TWI633046B - Micro-electromechanical apparatus for heating energy control - Google Patents

Abstract

A micro-electromechanical device capable of controlling heating energy includes a sensor and an integrated circuit chip. The heating element of the sensor is used for heating the sensing element. The detection element of the sensor is used to detect the physical quantity, and the memory unit of the integrated circuit chip stores the target value of the sensing element. The data processing unit of the integrated circuit chip converts the physical quantity into a converted value, and defines the gap value as the target value minus the converted value. In addition, the control unit of the integrated circuit chip sets a parameter value according to the gap value, and the driving unit drives the heating element to adjust the heat generated by the heating element according to the parameter value, so that the heating element heating time and heating frequency can be reduced to reduce power consumption. The micro-electromechanical device can be applied to a microcomputer inductive sensor that needs to control the operating temperature, such as a gas sensor.

Description

Micro-electromechanical device capable of controlling heating energy

The present invention relates to a micro-electro-mechanical device, and more particularly, to a micro-electro-mechanical device for controlling heating energy.

In recent years, smart micro-mobile devices have become increasingly popular and integrated into the lives of the public, which are closely related to the recent booming APP applications. The reason why these APP applications can achieve the function of smart interaction is mainly because the sensing technology of human-machine interaction with the environment continues to evolve. By adding various sensors to the smart micro-mobile device, the environmental sensing information can be provided to the user in time to achieve a variety of life applications. Among the many types of sensors, the development of microelectromechanical gas sensors is the most striking.

The sensing method of the existing micro-electro-mechanical gas sensor is to apply different voltages to the heater, so that the heater heats the sensing material, so that the sensing material reaches the preset operating temperature of different gases. However, when the temperature of the sensing material is changed due to external environment or other factors, and it is impossible to operate at the optimal operating temperature of the gas to be measured, it will cause different types of gas to be measured to change the output of the sensor. Therefore, it is not possible to clearly identify what kind of gas and its concentration are caused by changes in the sensing signal. Generally, a voltage is applied to the heater for a fixed time to ensure that the temperature of the sensing material can reach a preset operating temperature and maintain a constant temperature. However, during the process of actually driving the heater to heat the sensing material, there may be a difference between the preset operating temperature and the actual operating temperature. Therefore, although the above method can maintain a constant temperature, its preset operating temperature may not necessarily be equal to the actual operating temperature. In addition, the method of supplying the voltage to drive the heater for a fixed time will provide excess heat, which cannot effectively reduce the power consumption of the micro-electromechanical gas sensor.

The invention provides a micro-electromechanical device, which can improve the accuracy of sensing and reduce the consumption of electrical energy.

The invention provides a micro-electromechanical device, which includes a sensor and an integrated circuit chip. The sensor includes a sensing element, a heating element and at least one detecting element. The integrated circuit chip includes a memory unit, a data processing unit, a control unit and a driving unit. The heating element is used for heating the sensing element, at least one detecting element is used for detecting at least one physical quantity, and the memory unit stores at least one target value of the sensing element. The data processing unit converts at least one physical quantity into at least one conversion value, and defines at least one gap value at least one target value minus at least one conversion value. The control unit sets at least one parameter value according to the at least one gap value, and the driving unit drives the heating element to adjust the heat generated by the heating element according to the at least one parameter value.

The invention further provides a micro-electromechanical device, which includes a sensor and an integrated circuit chip. The sensor includes a sensing element, a heating element and at least one detecting element. The integrated circuit chip includes a memory unit, a data processing unit, a control unit and a driving unit. The heating element is used for heating the sensing element, and the at least one detecting element is used for detecting at least one physical quantity. At least one detection element is a power meter, and at least one physical quantity is the power of the heating element. The memory unit stores at least one target value of the sensing element. The data processing unit converts at least one physical quantity into at least one conversion value, and defines at least one gap value at least one target value minus at least one conversion value. The control unit sets at least one parameter value according to the at least one gap value, and the driving unit drives the heating element to adjust the heat generated by the heating element according to the at least one parameter value. When at least one gap value is greater than 0, the driving unit drives the heating element according to at least one parameter value to increase the heat generated by the heating element. When at least one gap value is less than 0, the driving unit drives the heating element according to at least one parameter value to reduce the heat generated by the heating element. At least one parameter value includes voltage and time, and the control unit is configured to adjust the voltage and time according to the Joule heat equation. The Joule heat equation includes a first heat difference, a first resistance value, and a first voltage value.

