CN111315128B - 一种可折弯pcb板 - Google Patents
一种可折弯pcb板 Download PDFInfo
- Publication number
- CN111315128B CN111315128B CN202010171949.3A CN202010171949A CN111315128B CN 111315128 B CN111315128 B CN 111315128B CN 202010171949 A CN202010171949 A CN 202010171949A CN 111315128 B CN111315128 B CN 111315128B
- Authority
- CN
- China
- Prior art keywords
- pcb
- rotating
- mounting
- main board
- arc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011248 coating agent Substances 0.000 claims abstract description 15
- 238000000576 coating method Methods 0.000 claims abstract description 15
- 230000017525 heat dissipation Effects 0.000 claims abstract description 15
- 238000005260 corrosion Methods 0.000 claims abstract description 6
- 230000007246 mechanism Effects 0.000 claims description 20
- 238000009434 installation Methods 0.000 claims description 8
- -1 phenolic aldehyde Chemical class 0.000 claims description 6
- 229920001342 Bakelite® Polymers 0.000 claims description 4
- 239000004637 bakelite Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 230000004888 barrier function Effects 0.000 claims 1
- 230000007797 corrosion Effects 0.000 claims 1
- 241000755266 Kathetostoma giganteum Species 0.000 abstract 1
- 239000000463 material Substances 0.000 description 15
- 230000000694 effects Effects 0.000 description 11
- 229920000877 Melamine resin Polymers 0.000 description 5
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical group NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 description 5
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 4
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical group O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Panels For Use In Building Construction (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010171949.3A CN111315128B (zh) | 2020-03-12 | 2020-03-12 | 一种可折弯pcb板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010171949.3A CN111315128B (zh) | 2020-03-12 | 2020-03-12 | 一种可折弯pcb板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111315128A CN111315128A (zh) | 2020-06-19 |
CN111315128B true CN111315128B (zh) | 2021-06-15 |
Family
ID=71162299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010171949.3A Active CN111315128B (zh) | 2020-03-12 | 2020-03-12 | 一种可折弯pcb板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111315128B (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1537408A (zh) * | 2001-07-31 | 2004-10-13 | ��ʿͨ��ʽ���� | 携带设备 |
DE102005033109A1 (de) * | 2005-07-15 | 2007-01-25 | Miele & Cie. Kg | Leiterplattenanordnung, elektrisches Gerät mit einer Leiterplattenanordnung und Scharnierelement, insbesondere für eine Leiterplattenanordnung |
CN204795863U (zh) * | 2015-06-29 | 2015-11-18 | 智恩电子(大亚湾)有限公司 | 新型可调节电路板 |
CN207354704U (zh) * | 2017-08-31 | 2018-05-11 | 铜陵安博电路板有限公司 | 一种可折叠双层电路板 |
CN209897351U (zh) * | 2019-03-04 | 2020-01-03 | 昆山市华涛电子有限公司 | 可折叠线路板 |
-
2020
- 2020-03-12 CN CN202010171949.3A patent/CN111315128B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1537408A (zh) * | 2001-07-31 | 2004-10-13 | ��ʿͨ��ʽ���� | 携带设备 |
DE102005033109A1 (de) * | 2005-07-15 | 2007-01-25 | Miele & Cie. Kg | Leiterplattenanordnung, elektrisches Gerät mit einer Leiterplattenanordnung und Scharnierelement, insbesondere für eine Leiterplattenanordnung |
CN204795863U (zh) * | 2015-06-29 | 2015-11-18 | 智恩电子(大亚湾)有限公司 | 新型可调节电路板 |
CN207354704U (zh) * | 2017-08-31 | 2018-05-11 | 铜陵安博电路板有限公司 | 一种可折叠双层电路板 |
CN209897351U (zh) * | 2019-03-04 | 2020-01-03 | 昆山市华涛电子有限公司 | 可折叠线路板 |
Also Published As
Publication number | Publication date |
---|---|
CN111315128A (zh) | 2020-06-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A bendable PCB board Effective date of registration: 20211117 Granted publication date: 20210615 Pledgee: Jiujiang Bank Co.,Ltd. Wan'an sub branch Pledgor: WANAN YUWEI ELECTRONICS Co.,Ltd. Registration number: Y2021980012543 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
CP01 | Change in the name or title of a patent holder |
Address after: 343000 electronic circuit board industrial park, Wan'an County, Ji'an City, Jiangxi Province Patentee after: Wan'an Yuwei Electronics Co.,Ltd. Address before: 343000 electronic circuit board industrial park, Wan'an County, Ji'an City, Jiangxi Province Patentee before: WANAN YUWEI ELECTRONICS Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20210615 Pledgee: Jiujiang Bank Co.,Ltd. Wan'an sub branch Pledgor: WANAN YUWEI ELECTRONICS Co.,Ltd. Registration number: Y2021980012543 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |