CN111239592A - Chip testing seat - Google Patents
Chip testing seat Download PDFInfo
- Publication number
- CN111239592A CN111239592A CN202010247245.XA CN202010247245A CN111239592A CN 111239592 A CN111239592 A CN 111239592A CN 202010247245 A CN202010247245 A CN 202010247245A CN 111239592 A CN111239592 A CN 111239592A
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- Prior art keywords
- contact
- edge
- conductive metal
- metal sheet
- chip
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- 238000012360 testing method Methods 0.000 title claims abstract description 124
- 239000002184 metal Substances 0.000 claims abstract description 127
- 229910052751 metal Inorganic materials 0.000 claims abstract description 127
- 238000003825 pressing Methods 0.000 claims abstract description 29
- 230000000694 effects Effects 0.000 abstract description 6
- 239000000523 sample Substances 0.000 description 22
- 238000005096 rolling process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000002035 prolonged effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The embodiment of the invention discloses a chip testing seat, which comprises: a base; the groove body is arranged on the base; the insulating elastic rod is positioned in the clamping groove of the groove body; at least one conductive metal sheet positioned in the tank body; the conductive metal sheet comprises a first edge and a second edge which are oppositely arranged; the first edge comprises at least two arc edges and is arranged on two sides of the midpoint of the first edge; the second edge is at least partially in snap contact with the surface of the insulating elastic rod; the conductive metal sheet further comprises a first contact and a second contact; along the extending direction of the first edge, the first contact and the second contact are arranged at two ends of the conductive metal sheet; the first contact is used for being electrically connected with a chip to be tested, and the second contact is used for being electrically connected with a test circuit board; the pressing plate is arranged on one side, far away from the insulating elastic rod, of the conductive metal sheet, and the pressing plate is in meshed contact with the arc edge of the first edge and used for providing pressure for the conductive metal sheet. The chip testing seat provided by the embodiment of the invention can realize high-frequency testing of the chip and has a better high-frequency testing effect.
Description
Technical Field
The embodiment of the invention relates to a chip testing technology, in particular to a chip testing seat.
Background
In the production process of chips, testing of chips is an important step, and a chip test socket is usually required to test chips, check the on-line open/short circuit conditions of single chip components and circuit networks, and test the logic functions of analog devices and digital devices, so that the performance of the chip test socket is an important research content.
At present, the existing chip testing seat generally comprises a guide frame, a main body, a retaining plate and a spring probe, the spring probe is connected with a chip for testing, the times of the chip to be tested are many, the needle point abrasion speed of the spring probe is very high, the elasticity of the spring probe is weakened after the spring probe is compressed for many times, the service life of the spring probe is shortened, and the testing effect of the chip is influenced. In addition, because the spring probe is formed by installing the needle heads at the two ends and the spring in the copper pipe, the cost of the probe is high, and after the chip test seat is used for multiple times, the conductive elastic force of the spring probe is weakened and needs to be replaced frequently, so that the spring probe is complex, and the cost of the probe is further increased. When the high-frequency test is carried out, because the spring in the traditional spring probe is thin, the high-frequency signal transmission capability is not strong, and because the probe is formed by three structures that the needle heads at two ends and the spring are arranged in the copper pipe, when the high-frequency signal is transmitted, the signal passes through the three components, and the transmission of the signal is limited by the connecting nodes among the three components, the high-frequency signal transmission capability of the spring probe is weaker, and the high-frequency test effect is influenced.
Disclosure of Invention
The embodiment of the invention provides a chip testing seat, which is used for realizing high-frequency testing of a chip and has a good high-frequency testing effect.
In a first aspect, an embodiment of the present invention provides a chip testing socket, including:
a base;
the groove body is arranged on the base;
the insulating elastic rod is positioned in the clamping groove of the groove body;
at least one conductive metal sheet positioned in the tank body; the conductive metal sheet comprises a first edge and a second edge which are oppositely arranged; the first edge comprises at least two arc edges and is arranged on two sides of the midpoint of the first edge; the second edge is at least partially in snap contact with the surface of the insulating elastic rod; the conductive metal sheet further comprises a first contact and a second contact; along the extending direction of the first edge, the first contact and the second contact are arranged at two ends of the conductive metal sheet; the first contact is used for being electrically connected with a chip to be tested, and the second contact is used for being electrically connected with a test circuit board;
the pressing plate is arranged on one side, far away from the insulating elastic rod, of the conductive metal sheet, and the pressing plate is in meshed contact with the arc edge of the first edge and used for providing pressure for the conductive metal sheet.
