WO2002099930B1 - Socket connector and contact for use in a socket connector - Google Patents

Socket connector and contact for use in a socket connector

Info

Publication number
WO2002099930B1
WO2002099930B1 PCT/US2002/016389 US0216389W WO02099930B1 WO 2002099930 B1 WO2002099930 B1 WO 2002099930B1 US 0216389 W US0216389 W US 0216389W WO 02099930 B1 WO02099930 B1 WO 02099930B1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
contact piece
semiconductor package
piece
leaf spring
Prior art date
Application number
PCT/US2002/016389
Other languages
French (fr)
Other versions
WO2002099930A1 (en
Inventor
Tomohiro Nakano
Original Assignee
Molex Inc
Tomohiro Nakano
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc, Tomohiro Nakano filed Critical Molex Inc
Priority to US10/467,501 priority Critical patent/US20040067665A1/en
Publication of WO2002099930A1 publication Critical patent/WO2002099930A1/en
Publication of WO2002099930B1 publication Critical patent/WO2002099930B1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/045—Sockets or component fixtures for RF or HF testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H01R13/11—Resilient sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)

Abstract

A socket connector and a contact for use in a socket connector is disclosed. The socket connector includes a plurality of contacts arranged in a grid shape and a socket body provided with the respective contacts. The contact includes a first contact piece and a second contact piece out of contact with each other in a first condition and in contact with each other in a second condition. When the first and second contact piece are in conctact with each other, the electric path length is shortened to reduce a self-inductance, thereby allowing the socket connector of the present invention to be used in high frequency application and in test and evaluation sockets.

