CN111351566A - Vibration sensor with monitoring function and vibration signal monitoring method thereof - Google Patents
Vibration sensor with monitoring function and vibration signal monitoring method thereof Download PDFInfo
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Abstract
A vibration sensor with monitoring function comprises a substrate, a micro-electromechanical vibration sensing chip and a special application integrated circuit chip. The micro-electromechanical vibration sensing chip is arranged on the substrate and used for sensing the vibration born by the object to be tested so as to generate a plurality of vibration signals. The application specific integrated circuit chip is arranged on the substrate and electrically connected to the micro-electromechanical vibration sensing chip, and comprises a sampling module, a conversion module and an analysis module. The sampling module receives the vibration signals, converts the vibration signals into digital signals, and filters the digital signals to generate a plurality of time domain data. The conversion module converts the time domain data into frequency domain data according to a preset quantity value. The analysis module executes a comparison program to compare the frequency domain data with a preset frequency spectrum characteristic table and sends out a notification signal according to a comparison result of the comparison program. The invention further provides a vibration signal monitoring method.
Description
Technical Field
The present invention relates to a vibration sensor, and more particularly, to a vibration sensor with monitoring function. The invention also relates to a vibration signal monitoring method of the vibration sensor.
Background
Sensors are important devices for smart machines and smart manufacturing. The vibration sensor can detect vibration signals of an object to be measured, such as a machine tool, a motor, a ball screw, a feeding device and the like. The state data of the object to be measured can be obtained by analyzing the vibration signal.
Since the vibration signal needs to be subjected to complex signal conversion and signal analysis, the existing vibration sensor cannot directly analyze the frequency domain data of the obtained vibration signal. These vibration signals need to be transmitted to a monitoring machine outside the vibration sensor, and then a microcontroller inside the monitoring machine performs signal conversion and signal analysis by using signal analysis software to obtain information on the vibration state of the object to be measured, which is extremely inefficient.
In addition, because the monitoring machine platform for executing the signal analysis software is too large in size, the monitoring machine platform is extremely difficult to be integrated with the existing vibration sensor, and is not easy to be applied to the related application fields of intelligent machinery and intelligent manufacturing.
In order to meet different monitoring requirements, a plurality of vibration sensors may need to be installed on the object to be detected, and a higher sampling frequency and a wider frequency domain monitoring range are needed, so that a large amount of data needs to be transmitted. Therefore, when the existing vibration sensor transmits a vibration signal to a monitoring console outside the vibration sensor, data loss is easily caused or the data transmission time is too long, and the object to be detected cannot be monitored in real time.
Disclosure of Invention
The invention aims to provide a vibration sensor with a monitoring function and a vibration signal monitoring method thereof, and aims to solve the problems that the existing vibration sensor and monitoring machine lack efficiency in use, cannot monitor an object to be detected in real time, cannot be applied to the related application fields of intelligent machinery and intelligent manufacturing and the like.
The invention provides a vibration sensor with a monitoring function, which comprises a substrate, a micro-electromechanical vibration sensing chip and a special application integrated circuit chip. The micro-electromechanical vibration sensing chip is arranged on the substrate and used for sensing the vibration born by the object to be tested so as to generate a plurality of vibration signals. The application specific integrated circuit chip is arranged on the substrate and electrically connected to the micro-electromechanical vibration sensing chip, and comprises a sampling module, a conversion module and an analysis module. The sampling module comprises an analog front end unit, an analog-digital conversion unit and a filtering unit. The analog front end unit receives the vibration signals. The analog-digital conversion unit converts the vibration signals into a plurality of digital signals. The filtering unit filters the digital signals to generate a plurality of time domain data. The conversion module comprises a conversion unit and a time interval unit. The time interval unit transmits a preset quantity value to the conversion unit. The conversion unit converts the time domain data into frequency domain data, and the quantity value of the time domain data is equal to a preset quantity value. The analysis module executes a comparison program for comparing the frequency domain data with a preset frequency spectrum characteristic table and sending out a notification signal according to a comparison result of the comparison program.