The invention also proposes a micro-electromechanical device, which is suitable for sensing the concentration of a gas. The micro-electromechanical device includes a sensor and an integrated circuit chip. The sensor includes a sensing element, a heating element and at least one detecting element. The integrated circuit chip includes a memory unit, a data processing unit, a control unit and a driving unit. The sensing element is a gas sensing layer. The heating element is used for heating the sensing element, and the at least one detecting element is used for detecting at least one physical quantity. At least one detection element is a power meter, and at least one physical quantity is the power of the heating element. The power meter has a first resistance value and a first voltage value. The memory unit stores at least one target value of the sensing element. The data processing unit converts at least one physical quantity into at least one conversion value, and defines at least one gap value to be at least one target value minus at least one conversion value, wherein at least one gap value is a first heat difference. The control unit sets at least one parameter value according to the at least one gap value, and the driving unit drives the heating element to adjust the heat generated by the heating element according to the at least one parameter value. The at least one parameter value includes voltage and time. The control unit is used to adjust the voltage and time according to the Joule heat equation. The Joule heat equation includes a first heat difference, a first resistance value, and a first voltage value.

The invention further proposes a micro-electromechanical device, which is suitable for sensing the concentration of a gas. The micro-electromechanical device includes a sensor and an integrated circuit chip. The sensor includes a sensing element, a heating element and at least one detecting element. The sensing element includes a gas sensing layer. The heating element is used for heating the sensing element, and the at least one detecting element is used for detecting at least one physical quantity. The at least one detection element includes a power meter. The power meter is electrically connected in series with the heating element. The power meter and the heating element are electrically connected to the integrated circuit chip, respectively, and the resistance value of the power meter is smaller than the resistance value of the heating element. The shortest distance from the power meter to the heating element is greater than the shortest distance from the sensing element to the heating element.

Based on the foregoing, in the micro-electromechanical device of the embodiment of the present invention, the driving unit drives the heating element to adjust the heat generated by the heating element according to at least one physical quantity detected by the at least one detection element, so that the heating element can provide The heat causes the sensing element to reach a predetermined operating temperature. Therefore, the micro-electromechanical device has higher sensing accuracy. In addition, the driving unit also drives the heating element to adjust the heat generated by the heating element according to at least one gap value obtained by subtracting at least one conversion value from at least one target value, so the heating element provides heat to make the sensing element reach At the same time as the predetermined operating temperature, the heat generated by the heating element can be accurately controlled. In the case that it is not necessary to continuously supply power to drive the heater at a fixed time, the micro-electromechanical device of the embodiment of the present invention can effectively reduce power consumption.

In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings.

FIG. 1A is a schematic cross-sectional view of a micro-electromechanical device according to a first embodiment of the present invention. Please refer to FIG. 1A. In this embodiment, the micro-electromechanical device 100 can be applied to an environmental sensor to detect environmental characteristics such as gas or air quality in the environment in which humans are located. For example, the micro-electromechanical device 100 is suitable for sensing the concentration of a gas, or the related characteristics of a gas. The MEMS device 100 includes a sensor 110 and an integrated circuit chip 120. The sensor 110 includes a sensing element 112, a heating element 114, and at least one detecting element 116. Specifically, the micro-electromechanical device 100 of this embodiment further includes a thin film 130, a base 140, and a substrate 150. The base 140 and the integrated circuit chip 120 are bonded to the substrate 150 through a bonding layer 160, and the base 140 includes a cavity 141. In addition, the thin film 130 is disposed on the base 140, and the thin film 130 covers the cavity 141 for example. In other embodiments not shown, the film 130 may be partially covered with a cavity, and a part of the cavity is exposed to reduce the heat lost through the film, which is not limited in the present invention. In this embodiment, the base 140 may be made of a silicon substrate, other semiconductor substrates, or glass substrates, and the material of the thin film 130 may be selected from silicon nitride (Si ₃ N ₄ ), Suitable materials such as silicon dioxide (SiO2).

In this embodiment, the film 130 has a first surface 130a and a second surface 130b opposite to the first surface 130a. The thin film 130 is connected to the base 140 with a second surface 130b of one part thereof, and covers the cavity 141 with the second surface 130b of another part. In addition, the heating element 114 is disposed on the first surface 130 a of the film 130. In this embodiment, the film 130 may be, for example, a multi-layer film or a single-layer film. The present invention does not limit the number of layers of the film. In addition, the thin film 130 may be manufactured by, for example, a MEMS Thin Film Deposition Process. In addition, the heating element 114 is, for example, a heating coil, and a material thereof may be, for example, platinum (Platinum, Pt), titanium (Titanium, Ti), or tungsten (Tungsten, W). By applying a current, the heating element 114 can generate heat.

