CN211831614U - Micro-channel boiling-direct contact condensing type cold plate - Google Patents
Micro-channel boiling-direct contact condensing type cold plate Download PDFInfo
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- CN211831614U CN211831614U CN202020121578.3U CN202020121578U CN211831614U CN 211831614 U CN211831614 U CN 211831614U CN 202020121578 U CN202020121578 U CN 202020121578U CN 211831614 U CN211831614 U CN 211831614U
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Abstract
The utility model provides a microchannel boils-direct contact coagulation formula cold drawing, liquid distribution in with the collecting tank is to microchannel array structure in through capillary force suction effect, when cold drawing and heat loss module contact, liquid in the microchannel array boils fast and forms during the multi beam steam column incides the liquid flow way, steam condenses the self-excitation self-oscillation phenomenon that produces the high frequency with the liquid direct contact of its same kind of working medium, the periodic entering microchannel array of liquid in the runner promptly, the periodic entering liquid runner that produces in the microchannel array afterwards, go round and begin. With the single phase transition mode of present cold drawing or steam be showing differently at the indirect mode of condensing of wall, the utility model discloses utilize quick boiling and this kind of compound phase transition mode of steam direct contact condensation, have very high comprehensive heat transfer coefficient, can realize the quick heat dissipation of small and macroscopic heat loss module, and have compact structure, processing simply, the elasticity of processing yardstick is big, with low costs, characteristics that heat exchange efficiency is high.
Description
Technical Field
The utility model relates to a high-efficient heat dissipation and energy-conserving field especially relate to a combined phase transition cold drawing of steam boiling and direct contact combined action that condenses.
Background
Various types of heating devices such as electronic components are widely applied to the fields of national economy such as aviation, aerospace, automobiles, air conditioners, data centers and the like. With the improvement of power density of electronic components, effective heat dissipation becomes one of the major bottleneck problems restricting the reliability. The phase change cold plate is a common heat dissipation device and has high heat transfer efficiency.
The existing phase change cold plate mainly utilizes a solid-liquid phase change mode or a liquid boiling mode and a steam condensing mode on a wall surface to dissipate heat, and has poor heat dissipation effect on electronic components with high heat consumption and high temperature drop rate requirement. Therefore, there is a need to develop a cold plate with a novel phase-change heat dissipation mode to greatly improve the heat dissipation efficiency and solve the above problems.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects and shortcomings existing in the prior cold plate technology, the utility model provides a micro-channel boiling-direct contact condensing cold plate, which realizes the high-efficiency heat dissipation of electronic components, in particular high-heat flux density electronic components, in a composite phase change mode. The phase change cold plate has the characteristics of high heat transfer efficiency, easiness in processing and compact structure.
In order to solve the above problem, the utility model provides a technical scheme does:
a micro-channel boiling-direct contact condensing type cold plate comprises a base plate and a cover plate, wherein a micro-channel array, a liquid collecting pool and a liquid channel are arranged in the base plate, two ends of the micro-channel array are respectively communicated with the liquid collecting pool and the liquid channel, the liquid collecting pool is provided with a liquid collecting pool inlet, the liquid channel is provided with a liquid channel inlet and a liquid channel outlet, and the base plate and the cover plate are combined in a sealing mode.
Furthermore, the base plate and the cover plate are made of aluminum or aluminum alloy or copper.
Further, the base plate and the cover plate are hermetically combined in a brazing or electron beam welding mode.
Further, the micro-channel array of the substrate is formed by wire cutting, laser processing, milling or etching.
Further, the cross section of the micro-channel array is rectangular.
Further, the liquid working medium in the liquid collecting pool and the liquid flow channel is selected from distilled water, ethanol, acetone and cyclopentane.
Furthermore, the size of each micro-channel in the micro-channel array is 0.1 mm-2 mm of the depth of the channel, 0.1 mm-2 mm of the width of the channel and 5 mm-400 mm of the length of the micro-channel.
And the circulating pump is communicated with the liquid collecting pool inlet and the liquid flow channel inlet.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model provides a microchannel condensation cold drawing for electronic components especially high heat flux density electronic components does not adopt current solid-liquid phase change or liquid boiling and steam to dispel the heat at the mode of wall condensation, but has proposed and utilized liquid at first boiling in the microchannel groove array, then with the compound looks heat dissipation mode that working medium liquid direct contact of the same race condenses. The composite phase change heat dissipation mode is based on the physical reality that the direct contact condensation heat exchange coefficient is far higher than the indirect condensation heat exchange coefficient, and can realize that steam and cold water alternately appear in a micro channel at high frequency, namely, the self-excitation self-oscillation is realized by utilizing the water hammer phenomenon generated by the direct contact of the steam and liquid. The cooling speed is fast, and the provided micro-channel boiling-direct contact condensation type cold plate has the characteristics of high heat transfer coefficient, easy processing and compact structure.
Drawings
Fig. 1 is a view of a substrate configuration of a micro-channel boiling-direct contact condensing cold plate according to an embodiment of the present invention;
fig. 2 is a structural view of a cover plate of a micro-channel boiling-direct contact condensing cold plate according to an embodiment of the present invention;
FIG. 3 is a view of a sealed base plate and cover plate configuration of a micro-channel boiling-direct contact condensing cold plate according to an embodiment of the present invention;
fig. 4 is a view of a micro-channel boiling-direct contact condensing cold plate operating configuration according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a micro-channel boiling-direct contact condensing cold plate according to the present invention for dissipating heat from an electronic component 10.
Detailed Description
The invention is further described with reference to the drawings and the examples, which are not intended to limit the invention.
