and store the frequency domain data in another storage space.

步骤S55:当该些时域数据转换为频域数据后释放储存该些时域数据的储存空间。Step S55: Release the storage space for storing the time domain data after converting the time domain data into frequency domain data.

步骤S56:执行比对程序将频域数据的频域点与预设频谱特征表的频域点比对并得到总差距值。Step S56: Executing a comparison program to compare the frequency domain points of the frequency domain data with the frequency domain points of the preset spectrum feature table to obtain the total difference value.

步骤S57:执行比对程序后,释放储存频域数据的储存空间。Step S57: After the comparison procedure is executed, the storage space for storing the frequency domain data is released.

步骤S58:当比对结果是总差距值大于一门坎值时,设定通知信号为警示信号。Step S58: When the comparison result is that the total difference value is greater than a threshold value, set the notification signal as a warning signal.

请参阅图6A~图6D,其是本发明的第二实施例的具监测功能的振动传感器的储存空间管理机制的第一示意图至第四示意图。如图6A所示,存储单元2323包含储存空间P1及储存空间P2。其中,储存空间P1的容量对应于预先设定的数量值N及取样数量,储存空间P2的容量也对应于预先设定的数量值N及取样数量。滤波单元2313产生该些时域数据TD,并通过切换单元2322将该些时域数据TD传送至存储单元2323,存储单元2323则将该些时域数据TD储存在储存空间P1。Please refer to FIG. 6A to FIG. 6D , which are the first schematic diagram to the fourth schematic diagram of the storage space management mechanism of the vibration sensor with monitoring function according to the second embodiment of the present invention. As shown in FIG. 6A , the storage unit 2323 includes a storage space P1 and a storage space P2 . Wherein, the capacity of the storage space P1 corresponds to the preset quantity value N and the sampling quantity, and the capacity of the storage space P2 also corresponds to the preset quantity value N and the sampling quantity. The filtering unit 2313 generates the time domain data TD, and transmits the time domain data TD to the storage unit 2323 through the switching unit 2322, and the storage unit 2323 stores the time domain data TD in the storage space P1.

如图6B所示,存储单元2323将该些时域数据TD传送至转换单元2321后,存储单元2323能同时释放储存该些时域数据TD的储存空间P1。而转换单元2321产生频域数据FD,并通过切换单元将频域数据FD传送至存储单元2323。存储单元2323则将频域数据FD储存在储存空间P2。As shown in FIG. 6B , after the storage unit 2323 transmits the time domain data TD to the conversion unit 2321 , the storage unit 2323 can release the storage space P1 storing the time domain data TD at the same time. The converting unit 2321 generates the frequency domain data FD, and transmits the frequency domain data FD to the storage unit 2323 through the switching unit. The storage unit 2323 stores the frequency domain data FD in the storage space P2.

如图6C所示,存储单元2323将频域数据FD传送至分析模块233后,存储单元2323能同时释放储存频域数据FD的储存空间P2。由于存储单元2323已释放储存空间P1,故滤波单元2313产生的下一笔时域数据TD’能储存至储存空间P1。As shown in FIG. 6C , after the storage unit 2323 transmits the frequency domain data FD to the analysis module 233 , the storage unit 2323 can simultaneously release the storage space P2 for storing the frequency domain data FD. Since the storage unit 2323 has released the storage space P1, the next piece of time-domain data TD' generated by the filtering unit 2313 can be stored in the storage space P1.

如图6D所示,存储单元2323将该些时域数据TD’传送至转换单元2321后,存储单元2323能同时释放储存该些时域数据TD’的储存空间P1。由于存储单元2323已释放储存空间P2,故转换单元2321产生的下一笔频域数据FD’能储存至储存空间P2。As shown in FIG. 6D , after the storage unit 2323 transmits the time domain data TD' to the conversion unit 2321, the storage unit 2323 can simultaneously release the storage space P1 storing the time domain data TD'. Since the storage unit 2323 has released the storage space P2, the next piece of frequency domain data FD' generated by the conversion unit 2321 can be stored in the storage space P2.