In this embodiment, the sensing element 112 is disposed above the heating element 114, and the heating element 114 is disposed between the sensing element 112 and the film 130, for example. Specifically, the micro-electromechanical device 100 is, for example, a micro-electro-mechanical gas sensing device, and the sensing element 112 is, for example, a gas sensing layer. The sensing element 112 is in contact with the heating element 114, and the heating element 114 is used to heat the sensing element 112. In this embodiment, the sensing element 112 can sense different gases due to different types of nano-catalysts contained therein. Generally speaking, the resistance value of the sensing element 112 changes as the concentration of the target gas adsorbed changes. Therefore, by observing the change in the current input to the sensing element 112, the change in the resistance value of the sensing element 112 can be converted to know the change in the concentration of the target gas around the MEMS device 100. The heating element 114 can heat the sensing element 112 and maintain the temperature of the sensing element 112 within a preset range. In this way, when the target gas concentration changes, the resistance value generated by the sensing element 112 also changes accordingly.

In this embodiment, the integrated circuit chip 120 is electrically coupled to the sensing element 112, the heating element 114, and the at least one detecting element 116, respectively. The at least one detecting element 116 is used for detecting at least one physical quantity. Specifically, the at least one detection element 116 is, for example, a power meter, and the at least one physical quantity is the power P _h of the heating element 114. In general, the power meter detects the power P _{h of the} heating element 114 through the following relationship: ----------- (1) Among them, Vp represents the voltage value across the power meter when the heating element 114 is heated, which can be known by measurement. Rp is the resistance value of the power meter, which is a known value, and V represents the voltage difference applied by the system to the power meter and the heating element 114, which is the set value of the power supply and is also a known value. In this embodiment, the power meter is, for example, a resistance element. The power meter is electrically connected in series with the heating element 114, and the resistance value of the power meter is smaller than the resistance value of the heating element 114.

In this embodiment, a power meter (at least one detection element 116) is disposed on the first surface 130a of the film 130, and the shortest distance from the power meter to the heating element 114 is, for example, the distance d shown in FIG. 1A, which is greater than The shortest distance from the sensing element 112 to the heating element 114. In detail, the power meter is disposed at a position remote from the heating element 114, but is not limited to a specific position provided on the film 130. In this way, the resistance value of the power meter will not be affected by the high temperature to ensure the measurement accuracy of the power meter. In some embodiments, the power meter can also be disposed at other positions of the micro-electromechanical device 100, such as the substrate 150. In addition, in this embodiment, in order to use the formula (1) to obtain the power P _{h of} the heating element 114, the power meter (at least one detection element 116) needs to be electrically connected to the heating element 114 in series, and the resistance of the power meter The value R _p needs to be smaller than the resistance value R _{h of the} heating element 114.

FIG. 1B is a schematic diagram of a sensor and an integrated circuit chip according to the first embodiment of the present invention. Please refer to FIG. 1A and FIG. 1B simultaneously. In this embodiment, the integrated circuit chip 120 includes a memory unit 122, a data processing unit 124, a control unit 126, and a driving unit 128 electrically coupled to each other. The memory unit 122 is configured to store at least one target value of the sensing element 112, and the at least one target value is, for example, a predetermined heat value of a target gas suitable for heating the sensing element 112 for concentration detection. The data processing unit 124 is configured to convert at least one physical quantity detected by the power meter (at least one detection element 116), such as the power P _h of the heating element 114, into at least one conversion value, such as the heat generated by the heating element 114.

Specifically, the data processing unit 124 includes a sensing data processing unit 124_1, a sensing data correction unit 124_2, an analog digital conversion unit 124_3, a power data processing unit 124_4, a power data correction unit 124_5, and an analog digital conversion unit 124_6. For example, after the resistance signal of the sensing element 112 is converted into a digital signal by the analog digital conversion unit 124_3, the signal offset is corrected by the sensing data correction unit 124_2, and then transmitted to the sensing data processing unit 124_1 to sense the concentration of the target gas. Variety. In addition, the electrical signal (voltage difference) detected by the power meter is converted to a digital signal by the analog digital conversion unit 124_6, and the signal offset correction is performed by the power data correction unit 124_5, and then transmitted to the power data processing unit 124_4.

In this embodiment, the power data processing unit 124_4 obtains the power P _{h of the} heating element 114 through the above formula (1), for example. Further, the power data processing unit 124_4 power P _h in accordance with the heating time and the heating element 114 of heating element t obtained actual heat output value 114 (at least a converted value). Specifically, at least one gap value is defined as at least one target value minus at least one conversion value. The at least one gap value is, for example, a first heat difference DQ ₁ obtained by subtracting an actual output heat value (conversion value) of the heating element 114 from a predetermined heat value (target value).