Claims

AMENDED CLAIMS[received by the International Bureau on 23 December 2002 (23.12.02); original claims 1-17 replaced by new claims 1 -23 (6 pages)]
1. A test evaluation socket for a semiconductor package having a plurality of conductive elements, the test evaluation socket comprising: a plurality of contacts and a socket body provided with the respective contacts, wherein each contact includes an arcuate leaf spring portion, a fixture portion for fixing said leaf spring portion to said socket body, a conductive element contact portion provided at one end of said leaf spring portion, a conductive pattern contact portion provided at the other end of said leaf spring portion, a first contact piece provided at one end of said leaf spring portion, extending toward the other end of said leaf spring portion, and shiftable relative to said fixture portion, and a cantilever type second contact piece provided at the other end of said leaf spring portion, extending toward one end of said leaf spring portion, and shiftable relative to said fixture portion, and wherein said first contact piece and said second contact piece are set so as to be out of contact with each other under the condition that the conductive element is out of contact with said conductive element contact portion and the conductive pattern of the substrate is out of contact with said conductive pattern contact portion, and so as to be in contact with each other under the condition that the conductive element is in pressing contact with said conductive element contact portion, the conductive pattern of the substrate is in pressing contact with said conductive pattern contact portion and said first contact piece and said second contact piece are shifted in a direction close to each other.
2. The test evaluation socket for a semiconductor package according to claim 1 , wherein a slant surface with which said second contact piece contacts is formed in said first contact piece, and wherein said second contact piece is brought into contact with said slant surface arid moved relative to said slant surface in the process that said conductive element comes into pressing contact with said conductive element contact portion and said conductive pattern of the substrate comes into pressing contact with said conductive pattern contact portion so that said first contact piece and said second contact piece are shifted in the direction close to each other. 17
3. The test evaluation socket for a semiconductor package according to claim 1 , wherein said first contact piece and said second contact piece are set so as to form an electrical path length substantially in a linear form under the condition that said first contact piece and said second contact piece are in contact with each other.
4. The test evaluation socket for a semiconductor package according to claim 1, wherein said socket body comprises a carrier surface of the semiconductor package, a substrate facing surface opposite thereto and a plurality of contact receiving holes bored through from the carrier surface of the semiconductor package to the substrate facing surface, wherein each of said contact receiving holes is arranged in the grid shape, wherein a conductive element receiving space in which each laid conductive element of the semiconductor package is located is provided on the side of the semiconductor package carrier surface of each contact receiving hole, and wherein each contact is received in the associated contact receiving hole under the condition that the conductive element contact portion is located in said conductive element receiving space and the conductive pattern contact portion is projected from said substrate facing surface.
5. The test evaluation socket for a semiconductor package according to claim 1 , wherein the conductive element is a solder ball.
6. The test evaluation socket for a semiconductor package according to claim 5, wherein a slant surface with which said second contact piece contacts is formed in said first contact piece, and wherein said second contact piece is brought into contact with said slant surface and moved relative to said slant surface in the process that said solder ball comes into pressing contact with said solder ball contact portion and said conductive pattern of the substrate comes into pressing contact with said conductive pattern contact portion so that said first contact piece and said second contact piece are shifted in the direction close to each other.
7. The test evaluation socket for a semiconductor package according to claim 5, 18
wherein said first contact piece and said second contact piece are set so as to form an electrical path length substantially in a linear form under the condition that said first contact piece and said second contact piece are in contact with each other.
8. The test evaluation socket for a semiconductor package according to claim 5, wherein said socket body comprises a carrier surface of the semiconductor package, a substrate facing surface opposite thereto and a plurality of contact receiving holes bored through from the carrier surface of the semiconductor package to the substrate facing surface, wherein each of said contact receiving holes is arranged in the grid shape, wherein a solder ball receiving space in which each laid solder ball of the semiconductor package is located is provided on the side of the semiconductor package carrier surface of each contact receiving hole, and wherein each contact is received in the associated contact receiving hole under the condition that the solder ball contact portion is located in said solder ball receiving space and the conductive pattern contact portion is projected from said substrate facing surface.
9. The test evaluation socket for a semiconductor package according to claim 1 , wherein the conductive element is a pin terminal.
10. The test evaluation socket for a semiconductor package according to claim 9, wherein a slant surface with which said second contact piece contacts is formed in said first contact piece, and wherein said second contact piece is brought into contact with said slant surface and moved relative to said slant surface in the process that said pin terminal comes into pressing contact with said pin terminal contact portion and said conductive pattern of the substrate comes into pressing contact with said conductive pattern contact portion so that said first contact piece and said second contact piece are shifted in the direction close to each other.
11. The test evaluation socket for a semiconductor package according to claim 9, wherein said first contact piece and said second contact piece are set so as to form an electrical 19
path length substantially in a linear form under the condition that said first contact piece and said second contact piece are in contact with each other.
12. The test evaluation socket for a semiconductor package according to claim 9, wherein: said socket body comprises a carrier plate of the semiconductor package; said semiconductor package carrier plate is mounted on said socket body through springs so as to be reciprocatingly movable between a first position and a second position; said first position is a position where the semiconductor package is laid on said semiconductor package carrier plate with its pin terminals projected from a circumferential edge of the semiconductor package carrier plate; and said second position is a position where the projected pin terminals are in pressing contact with said pin terminal contact portions.
13. The test evaluation socket for a semiconductor package according to claim 1, wherein the plurality of contacts are arranged in a grid pattern.
14. The test evaluation socket for a semiconductor package according to claim 1, wherein the plurality of contacts are arranged in an outer circumference.
15. A contact for use in a socket connector, the socket connector capable of receiving a semiconductor package having a contact body, the contact comprising: an arcuate leaf spring portion, a fixture portion for fixing said leaf spring portion to said socket connector, a contact portion provided at one end of said leaf spring portion, a conductive pattern contact portion provided at the other end of said leaf spring portion, a first contact piece provided at one end of said leaf spring, extending toward the other end of said leaf spring portion, and shiftable relative to said fixture portion, and a cantilever type second contact piece provided at the other end of said leaf spring portion, extending toward one end of said leaf spring portion, and shiftable relative to said fixture portion, wherein said first contact piece and said second contact piece are set so as to be out of 20
contact with each other under the condition that the contact body is out of contact with said contact portion and the conductive pattern of the substrate is out of contact with said conductive pattern contact portion, and so as to be in contact with each other under the condition that the contact body is in pressing contact with said contact portion, the conductive pattern of the substrate is in pressing contact with said conductive pattern contact portion, and said first contact piece and said second contact piece are shifted in a direction close to each other.
16. The contact according to claim 15, wherein said contact body is a solder ball.
17. The contact according to claim 15, wherein said contact body is a pin terminal.
18. The contact according to claim 15, wherein said first contact piece and said second contact piece are set so as to form an electric path length substantially in a linear form under the condition that said first contact piece and said second contact piece are in contact with each other.
19. A socket connector, comprising: a plurality of contacts and a socket body provided with the respective contacts, each contact including an arcuate leaf spring portion, a fixture portion for fixing said leaf spring portion to said socket connector, a contact portion provided at one end of said leaf spring portion, a conductive pattern contact portion provided at the other end of said leaf spring portion, a first contact piece provided at one end of said leaf spring, extending toward the other end of said leaf spring portion, and shiftable relative to said fixture portion, and a second contact piece provided at the other end of said leaf spring portion, extending toward one end of said leaf spring portion, and shiftable relative to said fixture portion, wherein said first contact piece and said second contact piece are set so as to be out of contact with each other under the condition that the contact body is out of contact with said contact portion and the conductive pattern of the substrate is out of contact with said conductive pattern contact portion, and so as to be in contact with each other under the condition that the contact body is in pressing contact with said contact portion, the conductive pattern of the substrate is in pressing contact with said conductive pattern contact portion, and said first contact piece and said second 21
contact piece are shifted in a direction close to each other.
20. The socket connector of claim 19, wherein the second contact piece is cantilevered.
21. The socket connector of claim 19, wherein said first contact piece and said second contact piece are set so as to form an electric path length substantially in a linear form under the condition that said first contact piece and said second contact piece are in contact with each other.
22. The socket connector of claim 19, wherein the first contact piece includes a slant surface for contacting the second contact piece.
23. The socket connector of claim 22, wherein said second contact piece is brought into contact with said slant surface and moved relative to said slant surface in the process that said solder ball comes into pressing contact with said solder ball contact portion and said conductive pattern of the substrate comes into pressing contact with said conductive pattern contact portion so that said first contact piece and said second contact piece are shifted in the direction close to each other.
PCT/US2002/016389 2001-05-31 2002-05-23 Socket connector and contact for use in a socket connector WO2002099930A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/467,501 US20040067665A1 (en) 2001-05-31 2002-05-23 Socket connector and contact for use in a socket connector

