CN111199900A - 检查键合的半导体芯片的设备和方法 - Google Patents

检查键合的半导体芯片的设备和方法 Download PDF

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CN111199900A
CN111199900A CN201911130712.4A CN201911130712A CN111199900A CN 111199900 A CN111199900 A CN 111199900A CN 201911130712 A CN201911130712 A CN 201911130712A CN 111199900 A CN111199900 A CN 111199900A
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semiconductor chip
substrate
optical
optical assembly
top surface
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施会丰
邓江汶
周立基
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ASMPT Singapore Pte Ltd
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Abstract

一种用于检查键合在衬底的顶面上的半导体芯片的设备，其使用包括图像传感器和光学系统的光学组件以进行该检查。该光学组件相对于衬底的顶面倾斜一倾斜角，并且布置成使得其焦深基本垂直于衬底的顶面，以检查半导体芯片的至少一个侧壁。

Description

检查键合的半导体芯片的设备和方法
技术领域
本发明涉及半导体封装的制造，并且尤其涉及在半导体封装过程中对键合的半导体芯片的检查。
背景技术
在用于半导体封装的芯片键合应用中，环氧树脂通常被用作将半导体芯片键合到衬底的键合垫上的介质。首先将液态环氧树脂层分配到衬底的键合垫上，然后将半导体芯片压到位于键合垫上的环氧树脂层上。当按压半导体芯片时，一些环氧树脂从半导体芯片下面被挤出以覆盖半导体芯片的侧面直至一定高度，从而形成围绕键合的半导体芯片的填角。图1是衬底10的图示，衬底10具有使用环氧树脂键合到其上的半导体芯片12。从半导体芯片12的下面挤出一些环氧树脂以形成围绕芯片的填角14。如此形成的填角14的高度h是键合质量的重要指标。
常规地，使用位于衬底上方的照相机对键合的半导体芯片的进行检查以获得其平面图。这样，通过照相机只能获得键合在衬底10上的半导体芯片12的二维图像。因此，在线检查限于从半导体芯片12上方可观察到的诸如键合精度和渗出之类的缺陷。二维图像充其量仅提供填角高度h的间接近似值。在芯片键合设备已经键合了所需的半导体芯片12之后，必须离线检查样品衬底10以进行进一步的质量检查，例如填角高度，芯片倾斜度和键合线厚度（“BLT”）。应当理解，由于在这种环境下安装用于在线测量的成像相机的复杂性，所以无法在常规的芯片键合设备内测量填角高度。
由于只能使用上述传统方法离线验证最终的键合质量，因此存在现实的风险，即仅在完成整个芯片键合过程后才能发现有缺陷的键合的半导体芯片，从而导致良率降低，尤其是在大量的半导体芯片12只能在之后被发现有缺陷的情况下。
发明内容
因此，本发明的目的是寻求提供一种用于在芯片键合过程中精确在线检查键合的半导体芯片的例如填角高度等各个方面的装置和方法。
根据本发明的第一方面，提供了一种用于检查键合在衬底的顶面上的半导体芯片的设备，该设备包括：光学组件，其相对于衬底的顶面倾斜一倾斜角度，所述光学组件包括图像传感器和光学系统；其中，所述光学组件被布置为使得其焦深大致垂直于所述衬底的顶面，以检查半导体芯片的至少一个侧壁。
根据本发明的第二方面，提供了一种用于检查键合在衬底的顶面上的半导体芯片的设备，该设备包括：第一光学组件和第二光学组件，每个光学组件相对于所述衬底的顶面倾斜一倾斜角度，并且每个光学组件包括图像传感器和光学系统；其中，第一光学组件和第二光学组件中的每一个被布置为使得其焦深大致垂直于所述衬底的顶面，以检查所述半导体芯片的至少一个侧壁。