由上述可知,由于振动传感器2的存储单元2323分割为储存空间P1及储存空间P2,且储存空间P1及储存空间P2的容量均对应于预先设定的数量值N及取样数量,使存储单元2323的容量能够降低,且足以储存所有必要的数据,上述特殊的储存空间设计能大幅减少振动传感器的储存空间。As can be seen from the above, since the storage unit 2323 of the vibration sensor 2 is divided into a storage space P1 and a storage space P2, and the capacities of the storage space P1 and the storage space P2 all correspond to the preset quantity value N and the number of samples, the storage unit 2323 The capacity of the vibration sensor can be reduced and is sufficient to store all the necessary data. The above-mentioned special storage space design can greatly reduce the storage space of the vibration sensor.

另外,振动传感器2更具有特殊的储存空间管理机制,使储存空间能够更有效地循环利用,因此能进一步减少振动传感器2的储存空间。因此,上述储存空间管理机制与储存空间的设计结合,使振动传感器2可以更微型化,而无需在特殊应用集成电路芯片之外,设置另一存储器元件,因而能够满足智能机械与智能制造的相关应用领域的需求。In addition, the vibration sensor 2 has a special storage space management mechanism, so that the storage space can be recycled more effectively, so the storage space of the vibration sensor 2 can be further reduced. Therefore, the combination of the above-mentioned storage space management mechanism and the design of the storage space makes the vibration sensor 2 more miniaturized without setting another memory element outside the ASIC chip, thus meeting the requirements of intelligent machinery and intelligent manufacturing. The needs of the application field.

综上所述,根据本发明的实施例,具监测功能的振动传感器的特殊应用集成电路芯片能对振动信号的频域数据以进行分析,因此可减少分析时间,使即时监测的效率能大幅提升。To sum up, according to the embodiment of the present invention, the ASIC chip of the vibration sensor with monitoring function can analyze the frequency domain data of the vibration signal, so the analysis time can be reduced, and the efficiency of real-time monitoring can be greatly improved .

又,根据本发明的实施例,具监测功能的振动传感器的特殊应用集成电路芯片不需要将振动信号传送至振动传感器外部的监测机台即可对振动信号的频域数据以进行分析,故不会导致数据遗失且能大幅缩短数据传输时间。Moreover, according to the embodiment of the present invention, the ASIC chip of the vibration sensor with monitoring function can analyze the frequency domain data of the vibration signal without transmitting the vibration signal to the monitoring machine outside the vibration sensor, so there is no need to Can result in data loss and can drastically reduce data transfer times.

另外,根据本发明的实施例,具监测功能的振动传感器的特殊应用集成电路芯片的转换模块具有特殊的电路结构及运作机制,故特殊应用集成电路芯片无需设置另一取样模块,也不需要进行二次取样,使振动传感器能达到更高的效率。In addition, according to the embodiment of the present invention, the conversion module of the ASIC chip of the vibration sensor with monitoring function has a special circuit structure and operation mechanism, so the ASIC chip does not need to be equipped with another sampling module, nor does it need to perform Subsampling enables the vibration sensor to achieve higher efficiency.

此外,根据本发明的实施例,具监测功能的振动传感器的特殊应用集成电路芯片的转换模块具有特殊的电路结构及运作机制,因此能够通过改变特殊应用集成电路芯片的滤波单元的数据更新速率即可调整振动传感器的感测带宽,使用上更具弹性,以适应于具有各种不同振动带宽的待测物,扩大了具监测功能的振动传感器的使用对象。In addition, according to the embodiment of the present invention, the conversion module of the ASIC chip of the vibration sensor with monitoring function has a special circuit structure and operation mechanism, so it can be changed by changing the data update rate of the filter unit of the ASIC chip. The sensing bandwidth of the vibration sensor can be adjusted, which is more flexible in use, so as to adapt to objects to be measured with various vibration bandwidths, and expand the use objects of the vibration sensor with monitoring function.

再者,根据本发明的实施例,具监测功能的振动传感器的特殊应用集成电路芯片具有整合振动信号感测、振动信号分析的功能及特殊的储存空间管理机制,使储存空间能够更有效地利用,使具监测功能的振动传感器可以更微型化,故能满足智能机械与智能制造的相关应用领域的需求。Furthermore, according to the embodiment of the present invention, the ASIC chip of the vibration sensor with monitoring function has the function of integrating vibration signal sensing and vibration signal analysis and a special storage space management mechanism, so that the storage space can be used more effectively , so that the vibration sensor with monitoring function can be miniaturized, so it can meet the requirements of the relevant application fields of intelligent machinery and intelligent manufacturing.

以上所述仅为举例性,而非为限制性者。其它任何未脱离本发明的精神与范畴,而对其进行的等效修改或变更,均应该包含于所附的权利要求书中。The above descriptions are illustrative only, not restrictive. Any other equivalent modifications or changes made without departing from the spirit and scope of the present invention should be included in the appended claims.

Claims (17)

1.一种具监测功能的振动传感器,包含:1. A vibration sensor with monitoring function, comprising: 一基板;a substrate; 一微机电振动感测芯片,设置所述基板上,其中所述微机电振动感测芯片用于侦测一待测物所承受的振动以产生多个振动信号;以及A micro-electro-mechanical vibration sensing chip is arranged on the substrate, wherein the micro-electro-mechanical vibration sensing chip is used to detect the vibration suffered by an object under test to generate a plurality of vibration signals; and 一特殊应用集成电路芯片,设置所述基板上且电性连接至所述微机电振动感测芯片,包含:An application-specific integrated circuit chip, set on the substrate and electrically connected to the MEMS vibration sensing chip, comprising: 一取样模块,具有一取样数量值,包含:A sampling module, having a sampling quantity value, comprising: 一模拟前端单元;an analog front-end unit; 一模拟数字转换单元;以及an analog-to-digital conversion unit; and 一滤波单元;a filtering unit; 其中,所述模拟前端单元接收所述多个振动信号,所述模拟数字转换单元将所述多个振动信号转换为多个数字信号,而所述滤波单元对所述多个数字信号进行滤波以产生多个时域数据,所述取样数量值等于一预先设定的数量值,使得所述多个时域数据的数量值等于所述预先设定的数量值;Wherein, the analog front-end unit receives the plurality of vibration signals, the analog-to-digital conversion unit converts the plurality of vibration signals into a plurality of digital signals, and the filtering unit filters the plurality of digital signals to Generate a plurality of time-domain data, the sampling quantity value is equal to a preset quantity value, so that the quantity value of the plurality of time-domain data is equal to the preset quantity value; 一转换模块,包含:A conversion module, comprising: 一转换单元,所述转换单元将所述多个时域数据转换成频域数据;a conversion unit that converts the plurality of time domain data into frequency domain data; 一时间区间单元,所述时间区间单元传送所述预先设定的数量值至所述转换单元;a time interval unit, the time interval unit transmits the preset quantity value to the conversion unit; 一存储单元;以及a storage unit; and 一切换单元,所述切换单元分别电性连接所述取样模块、所述转换单元及所述存储单元;以及a switching unit, the switching unit is electrically connected to the sampling module, the conversion unit and the storage unit; and 一分析模块,用于执行一比对程序,其中所述比对程序将所述频域数据与一预设频谱特征表比对,并根据所述比对程序的一比对结果发出一通知信号;An analysis module, used to execute a comparison program, wherein the comparison program compares the frequency domain data with a preset spectrum feature table, and sends a notification signal according to a comparison result of the comparison program ; 其中,所述切换单元在所述取样模块产生所述多个时域数据时切换至所述取样模块,以将所述数量值等于所述预先设定的数量值的所述多个时域数据存放于所述存储单元,所述存储单元将所述数量值等于所述预先设定的数量值的所述多个时域数据传送至所述转换单元后,所述存储单元能同时释放储存所述多个时域数据的一储存空间;Wherein, the switching unit switches to the sampling module when the sampling module generates the plurality of time-domain data, so as to convert the plurality of time-domain data whose quantity value is equal to the preset quantity value Stored in the storage unit, after the storage unit transmits the plurality of time-domain data whose quantity value is equal to the preset quantity value to the conversion unit, the storage unit can release the stored data at the same time A storage space for the plurality of time domain data; 其中所述切换单元在所述转换单元产生所述频域数据时切换至所述转换单元,以将所述频域数据存放于所述存储单元,当所述存储单元将频域数据传送至所述分析模块后,所述存储单元能同时释放储存所述频域数据的所述储存空间。