CN111326429A - Double-base-island heat dissipation chip packaging process - Google Patents
Double-base-island heat dissipation chip packaging process Download PDFInfo
- Publication number
- CN111326429A CN111326429A CN202010150008.1A CN202010150008A CN111326429A CN 111326429 A CN111326429 A CN 111326429A CN 202010150008 A CN202010150008 A CN 202010150008A CN 111326429 A CN111326429 A CN 111326429A
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- China
- Prior art keywords
- lead frame
- stamping
- packaging
- frame blank
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 38
- 238000012858 packaging process Methods 0.000 title claims abstract description 13
- 238000004806 packaging method and process Methods 0.000 claims abstract description 46
- 238000000034 method Methods 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000004080 punching Methods 0.000 description 17
- 230000006835 compression Effects 0.000 description 14
- 238000007906 compression Methods 0.000 description 14
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49544—Deformation absorbing parts in the lead frame plane, e.g. meanderline shape
Abstract
The invention discloses a double-base-island heat dissipation chip packaging process, which comprises a lead frame blank, a chip, double base islands, a stamping device and a packaging device, wherein the double base islands are arranged on the lead frame blank; the lead frame blank is placed on a stamping device, the lead frame blank is compacted through a first compacting assembly, the middle of a base island is stamped by the lead frame blank through a stamping assembly to form a heat dissipation groove, and the heat dissipation groove penetrates through two end faces of the lead frame blank; installing the chip at two ends of the heat dissipation groove; the lead frame blank after the chip is installed is placed on the packaging device, the lead frame blank around the heat dissipation groove is compacted through the second pressing assembly, the upper end of the chip and the periphery of the chip are plastically packaged through the plastic packaging assembly of the packaging device, the chips at two ends of the heat dissipation groove are plastically packaged to form a base island, and through the arrangement, the lead frame blank cannot deform in a stamping mode and cannot deform in a packaging mode when the lead frame blank is plastically packaged.
Description
Technical Field
The invention relates to the technical field of packaging processes, in particular to a packaging process of a double-base-island heat dissipation chip.
Background
Packaging (Package) is necessary for the chip and is also critical. A package may also be said to refer to a housing for mounting a semiconductor integrated circuit chip which not only serves to protect the chip and enhance thermal conductivity, but also serves as a bridge between the internal world of the chip and external circuitry.
The sop (smalllooutlinepackage) is a small-outline package, which is a common package form and has a wide market range, and the heat generated by the package product in use can be conducted out through the exposed outer pins or the bottom heat sink. In order to increase the functions of the SOP product, a multi-chip package is generally adopted, and two chips are commonly packaged together. When the SOP chip is packaged, two base islands (or carriers) are arranged in the SOP chip, one base island is attached to one chip, the two base islands are independent from each other, the two chips are mainly required to be mutually spaced due to different functional requirements, and the used chip bonding glue is also different.
Traditional two base island SOP chip package structure include lead frame blank and plastic envelope in the outer plastic envelope body of lead frame blank, the lead frame blank includes base island district and a plurality of pin, base island district includes two mutual interval and parallel arrangement's base island, and two base islands are not exposed, all promptly by the plastic envelope in the lead frame blank. However, as the functions of the SOP product are increased, the heat of the SOP product is also increased, and in order to dissipate the heat generated inside the product during operation as soon as possible, a through groove is punched between the two islands at present, but the lead frame blank positioned in the heat dissipation groove is punched and deformed by the current punching device, and during packaging, molten plastic enters the heat dissipation groove to cause the lead frame blank around the heat dissipation groove to be heated and deformed, and then flows into the lower end of the lead frame blank to cause the lead frame blank to be packaged and deformed, and on the other hand, the molten plastic enters the lower end of the lead frame blank at a certain flow rate to cause the lead frame blank to be packaged and deformed, so that the packaging process needs to be improved.
Disclosure of Invention
The invention aims to provide a double-base-island heat dissipation chip packaging process, wherein the blank of a lead frame does not have stamping deformation during stamping and the blank of the lead frame does not have packaging deformation during plastic packaging.
The technical purpose of the invention is realized by the following technical scheme: a packaging process of a double-base-island heat dissipation chip,
and 4, compacting the blank of the lead frame through a second compacting assembly, plastically packaging the upper end and the periphery of the chip through a plastic packaging assembly of the packaging device, and plastically packaging the chip in the first base island and the chip in the second base island to form a plastic packaging body.
