CN111194157A - Micro-channel boiling-direct contact condensing type cold plate - Google Patents
Micro-channel boiling-direct contact condensing type cold plate Download PDFInfo
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- CN111194157A CN111194157A CN202010061287.4A CN202010061287A CN111194157A CN 111194157 A CN111194157 A CN 111194157A CN 202010061287 A CN202010061287 A CN 202010061287A CN 111194157 A CN111194157 A CN 111194157A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a micro-channel boiling-direct contact condensation type cold plate, which distributes liquid in a liquid collecting pool into a micro-channel array structure through the capillary force suction effect, when the cold plate is in contact with a heat consumption module, the liquid in the micro-channel array is quickly boiled and forms a plurality of steam columns to be incident into a liquid channel, steam is directly contacted and condensed with the liquid of the same working medium of the steam to generate a high-frequency self-excitation self-oscillation phenomenon, namely the liquid in the channel periodically enters the micro-channel array, and then the steam generated in the micro-channel array periodically enters the liquid channel to be repeated. Compared with the single phase change mode of the existing cold plate or the indirect condensation mode of steam on the wall surface, the composite phase change mode of the invention utilizes the rapid boiling and the direct contact condensation of the steam, has very high comprehensive heat transfer coefficient, can realize the rapid heat dissipation of micro and macro heat consumption modules, and has the characteristics of compact structure, simple processing, large processing scale elasticity, low cost and high heat exchange efficiency.
Description
Technical Field
The invention relates to the field of efficient heat dissipation and energy conservation, in particular to a composite phase change cold plate with combined action of steam boiling and direct contact condensation.
Background
Various types of heating devices such as electronic components are widely applied to the fields of national economy such as aviation, aerospace, automobiles, air conditioners, data centers and the like. With the improvement of power density of electronic components, effective heat dissipation becomes one of the major bottleneck problems restricting the reliability. The phase change cold plate is a common heat dissipation device and has high heat transfer efficiency.
The existing phase change cold plate mainly utilizes a solid-liquid phase change mode or a liquid boiling mode and a steam condensing mode on a wall surface to dissipate heat, and has poor heat dissipation effect on electronic components with high heat consumption and high temperature drop rate requirement. Therefore, there is a need to develop a cold plate with a novel phase-change heat dissipation mode to greatly improve the heat dissipation efficiency and solve the above problems.
Disclosure of Invention
Aiming at the defects and shortcomings in the prior cold plate technology, the invention provides a micro-channel boiling-direct contact condensing cold plate, which realizes the high-efficiency heat dissipation of electronic components, in particular high-heat-flow-density electronic components, in a composite phase change mode. The phase change cold plate has the characteristics of high heat transfer efficiency, easiness in processing and compact structure.
In order to solve the problems, the technical scheme provided by the invention is as follows:
a micro-channel boiling-direct contact condensing type cold plate comprises a base plate and a cover plate, wherein a micro-channel array, a liquid collecting pool and a liquid channel are arranged in the base plate, two ends of the micro-channel array are respectively communicated with the liquid collecting pool and the liquid channel, the liquid collecting pool is provided with a liquid collecting pool inlet, the liquid channel is provided with a liquid channel inlet and a liquid channel outlet, and the base plate and the cover plate are combined in a sealing mode.
Furthermore, the base plate and the cover plate are made of aluminum or aluminum alloy or copper.
Further, the base plate and the cover plate are hermetically combined in a brazing or electron beam welding mode.
Further, the micro-channel array of the substrate is formed by wire cutting, laser processing, milling or etching.
Further, the cross section of the micro-channel array is rectangular.
Further, the liquid working medium in the liquid collecting pool and the liquid flow channel is selected from distilled water, ethanol, acetone and cyclopentane.
Furthermore, the size of each micro-channel in the micro-channel array is 0.1 mm-2 mm of the depth of the channel, 0.1 mm-2 mm of the width of the channel and 5 mm-400 mm of the length of the micro-channel.
And the circulating pump is communicated with the liquid collecting pool inlet and the liquid flow channel inlet.
