CN111283814B - 一种带有顶出结构的smt线路板切割装置 - Google Patents
一种带有顶出结构的smt线路板切割装置 Download PDFInfo
- Publication number
- CN111283814B CN111283814B CN202010116566.6A CN202010116566A CN111283814B CN 111283814 B CN111283814 B CN 111283814B CN 202010116566 A CN202010116566 A CN 202010116566A CN 111283814 B CN111283814 B CN 111283814B
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- CN
- China
- Prior art keywords
- movably connected
- connecting rod
- shaft
- circuit board
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010116566.6A CN111283814B (zh) | 2020-02-25 | 2020-02-25 | 一种带有顶出结构的smt线路板切割装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010116566.6A CN111283814B (zh) | 2020-02-25 | 2020-02-25 | 一种带有顶出结构的smt线路板切割装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111283814A CN111283814A (zh) | 2020-06-16 |
CN111283814B true CN111283814B (zh) | 2021-06-18 |
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ID=71017196
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202010116566.6A Active CN111283814B (zh) | 2020-02-25 | 2020-02-25 | 一种带有顶出结构的smt线路板切割装置 |
Country Status (1)
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CN (1) | CN111283814B (zh) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003231091A (ja) * | 2002-02-07 | 2003-08-19 | Fuji Photo Film Co Ltd | 基板分割装置 |
ITTV20040056U1 (it) * | 2004-10-20 | 2005-01-20 | Dario Toncelli | Macchina tagliatrice combinata per la lavorazione di materiale in lastra. |
CN2885528Y (zh) * | 2005-10-26 | 2007-04-04 | 李建文 | 复轴加工式电路板切割机 |
JP5423302B2 (ja) * | 2009-10-02 | 2014-02-19 | トヨタ紡織株式会社 | ワークの製造装置及び製造方法 |
KR200482294Y1 (ko) * | 2016-06-28 | 2017-01-10 | 주식회사 아이엠테크놀로지 | 회로기판용 금형장치 |
CN208180155U (zh) * | 2018-02-07 | 2018-12-04 | 广州市国鼎模具制品有限公司 | 一种模具成品水口剪切装置 |
CN209999347U (zh) * | 2019-03-19 | 2020-01-31 | 武汉通领沃德汽车饰件有限公司 | 双工位切边工装 |
CN112847642B (zh) * | 2019-09-17 | 2022-07-19 | 佛山市顺德区威福电器有限公司 | 一种柔性电路板多刀切模系统及方法 |
CN110757533B (zh) * | 2019-11-04 | 2021-04-27 | 浙江群鹿新材料股份有限公司 | 一种塑料打包盒切边处理加工机械及加工方法 |
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2020
- 2020-02-25 CN CN202010116566.6A patent/CN111283814B/zh active Active
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CN111283814A (zh) | 2020-06-16 |
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PB01 | Publication | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20210531 Address after: 523000 No.1 Taoyuan 1st Road, Cunwei, Hengli Town, Dongguan City, Guangdong Province Applicant after: DONGGUAN HUAZHUANG ELECTRONIC Co.,Ltd. Address before: Fengcheng Road, Yichun City, Jiangxi Province Applicant before: Zhong Jibin |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 523000 No.1 Taoyuan 1st Road, Cunwei, Hengli Town, Dongguan City, Guangdong Province Patentee after: Guangdong Huazhuang Technology Co.,Ltd. Address before: 523000 No.1 Taoyuan 1st Road, Cunwei, Hengli Town, Dongguan City, Guangdong Province Patentee before: DONGGUAN HUAZHUANG ELECTRONIC CO.,LTD. |
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CP01 | Change in the name or title of a patent holder |