Optionally, the conductive metal sheets are symmetrical along the central line pattern; wherein, the middle line is a connecting line of the middle point of the first side and the middle point of the second side.
Optionally, the arc-shaped edge of the first edge is semicircular.
Optionally, the arc-shaped edge of the first edge is a first concave edge, and the pressing plate includes at least two convex surfaces; the convex surfaces are respectively in one-to-one corresponding occlusion contact with the first concave edges.
Optionally, the arc-shaped edge of the first edge is a convex edge, and the pressure plate comprises at least two concave surfaces; the concave surfaces are respectively in one-to-one corresponding occlusion contact with the convex edges.
Optionally, the conductive metal sheet further includes a third contact and a fourth contact; the third contact point is symmetrical to the first contact point along the central line, and the fourth contact point is symmetrical to the second contact point along the central line.
Optionally, the distance from the first contact to the upper surface of the base is 0.1-0.2mm, and the distance from the second contact to the lower surface of the base is 0.1-0.2 mm.
Optionally, the second edge comprises a second concave edge, and the second concave edge is engaged with the surface of the insulating elastic rod.
Optionally, the conductive metal sheets are arranged in multiple rows.
Optionally, the base further includes a plurality of holes, and the fixing member fixes the base on the test circuit board through the plurality of holes.
The embodiment of the invention provides a chip testing seat which comprises a conductive metal sheet, wherein the conductive metal sheet comprises a first edge and a second edge which are oppositely arranged; the first edge comprises at least two arc edges and is arranged on two sides of the midpoint of the first edge; the second edge is at least partially in snap contact with the surface of the insulating elastic rod; the conductive metal sheet further comprises a first contact and a second contact; along the extending direction of the first edge, the first contact and the second contact are arranged at two ends of the conductive metal sheet; the first contact is used for being electrically connected with a chip to be tested, the second contact is used for being electrically connected with a testing circuit board, the pressing plate is arranged on one side, away from the insulating elastic rod, of the conductive metal sheet, and the pressing plate is in meshed contact with the arc-shaped edge of the first edge and used for providing pressure for the conductive metal sheet. Compared with the prior chip testing seat which uses a spring probe to connect the chip to be tested and the testing circuit board, the conductive metal sheet in the chip testing seat is different from the probe structure and is an integral part, the transmission of high-frequency signals cannot be influenced by nodes between the parts when the high-frequency signals are transmitted, at least two arc edges on two sides of the midpoint of the first edge of the conductive metal sheet are meshed and contacted with a pressure plate, and the pressure plate provides downward pressure for the conductive metal sheet through the two arc edges in the process of testing the chip so that the conductive metal sheet can rotate along the arc edges and the second contact of the conductive metal sheet generates rolling friction on the testing circuit board, but not sliding friction, so that the service lives of the conductive metal sheet and the test circuit board can be prolonged. The second edge of the conductive metal sheet is at least partially in occlusion contact with the surface of the insulating elastic rod, the conductive metal sheet can be prevented from sliding, the first contact of the conductive metal sheet is electrically connected with the chip to be tested, the second contact of the conductive metal sheet is electrically connected with the test circuit board, the chip to be tested is electrically connected with the test circuit board, high-frequency testing is conducted on the chip, the conductive metal sheet is short and thick compared with a spring probe, loss of high-frequency signal transmission is very little, the high-frequency testing device can be applied to high-frequency testing of the chip, and the high-frequency testing effect is good.
Drawings
Fig. 1 is a schematic structural diagram of a chip test socket according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a chip testing socket according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a conductive metal sheet according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view illustrating a pre-pressed state of a chip to be tested on a chip testing socket according to an embodiment of the present invention;
fig. 5 is a schematic cross-sectional view illustrating a test state of a chip to be tested on a chip testing socket according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Fig. 1 is a schematic structural diagram of a chip testing socket according to an embodiment of the present invention, fig. 2 is a schematic cross-sectional diagram of the chip testing socket according to the embodiment of the present invention, fig. 3 is a schematic structural diagram of a conductive metal sheet according to the embodiment of the present invention, and this embodiment is applicable to situations such as chip testing, and with reference to fig. 1, fig. 2, and fig. 3, the chip testing socket includes: the device comprises a base 10, a groove body 20, an insulating elastic rod 30, at least one conductive metal sheet 40 and a pressing plate 50.