As shown in FIGS. 1-3, the utility model provides a microchannel boiling-direct contact condensing cold drawing, including base plate 2 and apron 4, these two are right through brazing or electron beam welded mode welding, and wherein the material of base plate 2 and apron 4 can be for aluminium or aluminum alloy or copper.
The inboard collecting basin 1, liquid runner 3 and the micro-channel array 6 that sets up of base plate, the inboard collecting basin 1 of base plate sets up liquid inlet 5, liquid runner 3 sets up liquid inlet 7 and export 8. The micro-channel array 6 is arranged between the liquid collecting pool 1 and the liquid flow channel 3, the cross section of the micro-channel array 6 can be rectangular, the depth and the width of the groove are controlled within 2mm, so that the capillary force can suck liquid, the base plate and the cover plate are combined together, and the micro-channel array, the liquid collecting pool and the liquid flow channel form a cavity or a channel with a closed upper end face.
As shown in fig. 4, the utility model discloses an experimental effect, the steam in the experimental process used single microchannel channel carries out direct contact with the liquid cold water in the cold water runner and verifies, and the vertical pipe inner diameter of microchannel that the experiment was used is 0.7mm, and horizontal pipe inner diameter 1.4mm utilizes high-speed photography system to carry out visual shooting, and the shooting frame rate is 2000 frames per second. Fig. 4(a) - (f) respectively illustrate that the steam column is rushed towards cold water, the cold water is injected to form steam plume, the steam plume is condensed in the cold water flow channel, the cold water in the flow channel is pumped into the vertical pipe, the steam column is rushed towards the cold water again, and the steam column is injected into the cold water to form the steam plume. On one hand, experiments prove that the steam in the micro-channel directly contacts with cold water to be condensed to cause the reciprocating motion of the steam-water in the vertical pipe, namely the water hammer phenomenon; on the other hand, through quantitative analysis, the steam plume reappears as a metering period, and the water hammer frequency is about 62.5Hz, which shows that the heat transfer by utilizing the phenomenon has high heat taking and dissipating capacity.
As shown in fig. 5, the microchannel cold plate of the present invention is used for heat dissipation of the electronic component 10. Before the electronic component is started, a liquid working medium is sent into the liquid collecting pool 1 by using the circulating pump 9, the liquid working medium enters the micro-channel array 6 under the action of capillary force suction, meanwhile, the circulating pump 11 is started to send the liquid working medium into the liquid channel 3, then, the electronic component is started to generate heat, the liquid working medium rapidly boils in the micro-channel to form a plurality of steam columns to enter the liquid channel 3, the steam columns are directly contacted and condensed with the liquid working medium therein to generate a high-frequency water hammer phenomenon, namely, the liquid working medium in the liquid channel periodically enters and exits the micro-channel array 6, so that the liquid working medium in the micro-channel is rapidly boiled to absorb heat, the steam generated after boiling is directly contacted and condensed with the liquid in the liquid channel 3 to rapidly release heat, the temperature of the electronic component is reduced, and the temperature of the electronic component is kept at a normal working temperature, for example 20-30 deg.c.
Although the present invention has been described with reference to the accompanying drawings, the present invention is not limited to the above embodiments, and those skilled in the art can make various changes and modifications without departing from the spirit of the present invention.
Claims (8)
1. A micro-channel boiling-direct contact condensing type cold plate is characterized by comprising a base plate and a cover plate, wherein a micro-channel array, a liquid collecting tank and a liquid channel are arranged in the base plate, two ends of the micro-channel array are respectively communicated with the liquid collecting tank and the liquid channel, the liquid collecting tank is provided with a liquid collecting tank inlet, the liquid channel is provided with a liquid channel inlet and a liquid channel outlet, and the base plate and the cover plate are combined in a sealing mode.
2. The micro-channel boiling-direct contact condensing cold plate of claim 1, wherein: the base plate and the cover plate are made of aluminum or aluminum alloy or copper.
3. The micro-channel boiling-direct contact condensing cold plate of claim 1, wherein: the base plate and the cover plate are hermetically combined in a soldering or electron beam welding mode.
4. The micro-channel boiling-direct contact condensing cold plate of claim 1, wherein: the micro-channel array of the substrate is formed by wire cutting, laser processing, milling or etching processing.
5. The micro-channel boiling-direct contact condensing cold plate of claim 1, wherein: the microchannel array is rectangular in cross section.
6. The micro-channel boiling-direct contact condensing cold plate of claim 1, wherein: the liquid working medium in the liquid collecting pool and the liquid flow channel is selected from distilled water, ethanol, acetone and cyclopentane.
7. The micro-channel boiling-direct contact condensing cold plate of claim 1, wherein: the size of each micro-channel in the micro-channel array is 0.1 mm-2 mm of the depth of the groove, 0.1 mm-2 mm of the width of the groove and 5 mm-400 mm of the length of the micro-channel.
8. The micro-channel boiling-direct contact condensing cold plate of claim 1, wherein: the liquid circulation device also comprises a circulating pump communicated with the liquid collecting pool inlet and the liquid runner inlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020121578.3U CN211831614U (en) | 2020-01-19 | 2020-01-19 | Micro-channel boiling-direct contact condensing type cold plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020121578.3U CN211831614U (en) | 2020-01-19 | 2020-01-19 | Micro-channel boiling-direct contact condensing type cold plate |
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| Publication Number | Publication Date |
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| CN211831614U true CN211831614U (en) | 2020-10-30 |
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| CN202020121578.3U Active CN211831614U (en) | 2020-01-19 | 2020-01-19 | Micro-channel boiling-direct contact condensing type cold plate |
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- 2020-01-19 CN CN202020121578.3U patent/CN211831614U/en active Active
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