Wherein the switching unit switches to the conversion unit when the conversion unit generates the frequency domain data, so as to store the frequency domain data in the storage unit, and when the storage unit transmits the frequency domain data to the After the analysis module is installed, the storage unit can simultaneously release the storage space for storing the frequency domain data. 2.根据权利要求1所述的振动传感器,其中所述转换模块还包含一转换系数单元,所述转换系数单元传送一转换系数至所述转换单元,所述转换单元根据所述预先设定的数量值及所述转换系数将所述多个时域数据转换为所述频域数据。2. The vibration sensor according to claim 1, wherein the conversion module further comprises a conversion coefficient unit, and the conversion coefficient unit transmits a conversion coefficient to the conversion unit, and the conversion unit is based on the preset The magnitude value and the conversion coefficient convert the plurality of time domain data into the frequency domain data. 3.根据权利要求1所述的振动传感器,另包含至少一个存储器元件,其中所述至少一个存储器元件电性连接至所述特殊应用集成电路芯片,并储存所述预设频谱特征表。3. The vibration sensor according to claim 1, further comprising at least one memory element, wherein the at least one memory element is electrically connected to the application-specific integrated circuit chip and stores the preset spectrum characteristic table. 4.根据权利要求1所述的振动传感器,其中所述比对程序将所述频域数据的频域点与所述预设频谱特征表的频域点比对并得到一总差距值,当所述分析模块确认所述比对结果是所述总差距值大于一门坎值时,则设定所述通知信号为一警示信号。4. The vibration sensor according to claim 1, wherein the comparison program compares the frequency domain points of the frequency domain data with the frequency domain points of the preset spectrum characteristic table and obtains a total difference value, when When the analysis module confirms that the comparison result is that the total difference value is greater than a threshold value, the notification signal is set as a warning signal. 5.根据权利要求1所述的振动传感器,其中所述储存空间的容量对应于所述预先设定的数量值。5. The vibration sensor according to claim 1, wherein the capacity of the storage space corresponds to the preset quantity value. 6.根据权利要求1所述的振动传感器,其中所述存储单元将所述储存空间的写保护机制解除,以释放储存所述多个时域数据的所述储存空间,使另一时域数据覆盖于所述储存空间。6. The vibration sensor according to claim 1, wherein the storage unit releases the write protection mechanism of the storage space to release the storage space storing the plurality of time-domain data, so that another time-domain data can be overwritten in the storage space. 7.根据权利要求1所述的振动传感器,其中所述存储单元将所述储存空间的所述多个时域数据删除,以释放储存所述多个时域数据的所述储存空间,使另一时域数据存放于所述储存空间。7. The vibration sensor according to claim 1, wherein the storage unit deletes the plurality of time-domain data in the storage space to release the storage space storing the plurality of time-domain data, so that other A time domain data is stored in the storage space. 8.根据权利要求1所述的振动传感器,其中所述存储单元将所述储存空间的写保护机制解除,以释放储存所述频域数据的所述储存空间,使另一频域数据覆盖于所述储存空间。8. The vibration sensor according to claim 1, wherein the storage unit releases the write protection mechanism of the storage space to release the storage space storing the frequency domain data, so that another frequency domain data is overwritten on the the storage space. 9.根据权利要求1所述的振动传感器,其中所述存储单元将所述储存空间的所述频域数据删除,以释放储存所述频域数据的所述储存空间,使另一频域数据存放于所述储存空间。