The invention provides another vibration signal monitoring method, which comprises the following steps: detecting the vibration borne by the object to be detected to generate a plurality of vibration signals; receiving the vibration signals and converting the vibration signals into a plurality of digital signals; filtering the digital signals to generate a plurality of time domain data; converting the time domain data into frequency domain data, wherein the quantity value of the time domain data is equal to the preset quantity value; and executing a comparison program to compare the frequency domain data with a preset frequency spectrum characteristic table, and sending out a notification signal according to a comparison result of the comparison program.
As described above, according to the vibration sensor with monitoring function and the vibration signal monitoring method thereof of the embodiment of the present invention, the following technical effects can be provided:
(1) in an embodiment of the invention, the asic chip of the vibration sensor with monitoring function can analyze the frequency domain data of the vibration signal, thereby reducing the analysis time and improving the efficiency of real-time monitoring.
(2) In an embodiment of the invention, the asic chip of the vibration sensor with monitoring function can analyze the frequency domain data of the vibration signal without transmitting the vibration signal to a monitoring machine external to the vibration sensor, so that data loss is avoided and data transmission time is shortened.
(3) In an embodiment of the invention, the conversion module of the asic chip of the vibration sensor with monitoring function has a special circuit structure and operation mechanism, so that the sampling module of the asic chip does not need to perform secondary sampling, thereby improving the efficiency of the vibration sensor.
(4) In an embodiment of the invention, the conversion module of the asic chip of the vibration sensor with monitoring function has a special circuit structure and an operation mechanism, so that the sensing bandwidth of the vibration sensor can be adjusted by changing the data update rate of the filter unit of the asic chip, thereby adapting to the objects to be measured with various different vibration bandwidths and expanding the objects to be used of the vibration sensor with monitoring function.
(5) In an embodiment of the invention, the asic chip of the vibration sensor with monitoring function has functions of integrating vibration signal sensing and vibration signal analysis and a special storage space management mechanism, so that the storage space can be utilized more effectively, and the vibration sensor with monitoring function can be miniaturized, thereby meeting the requirements of related application fields of intelligent machinery and intelligent manufacturing.
Drawings
Fig. 1 is a schematic view of a vibration sensor with a monitoring function according to a first embodiment of the present invention.
Fig. 2 is a flow chart of a first embodiment of the present invention.
Fig. 3 is a circuit diagram of a vibration sensor with a monitoring function according to a second embodiment of the present invention.
Fig. 4 is a circuit diagram of an asic chip of a vibration sensor with a monitoring function according to a second embodiment of the present invention.
Fig. 5 is a flow chart of a second embodiment of the present invention.
Fig. 6A is a first schematic diagram of a storage space management mechanism of a vibration sensor with monitoring function according to a second embodiment of the present invention.
Fig. 6B is a second schematic diagram of a storage space management mechanism of a vibration sensor with monitoring function according to a second embodiment of the present invention.
Fig. 6C is a third schematic diagram of a storage space management mechanism of a vibration sensor with monitoring function according to a second embodiment of the present invention.
Fig. 6D is a fourth schematic diagram of a storage space management mechanism of a vibration sensor with monitoring function according to a second embodiment of the present invention.
Description of the symbols
1. 2 vibration sensor
11 substrate
12. 22 micro-electromechanical vibration sensing chip
13. 23 ASIC chip
231 sampling module
2311 analog front end unit
2312 analog-to-digital conversion unit
2313 filtering unit
232 conversion module
2321 conversion unit
2322 switching unit
2323 memory cell
2324 time interval unit
2325 conversion coefficient unit
233 analysis module
14. 24 memory element
TD, TD' time domain data
FD. TD' frequency domain data
VS vibration signal
S notification signal
T preset frequency spectrum characteristic table
N predetermined quantity value
Coefficient of C conversion
P1, P2 storage space
A1～An、A1’～An' frequency domain point
S21-S25, S51-S58 steps
Detailed Description
Embodiments of a vibration sensor with a monitoring function and a vibration signal monitoring method thereof according to the present invention will be described below with reference to the accompanying drawings, in which components may be exaggerated or reduced in size or in scale for the purpose of clarity and convenience in the description of the drawings. In the following description and/or claims, when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present; when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present. For ease of understanding, like elements in the following embodiments are illustrated with like reference numerals.