根据本发明的第三方面，提供了一种用于检查结合在衬底的顶面上的半导体芯片的方法，该方法包括：将半导体芯片键合到所述衬底的顶面上；用相对于所述衬底的顶面倾斜一倾斜角度的光学组件检查所述半导体芯片，所述光学组件包括图像传感器和光学系统；其中，所述光学组件被布置为使得其焦深大致垂直于所述衬底的顶面，以检查所述半导体芯片的至少一个侧壁。
在下述中，参考示出本发明的特定优选实施例的附图更详细地描述本发明将是方便的。附图和相关描述的特殊性不应被理解为取代权利要求所限定的本发明的广泛辨识的一般性。
附图说明
现在将参照附图描述根据本发明的用于检查键合的半导体芯片的示例性设备和方法。
图1是衬底的侧视图，该衬底具有使用环氧树脂键合于其上的半导体芯片。
图2是根据本发明优选实施例的倾斜光学组件的布局的示意图。
图3包括图2的示意图，进一步示出了倾斜光学组件布置的原理。
图4示出了用于同时检查键合的半导体芯片的相对侧的一对倾斜光学组件。
图5是本发明另一个优选实施例的示意图，其中使用反射镜使设备更紧凑。
图6是根据本发明的优选实施例的用于检查已键合到衬底上的半导体芯片阵列的设备的等轴视图。
图7是相对于衬底可旋转的双光学组件的等轴示图。
具体实施方式
图2是根据本发明的优选实施例的用于检查键合在衬底的顶面上的半导体芯片的倾斜光学组件的布局的示意图。倾斜光学组件总体上包括具有光轴16和图像传感器22的光学系统20。例如，当光学系统20的光轴16相对于衬底10的顶面倾斜一倾斜角度时，该光学组件相对于衬底10的顶面倾斜一倾斜角度。
由于图像传感器22相对于光轴16偏移的布置，倾斜光学组件的焦点18相应地相对于光轴16偏移。如图2所示，图像传感器22和焦点18位于光轴16的相对侧。焦点18优选地布置在与填角14的期待高度或期望高度h相同或接近的高度处。由于包括光学系统20和图像传感器22的倾斜光学组件在某个固定的高度相对于半导体芯片12移动，形成了当光学组件移动时与焦点18的位置重合的虚拟焦平面26。这样的虚拟焦平面26基本平行于由半导体芯片12的顶面和衬底10限定的平面。
光学系统20和图像传感器22被布置成使得倾斜光学组件固有的焦深28大致垂直于衬底10的顶面用于检查围绕半导体芯片12的填角14的高度。如此，焦深大致横向于虚拟焦平面26在虚拟焦平面26上方和下方延伸一定距离，而焦平面26基本在中间。光学组件的垂直布置的焦深28对应于半导体芯片12的垂直侧壁，以确保沿着半导体芯片12的该侧壁（位于虚拟焦平面26之外的高度范围内）在虚拟焦平面26上方或下方的填角14的顶部的图像是对焦的，并且可以由图像传感器22识别。从焦点18周围反射的光线24由光学系统20以相对于光轴16偏移的方式传送到图像传感器22。
相对于光轴16倾斜图像传感器22的益处在于，倾斜光学组件的焦深28对应于预期被定位填角14的顶部附近的半导体芯片12的垂直侧壁。另一方面，如果图像传感器22与光轴16对准，则倾斜光学组件的焦深将替换为沿着光轴16。在这种情况下，当被图像传感器22观察时，位于焦点18外部的填角14的顶部更有可能失焦。如果不能确保填角14的顶部对焦，这将导致填角14的高度h的测量不可靠。
图3包括图2的示意图，进一步示出了倾斜光学组件布置的原理。光学系统20相对于物平面30（或衬底10的顶面）倾斜α角度，而图像传感器22的像平面32相对于光学系统20倾斜α’角度。α和α’之间的关系可以表示为等式：tanα＝ M tanα’，其中M是光学系统20中包括的透镜组件的放大系数。
选择α和α’的值，使得焦深28大致垂直，或者换言之，大致垂直于物平面30，以使得倾斜光学组件能够检查到半导体芯片12的侧壁。
图4示出了用于同时检查键合的半导体芯片12的相对侧的一对倾斜光学组件。在该示图中，包括第一光学系统20和第一图像传感器22的第一倾斜光学组件被定位在半导体芯片12的一侧，而包括第二光学系统40和第二图像传感器42的第二倾斜光学组件位于半导体芯片12的相对侧。因此，第一倾斜光学组件检查半导体芯片12的一侧，而第二倾斜光学组件同时检查半导体芯片12的相对侧。应当理解，如果每个倾斜光学组件将被定位在半导体芯片12的相应角处，使得每个倾斜光学组件能够一次检查半导体芯片12的两侧，则当各个倾斜光学组件位于半导体芯片12的相对角附近时（例如，参见图6），可以同时检查和检查四边形的半导体芯片12的四侧。