Wherein, the groove body 20 is arranged on the base 10; the insulating elastic rod 30 is positioned in the clamping groove of the groove body 20; at least one conductive metal sheet 40 is located in the tank 20; the conductive metal sheet 40 includes a first side 41 and a second side 42 disposed opposite to each other; the first side 41 comprises at least two arc-shaped sides 411 arranged on two sides of the midpoint of the first side 41; the second edge 42 is in at least partial snap contact with the surface of the insulating elastic rod 30; the conductive metal sheet 40 further comprises a first contact 43 and a second contact 44; along the extending direction of the first edge 41, a first contact 43 and a second contact 44 are arranged at two ends of the conductive metal sheet 40; the first contact 43 is used for electrically connecting with a chip to be tested, and the second contact 44 is used for electrically connecting with a test circuit board; the pressing plate 50 is disposed on a side of the conductive metal sheet 40 away from the insulating elastic rod 30, and the pressing plate 50 is in snap contact with the arc-shaped edge 411 of the first edge 41 for providing pressure to the conductive metal sheet 40.
Specifically, a chip to be tested can be placed in a chip testing seat through a chip taking and placing device, when the chip to be tested is placed in the chip testing seat, the pressure plate 50 is subjected to external pressure, because the pressure plate 50 is in occlusion contact with the arc-shaped edge 411 of the first edge 41 of the conductive metal sheet 40, the pressure plate 50 can provide downward pressure for the conductive metal sheet 40 to ensure that the second contact 44 of the conductive metal sheet 40 is electrically connected with a testing circuit board, at the moment, the insulating elastic rod 30 in occlusion contact with the second edge 42 of the conductive metal sheet 40 provides a supporting function for the conductive metal sheet 40 to prevent the conductive metal sheet 40 from sliding, when the chip to be tested is placed in the chip testing seat, the chip to be tested is subjected to downward pressure, the chip to be tested is electrically connected with the first contact 43 of the conductive metal sheet 40 until the chip to be tested is placed in a preset testing position, the conductive metal sheet 40 is electrically connected, and is electrically connected with the test circuit board through the second contact 44, so that the chip to be tested is electrically connected with the test circuit board, and the chip to be tested is tested at high frequency and the like.
When a chip to be tested is placed on the chip testing seat for testing, the pressure plate 50 is pressed downwards, the pressure plate 50 is in snap contact with at least two arc-shaped edges 411 at two sides of the midpoint of the first edge 41 of the conductive metal sheet 40, and provides a downward pressure to the conductive metal sheet 40 to electrically connect the second contact 44 of the conductive metal sheet 40 to the test circuit board and a rightward pressure to prevent the first contact 43 of the conductive metal sheet 40 from being biased to the left side to be electrically disconnected from the chip to be tested, during the testing of the chip to be tested, the pressing plate 50 provides downward pressure to the conductive metal sheet 40 through the arc-shaped edge 411, so that the conductive metal sheet 40 can rotate along the arc-shaped edge 411, thereby causing the second contact 44 of the conductive metal sheet 40 to generate rolling friction against the test circuit board, rather than sliding friction, and thus may extend the life of the conductive sheet metal 40 and the test circuit board.
And, the surface of the insulating elastic rod 30 is at least partially in snap contact with the second edge 42 of the conductive metal sheet 40, so as to provide an upward supporting force for the conductive metal sheet 40, prevent the conductive metal sheet 40 from sliding and enable the first contact 43 of the conductive metal sheet 40 to be electrically connected with the chip to be tested, thereby enabling the chip to be tested to be electrically connected with the test circuit board through the first contact 43 and the second contact 44 of the conductive metal sheet 40, so as to perform a high-frequency test on the chip to be tested.