Please refer to fig. 1, which is a schematic diagram of a vibration sensor with monitoring function according to a first embodiment of the present invention. As shown, the vibration sensor 1 includes a substrate 11, a mems vibration sensing chip 12, an asic chip 13, and an optional memory device 14. At the beginning of the development of the vibration sensor with a monitor function, the memory element 14 is provided outside the asic chip 13. The memory device 14 provides different storage spaces for storing the vibration signals and the analyzed data according to the vibration signals of different objects. However, in mass production of the vibration sensor with monitoring function, the memory unit (not shown) in the asic chip 13 can be used to replace the memory element 14, so as to reduce the overall size of the vibration sensor 11 and simplify the assembly process of the vibration sensor 11. The micro-electromechanical vibration sensing chip 12 is disposed on the substrate and configured to sense vibration of an object to be tested to generate a plurality of vibration signals. The object to be measured may be, for example, a machine tool, a motor, a ball screw, a feeding device, and other devices that generate vibration during various operations.
The memory device 14 may be selectively disposed on the substrate 11 according to different requirements, and is used for storing a predetermined spectrum characteristic table and various parameters, such as calibration parameters, filter parameters, and conversion parameters. The memory device 14 may be, for example, a one-time programmable memory, a multi-time programmable memory, a flash memory, or an eeprom.
The asic chip 13 is disposed on the substrate 11 and electrically connected to the mems vibration sensing chip 12 and the memory device 14. The asic chip 13 receives the vibration signals, converts the vibration signals into digital signals, and filters the digital signals to generate time domain data. Then, a specific amount of time domain data is converted into a frequency domain data according to a preset amount value N. When converting a specific amount of time domain data into a frequency domain data, the specific amount of data is equal to the predetermined amount of data. Finally, the asic chip 13 executes the comparison program and sends a notification signal according to the comparison result to indicate the information of the vibration state of the object. The information of the vibration state of the object to be measured may be, for example, an abnormal vibration warning, a spectrum characteristic diagnosis, a health state or a remaining life estimation.
As can be seen from the above, the vibration sensor 1 has the asic chip 13 integrating the spectrum conversion function and the signal analysis function, so that the vibration sensor 1 can perform real-time analysis on the frequency domain data of the vibration signal, thereby greatly reducing the analysis time and effectively improving the efficiency.
Please refer to fig. 2, which is a flowchart illustrating the vibration sensor 1 according to the first embodiment of the present invention monitoring the vibration signal of the object. As shown in the figure, the vibration signal monitoring method of the vibration sensor 1 of the present embodiment includes the following steps:
step S21: the vibration of the object to be tested is detected to generate a plurality of vibration signals.
Step S22: the vibration signals are received and converted into a plurality of digital signals.
Step S23: the digital signals are filtered to generate a plurality of time domain data.
Step S24: the time domain data are converted into frequency domain data according to a preset quantity value, and the quantity value of the time domain data is equal to the preset quantity value.
Step S25: and executing a comparison program, comparing the frequency domain data with a preset frequency spectrum characteristic table, and sending out a notification signal according to a comparison result of the comparison program.
Please refer to fig. 3 and 4, which are a circuit diagram of a vibration sensor with a monitoring function and a circuit diagram of an asic chip according to a second embodiment of the present invention. As shown in fig. 3, the vibration sensor 2 includes a micro-electromechanical vibration sensing chip 22, an asic chip 23, and a memory device 24 selectively used according to different requirements.
The mems chip 22 detects the vibration of the object to be tested to generate a plurality of vibration signals VS. The object to be measured can be various devices that generate vibration during operation, such as a machine tool, a motor, a ball screw, a feeding device, and the like.
The memory device 24 is used for storing a predetermined spectrum characteristic table T and various parameters, such as calibration parameters, filter parameters, conversion parameters, and the like. In the present embodiment, the memory device is a memory cell built in the ASIC chip 23.