图5是本发明的另一个优选实施例的示意图，其中使用反射镜50、52使设备更紧凑。在该优选实施例中，由于相对庞大的光学系统20、40被垂直布置，以便占用相对较小的空间，所以该设备可以组装得更紧凑。因此，光学系统20、40的光轴16垂直于衬底12的顶面。反射镜50、52布置在各个光学系统20、40的下方，以将半导体芯片12的侧壁的图像反射向光学系统20、40。
因此，第一反射镜50和第二反射镜52相对于衬底12的顶面以一倾斜角度定位和倾斜，以将从第一倾斜光学组件和第二倾斜光学组件的焦点18发出的光线24重定向到各垂直布置的光学系统20，40。在这个实施例中，图像传感器22、42类似地以一倾斜角度倾斜，并且相对于光学系统20、40的光轴16偏移。
图6是根据本发明的优选实施例的用于检查已经键合到衬底10上的半导体芯片12的阵列的设备的等轴视图。在该图示中，三个半导体芯片12已键合到衬底10上的键合垫60上。每个键合的半导体芯片12具有包围它的填角14的层。此时，检查设备被启动以检查一行半导体芯片12以确定其填角高度h。
通常由第一和第二光学系统20、40表示的每个倾斜光学组件在使用时相对于半导体芯片12与另一个倾斜光学组件成对角地定位，以便分别检查半导体芯片12的角。因此，两个倾斜光学组件被配置为位于半导体芯片12的相对侧上，以在使用时同时检查半导体芯片12的相对侧。更具体地，每个倾斜光学组件定位在半导体芯片12的相应角处，并且可操作以同时查看半导体芯片12的两侧，从而可以同时检查半导体芯片12的所有四个侧。当光学系统20、40被垂直地布置时，第一和第二反射镜（图6中未示出）被用来将光线24从半导体芯片12的各侧朝向光学系统20、40重定向。
在检查了第一半导体芯片12并确定了围绕它的填角14的高度h之后，倾斜光学组件通过移动机构相对于衬底10移动，以便放置定位倾斜光学组件来检查半导体芯片12的阵列中的另一个半导体芯片12的各侧。应当理解，这种相对运动可以通过移动衬底10，移动倾斜光学组件或两种运动的组合来实现。
倾斜光学组件的行进路径将继续到光学系统20'、40'的末端位置，到那时，倾斜光学组件将已经检查了第一行中的所有半导体芯片12。如果没有发现缺陷，更具体地说，如果围绕半导体芯片12的填角14的高度处于预定范围内，则可以放心地继续将另外的半导体芯片12键合到随后的键合垫60上。这意味着例如已经正确设置了键合参数，并且需要进行更改以避免键合缺陷。
图7是相对于衬底10可旋转的双光学组件的等轴示图。已被键合在衬底10上的半导体芯片12可相对于衬底10的传送方向错开。为了获得与当将半导体芯片12与传送方向对准时所获得的相等的图像，如参照图6所述的用于使光学组件相对于衬底10移动的移动机构也要操作以使光学组件一起相对于衬底10旋转。在图7的图示中，光学组件逆时针旋转，以使每个倾斜光学组件再次位于半导体芯片12的相应角，并且可操作以同时检查半导体芯片12的两侧，从而使半导体组件12的所有四侧可以同时被检查。因此，光线24再次从半导体芯片12的所有四侧被重定向到光学系统20、40。
由于根据本发明的装置和方法能够同时检查半导体芯片12的所有四侧，因此除了填角高度（h）之外，也可以使用相同的方法确定键合质量的其他方面，诸如芯片倾斜度（基于芯片各侧的相对高度）和BLT（芯片和衬底之间的环氧树脂层的厚度）。
应当理解，上述检查设备和方法使得能够在芯片键合机中创建集成解决方案以实现芯片键合和在线检查。因此，可以立即确定键合质量的指标，例如填角高度，芯片倾斜度和BLT，以进行闭环反馈和控制。可以立即确定有缺陷的已键合的半导体芯片12。
此外，由于可以在键合过程之后立即进行检查，因此在键合过程中，对键合参数（如键合高度，填角高度，芯片倾斜度和BLT）的实时调整是可变的。例如，对于下一个进行芯片键合的衬底10，环氧树脂写入参数是可调节的。
由于倾斜光学组件的焦平面26和物平面30平行于半导体芯片12和衬底10的上表面的平面，因此不需要进行移动以调节各个倾斜光学组件的相对位置来适用于不同的半导体芯片尺寸。这是因为，如倾斜光学组件所检查到的，半导体芯片12的位置沿水平面的移位将不会影响其聚焦。此外，仅需要两个倾斜光学组件来同时检查半导体芯片12的所有四个边缘，并且倾斜光学组件之间的关系可以被固定以形成用于期望的各种测量的立体系统。
还应当理解，本申请不限于在线检查，因为本申请所述的装置和方法也适用于在独立的自动光学检查机中离线测量填角高度的经济高效的解决方案。
本发明所描述的本发明除了具体描述的那些之外还可以进行变化、修改和/或添加，并且应当理解，本发明包括落入上述描述的精神和范围内的所有这样的变化、修改和/或添加。