The chip testing seat provided by the embodiment comprises a conductive metal sheet, wherein the conductive metal sheet realizes the electric connection between a chip to be tested and a testing circuit board through a first contact and a second contact so as to test the chip to be tested through the testing circuit board, compared with the existing chip testing seat which uses a spring probe to connect the chip to be tested and the testing circuit board, the conductive metal sheet in the chip testing seat is different from a probe structure and is an integral part, the transmission of a high-frequency signal cannot be influenced by a node between the parts when the high-frequency signal is transmitted, at least two arc edges on two sides of a middle point of a first edge of the conductive metal sheet are meshed and contacted with a pressure plate, and the pressure plate provides downward pressure for the conductive metal sheet through the two arc edges in the process of testing the chip so that the conductive metal sheet can rotate along the arc edges, therefore, the second contact of the conductive metal sheet generates rolling friction instead of sliding friction on the test circuit board, and the service lives of the conductive metal sheet and the test circuit board can be prolonged. The second edge of the conductive metal sheet is at least partially in occlusion contact with the surface of the insulating elastic rod, the conductive metal sheet can be prevented from sliding, the first contact of the conductive metal sheet is electrically connected with the chip to be tested, the second contact of the conductive metal sheet is electrically connected with the test circuit board, the chip to be tested is electrically connected with the test circuit board, high-frequency testing is conducted on the chip, the conductive metal sheet is short and thick compared with a spring probe, loss of high-frequency signal transmission is very little, the high-frequency testing device can be applied to high-frequency testing of the chip, and the high-frequency testing effect is good.
Fig. 4 is a schematic cross-sectional view of a chip to be tested in a pre-stressed state on a chip testing socket according to an embodiment of the present invention, and referring to fig. 3 and fig. 4, optionally, the conductive metal sheet 40 is symmetrical along a center line L.
The central line L is a connecting line between the midpoint a of the first edge 41 and the midpoint B of the second edge 42, the conductive metal sheet 40 has a symmetrical structure, and the conductive metal sheet 40 can be used continuously after being turned over, so that the service life of the conductive metal sheet 40 can be prolonged.
Optionally, the arcuate edge 411 of the first edge 41 is semi-circular.
The semicircular arc edge 411 is in snap contact with the pressure plate 50, and the semicircular structure enables the arc edge 411 to be in better snap contact with the pressure plate 50, so that the pressure plate 50 can provide pressure for the conductive metal sheet 40 when the chip 200 to be tested is tested. In the process of testing the chip 200 to be tested, when the second contact 44 of the conductive metal sheet 40 generates rolling friction on the test circuit board 100, the rolling friction is smaller due to the semicircular shape, so that the abrasion of the second contact 44 is reduced, and the service life of the conductive metal sheet 40 is prolonged.
Optionally, the arc-shaped edge 411 of the first edge 41 is a first concave edge, and the pressing plate 50 includes at least two convex surfaces 51; the convex surfaces 51 are in one-to-one corresponding snap contact with the first concave edges, respectively.
The convex surface 51 of the pressing plate 50 is in one-to-one corresponding occlusion contact with the arc-shaped edge 411 of the first concave edge, when the pressing plate 50 is pressed downwards, the pressing plate 50 can provide a downward pressure and a rightward pressure to the arc-shaped edge 411 of the first edge 41, the downward pressure can enable the second contact 44 of the conductive metal sheet 40 to be electrically connected with the test circuit board 100, and the rightward pressure can prevent the upper half part of the conductive metal sheet 40 from moving leftwards so that the first contact 43 of the conductive metal sheet 40 is deflected rightwards and cannot be electrically connected with the chip 200 to be tested.
Optionally, the arc-shaped edge 411 of the first edge 41 is a convex edge, and the pressing plate 50 includes at least two concave surfaces; the concave surfaces are respectively in one-to-one corresponding occlusion contact with the convex edges.
The concave surface of the pressing plate 50 is in one-to-one corresponding occlusion contact with the convex edge, so that when the pressing plate 50 is pressed downwards, the pressing plate 50 can provide downward pressure and rightward pressure for the arc-shaped edge 411 of the first edge 41, the second contact 44 of the conductive metal sheet 40 is electrically connected with the testing circuit board 100, the first contact 43 of the conductive metal sheet 40 is electrically connected with the chip 200 to be tested, the chip 200 to be tested is electrically connected with the testing circuit board 100 through the conductive metal sheet 40, and the chip 200 to be tested is tested by testing the chip 200 to be tested.
It should be noted that, in fig. 3, the arc-shaped edge 411 of the first edge 41 is a concave edge for illustrative purposes, and the arc-shaped edge 411 of the first edge 41 may also be a convex edge, which is not limited herein.
Referring to fig. 3, optionally, the conductive metal sheet 40 further includes a third contact 45 and a fourth contact 46; the third contact 45 is positioned symmetrically to the first contact 43 along the center line L, and the fourth contact 46 is positioned symmetrically to the second contact 44 along the center line L.
