CN111200700A - 摄像组件及其封装方法、镜头模组、电子设备 - Google Patents
摄像组件及其封装方法、镜头模组、电子设备 Download PDFInfo
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- CN111200700A CN111200700A CN201811385606.6A CN201811385606A CN111200700A CN 111200700 A CN111200700 A CN 111200700A CN 201811385606 A CN201811385606 A CN 201811385606A CN 111200700 A CN111200700 A CN 111200700A
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Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Lens Barrels (AREA)
- Blocking Light For Cameras (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
Abstract
Description
Claims (20)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811385606.6A CN111200700B (zh) | 2018-11-20 | 2018-11-20 | 摄像组件及其封装方法、镜头模组、电子设备 |
PCT/CN2018/119986 WO2020103213A1 (zh) | 2018-11-20 | 2018-12-10 | 摄像组件及其封装方法、镜头模组、电子设备 |
JP2019568295A JP6993724B2 (ja) | 2018-11-20 | 2018-12-10 | 撮影アセンブリおよびそのパッケージング方法、レンズモジュール、電子機器 |
KR1020197036887A KR102250603B1 (ko) | 2018-11-20 | 2018-12-10 | 촬영 어셈블리 및 이의 패키징 방법, 렌즈 모듈, 전자 기기 |
US16/235,267 US11069670B2 (en) | 2018-11-20 | 2018-12-28 | Camera assembly and packaging method thereof, lens module, and electronic device |
US17/304,818 US20210320095A1 (en) | 2018-11-20 | 2021-06-25 | Camera assembly, lens module, and electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811385606.6A CN111200700B (zh) | 2018-11-20 | 2018-11-20 | 摄像组件及其封装方法、镜头模组、电子设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111200700A true CN111200700A (zh) | 2020-05-26 |
CN111200700B CN111200700B (zh) | 2021-10-19 |
Family
ID=70747332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811385606.6A Active CN111200700B (zh) | 2018-11-20 | 2018-11-20 | 摄像组件及其封装方法、镜头模组、电子设备 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6993724B2 (zh) |
KR (1) | KR102250603B1 (zh) |
CN (1) | CN111200700B (zh) |
WO (1) | WO2020103213A1 (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102142416A (zh) * | 2009-10-30 | 2011-08-03 | 三洋电机株式会社 | 元件搭载用基板、半导体模块及便携式设备 |
CN103456754A (zh) * | 2012-05-31 | 2013-12-18 | 意法半导体有限公司 | 晶片级光学传感器封装和低剖面照相机模块以及制造方法 |
US8697473B2 (en) * | 2011-01-31 | 2014-04-15 | Aptina Imaging Corporation | Methods for forming backside illuminated image sensors with front side metal redistribution layers |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000235989A (ja) * | 1999-02-16 | 2000-08-29 | Furukawa Electric Co Ltd:The | バンプ付き回路基板の製造方法 |
KR20010061546A (ko) * | 1999-12-28 | 2001-07-07 | 박종섭 | 강유전체 메모리 소자의 콘택식각 방법 |
JP4158714B2 (ja) * | 2004-02-06 | 2008-10-01 | 松下電器産業株式会社 | 電子部品実装済基板の製造方法 |
JP2006005612A (ja) * | 2004-06-17 | 2006-01-05 | Shinko Electric Ind Co Ltd | 撮像モジュール |
JP2007123351A (ja) * | 2005-10-25 | 2007-05-17 | Fujifilm Corp | 固体撮像装置 |
JP4382030B2 (ja) * | 2005-11-15 | 2009-12-09 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
JP2009176894A (ja) * | 2008-01-23 | 2009-08-06 | Panasonic Corp | 光学半導体装置 |
US20130237055A1 (en) * | 2010-06-11 | 2013-09-12 | Imec | Method of redistributing functional element |
KR20120016499A (ko) * | 2010-08-16 | 2012-02-24 | 삼성전자주식회사 | 카메라 모듈 |
CN103700634B (zh) * | 2013-11-06 | 2016-06-22 | 南昌欧菲光电技术有限公司 | 相机模组及其封装结构和封装方法 |
JP6100195B2 (ja) * | 2014-04-09 | 2017-03-22 | 富士フイルム株式会社 | 撮像装置 |
CN203895459U (zh) * | 2014-05-20 | 2014-10-22 | 苏州晶方半导体科技股份有限公司 | 一种影像传感器模组 |
JP2016100573A (ja) * | 2014-11-26 | 2016-05-30 | 株式会社東芝 | 電子モジュール、及びカメラモジュール |
CN105244359B (zh) * | 2015-10-28 | 2019-02-26 | 苏州晶方半导体科技股份有限公司 | 影像传感芯片封装结构及封装方法 |
CN106206485A (zh) * | 2016-09-20 | 2016-12-07 | 苏州科阳光电科技有限公司 | 图像传感器模组及其制作方法 |
CN107958881A (zh) * | 2017-11-28 | 2018-04-24 | 华进半导体封装先导技术研发中心有限公司 | 一种cis器件封装结构及封装方法 |
-
2018
- 2018-11-20 CN CN201811385606.6A patent/CN111200700B/zh active Active
- 2018-12-10 KR KR1020197036887A patent/KR102250603B1/ko active IP Right Grant
- 2018-12-10 WO PCT/CN2018/119986 patent/WO2020103213A1/zh active Application Filing
- 2018-12-10 JP JP2019568295A patent/JP6993724B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102142416A (zh) * | 2009-10-30 | 2011-08-03 | 三洋电机株式会社 | 元件搭载用基板、半导体模块及便携式设备 |
US8697473B2 (en) * | 2011-01-31 | 2014-04-15 | Aptina Imaging Corporation | Methods for forming backside illuminated image sensors with front side metal redistribution layers |
CN103456754A (zh) * | 2012-05-31 | 2013-12-18 | 意法半导体有限公司 | 晶片级光学传感器封装和低剖面照相机模块以及制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2021511651A (ja) | 2021-05-06 |
JP6993724B2 (ja) | 2022-01-14 |
KR20200063106A (ko) | 2020-06-04 |
WO2020103213A1 (zh) | 2020-05-28 |
KR102250603B1 (ko) | 2021-05-13 |
CN111200700B (zh) | 2021-10-19 |
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Denomination of invention: Camera assembly and packaging method thereof, lens module, and electronic equipment Effective date of registration: 20220906 Granted publication date: 20211019 Pledgee: Bank of China Limited Beilun Branch Pledgor: NINGBO SEMICONDUCTOR INTERNATIONAL Corp. Registration number: Y2022330002150 |
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Denomination of invention: Camera components and their packaging methods, lens modules, electronic devices Effective date of registration: 20231107 Granted publication date: 20211019 Pledgee: Bank of China Limited Beilun Branch Pledgor: NINGBO SEMICONDUCTOR INTERNATIONAL Corp. Registration number: Y2023980064197 |
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