In this embodiment, the control unit 126 sets at least one parameter value according to at least one gap value (the first heat difference DQ ₁ ), and the driving unit 128 drives the heating element 114 to adjust the heat generated by the heating element 114 according to the at least one parameter value. . Specifically, the control unit 126 includes a heating control unit 126_1 and a comparison unit 126_2. The comparison unit 126_2 receives signals provided by the power data processing unit 124_4 and the memory unit 122, and determines whether the actual output heat value of the heating element 114 has reached a predetermined heat value. If the actual output heat value of the heating element 114 does not reach the predetermined heat value, the heating control unit 126_1 controls the driving unit 128 to drive the heating element 114 to heat to compensate the above-mentioned first heat difference DQ ₁ . In detail, when the first heat difference DQ ₁ (at least one gap value) is greater than 0, it means that the actual output heat value does not reach the predetermined heat value. At this time, the driving unit 128 drives the heating element 114 according to at least one parameter value to increase the heat generated by the heating element 114. In addition, when the first heat difference DQ ₁ (at least one gap value) is less than 0, it means that the actual output heat value exceeds a predetermined heat value. At this time, the driving unit 128 drives the heating element 114 according to at least one parameter value to reduce the heat generated by the heating element 114.

Specifically, the control unit 126 (e.g., a heating control unit 126_1) setting at least _one difference between a parameter value according to the first heat DQ. The at least one parameter value includes, for example, the voltage V and the time t. The control unit 126 can be used to adjust the voltage V and time t according to the Joule heat equation. The Joule heat equation includes a first heat difference DQ ₁ , a first resistance value R _p (ie, a resistance value R _{p of the} power meter), and a first voltage value V. _p (that is, the voltage difference V _p across the power meter when the heating element 114 is heated). The Joule heat equation is as follows: -----------(2)

Specifically, the micro-electromechanical device 100 can set the voltage difference (voltage V) that the system should apply to the power meter and the heating element 114 and / or the heating time t for the system to drive the heating element 114 to meet the above-mentioned thermal Joule equation (formula (2)), so as to adjust the heat generated by the heating element 114 to make up for the first heat difference DQ ₁ . Therefore, the heat generated by the heating element 114 can be accurately controlled.

In addition, the memory unit 122 may also store at least one piece of data (at least one piece of data between the voltage V and the time t) that makes up the first thermal difference DQ ₁ . At least one of the voltage V and the time t is an optimized data that has been experimentally verified, so that the heating element 114 can accurately compensate for the first heat difference DQ ₁ . The control unit 126 may directly use at least one of the optimized voltage V and time t according to the obtained first heat difference DQ ₁ to quickly compensate the first heat difference DQ ₁ . Specifically, the micro-electromechanical device 100 according to the first embodiment of the present invention can effectively reduce the consumption of electric power without the need to continuously supply electric power to drive the heating element 114 for a fixed time.

2A is a schematic cross-sectional view of a micro-electromechanical device according to a second embodiment of the present invention, and FIG. 2B is a schematic diagram of a sensor and an integrated circuit chip of the second embodiment of the present invention. Please refer to FIG. 2A first. The micro-electromechanical device 200 of the embodiment of FIG. 2A is similar to the micro-electromechanical device 100 of the embodiment of FIG. 1A, and the differences are as follows. The sensor 210 of the micro-electromechanical device 200 includes at least one detection element 216, and the at least one detection element 216 is, for example, a thermometer. A thermometer (at least one detection element 216) is disposed between the heating element 114 and the sensing element 112. In this way, the heat generated by the heating element 114 is not lost and the thermometer can accurately detect the temperature of the sensing element 112. In addition, please refer to FIG. 2B. In this embodiment, the data processing unit 224 of the integrated circuit chip 220 includes temperature data in addition to the sensing data processing unit 124_1, the sensing data correction unit 124_2, and the analog digital conversion unit 124_3 The processing unit 224_1, the temperature data correction unit 224_2, and the analog-to-digital conversion unit 224_3. The electrical signal of the thermometer is converted into a digital signal by the analog digital conversion unit 224_3, for example, and the signal data is corrected by the temperature data correction unit 224_2, and then transmitted to the temperature data processing unit 224_1.