Specifically, when the first contact 43 and/or the second contact 44 are worn, the conductive metal sheet 40 can be turned over and then electrically connected to the chip 200 to be tested through the third contact 45, and the fourth contact 46 is electrically connected to the test circuit board 100, so that the service life of the conductive metal sheet 40 is prolonged.
Referring to fig. 2, alternatively, the first contact 43 may be spaced 0.1-0.2mm from the upper surface 11 of the base 10 and the second contact 44 may be spaced 0.1-0.2mm from the lower surface 12 of the base 10.
The conductive metal sheet 40 is pressed by the pressing plate 50, the conductive metal sheet 40 protrudes from the lower surface of the base 10, and the protruding distance is referred to as a pre-pressing distance, which is the distance from the second contact 44 to the lower surface 12 of the base 10, and the distance may be 0.1-0.2mm, and cannot be too large to ensure that the base 10 is fixed to the test circuit board 100, and the distance from the first contact 43 to the upper surface 11 of the base 10 may be a value within a range of 0.1-0.2mm, and cannot be too large to ensure that the chip 200 to be tested can be pressed down to a preset test position.
Referring to fig. 2 and 3, optionally, the second edge 42 includes a second concave edge 421, and the second concave edge 421 engages with a surface of the insulating elastic rod 30.
The second concave edge 421 may be semicircular, so that the second concave edge 421 can be better engaged with the surface of the insulating elastic rod 30, and when the conductive metal sheet 40 is pressed by the pressing plate 50, the insulating elastic rod 30 can provide a supporting function for the conductive metal sheet 40, and prevent the conductive metal sheet 40 from sliding.
With continued reference to fig. 1, the conductive metal sheets 40 are optionally arranged in a plurality of rows.
For example, the conductive metal sheets 40 may be arranged in multiple rows as shown in fig. 1, so that each pin of the chip to be tested can be electrically connected to a different conductive metal sheet 40, thereby testing each pin of the chip to be tested.
Referring to fig. 1 and 4, optionally, the base 10 further includes a plurality of holes 13, and the fixing member fixes the base 10 to the test circuit board 100 through the plurality of holes 13.
When the base 10 is fixed to the test circuit board 100, the conductive metal sheet 40 protruding out of the lower surface of the base 10 moves upward, and due to the action of the downward-pressing elastic force on the pressing plate 50, the pressing plate 50 contacts the arc-shaped edge 411 of the first edge 41 of the conductive metal sheet 40 to provide downward pressure to the conductive metal sheet 40, so as to ensure stable electrical connection between the conductive metal sheet 40 and the test circuit board 50. The chip 200 to be tested is put into the slot body 20 through the chip pick-and-place device, the pins of the chip 200 to be tested are electrically connected with the first contacts 43 of the corresponding conductive metal sheets 40, and at this time, the pins of the chip 200 to be tested are higher than the upper surface of the base 10.
Fig. 5 is a cross-sectional schematic view of a test state of a chip to be tested on a chip test socket according to an embodiment of the present invention, and with reference to fig. 4 and fig. 5, an exemplary process of the chip to be tested 200 from a pre-stressed state in fig. 4 to a test state in fig. 5 is as follows: the chip to be tested 200 is downwardly pressed to move downwardly so that the chip to be tested 200 is brought into contact with the upper surface of the base 10. In the process, the pins of the chip 200 to be tested generate downward pressure on the conductive metal sheet 40, so that the arc-shaped edge 411 of the first edge 41 of the conductive metal sheet 40 rotates around the symmetry axis of the conductive metal sheet 40, and the second contact 44 of the conductive metal sheet 40 generates rolling friction instead of sliding friction on the test circuit board 100, thereby prolonging the service life of the test circuit board 100.