Compared with the prior art, the invention has the beneficial effects that:
the invention provides a micro-channel condensation cold plate for electronic components, in particular to high-heat-flux-density electronic components, which does not adopt the existing solid-liquid phase change or liquid boiling and steam condensation modes on the wall surface for heat dissipation, but provides a composite phase heat dissipation mode that liquid firstly boils in a micro-channel array and then directly contacts and condenses with the same working medium liquid. The composite phase change heat dissipation mode is based on the physical reality that the direct contact condensation heat exchange coefficient is far higher than the indirect condensation heat exchange coefficient, and can realize that steam and cold water alternately appear in a micro channel at high frequency, namely, the self-excitation self-oscillation is realized by utilizing the water hammer phenomenon generated by the direct contact of the steam and liquid. The cooling speed is fast, and the provided micro-channel boiling-direct contact condensation type cold plate has the characteristics of high heat transfer coefficient, easy processing and compact structure.
Drawings
FIG. 1 is a view of a substrate configuration of a micro-channel boiling-direct contact condensing cold plate according to an embodiment of the present invention;
FIG. 2 is a structural view of a cover plate of a micro-channel boiling-direct contact condensing cold plate according to an embodiment of the present invention;
FIG. 3 is a view of a sealed base plate and cover plate configuration of a micro-channel boiling-direct contact condensing cold plate according to an embodiment of the present invention;
FIG. 4 is a view of a micro-channel boiling-direct contact condensing cold plate operating configuration according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a micro-channel boiling-direct contact condensing cold plate according to the present invention for heat dissipation of an electronic component 10.
Detailed Description
The invention is further illustrated in the following description with reference to the figures and examples, which are not intended to limit the invention.
As shown in fig. 1 to 3, the micro-channel boiling-direct contact condensing cold plate provided by the present invention includes a substrate 2 and a cover plate 4, which are assembled by soldering or electron beam welding, wherein the substrate 2 and the cover plate 4 may be made of aluminum or aluminum alloy or copper.
The inboard collecting basin 1, liquid runner 3 and the micro-channel array 6 that sets up of base plate, the inboard collecting basin 1 of base plate sets up liquid inlet 5, liquid runner 3 sets up liquid inlet 7 and export 8. The micro-channel array 6 is arranged between the liquid collecting pool 1 and the liquid flow channel 3, the cross section of the micro-channel array 6 can be rectangular, the depth and the width of the groove are controlled within 2mm, so that the capillary force can suck liquid, the base plate and the cover plate are combined together, and the micro-channel array, the liquid collecting pool and the liquid flow channel form a cavity or a channel with a closed upper end face.
As shown in fig. 4, the experimental effect of the present invention is shown, in the experimental process, the steam in the single micro-channel directly contacts the liquid cold water in the cold water channel for verification, the inner diameter of the vertical pipe of the micro-channel used in the experiment is 0.7mm, the inner diameter of the horizontal pipe is 1.4mm, the high-speed photography system is used for performing visual photography, and the photography frame rate is 2000 frames/second. Fig. 4(a) - (f) respectively illustrate that the steam column is rushed towards cold water, the cold water is injected to form steam plume, the steam plume is condensed in the cold water flow channel, the cold water in the flow channel is pumped into the vertical pipe, the steam column is rushed towards the cold water again, and the steam column is injected into the cold water to form the steam plume. On one hand, experiments prove that the steam in the micro-channel directly contacts with cold water to be condensed to cause the reciprocating motion of the steam-water in the vertical pipe, namely the water hammer phenomenon; on the other hand, through quantitative analysis, the steam plume reappears as a metering period, and the water hammer frequency is about 62.5Hz, which shows that the heat transfer by utilizing the phenomenon has high heat taking and dissipating capacity.