The mems vibration sensing chip 22 is electrically connected to the asic chip 23 to transmit a vibration signal to the asic chip 23.
Fig. 4 illustrates a circuit design of an application specific integrated circuit chip 23. As shown in FIG. 4, the ASIC 23 includes a sampling module 231, a conversion module 232 and an analysis module 233.
The sampling module 231 includes an analog front end unit 2311, an analog-to-digital conversion unit 2312, and a filtering unit 2313. The analog front end unit 2311 receives the vibration signals VS. The analog front end unit 2311 may be, for example, an analog front end circuit or a signal receiving circuit. The analog-to-digital conversion unit 2312 converts the vibration signals into a plurality of digital signals. The analog-to-digital conversion unit 2312 may be, for example, an analog-to-digital converter or a discrete signal converter. The filtering unit 2313 filters the digital signals to generate a plurality of time domain data TDs. The filtering unit 2313 may be, for example, a digital filter or a noise filter.
The conversion module 232 includes a conversion unit 2321, a switching unit 2322, a storage unit 2323, a time interval unit 2324 and a conversion coefficient unit 2325. When the filtering unit 2313 generates the time domain data TDs, the switching unit 2322 switches to the filtering unit 2313 to receive the time domain data TDs and transmit the time domain data TDs to the storing unit 2323. The switching unit 2322 may be a multiplexer or a switch, for example.
The storage unit 2323 stores the time domain data TD in a storage unit 2323, and then transmits the time domain data TD to the conversion unit 2321. The storage unit 2323 has a special storage space management mechanism; after the storage unit 2323 transmits the time domain data TDs to the conversion unit 2321, the storage unit 2323 can simultaneously release the storage space for storing the time domain data TDs, so that another time domain data TD can be stored in the storage space. For example, the storage unit 2323 may release the write protection mechanism of the storage space or delete the time domain data TD of the storage space to release the storage space, so that another time domain data TD can be stored in the storage space. The storage unit 2323 may be, for example, a register or a random access memory.
The time interval unit 2324 sends a predetermined value N, which is equal to the time domain data TD, to the transform unit 2321, and the transform coefficient unit 2325 sends a transform coefficient C to the transform unit 2321. In one embodiment, the predetermined number N is equal to the number of samples set by the sampling module 231. In another embodiment, the predetermined number value N is not equal to the sampling number set by the sampling module 231. The converting unit 2321 can perform time-frequency domain conversion according to the predetermined quantity value N and the conversion coefficient C to convert the time domain data TD into frequency domain data FD. Therefore, the preset quantity value N can be adjusted according to the actual state. For example, if the predetermined number value N is set to 3, converting unit 2321 can convert 3 time domain data TD into one frequency domain data FD according to the predetermined number value N and the conversion coefficient C. When the converting unit 2321 generates the frequency domain data FD, the switching unit 2322 switches to the converting unit 2321, receives the frequency domain data FD, and transmits the frequency domain data FD to the storing unit 2323. The time interval unit 2324 may be, for example, a register or a random access memory. The transform coefficient unit 2325 may be, for example, a register or a read only memory.
As can be seen from the above, the conversion module 232 has a special circuit structure and operation mechanism, i.e. the time interval unit 2324 can transmit the predetermined quantity value N to the conversion unit 2321. In one embodiment, the predetermined quantity value N is equal to the quantity values of the time domain data TD and the sampling quantity set by the sampling module 231. In another embodiment, the predetermined value N is equal to the values of the time domain data TD but not equal to the number of samples set by the sampling module 231. Therefore, in the asic chip 23, another sampling module is not required between the filtering unit 2313 and the switching unit 2322. In other words, the conversion module 232 does not need to sub-sample the time domain data before converting it into frequency domain data. Therefore, the vibration sensor 2 of the present embodiment can reduce the risk of data loss when converting the time domain data into the frequency domain data, so as to achieve a more accurate analysis result. In addition, since the conversion module 232 has the above-mentioned special circuit structure and operation mechanism, the sensing bandwidth of the vibration sensor 2 can be adjusted by changing the Data update Rate (ODR) of the filtering unit 2313, so as to be suitable for the objects to be measured with different vibration bandwidths.