In this embodiment, the data processing unit 224 is configured to convert the electrical signal provided by the thermometer (at least one detection element 216) into a temperature value (at least one conversion value) for calculating the temperature difference DT. In addition, the temperature difference DT (at least one difference value) is defined as a predetermined temperature (at least one target value stored in the memory unit) minus the above-mentioned temperature value (at least one conversion value). In this embodiment, the control unit 126 can be used to set at least one parameter value according to the temperature difference DT. The at least one parameter value includes a voltage V and a time t. Specifically, the control unit 126 can adjust the voltage V and the time t according to at least one data corresponding to the temperature difference DT. At least one piece of data optimized by experiments is stored in the memory unit 122. That is, the micro-electromechanical device 200 can use at least one data obtained from experiments to set the voltage V and time t to adjust the heat generated by the heating element 114, and then quickly and accurately compensate for the temperature difference DT. Specifically, at least one detecting element 216 (thermometer) of the micro-electromechanical device 200 according to the second embodiment of the present invention can detect the temperature of the sensing element 112. In addition, the micro-electro-mechanical device 200 estimates the temperature difference DT based on the detected temperature of the sensing element 112, and adjusts the heat generated by the heating element 114 according to the temperature difference DT. In this way, the heating element 114 can provide heat so that the sensing element 112 does reach a predetermined operating temperature. Therefore, the micro-electromechanical device 200 has higher sensing accuracy. In addition, the micro-electromechanical device 200 according to the second embodiment of the present invention can effectively reduce the power consumption without the need to continuously supply power to drive the heating element 114.

3A is a schematic cross-sectional view of a micro-electromechanical device according to a third embodiment of the present invention, and FIG. 3B is a schematic diagram of a sensor and an integrated circuit chip of the third embodiment of the present invention. Please refer to FIG. 3A first. The MEMS device 300 of the embodiment of FIG. 3A is similar to the MEMS device 100 of the embodiment of FIG. 1A, and the differences are as follows. The sensor 310 of the MEMS device 300 includes at least one detection element 316. The at least one detecting element 316 includes a power meter 316_1 and a thermometer 316_2. The power meter 316_1 is used to detect the power of the heating element 114, and the thermometer 316_2 is used to detect the temperature of the sensing element 112. Further, power meter 316_1 resistance value R _p smaller than the resistance value R _h of the heating element 114, so that the power meter can 316_1 using the formula (1) obtained by the heating element 314 to a power P _h. In addition, in this embodiment, the power meter 316_1 is similar to at least one detection element 116 (power meter) in the embodiment of FIG. 1A, and the thermometer 316_2 is similar to at least one detection element 216 (thermometer) in the embodiment of FIG. 2A. In addition, please refer to FIG. 3B. In this embodiment, the data processing unit 324 of the integrated circuit chip 320 includes power data in addition to the sensing data processing unit 124_1, the sensing data correction unit 124_2, and the analog digital conversion unit 124_3. The processing unit 324_1, the power data correction unit 324_2, and the analog digital conversion unit 324_3, the temperature data processing unit 324_4, the temperature data correction unit 324_5, and the analog digital conversion unit 324_6. Specifically, the electrical signal of the power meter 316_1 is converted into a digital signal by the analog digital conversion unit 324_3, for example, and the signal data is corrected by the power data correction unit 324_2, and then transmitted to the power data processing unit 324_1. In addition, the electrical signal of the thermometer 316_2 is converted into a digital signal by the analog-to-digital conversion unit 324_6, and the signal offset correction is performed by the temperature data correction unit 324_5, and then transmitted to the temperature data processing unit 324_4.

In this embodiment, the data processing unit 324 is configured to convert the electrical signal provided by the power meter 316_1 into a success rate value, and then obtain the actual output heat value of the heating element 114. In addition, the actual output heat value of the heating element 114 is subtracted from the predetermined heat value to obtain the first heat difference DQ ₁ . In addition, the data processing unit 324 is also used to convert the electrical signal provided by the thermometer 316_2 into a temperature value. In addition, the micro-electromechanical device 300 can calculate the second heat difference DQ ₂ according to the temperature value stored in the memory unit 122. The second heat difference DQ ₂ can be defined by the following formula: ----------- (3)

Among them, m is the mass of the sensing element 112, s is the specific heat of the sensing element 112, and Dt is, for example, the temperature difference between the temperature value measured by the thermometer 316_2 and the target temperature value stored in the memory unit 122.