As shown in fig. 5, the microchannel cold plate of the present invention is used to dissipate heat from the electronic component 10. Before the electronic component is started, a liquid working medium is sent into the liquid collecting pool 1 by using the circulating pump 9, the liquid working medium enters the micro-channel array 6 under the action of capillary force suction, meanwhile, the circulating pump 11 is started to send the liquid working medium into the liquid channel 3, then, the electronic component is started to generate heat, the liquid working medium rapidly boils in the micro-channel to form a plurality of steam columns to enter the liquid channel 3, the steam columns are directly contacted and condensed with the liquid working medium therein to generate a high-frequency water hammer phenomenon, namely, the liquid working medium in the liquid channel periodically enters and exits the micro-channel array 6, so that the liquid working medium in the micro-channel is rapidly boiled to absorb heat, the steam generated after boiling is directly contacted and condensed with the liquid in the liquid channel 3 to rapidly release heat, the temperature of the electronic component is reduced, and the temperature of the electronic component is kept at a normal working temperature, for example 20-30 deg.c.
Although the present invention has been described above with reference to the accompanying drawings, the present invention is not limited to the above embodiments, and those skilled in the art can make various changes or modifications without departing from the spirit of the present invention.
Claims (8)
1. A micro-channel boiling-direct contact condensing type cold plate is characterized by comprising a base plate and a cover plate, wherein a micro-channel array, a liquid collecting tank and a liquid channel are arranged in the base plate, two ends of the micro-channel array are respectively communicated with the liquid collecting tank and the liquid channel, the liquid collecting tank is provided with a liquid collecting tank inlet, the liquid channel is provided with a liquid channel inlet and a liquid channel outlet, and the base plate and the cover plate are combined in a sealing mode.
2. The micro-channel boiling-direct contact condensing cold plate of claim 1, wherein: the base plate and the cover plate are made of aluminum or aluminum alloy or copper.
3. The micro-channel boiling-direct contact condensing cold plate of claim 1, wherein: the base plate and the cover plate are hermetically combined in a soldering or electron beam welding mode.
4. The micro-channel boiling-direct contact condensing cold plate of claim 1, wherein: the micro-channel array of the substrate is formed by wire cutting, laser processing, milling or etching processing.
5. The micro-channel boiling-direct contact condensing cold plate of claim 1, wherein: the microchannel array is rectangular in cross section.
6. The micro-channel boiling-direct contact condensing cold plate of claim 1, wherein: the liquid working medium in the liquid collecting pool and the liquid flow channel is selected from distilled water, ethanol, acetone and cyclopentane.
7. The micro-channel boiling-direct contact condensing cold plate of claim 1, wherein: the size of each micro-channel in the micro-channel array is 0.1 mm-2 mm of the depth of the groove, 0.1 mm-2 mm of the width of the groove and 5 mm-400 mm of the length of the micro-channel.
8. The micro-channel boiling-direct contact condensing cold plate of claim 1, wherein: the liquid circulation device also comprises a circulating pump communicated with the liquid collecting pool inlet and the liquid runner inlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010061287.4A CN111194157A (en) | 2020-01-19 | 2020-01-19 | Micro-channel boiling-direct contact condensing type cold plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010061287.4A CN111194157A (en) | 2020-01-19 | 2020-01-19 | Micro-channel boiling-direct contact condensing type cold plate |
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| Publication Number | Publication Date |
|---|---|
| CN111194157A true CN111194157A (en) | 2020-05-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010061287.4A Pending CN111194157A (en) | 2020-01-19 | 2020-01-19 | Micro-channel boiling-direct contact condensing type cold plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111975161A (en) * | 2020-08-19 | 2020-11-24 | 扬州船用电子仪器研究所(中国船舶重工集团公司第七二三研究所) | Welding parting and preprocessing method for plate type pulsating heat pipe |
| CN112629298A (en) * | 2020-12-02 | 2021-04-09 | 东莞领杰金属精密制造科技有限公司 | Method for preparing vapor chamber and vapor chamber |
-
2020
- 2020-01-19 CN CN202010061287.4A patent/CN111194157A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111975161A (en) * | 2020-08-19 | 2020-11-24 | 扬州船用电子仪器研究所(中国船舶重工集团公司第七二三研究所) | Welding parting and preprocessing method for plate type pulsating heat pipe |
| CN112629298A (en) * | 2020-12-02 | 2021-04-09 | 东莞领杰金属精密制造科技有限公司 | Method for preparing vapor chamber and vapor chamber |
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