The storage unit 2323 stores the frequency domain data FD in another storage space, and then transmits the frequency domain data FD to the analysis module 233, and performs storage space management through the aforementioned storage space management mechanism. For example, after the storage unit 2323 transmits the frequency domain data FD to the analysis module 233, the storage unit 2323 can simultaneously release the storage space for storing the frequency domain data FD, so that another frequency domain data FD can be stored in the storage space. In more detail, the memory unit 2323 can be divided into at least two storage spaces, and the capacity of the storage spaces is determined by a predetermined quantity value N, so that the storage spaces can be utilized most effectively. For example, the storage unit 2323 may release the write protection mechanism of the storage space or delete the frequency domain data FD of the storage space to release the storage space, so that another frequency domain data FD can be stored in the storage space. From the above, the vibration sensor 2 can implement a special storage space management mechanism, so that the memory unit 2323 of the vibration sensor 2 can selectively activate the write-protection mechanism or release a part of the storage space, so that the storage space can be more effectively utilized without using a memory element external to the asic chip 23.
The analysis module 233 executes a comparison procedure to compare the frequency domain data FD with the preset spectrum feature table T. The calculating unit 2331 sends out a notification signal S according to the comparison result of the comparison program. The analysis module 233 may be, for example, a comparator or a logic operation unit. When the analysis module 233 executes the comparison procedure, the frequency domain point a of the frequency domain data FD is determined1～AnAnd a frequency domain point A of a preset frequency spectrum characteristic table T1’～AnComparing, calculating and obtaining a frequency domain point A of the frequency domain data FD1～AnAnd a frequency domain point A of a preset frequency spectrum characteristic table T1’～An' total difference value between. When the analysis module 233 determines that the total distance difference is greater than a threshold, the notification signal S is set as an alarm signal. When the notification signal S is set as the warning signal, the vibration state of the object to be measured is beyond the acceptable range. The user should find the reason why the vibration state is out of the acceptable range and improve the vibration state of the object to be measured.
Because the vibration signals are subjected to complex frequency spectrum conversion and signal analysis, the conventional vibration sensor transmits the vibration signals to a monitoring machine table outside the vibration sensor. The microcontroller inside the monitoring machine performs spectrum conversion and signal analysis by means of signal analysis software to obtain the information of the vibration state of the object to be measured, so that the efficiency is poor and the requirement on practical application cannot be met. However, according to the embodiment of the present invention, the vibration sensor with monitoring function has the asic chip capable of analyzing the frequency domain data of the vibration signal, so that the analysis time can be reduced and the efficiency of real-time monitoring can be greatly improved.
In order to meet different monitoring requirements, a plurality of vibration sensors may need to be installed on the object to be detected, and a higher sampling frequency and a wider frequency domain monitoring range are needed. The transmission system of the existing vibration sensor needs to transmit a large amount of data, so that the data is easy to lose or the data transmission time is too long, and the object to be detected cannot be monitored in real time. However, according to the embodiment of the present invention, the asic chip of the vibration sensor with monitoring function can analyze the frequency domain data of the vibration signal without transmitting the vibration signal to an external monitoring machine, so that data loss is not caused and the data transmission time can be greatly shortened.
In addition, according to the embodiment of the invention, the conversion module of the ASIC chip of the vibration sensor with the monitoring function has a special circuit structure and an operation mechanism, so that the ASIC chip does not need another sampling module to perform secondary sampling, and the vibration sensor can achieve higher efficiency.
In addition, according to the embodiment of the invention, the conversion module of the asic chip of the vibration sensor with monitoring function has a special circuit structure and operation mechanism, so that the sensing bandwidth of the vibration sensor can be adjusted only by changing the data updating rate of the filter unit of the asic chip, so as to adapt to the objects to be measured with various vibration bandwidths, thereby expanding the use range of the vibration sensor with monitoring function.