9. The vibration sensor according to claim 1 , wherein the storage unit deletes the frequency domain data of the storage space to release the storage space storing the frequency domain data, so that another frequency domain data stored in the storage space. 10.一种振动信号监测方法,包含:10. A vibration signal monitoring method, comprising: 侦测一待测物所承受的振动以产生多个振动信号;Detect the vibration of an object under test to generate multiple vibration signals; 接收所述多个振动信号,并根据一取样数量值将所述多个振动信号转换为多个数字信号;receiving the plurality of vibration signals, and converting the plurality of vibration signals into a plurality of digital signals according to a sampling quantity value; 对所述多个数字信号进行滤波以产生多个时域数据,所述取样数量值等于一预先设定的数量值,使得所述多个时域数据的数量值等于所述预先设定的数量值;Filtering the plurality of digital signals to generate a plurality of time-domain data, the number of samples is equal to a preset number, so that the number of the plurality of time-domain data is equal to the preset number value; 根据所述预先设定的数量值将所述多个时域数据转换为一频域数据;converting the plurality of time-domain data into frequency-domain data according to the preset quantity value; 当所述多个时域数据转换为所述频域数据后释放储存所述时域数据的一储存空间;releasing a storage space for storing the time domain data after converting the plurality of time domain data into the frequency domain data; 执行一比对程序将所述频域数据与一预设频谱特征表比对,并根据所述比对程序的一比对结果发出一通知信号;以及Executing a comparison program to compare the frequency domain data with a preset spectrum characteristic table, and sending a notification signal according to a comparison result of the comparison program; and 执行所述比对程序后,释放储存所述频域数据的所述储存空间。After the comparison program is executed, the storage space for storing the frequency domain data is released. 11.根据权利要求10所述的振动信号监测方法,其中将所述多个时域数据转换为所述频域数据的步骤还包含:11. The vibration signal monitoring method according to claim 10, wherein the step of converting said plurality of time-domain data into said frequency-domain data further comprises: 提供一转换系数;以及provide a conversion factor; and 根据所述预先设定的数量值及所述转换系数将所述多个时域数据转换为所述频域数据。converting the plurality of time-domain data into the frequency-domain data according to the preset quantity value and the conversion coefficient. 12.根据权利要求10所述的振动信号监测方法,其中执行所述比对程序将所述频域数据与所述预设频谱特征表比对,并根据所述比对程序的所述比对结果发出所述通知信号的步骤还包含:12. The vibration signal monitoring method according to claim 10, wherein performing the comparison program compares the frequency domain data with the preset spectrum feature table, and according to the comparison of the comparison program As a result, the step of sending the notification signal also includes: 将所述频域数据的频域点与所述预设频谱特征表的频域点比对并得到一总差距值;以及comparing the frequency domain points of the frequency domain data with the frequency domain points of the preset spectrum feature table to obtain a total difference value; and 当所述比对结果是所述总差距值大于一门坎值时,设定所述通知信号为一警示信号。When the comparison result is that the total difference value is greater than a threshold value, the notification signal is set as a warning signal. 13.根据权利要求10所述的振动信号监测方法,还包含:13. The vibration signal monitoring method according to claim 10, further comprising: 使所述储存空间的容量对应于所述预先设定的数量值。Make the capacity of the storage space correspond to the preset quantity value. 14.根据权利要求10所述的振动信号监测方法,其中当所述多个时域数据转换为所述频域数据后释放所述储存空间的步骤还包含:14. The vibration signal monitoring method according to claim 10, wherein the step of releasing the storage space after converting the plurality of time-domain data into the frequency-domain data further comprises: 将所述储存空间的写保护机制解除,以释放所述储存空间,使另一时域数据覆盖于所述储存空间。The write protection mechanism of the storage space is released to release the storage space, so that another time domain data is overwritten in the storage space. 