Further, stamping device includes the punching press die holder, locates first compress tightly subassembly and the punching press subassembly on the punching press die holder, first compress tightly the subassembly and include first clamp plate, locate the first compression leg of a plurality of groups of first clamp plate lower extreme and drive the first drive assembly that first clamp plate slided, first clamp plate is under first drive assembly's promotion, and the first compression leg of every group on the first clamp plate compresses tightly around the radiating groove, the punching press subassembly includes the punching press board, locates a plurality of hilts of punching press board lower extreme, locates a plurality of stands around the punching press board and drive the punching press board punching machine of motion, first clamp plate is equipped with a plurality of notches that supply the hilts to get into, the notch runs through the upper and lower terminal surface of first clamp plate, punching press die holder up end is equipped with the arrangement groove that supplies the hilts to go into.
Further, the packaging device comprises a packaging die holder, a second pressing assembly and a plastic package assembly, the second pressing assembly and the plastic package assembly are arranged on the packaging die holder, the lead frame blank provided with the chip is arranged on the packaging die holder, the second pressing assembly comprises a second pressing plate, a plurality of groups of second pressing columns arranged at the lower end of the second pressing plate and a second driving assembly driving the second pressing plate to slide, and under the pushing of the second driving assembly, each group of second pressing columns on the second pressing plate press the periphery of the heat dissipation groove.
Furthermore, a plurality of convex blocks are convexly arranged on the lower end face of the lead frame blank, and positioning grooves matched with the convex blocks in a positioning mode are respectively arranged on the upper end face of the stamping die holder and the upper end face of the packaging die holder.
In conclusion, the invention has the following beneficial effects:
a double-base-island heat dissipation chip packaging process is characterized in that a lead frame blank is compressed through a first compression assembly before stamping, the middle of a base island is compressed through each group of first compression columns on a first pressing plate in a compression mode, a cutter handle on a stamping device is pushed by a stamping machine to extend into a notch and stamp the lead frame blank, the lead frame blank is stamped to form a heat dissipation groove, the heat dissipation groove penetrates through the upper end face and the lower end face of the lead frame blank to divide the base island into a first base island and a second base island, and stamping deformation of the lead frame blank can be avoided through the arrangement; correspondingly installing the chips in the first base island and the second base island; the mounted lead frame blank is placed on the packaging die holder, the second compression columns compress the periphery of the heat dissipation groove, the plastic package assembly plastically packages the chip on the lead frame blank, the second compression assembly is arranged to prevent plastic package, the lead frame around the heat dissipation groove is heated and deformed, and then molten plastic enters the heat dissipation groove and flows into the lower end of the lead frame blank to cause packaging deformation.
Drawings
FIG. 1 is a schematic diagram of a lead frame blank of the present invention after being cut and plastic encapsulated;
FIG. 2 is an enlarged view of the invention at A;
FIG. 3 is a schematic view of the construction of the stamping apparatus of the present invention;
FIG. 4 is an enlarged view of the invention at B;
FIG. 5 is a schematic view of a dual base island and first stud of the present invention;
FIG. 6 is a schematic structural view of a second hold-down assembly of the present invention;
fig. 7 is an enlarged view of the invention at C.
In the figure: 1. a lead frame blank; 11. a heat sink; 12. a bump; 2. a chip; 3. a first base island; 31. a second base island; 4. a first hold-down assembly; 41. a first platen; 411. a notch; 42. a first compression leg; 43. a first drive assembly; 5. a stamping assembly; 51. stamping the plate; 52. a hilt; 53. a column; 54. a punch press; 6. a second hold-down assembly; 61. a second platen; 62. a second compression leg; 63. a second drive assembly; 7. plastic packaging the assembly; 8. a stamping die holder; 81. a placing groove; 82. positioning a groove; 9. and (5) packaging the die holder.
Detailed Description
The invention will be further described with reference to the accompanying drawings.
As shown in fig. 1-7, a dual-base island heat sink chip packaging process,
and 4, compacting the periphery of the heat dissipation groove 11 through the second pressing assembly 6, and plastically packaging the upper end and the periphery of the chip 2 through the plastic packaging assembly 7 of the packaging device, wherein the first base island 3 and the chip 2 in the second base island 31 are plastically packaged to form a plastic packaging body.