Moreover, the monitoring machine platform for executing the signal analysis software is too large in size, so that the monitoring machine platform is extremely difficult to integrate with the existing vibration sensor, and is not easy to be applied to the related application fields of intelligent machinery and intelligent manufacturing. According to the embodiment of the invention, the special application integrated circuit chip of the vibration sensor with the monitoring function has the functions of integrating vibration signal sensing and vibration signal analysis and a special storage space management mechanism, so that the storage space can be more effectively utilized, the vibration sensor with the monitoring function can be more miniaturized, and the requirements of related application fields of intelligent machinery and intelligent manufacturing can be met.
Please refer to fig. 5, which is a flowchart illustrating a second embodiment of the present invention. As shown in the figure, the vibration signal monitoring method of the vibration sensor 2 of the present embodiment includes the following steps:
step S51: the vibration of the object to be tested is detected to generate a plurality of vibration signals.
Step S52: the vibration signals are received and converted into a plurality of digital signals.
Step S53: the digital signals are filtered to generate a plurality of time domain data, and the time domain data are stored in a storage space.
Step S54: providing a preset quantity value and a conversion coefficient, converting the time domain data into frequency domain data according to the preset quantity value and the conversion coefficient, and storing the frequency domain data in another storage space.
Step S55: and releasing the storage space for storing the time domain data after the time domain data are converted into frequency domain data.
Step S56: and executing a comparison program to compare the frequency domain points of the frequency domain data with the frequency domain points of the preset frequency spectrum characteristic table and obtain a total gap value.
Step S57: and after the comparison program is executed, the storage space for storing the frequency domain data is released.
Step S58: and when the comparison result shows that the total distance difference value is larger than a threshold value, setting the notification signal as an alarm signal.
Please refer to fig. 6A to 6D, which are first to fourth schematic diagrams illustrating a storage space management mechanism of a vibration sensor with a monitoring function according to a second embodiment of the present invention. As shown in FIG. 6A, the memory cell 2323 includes a storage space P1 and a storage space P2. The capacity of the storage space P1 corresponds to a predetermined quantity value N and a predetermined number of samples, and the capacity of the storage space P2 also corresponds to a predetermined quantity value N and a predetermined number of samples. The filtering unit 2313 generates the time domain data TD, and transmits the time domain data TD to the storage unit 2323 through the switching unit 2322, and the storage unit 2323 stores the time domain data TD in the storage space P1.
As shown in fig. 6B, after the storage unit 2323 transmits the time domain data TDs to the conversion unit 2321, the storage unit 2323 can release the storage space P1 for storing the time domain data TDs at the same time. The conversion unit 2321 generates the frequency domain data FD, and transfers the frequency domain data FD to the storage unit 2323 through the switching unit. The storage unit 2323 stores the frequency-domain data FD in the storage space P2.
As shown in fig. 6C, after the storage unit 2323 transmits the frequency domain data FD to the analysis module 233, the storage unit 2323 can simultaneously release the storage space P2 for storing the frequency domain data FD. Since the storage space P1 is released by the storage unit 2323, the next time domain data TD' generated by the filtering unit 2313 can be stored in the storage space P1.
As shown in fig. 6D, after the storage unit 2323 transmits the time domain data TD 'to the conversion unit 2321, the storage unit 2323 can release the storage space P1 for storing the time domain data TD' at the same time. Since the storage space P2 is already released by the storage unit 2323, the next data FD' generated by the conversion unit 2321 can be stored in the storage space P2.
As described above, since the storage unit 2323 of the vibration sensor 2 is divided into the storage space P1 and the storage space P2, and the capacities of the storage space P1 and the storage space P2 both correspond to the predetermined quantity value N and the sampling quantity, the capacity of the storage unit 2323 can be reduced, and all necessary data can be stored sufficiently, and the storage space of the vibration sensor can be greatly reduced by the special storage space design.
In addition, the vibration sensor 2 has a special storage space management mechanism, so that the storage space can be more effectively recycled, and the storage space of the vibration sensor 2 can be further reduced. Therefore, the storage space management mechanism is combined with the design of the storage space, so that the vibration sensor 2 can be more miniaturized without arranging another memory element outside the asic chip, thereby meeting the requirements of the related application fields of smart machines and smart manufacturing.