In this embodiment, the control unit 126 sets at least one parameter value according to at least one gap value (the first heat difference DQ ₁ and the first heat difference DQ ₂ ). The driving unit 128 drives the heating element 114 according to the at least one parameter value to adjust the heat generated by the heating element 114. Specifically, the at least one parameter value includes a voltage V that the system should apply to the heating element 114 and a heating time t that the system drives the heating element 114 to perform heating. That is, the control unit 126 can adjust the voltage V and the time t according to the first heat difference DQ ₁ and the second heat difference DQ _{2 to} adjust the heat generated by the heating element 114. Specifically, the micro-electromechanical device 300 according to the third embodiment of the present invention can obtain at least technical effects similar to those described in the first and second embodiments of the present invention. Therefore, the micro-electromechanical device 300 has higher sensing accuracy and can effectively reduce power consumption. In addition, since the micro-electro-mechanical device 300 can simultaneously measure the temperature of the sensing element 112 by means of the thermometer 316_2 and the power of the heating element 114 by means of the power meter 316_1, as the micro-electro-mechanical device 300 adjusts the heat generated by the heating element 114 to Basis for compensation. Therefore, compared with the first embodiment and the second embodiment, the micro-electromechanical device 300 can perform more accurate heat compensation, and can reduce the number and time of heat compensation, thereby effectively reducing power consumption.

Specifically, the sensing data processing unit 124_1, the sensing data correction unit 124_2, the analog digital conversion unit 124_3, 124_6, 224_3, 324_3, 324_6, and the like described in the first, second, and third embodiments. Components such as power data processing units 124_4, 324_1, power data correction units 124_5, 324_2, temperature data processing units 224_1, 324_4, temperature data correction units 224_2, 324_5, heating control unit 126_1, comparison unit 126_2, and drive unit 128 can be, for example, transmitted through Implemented with computing hardware (such as chipset, processor, etc.). For example, the above components may be provided by a Central Processing Unit (CPU), or other programmable microprocessor (Microprocessor), Application Specific Integrated Circuits (ASIC), or other similar devices. To implement, the present invention is not limited thereto.

In addition, the memory unit 122 described in the first embodiment, the second embodiment, and the third embodiment may be, for example, an embedded storage unit or an external storage unit. Internal storage unit can be Random Access Memory (RAM), Read-Only Memory (ROM), Flash memory, Magnetic disk storage device Wait. The external storage unit may be a compact flash (CF) memory card, a secure digital (SD) memory card, a micro SD memory card, a memory stick (MS), etc. It is not limited to this.

FIG. 4 is a flowchart of steps of various gas sensing methods according to an embodiment of the present invention. Please refer to FIG. 4. In this embodiment, the gas sensing method can be applied to at least the micro-electromechanical device 200 in the embodiment of FIG. 2A. The gas sensing method has the following steps. In step S410, initialization of the micro-electromechanical device is performed. Next, in step S420, a voltage is provided to the heating control unit according to the temperature setting stored in the memory unit to drive the heating element to heat the sensing element. It should be noted that the voltage value in step S420 is preset and stored in the memory unit. After that, in step S430, the output of the temperature data processing unit is received to receive, for example, the temperature value of the sensing element. Next, in step S440, it is compared whether the temperature value of the sensing element has reached a target value (that is, a predetermined temperature). If the target value has not been reached, it is determined whether the temperature value of the sensing element exceeds the target value in step S440_1. Specifically, when the temperature difference (at least one gap value) obtained by subtracting the above temperature value from the predetermined temperature (target value) is greater than 0, it means that the temperature value of the sensing element does not exceed the target value, and indicates the temperature of the sensing element The value is less than the target value. At this time, in step S440_2, the voltage value provided to the heating control unit is increased to increase the heat generated by the heating element. In addition, when the temperature difference (at least one difference value) is less than 0, it indicates that the temperature value of the sensing element exceeds the target value, and that the temperature value of the sensing element is greater than the target value. At this time, in step S440_3, the voltage value provided to the heating control unit is reduced to reduce the heat generated by the heating element. The increase amount of the voltage value of the heating control unit or the decrease amount of the voltage value of the heating control unit is obtained based on the experimental data corresponding to the gap value (the temperature difference obtained by subtracting the temperature value of the sensing element from the target value). These corresponding experimental data have been stored in the memory before the initialization of the MEMS device. Next, in step S440_4, the heating control unit adjusts the voltage value and provides an updated voltage value. In step S420, the updated voltage value is provided to the heating control unit again to drive the heating element to heat the sensing element. It should be noted that the voltage value in step S420 is the updated voltage value.

In addition, in step S440, if the temperature value of the sensing element reaches the target value, after waiting for a predetermined time in step S450, the resistance value of the gas sensing layer (sensing element) is measured in step S460, for example, to perform Target gas concentration sensing. After that, in step S470, it is confirmed whether the measurement of all the target gases is completed. If the measurement of all target gases has not been completed, step S420 to step S460 are repeated to measure each target gas. If the measurement of all the target gases has been completed, step S480 is performed to turn off the heating element. Specifically, the gas sensing method according to the embodiment of the present invention can obtain sufficient teaching, suggestions, and implementation description from the description of the embodiment of FIGS. 1A to 3B, and therefore will not be described again.