15.根据权利要求10所述的振动信号监测方法,其中当所述多个时域数据转换为所述频域数据后释放所述储存空间的步骤还包含:15. The vibration signal monitoring method according to claim 10, wherein the step of releasing the storage space after converting the plurality of time-domain data into the frequency-domain data further comprises: 将所述储存空间的所述多个时域数据删除,以释放所述储存空间,使另一时域数据存放于所述储存空间。The plurality of time-domain data in the storage space is deleted to release the storage space, so that another time-domain data is stored in the storage space. 16.根据权利要求10所述的振动信号监测方法,其中执行所述比对程序后,释放所述储存空间的步骤还包含:16. The vibration signal monitoring method according to claim 10, wherein after executing the comparison program, the step of releasing the storage space further comprises: 将所述储存空间的写保护机制解除,以释放所述储存空间,使另一频域数据覆盖于所述储存空间。The write protection mechanism of the storage space is released to release the storage space, so that another frequency domain data is covered in the storage space. 17.根据权利要求10所述的振动信号监测方法,其中执行所述比对程序后,释放所述储存空间的步骤还包含:17. The vibration signal monitoring method according to claim 10, wherein after executing the comparison program, the step of releasing the storage space further comprises: 将所述储存空间的所述频域数据删除,以释放所述储存空间,使另一频域数据存放于所述储存空间。The frequency domain data in the storage space is deleted to release the storage space, so that another frequency domain data is stored in the storage space.
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US8250921B2 (en) * 2007-07-06 2012-08-28 Invensense, Inc. Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics
CN101436046B (en) * 2008-12-08 2010-10-06 东南大学 Integrated multichannel synchronous oscillation data acquiring and monitoring and analysis diagnostic device
JP2011101213A (en) * 2009-11-06 2011-05-19 Seiko Epson Corp Vibration device
US8827550B2 (en) * 2009-12-23 2014-09-09 Intel Corporation Thermal sensor using a vibrating MEMS resonator of a chip interconnect layer
TWM405700U (en) * 2010-12-08 2011-06-11 Fan-En Yue Micro-electromechanical receiver
CN103220610A (en) * 2013-03-28 2013-07-24 山东共达电声股份有限公司 MEMS (micro-electromechanical system) microphone and sound receiving device
WO2015032094A1 (en) * 2013-09-09 2015-03-12 Robert Bosch Gmbh Shock sensor
US9435698B2 (en) * 2013-12-16 2016-09-06 Tdg Aerospace, Inc. Monitoring systems and methods
CN104754456A (en) * 2013-12-30 2015-07-01 天津福润龙科技发展有限公司 Pickup device
CN103954795B (en) * 2014-04-30 2016-04-13 中国科学院地质与地球物理研究所 A kind of can the mems accelerometer of through engineering approaches
US9955274B2 (en) * 2015-04-08 2018-04-24 The Boeing Company Vibration monitoring systems
TWI633046B (en) * 2016-12-29 2018-08-21 財團法人工業技術研究院 Micro-electromechanical apparatus for heating energy control
CN108168811A (en) * 2017-12-12 2018-06-15 电子科技大学 The Portable acquiring analytical equipment and method of a kind of vibration signal
CN108666412A (en) * 2018-05-31 2018-10-16 歌尔股份有限公司 A kind of MEMS microphone and baroceptor integrated morphology and preparation method thereof
CN108981826A (en) * 2018-09-12 2018-12-11 成都安尔法智控科技有限公司 Three shaft vibrations and temperature monitoring sensor

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
《Design of a NEMS based LC oscillation circuit for tiny vibration determination》;Ming Yin;《2011 International Conference on Electric Information and Control Engineering》;20110417;全文 *
《Nondestructive diagnosis of flip chips based on vibration analysis using PCA-RBF》;Lei Su;《Mechanical Systems and Signal Processing》;20170215;全文 *
《振动信号多通道同步整周期数据采集卡设计》;杨世锡;《振动.测试与诊断》;20130215;全文 *

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