In summary, according to the embodiments of the invention, the asic chip of the vibration sensor with monitoring function can analyze the frequency domain data of the vibration signal, so as to reduce the analysis time and greatly improve the real-time monitoring efficiency.
In addition, according to the embodiment of the invention, the asic chip of the vibration sensor with monitoring function can analyze the frequency domain data of the vibration signal without transmitting the vibration signal to a monitoring machine external to the vibration sensor, so that data loss is avoided and the data transmission time can be greatly shortened.
In addition, according to the embodiment of the invention, the conversion module of the ASIC chip of the vibration sensor with the monitoring function has a special circuit structure and an operation mechanism, so that the ASIC chip does not need to be provided with another sampling module or perform secondary sampling, and the vibration sensor can achieve higher efficiency.
In addition, according to the embodiment of the invention, the conversion module of the asic chip of the vibration sensor with the monitoring function has a special circuit structure and an operation mechanism, so that the sensing bandwidth of the vibration sensor can be adjusted by changing the data update rate of the filter unit of the asic chip, and the conversion module is more flexible in use, so as to adapt to objects to be measured with various vibration bandwidths, thereby expanding the use range of the vibration sensor with the monitoring function.
Furthermore, according to the embodiment of the present invention, the asic chip of the vibration sensor with monitoring function has functions of integrating vibration signal sensing and vibration signal analysis and a special storage space management mechanism, so that the storage space can be utilized more effectively, and the vibration sensor with monitoring function can be miniaturized, thereby meeting the requirements of the related application fields of smart machines and smart manufacturing.
The foregoing is by way of example only, and not limiting. It is intended that the appended claims cover any and all such modifications and variations as fall within the true spirit and scope of this present invention.
Claims (24)
1. A vibration sensor with a monitoring function, comprising:
a substrate; and
the micro-electromechanical vibration sensing chip is arranged on the substrate and used for sensing the vibration born by an object to be detected so as to generate a plurality of vibration signals;
an ASIC chip disposed on the substrate and electrically connected to the MEMS vibration sensing chip, comprising:
a sampling module, comprising:
an analog front end unit;
an analog-to-digital conversion unit; and
a filtering unit;
wherein the analog front end unit receives the plurality of vibration signals, the analog-to-digital conversion unit converts the plurality of vibration signals into a plurality of digital signals, and the filtering unit filters the plurality of digital signals to generate a plurality of time domain data;
a conversion module, comprising:
a conversion unit; and
a time interval unit;
wherein the time interval unit transmits a predetermined quantity value to the conversion unit,
the conversion unit converts the plurality of time domain data into frequency domain data, wherein the number value of the plurality of time domain data is equal to the preset number value; and
and the analysis module is used for executing a comparison program, wherein the comparison program compares the frequency domain data with a preset frequency spectrum feature table and sends out a notification signal according to a comparison result of the comparison program.
2. The vibration sensor according to claim 1, wherein the predetermined number value of the time interval unit is equal to a sampling number set by the sampling module.
3. The vibration sensor according to claim 1, wherein the conversion module further comprises a conversion coefficient unit, the conversion coefficient unit transmits a conversion coefficient to the conversion unit, and the conversion unit converts the plurality of time domain data into the frequency domain data according to the predetermined quantity value and the conversion coefficient.
4. The vibration sensor according to claim 1, further comprising at least one memory device, wherein the at least one memory device is electrically connected to the ASIC chip and stores the predetermined spectral signature.
5. The vibration sensor according to claim 1, wherein the comparison program compares the frequency domain points of the frequency domain data with the frequency domain points of the preset spectral feature table to obtain a total difference value, and when the analysis module determines that the total difference value is greater than a threshold value, the analysis module sets the notification signal as a warning signal.
6. The vibration sensor according to claim 1, wherein the conversion module comprises a storage unit, one storage space of the storage unit is used for storing the plurality of time domain data, and another storage space of the storage unit is used for storing the frequency domain data.
7. The vibration sensor according to claim 6, wherein a capacity of the storage space and a capacity of the other storage space correspond to the predetermined quantity values.
8. The vibration sensor according to claim 6, wherein the storage unit releases the storage space after the plurality of time domain data are transmitted to the conversion unit.