In summary, in the micro-electromechanical device of the embodiment of the present invention, the driving unit provides an updated voltage to drive the heating element according to at least one physical quantity detected by the at least one detecting element, thereby adjusting the heat generated by the heating element. Therefore, the heating element can provide accurate heat to enable the sensing element to reach the predetermined operating temperature quickly and surely. Therefore, the micro-electromechanical device has higher sensing accuracy. In addition, the driving unit also provides an updated voltage according to at least one gap value obtained by subtracting at least one conversion value from at least one target value. The updated voltage can drive the heating element to adjust the heat generated by the heating element. Therefore, while the heating element provides heat so that the sensing element reaches a predetermined operating temperature, the heat generated by the heating element can be accurately controlled. In the case that it is not necessary to continuously supply power to drive the heater at a fixed time, the micro-electromechanical device of the embodiment of the present invention can effectively reduce power consumption.

Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.

100, 200, 300: MEMS 110, 210, 310: sensor 112: sensing element 114: heating element 116, 216, 316: detection element 120, 220, 320: integrated circuit chip 122: memory unit 124, 224, 324: data processing unit 124_1: sensing data processing unit 124_2: sensing data correction unit 124_3, 124_6, 224_3, 324_3, 324_6: analog digital conversion unit 124_4, 324_1: power data processing unit 124_5, 324_2: power Data correction unit 126: control unit 126_1: heating control unit 126_2: comparison unit 128: drive unit 130: film 130a: first surface 130b: second surface 140: base 141: cavity 150: substrate 160: bonding layer 224_1, 324_4 : Temperature data processing unit 224_2, 324_5: Temperature data correction unit 316_1: Power meter 316_2: Thermometer d: Distance S410, S420, S430, S440, S440_1, S440_2, S440_3, S440_4, S450, S460, S470, S480: Gas sensing Method steps

FIG. 1A is a schematic cross-sectional view of a micro-electromechanical device according to a first embodiment of the present invention. FIG. 1B is a schematic diagram of a sensor and an integrated circuit chip according to the first embodiment of the present invention. 2A is a schematic cross-sectional view of a micro-electromechanical device according to a second embodiment of the present invention. 2B is a schematic diagram of a sensor and an integrated circuit chip according to a second embodiment of the present invention. 3A is a schematic cross-sectional view of a micro-electromechanical device according to a third embodiment of the present invention. 3B is a schematic diagram of a sensor and an integrated circuit chip according to a third embodiment of the present invention. FIG. 4 is a flowchart of steps of various gas sensing methods according to an embodiment of the present invention.

Claims (20)