The stamping device comprises a stamping die holder 8, a first pressing component 4 and a stamping component 5 which are arranged on the stamping die holder 8, the first pressing component 4 comprises a first pressing plate 41, a plurality of groups of first pressing columns 42 arranged at the lower end of the first pressing plate 41 and a first driving component 43 driving the first pressing plate 41 to slide, under the pushing of the first pressing plate 41 by the first driving assembly 43, each set of first pressing pillars 42 on the first pressing plate 41 presses the periphery of the heat sink 11, the punching assembly 5 comprises a punching plate 51, a plurality of knife handles 52 arranged at the lower end of the punching plate 51, a plurality of upright posts 53 arranged at the periphery of the punching plate 51 and a punching machine 54 for driving the punching plate 51 to move, the first pressing plate 41 is provided with a plurality of notches 411 for the knife holder 52 to enter, the notches 411 penetrate through the upper end surface and the lower end surface of the first pressing plate 41, and the upper end surface of the stamping die holder 8 is provided with a placing groove 81 for the knife holder 52 to abut into.
The packaging device comprises a packaging die holder 9, a second pressing assembly 6 and a plastic package assembly 7 which are arranged on the packaging die holder 9, wherein the lead frame blank 1 provided with the chip 2 is arranged on the packaging die holder 9, the second pressing assembly 6 comprises a second pressing plate 61, a plurality of groups of second pressing columns 62 arranged at the lower end of the second pressing plate 61 and a second driving assembly 63 driving the second pressing plate 61 to slide, and the second pressing plate 61 is pushed by the second driving assembly 63 to press the periphery of the heat dissipation groove 11 by each group of second pressing columns 62 on the second pressing plate 61.
The lower end face of the lead frame blank 1 is convexly provided with a plurality of convex blocks 12, the upper end face of the stamping die holder 8 and the upper end face of the packaging die holder 9 are respectively provided with a positioning groove 82 which is matched with the convex blocks 12 in a positioning manner, and the lead frame blank 1 is positioned and installed on the upper end face of the stamping die holder 8 or the upper end face of the packaging die holder 9 through the arrangement.
The basic working principle of the invention is as follows:
a double-base-island heat dissipation chip packaging process is characterized in that a lead frame blank 1 is compressed through a first compression assembly 4 before stamping, the middle of a base island is compressed through each group of first compression columns 42 on a first pressing plate 41 in the compression mode, a cutter handle 52 on a stamping device is pushed by a stamping machine 54 to extend into a notch 411 and stamp the lead frame blank 1, the lead frame blank 1 is stamped to form a heat dissipation groove 11, the heat dissipation groove 11 penetrates through the upper end surface and the lower end surface of the lead frame blank 1 to divide the base island into a first base island 3 and a second base island 31, and through the arrangement, stamping deformation of the lead frame blank 1 can be avoided; correspondingly installing the chip 2 in the first base island 3 and the second base island 31; the mounted lead frame blank 1 is placed on the packaging die holder 9, the second compression columns 62 compress the periphery of the heat dissipation groove 11, the plastic package assembly 7 carries out plastic package on the chip 2 on the lead frame blank 1, the second compression assemblies 6 are arranged to avoid the plastic package process, the lead frame 1 around the heat dissipation groove 11 is heated and deformed, and then molten plastic enters the heat dissipation groove 11 and flows into the lower end of the lead frame blank 1 to cause packaging deformation.
The above description is only a preferred embodiment of the present invention, and all equivalent changes or modifications of the structure, characteristics and principles described in the present invention are included in the scope of the present invention.
Claims (4)
1. The utility model provides a two base island heat dissipation chip encapsulation processes which characterized in that:
step 1, forming a plurality of base islands on a lead frame blank (1),
step 2, placing the lead frame blank (1) on a stamping die holder (8) of a stamping device, firstly, compacting the lead frame blank (1) through a first compacting assembly (4), stamping the middle part of a base island through the lead frame blank (1) through a stamping assembly (5) to form a heat dissipation groove (11), wherein the heat dissipation groove (11) penetrates through the upper end surface and the lower end surface of the lead frame blank (1) to divide the base island into a first base island (3) and a second base island (31);
step 3, correspondingly installing the chip (2) in the first base island (3) and the second base island (31);
and 4, compacting the lead frame blank (1) through the second compacting assembly (6), plastically packaging the upper end and the periphery of the chip (2) through the plastic packaging assembly (7) of the packaging device, and plastically packaging the chip (2) in the first base island (3) and the second base island (31) to form a plastic packaging body.