The chip testing seat provided by the embodiment comprises a conductive metal sheet which is of a symmetrical structure, the chip to be tested is electrically connected with a testing circuit board through a first contact and a second contact, or the chip to be tested is electrically connected with the testing circuit board through a third contact and a fourth contact, so that the chip to be tested is tested through the testing circuit board, compared with the existing chip testing seat which uses a spring probe to connect the chip to be tested with the testing circuit board, the conductive metal sheet in the chip testing seat is of a structure different from the probe and is an integral part, the transmission of high-frequency signals cannot be influenced by nodes among parts when the high-frequency signals are transmitted, at least two arc edges on two sides of a middle point of a first edge of the conductive metal sheet are in meshed contact with a pressing plate, and in the process of testing the chip, the pressing plate provides downward pressure for the conductive metal sheet through the two arc edges, the conductive metal sheet can rotate along the arc edge, so that the second contact of the conductive metal sheet generates rolling friction instead of sliding friction on the test circuit board, and the service lives of the conductive metal sheet and the test circuit board can be prolonged. The second edge of the conductive metal sheet is at least partially in occlusion contact with the surface of the insulating elastic rod, so that the conductive metal sheet can be prevented from sliding, the first contact of the conductive metal sheet is electrically connected with the chip to be tested, the second contact is electrically connected with the test circuit board, or the third contact is electrically connected with the chip to be tested, and the fourth contact is electrically connected with the test circuit board, so that the chip to be tested is electrically connected with the test circuit board, so that the chip is subjected to high-frequency test.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A chip test socket, comprising:
a base;
the groove body is arranged on the base;
the insulating elastic rod is positioned in the clamping groove of the groove body;
at least one conductive metal sheet located in the tank body; the conductive metal sheet comprises a first edge and a second edge which are oppositely arranged; the first edge comprises at least two arc-shaped edges and is arranged on two sides of the midpoint of the first edge; the second edge is at least partially in snap contact with the surface of the insulating elastic rod; the conductive metal sheet further comprises a first contact and a second contact; the first contact and the second contact are arranged at two ends of the conductive metal sheet along the extending direction of the first edge; the first contact is used for being electrically connected with a chip to be tested, and the second contact is used for being electrically connected with a test circuit board;
the pressing plate is arranged on one side, far away from the insulating elastic rod, of the conductive metal sheet, and the pressing plate is in meshed contact with the arc-shaped edge of the first edge and used for providing pressure for the conductive metal sheet.
2. The die test socket according to claim 1, wherein the conductive metal sheet is symmetrical along a centerline pattern; wherein the midline is a connecting line of the midpoint of the first edge and the midpoint of the second edge.
3. The die paddle of claim 2, wherein the arcuate edge of the first edge is semi-circular.
4. The die paddle of claim 3, wherein the arcuate edge of the first edge is a first concave edge and the platen includes at least two convex surfaces; the convex surfaces are respectively in one-to-one corresponding meshed contact with the first concave edges.
5. The die test socket according to claim 3, wherein the first side has an arcuate edge that is convex, and the pressure plate includes at least two concave surfaces; the concave surfaces are respectively in one-to-one corresponding occlusion contact with the convex edges.
6. The die test socket of claim 2, wherein the conductive metal sheet further comprises a third contact and a fourth contact; the third contact is symmetrical to the first contact along the midline, and the fourth contact is symmetrical to the second contact along the midline.
7. The die test socket according to claim 1, wherein the first contact is spaced from the upper surface of the base by 0.1-0.2mm, and the second contact is spaced from the lower surface of the base by 0.1-0.2 mm.
8. The die test socket according to claim 1 or 2, wherein the second edge comprises a second recessed edge, the second recessed edge engaging a surface of the insulating elastic rod.
9. The die test socket according to claim 1, wherein the conductive metal sheets are arranged in a plurality of rows.
10. The die test socket according to claim 1, wherein the base further comprises a plurality of holes, and a fixing member fixes the base to the test circuit board through the plurality of holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010247245.XA CN111239592B (en) | 2020-03-31 | 2020-03-31 | Chip test seat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010247245.XA CN111239592B (en) | 2020-03-31 | 2020-03-31 | Chip test seat |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111239592A true CN111239592A (en) | 2020-06-05 |
| CN111239592B CN111239592B (en) | 2024-07-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010247245.XA Active CN111239592B (en) | 2020-03-31 | 2020-03-31 | Chip test seat |
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| CN (1) | CN111239592B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112083315A (en) * | 2020-09-15 | 2020-12-15 | 苏州韬盛电子科技有限公司 | Kelvin test socket for QFN |
| CN118209762A (en) * | 2024-05-21 | 2024-06-18 | 四川斯艾普电子科技有限公司 | Slide type high-power microwave module testing device and method |
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| CN118209762A (en) * | 2024-05-21 | 2024-06-18 | 四川斯艾普电子科技有限公司 | Slide type high-power microwave module testing device and method |
| CN118209762B (en) * | 2024-05-21 | 2024-08-20 | 四川斯艾普电子科技有限公司 | Slide type high-power microwave module testing device and method |
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