A micro-electromechanical device includes: a sensor including: a sensing element; a heating element for heating the sensing element; and at least one detection element for detecting at least one physical quantity; and a product The circuit chip includes: a memory unit storing at least one target value of the sensing element; a data processing unit, wherein the data processing unit converts the at least one physical quantity into at least one conversion value, and defines at least one gap value as the At least one target value minus the at least one conversion value; a control unit that sets at least one parameter value according to the at least one gap value; and a driving unit that drives the heating element to adjust the heating element generated according to the at least one parameter value A heat. According to the micro-electromechanical device described in item 1 of the patent application scope, wherein the at least one detection element is a power meter, and the at least one physical quantity is a power of the heating element. According to the micro-electro-mechanical device described in item 1 of the patent application scope, wherein the at least one detecting element is a thermometer, and the at least one physical quantity is a temperature of the sensing element. According to the micro-electro-mechanical device described in item 1 of the patent application scope, wherein the at least one detection element includes a power meter and a thermometer, the power meter is used to detect a power of the heating element, and the thermometer is used to detect A temperature of the sensing element. The micro-electromechanical device according to item 2 of the scope of patent application, wherein the at least one gap value is a first heat difference. According to the micro-electromechanical device described in item 2 of the patent application scope, a shortest distance from the power meter to the heating element is greater than a shortest distance from the sensing element to the heating element. The micro-electromechanical device according to item 2 of the scope of patent application, wherein the power meter is electrically connected in series with the heating element, and a resistance value of the power meter is smaller than a resistance value of the heating element. According to the micro-electromechanical device according to item 5 of the patent application scope, wherein the at least one parameter value includes a voltage and a time, the control unit is configured to adjust the voltage and the time according to a Joule heat equation, and the Joule heat equation includes The first heat difference, a first resistance value, and a first voltage value. The micro-electromechanical device according to item 8 of the scope of patent application, wherein the voltage and the time satisfy the following equations: Among them, DQ _{1 is} the first heat difference, V is the voltage, R _{p is} the first resistance value, V _p is the first voltage value across the power meter when the heating element is heating, and t is the time. The micro-electromechanical device according to item 3 of the scope of patent application, wherein the at least one gap value is a temperature difference. The micro-electromechanical device according to item 3 of the scope of patent application, wherein the thermometer is disposed between the heating element and the sensing element. According to the micro-electromechanical device according to item 10 of the scope of patent application, wherein the at least one parameter value includes a voltage and a time, the control unit is configured to adjust the voltage and the time according to at least one data corresponding to the temperature difference, and The at least one data is stored in the memory unit. The micro-electromechanical device according to item 4 of the scope of patent application, wherein the at least one gap value includes a first heat difference and a second heat difference. The micro-electromechanical device according to item 4 of the scope of the patent application, wherein the power meter is electrically connected in series with the heating element, and a resistance value of the power meter is smaller than a resistance value of the heating element. According to the micro-electromechanical device according to item 13 of the patent application scope, wherein the at least one parameter value includes a voltage and a time, the control unit is configured to adjust the voltage and the time according to the first heat difference and the second heat difference. . A micro-electromechanical device includes: a sensor including: a sensing element; a heating element for heating the sensing element; and at least one detection element for detecting at least one physical quantity; and a product The circuit chip includes: a memory unit storing at least one target value of the sensing element; a data processing unit, wherein the data processing unit converts the at least one physical quantity into at least one conversion value, and defines at least one gap value as the At least one target value minus the at least one conversion value; a control unit that sets at least one parameter value according to the at least one gap value; and a driving unit that drives the heating element to adjust the heating element generated according to the at least one parameter value A heat amount, wherein when the at least one gap value is greater than 0, the driving unit increases the heat generated by the heating element according to the at least one parameter value; when the at least one gap value is less than 0, the driving unit A parameter value reduces the heat generated by the heating element, wherein the at least one parameter value Comprising a voltage and a time, the control unit is configured to Joule heat according to an equation of the adjustment voltage and the time of the Joule heat difference equation of heat comprising a first, a first resistance value and a first voltage value. According to the micro-electromechanical device according to item 16 of the patent application scope, wherein the at least one detection element is a power meter, and the at least one physical quantity is a power of the heating element. According to the micro-electromechanical device according to item 17 of the scope of patent application, wherein the at least one gap value is the first heat difference, the power meter has the first resistance value and the first voltage value, and the voltage and the time satisfy the following equation: Among them, DQ _{1 is} the first heat difference, V is the voltage, R _{p is} the first resistance value, V _p is the first voltage value across the power meter when the heating element is heating, and t is the time. A micro-electromechanical device suitable for sensing the concentration of a gas includes: a sensor comprising: a sensing element that is a gas sensing layer; a heating element for heating the sensing element; and at least one detector A measuring element for detecting at least one physical quantity, wherein the at least one detecting element is a power meter, the at least one physical quantity is a power of the heating element, and the power meter has a first resistance value and a first voltage value And the first voltage value is defined as a voltage value across the power meter when the heating element is heated; and an integrated circuit chip including: a memory unit storing at least a target value of the sensing element; a data A processing unit, wherein the data processing unit converts the at least one physical quantity into at least one conversion value, and defines at least one gap value minus the at least one conversion value, wherein the at least one gap value is a first Heat difference; a control unit that sets at least one parameter value based on the at least one gap value; and a drive unit that depends on the at least one The heating element is numerically driven to adjust a heat generated by the heating element. The at least one parameter value includes a voltage and a time. The control unit is used to adjust the voltage and the time according to a Joule heat equation. The Joule heat equation Including the first heat difference, the first resistance value, and the first voltage value. A micro-electromechanical device suitable for sensing the concentration of a gas includes: a sensor including: a sensing element including a gas sensing layer; a heating element for heating the sensing element; and at least one detector A measuring element for detecting at least one physical quantity, wherein the at least one detecting element includes a power meter; and an integrated circuit chip, wherein the power meter is electrically connected in series with the heating element, and the power meter and the heating element are respectively connected with the heating element The integrated circuit chip is electrically connected, and the resistance value of the power meter is smaller than the resistance value of the heating element, wherein a shortest distance from the power meter to the heating element is greater than a shortest distance from the sensing element to the heating element.