9. The vibration sensor according to claim 8, wherein the storage unit releases a write protection mechanism of the storage space to release the storage space, allowing another time domain data to be overlaid on the storage space.
10. The vibration sensor according to claim 8, wherein the storage unit deletes the plurality of time domain data of the storage space to release the storage space for another time domain data to be stored in the storage space.
11. The vibration sensor of claim 6, wherein the storage unit frees the another storage space after the storage unit transmits the frequency domain data to the analysis module.
12. The vibration sensor according to claim 11, wherein the storage unit releases a write protection mechanism of the other storage space to release the other storage space, so that another frequency domain data is overlaid on the other storage space.
13. The vibration sensor according to claim 11, wherein the storage unit deletes the frequency domain data of another storage space to release the another storage space for storing another frequency domain data in the another storage space.
14. The vibration sensor according to claim 6, wherein the conversion module further comprises a switching unit, the storage unit and the conversion unit are electrically connected to the sampling module through the switching unit, and are switched to the sampling module when the sampling module generates the plurality of time domain data, and are switched to the conversion unit when the conversion unit generates the frequency domain data.
15. A vibration signal monitoring method, comprising:
detecting vibration borne by an object to be detected to generate a plurality of vibration signals;
receiving the plurality of vibration signals and converting the plurality of vibration signals into a plurality of digital signals;
filtering the plurality of digital signals to produce a plurality of time domain data;
converting the plurality of time domain data into frequency domain data according to a preset quantity value, wherein the quantity value of the plurality of time domain data is equal to the preset quantity value; and
and executing a comparison program to compare the frequency domain data with a preset frequency spectrum feature table, and sending a notification signal according to a comparison result of the comparison program.
16. A vibration signal monitoring method according to claim 15, wherein the step of converting the plurality of time domain data into the frequency domain data further comprises:
providing a conversion coefficient; and
and converting the plurality of time domain data into the frequency domain data according to the preset quantity value and the conversion coefficient.
17. The method according to claim 15, wherein the step of executing the comparison program to compare the frequency domain data with the preset spectral feature table and sending the notification signal according to the comparison result of the comparison program further comprises:
comparing the frequency domain points of the frequency domain data with the frequency domain points of the preset frequency spectrum characteristic table to obtain a total gap value; and
and when the comparison result shows that the total difference value is greater than a threshold value, setting the notification signal as a warning signal.
18. A vibration signal monitoring method according to claim 15, further comprising:
providing a storage space for storing the plurality of time domain data, and providing another storage space for storing the frequency domain data, wherein the capacity of the storage space and the capacity of the another storage space correspond to the predetermined quantity value.
19. A vibration signal monitoring method according to claim 18, wherein the step of providing the storage space for storing the plurality of time domain data and providing the another storage space for storing the frequency domain data further comprises:
and releasing the storage space after the plurality of time domain data are converted into the frequency domain data.
20. A method for vibration signal monitoring as claimed in claim 19, wherein the step of releasing the storage space after converting the plurality of time domain data into the frequency domain data further comprises:
and releasing the write protection mechanism of the storage space to release the storage space, so that the other time domain data is covered in the storage space.
21. A method for vibration signal monitoring as claimed in claim 19, wherein the step of releasing the storage space after converting the plurality of time domain data into the frequency domain data further comprises:
deleting the plurality of time domain data of the storage space to release the storage space, so that another time domain data is stored in the storage space.
22. A vibration signal monitoring method according to claim 18, wherein the step of providing the storage space for storing the plurality of time domain data and providing the another storage space for storing the frequency domain data further comprises:
and releasing the other storage space after the comparison program is executed.
23. The method according to claim 22, wherein the step of releasing the storage space after the comparing procedure further comprises:
and releasing the write protection mechanism of the other storage space to release the other storage space, so that the other storage space is covered by the other frequency domain data.
24. The method according to claim 22, wherein the step of releasing the storage space after the comparing procedure further comprises:
deleting the frequency domain data of the other storage space to release the other storage space, so that the other frequency domain data is stored in the other storage space.
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