Claims (20)

1.一种用于检查键合在衬底的顶面上的半导体芯片的设备，该设备包括：
光学组件，其相对于所述衬底的顶面倾斜一倾斜角度，所述光学组件包括图像传感器和光学系统；
其中，所述光学组件被布置为使得其焦深大致垂直于所述衬底的顶面，以检查所述半导体芯片的至少一个侧壁。
2.根据权利要求1所述的设备，其中，所述光学组件的焦点被布置为使得所述图像传感器和所述焦点均偏离所述光学系统的光轴。
3.根据权利要求2所述的设备，其中，所述图像传感器和所述焦点位于所述光学系统的所述光轴的相对侧。
4.根据权利要求2所述的设备，其中，所述焦点被布置在与围绕所述半导体芯片的填角的期望高度相接近的高度处。
5.根据权利要求2所述的设备，其中，所述光学组件能相对于所述衬底移动，使得当所述光学组件移动时，所述光学组件的虚拟焦平面基本与由所述衬底的顶面限定的平面平行，所述虚拟焦平面与所述焦点的位置重合。
6.根据权利要求5所述的设备，其中，所述光学组件的相对于所述虚拟焦平面的焦深被配置为横向于所述虚拟焦平面而在所述光学组件的所述虚拟焦平面上方和下方延伸一定距离。
7.根据权利要求6所述的设备，其中，所述光学组件的所述焦深对应于所述半导体芯片的垂直侧壁，以确保沿着所述半导体芯片的位于所述虚拟焦平面之外的高度范围内的侧壁而围绕所述半导体芯片的填角的顶部的图像是对焦的。
8. 根据权利要求1所述的设备，其中，所述光学系统相对于所述衬底的顶面倾斜一倾斜角度α，并且所述图像传感器的像平面相对于所述光学系统倾斜一倾斜角度α’，使得tanα=M tan α’，其中M是包括在所述光学系统中的透镜组件的放大系数。
9.根据权利要求1所述的设备，还包括第二光学组件，其中，所述光学组件和所述第二光学组件在使用时被配置为位于所述半导体芯片的相对侧。
10.根据权利要求9所述的设备，其中，所述光学组件和所述第二光学组件被布置为并且可操作为同时检查所述半导体芯片的相对侧。
11.根据权利要求10所述的装置，其中，每个光学组件被布置为并且可操作为同时分别检查所述半导体芯片的不同两侧，使得同时检查所述半导体芯片的四侧。
12.根据权利要求11所述的设备，其中，每个光学组件被定位在所述半导体芯片的相应角处，以同时检查所述半导体芯片的不同两侧。
13.根据权利要求1所述的设备，其中，所述光学组件还包括反射镜，所述反射镜相对于所述衬底的顶面以一倾斜角度倾斜，以将所述半导体芯片的所述至少一个侧壁的图像朝着所述光学系统和所述图像传感器传送。
14.根据权利要求13所述的设备，其中，所述光学系统垂直地布置，使得其光轴垂直于所述衬底的顶面。
15.根据权利要求14所述的设备，其中，所述图像传感器相对于所述光学系统的光轴以一倾斜角度倾斜并且偏移。
16.一种用于检查键合在衬底的顶面上的半导体芯片的设备，该设备包括：
第一光学组件和第二光学组件，每个光学组件相对于所述衬底的顶面倾斜一倾斜角度，并且每个光学组件包括图像传感器和光学系统；
其中，第一光学组件和第二光学组件中的每一个被布置为使得其焦深大致垂直于所述衬底的顶面，以检查所述半导体芯片的至少一个侧壁。
17.根据权利要求16所述的设备，还包括移动机构，该移动机构用于使所述第一光学组件和第二光学组件相对于所述衬底移动，以检查键合在所述衬底的顶面上的半导体芯片的阵列，并且所述移动机构进一步可操作为使所述第一光学组件和第二光学组件一起相对于所述衬底旋转。
18.根据权利要求16所述的设备，其中，所述第一光学组件在使用时被配置和布置成相对于所述半导体芯片与所述第二光学组件大致成对角。
19.一种用于检查键合在衬底的顶面上的半导体芯片的方法，该方法包括：
将半导体芯片键合到所述衬底的顶面上；
用相对于所述衬底的顶面倾斜一倾斜角度的光学组件检查所述半导体芯片，所述光学组件包括图像传感器和光学系统；
其中，所述光学组件被布置为使得其焦深大致垂直于所述衬底的顶面，以检查所述半导体芯片的至少一个侧壁。
20.根据权利要求19所述的方法，还包括以下步骤：如果围绕所述半导体芯片的填角的高度处于预定范围内，则将另外的半导体芯片键合到所述衬底上的后续键合垫上。
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