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-164404 2001-05-31
JP2001164404A JP2002367746A (en) 2001-05-31 2001-05-31 Socket and contact for test evaluation of semiconductor package

Publications (2)

Publication Number Publication Date
WO2002099930A1 WO2002099930A1 (en) 2002-12-12
WO2002099930B1 true WO2002099930B1 (en) 2003-10-23

Family

ID=19007229

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/016389 WO2002099930A1 (en) 2001-05-31 2002-05-23 Socket connector and contact for use in a socket connector

Country Status (4)

Country Link
JP (1) JP2002367746A (en)
CN (1) CN1238928C (en)
TW (1) TW534507U (en)
WO (1) WO2002099930A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4021457B2 (en) 2003-07-29 2007-12-12 株式会社アドバンテスト Socket and test device
JP2007234604A (en) * 2003-07-29 2007-09-13 Advantest Corp Socket and test apparatus
JP2005108518A (en) * 2003-09-29 2005-04-21 Tyco Electronics Amp Kk Contact for ic socket
JP4973988B2 (en) 2006-06-12 2012-07-11 山一電機株式会社 Contact and IC socket using the same
JP5074179B2 (en) * 2007-12-28 2012-11-14 タイコエレクトロニクスジャパン合同会社 Contact member and electrical connector
JP5270480B2 (en) * 2008-11-05 2013-08-21 富士通コンポーネント株式会社 connector
JP5856864B2 (en) * 2012-02-07 2016-02-10 日本発條株式会社 Connection terminal and connection terminal unit
KR101669256B1 (en) * 2015-07-23 2016-10-26 주식회사 오킨스전자 Pressurizable contact pin for semiconductor package test socket
CN107196096B (en) * 2017-04-24 2019-08-30 番禺得意精密电子工业有限公司 Electric connector and its terminal
CN107576902B (en) * 2017-07-25 2018-05-22 法特迪精密科技（苏州）有限公司 A kind of test jack of insertion slot type terminal
JP2020071052A (en) * 2018-10-29 2020-05-07 株式会社エンプラス Contact pin and socket
KR102092006B1 (en) * 2019-04-23 2020-03-23 박상량 Leaf spring type connection pin

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62157086U (en) * 1986-03-26 1987-10-06
JPH0744052B2 (en) * 1987-05-01 1995-05-15 株式会社日立製作所 IC Socket
JPH0378529U (en) * 1989-12-04 1991-08-08
JPH04144083A (en) * 1990-10-04 1992-05-18 Fujitsu Ltd Electric contact piece and ic socket
JP2787534B2 (en) * 1992-11-18 1998-08-20 日本エー・エム・ピー株式会社 Contact and socket using it
JPH08222335A (en) * 1994-12-15 1996-08-30 Amp Japan Ltd Electric contact and ic socket using the contact
US5498970A (en) * 1995-02-06 1996-03-12 Minnesota Mining And Manufacturing Top load socket for ball grid array devices
US5746608A (en) * 1995-11-30 1998-05-05 Taylor; Attalee S. Surface mount socket for an electronic package, and contact for use therewith
US5730606A (en) * 1996-04-02 1998-03-24 Aries Electronics, Inc. Universal production ball grid array socket
JP2912882B2 (en) * 1996-10-23 1999-06-28 山一電機株式会社 Double-sided contact type connector

Also Published As

Publication number Publication date
CN1238928C (en) 2006-01-25
TW534507U (en) 2003-05-21
CN1513219A (en) 2004-07-14
JP2002367746A (en) 2002-12-20
WO2002099930A1 (en) 2002-12-12

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