CN111193181B - TO packaged TOSA and optical module - Google Patents

TO packaged TOSA and optical module Download PDF

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Publication number
CN111193181B
CN111193181B CN202010016310.8A CN202010016310A CN111193181B CN 111193181 B CN111193181 B CN 111193181B CN 202010016310 A CN202010016310 A CN 202010016310A CN 111193181 B CN111193181 B CN 111193181B
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China
Prior art keywords
tosa
present
optical module
brackets
supports
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CN202010016310.8A
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Chinese (zh)
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CN111193181A (en
Inventor
易利
陈雯
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Source Photonics Chengdu Co Ltd
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Source Photonics Chengdu Co Ltd
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Priority to CN202010016310.8A priority Critical patent/CN111193181B/en
Publication of CN111193181A publication Critical patent/CN111193181A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0231—Stems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

The invention relates TO a TO packaged TOSA and an optical module, which comprise a laser chip, a tube seat, two brackets, two carriers and a semiconductor refrigerator, wherein the two brackets are respectively used for supporting one carrier and conducting heat, the carrier is used for transmitting signals, one bracket is arranged on the semiconductor refrigerator, the other bracket is directly arranged on the tube seat, and the two brackets are connected through two wires. The TOSA can effectively reduce the capacitance problem between the two brackets, and further can eliminate the harm of resonance phenomenon.

Description

TO packaged TOSA and optical module
Technical Field
The invention relates TO the technical field of optical communication, in particular TO a TO packaged TOSA and an optical module.
Background
An optical module is a device that can convert an optical signal into an electrical signal and vice versa, and a TOSA is an essential component in an optical module for emitting a laser signal. Because most of optical modules are installed outdoors, the emission of optical signals can be seriously influenced in a high-temperature and high-humidity environment, and therefore the high requirement of a laser chip on air tightness is generally met by adopting TO packaging. Referring TO fig. 1, a TO-packaged TOSA includes a laser chip, a stem, supports for supporting a carrier for transmitting a signal and supporting a laser and for conducting heat, respectively, a carrier for transmitting a signal and for supporting a laser, and a semiconductor cooler (TEC). The first support is arranged on the semiconductor refrigerator, and the second support is directly arranged on the tube seat. In actual use, the potential difference exists between the two supports, then a capacitor is formed between the two supports, and the capacitor and the inductor of the gold wire on the two carriers form capacitance-inductance resonance, so that the energy of certain frequency points cannot be transmitted between the two carriers.
Disclosure of Invention
The invention aims TO overcome the defect that the TO packaging in the prior art has a resonance phenomenon, and provides a TOSA with a novel structure and an optical module applying the TOSA so as TO solve the resonance problem.
In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:
in one aspect, an embodiment of the present invention provides a TO-packaged TOSA, including a laser chip, a tube seat, two brackets, two carriers and a semiconductor refrigerator, where the two brackets are respectively used TO support one carrier and conduct heat, the carrier is used TO transmit signals, one of the brackets is installed on the semiconductor refrigerator, the other bracket is directly installed on the tube seat, and the two brackets are connected through two wires.
Because the two supports are made of metal materials and the distance between the two supports is very small, a large capacitance can be generated. Above-mentioned TOSA connects through increasing two wires, makes two electric potential levels such as support to reduce the electric capacity energy storage, reduce the resonance.
On the other hand, an embodiment of the present invention further provides an optical module, which includes the TO-packaged TOSA according TO any embodiment of the present invention.
Compared with the prior art, the invention has the following beneficial effects: through increasing two wires, make two supports equipotential to reduce the electric capacity energy storage, can reduce or even eliminate the harm that the resonance brought.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a TOSA of the TO package in the embodiment of the present invention.
FIG. 2 is a side view of the TOSA of the TO package in an embodiment of the present invention.
Figure 3 is a graph comparing the test loss of a TOSA of the present invention TO a TOSA of a conventional TO package.
Figures 4a, 4b are test eye diagrams of a TOSA of the TO package of the present invention and a TOSA of a conventional TO package, respectively.
10-tube seat; 20-bracket one; 30-bracket two; 40-vector one; 50-vector two; 60-a semiconductor refrigerator; 70-gold wire.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
Referring TO fig. 1-2, the TO-packaged TOSA of the present embodiment includes a laser chip, a stem 10, two supports, two carriers and a semiconductor cooler 60, where the two supports are respectively defined as a first support 20 and a second support 30, the two carriers are respectively defined as a first support 40 and a second support 50, the two supports are respectively used TO support a carrier and conduct heat, the two carriers are both used TO transmit signals, the first support 20 is mounted on the semiconductor cooler 60, the second support 30 is directly mounted on the stem 10, and the two supports are connected by two wires, such as gold wires 70.
Because two supports are made by the metal material, and the distance between the two is very little, consequently can produce great electric capacity, through connecting two for the support wire, can make electric potential levels such as two supports to reduce the electric capacity energy storage, can reduce or even eliminate the harm that the resonance brought, make more energy can transmit smoothly.
In fig. 3, the upper curve is the TOSA test curve of the TO package of the present invention, and the lower curve is the TOSA test curve of the conventional TO package, and it can be shown from fig. 3 that the present invention can solve the resonance problem well.
Fig. 4a is an eye diagram result of the TOSA of the TO package of the present invention, and fig. 4b is an eye diagram result of the TOSA of the conventional TO package, thereby showing that the eye diagram quality can be significantly improved.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention.

Claims (2)

1. The TOSA comprises a laser chip, a tube seat, two supports, two carriers and a semiconductor refrigerator, wherein the two supports are used for supporting one carrier and conducting heat respectively, the carrier is used for transmitting signals, one support is arranged on the semiconductor refrigerator, and the other support is directly arranged on the tube seat.
2. An optical module, characterized by a TOSA including the TO package of claim 1.
CN202010016310.8A 2020-01-08 2020-01-08 TO packaged TOSA and optical module Active CN111193181B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010016310.8A CN111193181B (en) 2020-01-08 2020-01-08 TO packaged TOSA and optical module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010016310.8A CN111193181B (en) 2020-01-08 2020-01-08 TO packaged TOSA and optical module

Publications (2)

Publication Number Publication Date
CN111193181A CN111193181A (en) 2020-05-22
CN111193181B true CN111193181B (en) 2022-09-09

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111969397B (en) * 2020-08-17 2023-10-24 索尔思光电股份有限公司 TOSA and optical module of encapsulation of borduring
CN113031174B (en) * 2021-04-08 2023-03-28 索尔思光电（成都）有限公司 TO-CAN module, transmitting assembly and optical module

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CN1353485A (en) * 2000-11-10 2002-06-12 三菱电机株式会社 Optical element module
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