2. The process of packaging double-base-island heat dissipation chips according to claim 1, wherein: the stamping device comprises a stamping die holder (8), a first pressing component (4) and a stamping component (5), wherein the first pressing component (4) is arranged on the stamping die holder (8), the first pressing component (4) comprises a first pressing plate (41), a plurality of groups of first pressing columns (42) arranged at the lower end of the first pressing plate (41) and a first driving component (43) for driving the first pressing plate (41) to slide, the first pressing plate (41) is pushed by the first driving component (43), each group of first pressing columns (42) on the first pressing plate (41) tightly press the periphery of the heat dissipation groove (11), the stamping component (5) comprises a stamping plate (51), a plurality of knife handles (52) arranged at the lower end of the stamping plate (51), a plurality of upright columns (53) arranged at the periphery of the stamping plate (51) and a stamping machine (54) for driving the stamping plate (51) to move, the first pressing plate (41) is provided with a notch (411) for the knife handles (52) to enter, the notch (411) penetrates through the upper end face and the lower end face of the first pressing plate (41), and the upper end face of the stamping die holder (8) is provided with a placing groove (81) for the knife handle (52) to abut into.
3. The process of claim 2, wherein the double-island heat-dissipating chip packaging process comprises: the packaging device comprises a packaging die holder (9), a second pressing assembly (6) and a plastic package assembly (7) which are arranged on the packaging die holder (9), wherein a lead frame blank (1) provided with a chip (2) is arranged on the packaging die holder (9), the second pressing assembly (6) comprises a second pressing plate (61), a plurality of groups of second pressing columns (62) arranged at the lower end of the second pressing plate (61) and a second driving assembly (63) driving the second pressing plate (61) to slide, the second pressing plate (61) is pushed by the second driving assembly (63), and all the peripheries of the radiating grooves (11) are pressed by each group of second pressing columns (62) on the second pressing plate (61).
4. The process of claim 3, wherein the double-island heat-dissipating chip packaging process comprises: the lower end face of the lead frame blank (1) is convexly provided with a plurality of convex blocks (12), and the upper end face of the stamping die holder (8) and the upper end face of the packaging die holder (9) are respectively provided with a positioning groove (82) matched with the convex blocks (12) in a positioning mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010150008.1A CN111326429B (en) | 2020-03-06 | 2020-03-06 | Double-base-island heat dissipation chip packaging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010150008.1A CN111326429B (en) | 2020-03-06 | 2020-03-06 | Double-base-island heat dissipation chip packaging process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111326429A true CN111326429A (en) | 2020-06-23 |
| CN111326429B CN111326429B (en) | 2021-08-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010150008.1A Expired - Fee Related CN111326429B (en) | 2020-03-06 | 2020-03-06 | Double-base-island heat dissipation chip packaging process |
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| Country | Link |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000228475A (en) * | 1999-02-05 | 2000-08-15 | Nec Corp | Semiconductor device |
| US20040159939A1 (en) * | 1998-08-05 | 2004-08-19 | Fairchild Semiconductor Corporation | High performance multi-chip flip chip package |
| CN2739798Y (en) * | 2004-03-12 | 2005-11-09 | 上海华旭微电子有限公司 | Semiconductor integrated circuit lead frame |
| CN201629305U (en) * | 2010-03-16 | 2010-11-10 | 日立电线(苏州)精工有限公司 | Radiating and packaging structure of lead frame |
| CN103187409A (en) * | 2011-12-31 | 2013-07-03 | 刘胜 | Light-emitting diode (LED) array packaging light source module based on lead frame |
-
2020
- 2020-03-06 CN CN202010150008.1A patent/CN111326429B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040159939A1 (en) * | 1998-08-05 | 2004-08-19 | Fairchild Semiconductor Corporation | High performance multi-chip flip chip package |
| JP2000228475A (en) * | 1999-02-05 | 2000-08-15 | Nec Corp | Semiconductor device |
| CN2739798Y (en) * | 2004-03-12 | 2005-11-09 | 上海华旭微电子有限公司 | Semiconductor integrated circuit lead frame |
| CN201629305U (en) * | 2010-03-16 | 2010-11-10 | 日立电线(苏州)精工有限公司 | Radiating and packaging structure of lead frame |
| CN103187409A (en) * | 2011-12-31 | 2013-07-03 | 刘胜 | Light-emitting diode (LED) array packaging light source module based on lead frame |
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| Publication number | Publication date |
|---|---|
| CN111326429B (en) | 2021-08-06 |
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Granted publication date: 20210806 |