CN209266840U - A kind of laser carrier and laser - Google Patents
A kind of laser carrier and laser Download PDFInfo
- Publication number
- CN209266840U CN209266840U CN201821833530.4U CN201821833530U CN209266840U CN 209266840 U CN209266840 U CN 209266840U CN 201821833530 U CN201821833530 U CN 201821833530U CN 209266840 U CN209266840 U CN 209266840U
- Authority
- CN
- China
- Prior art keywords
- metal
- coat
- laser
- chip
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Semiconductor Lasers (AREA)
Abstract
The utility model embodiment provides a kind of laser carrier and laser, and there are four the coats of metal for setting on the coating laying face of laser carrier；First coat of metal can help to realize the electrical connection of one electrode and corresponding pin of monitoring chip.Second coat of metal, the third coat of metal and the 4th coat of metal can help to realize the electrical connection for corresponding to pin on master chip positive and negative electrode and laser tube socket, by the way that the coat of metal is arranged on laser carrier, and then plain conductor is substituted to a certain extent using the electric action of the coat of metal, and then the electrode for reducing master chip, monitoring chip reduces the interference that plain conductor generates in laser under high-frequency signal to the plain conductor length of corresponding pin.It also can be reduced parasitic capacitance inductance simultaneously, improving laser device enhances the transmission performance of laser to the laser propagation effect of high-frequency signal.
Description
Technical field
The utility model relates to optical communication field more particularly to a kind of laser carriers and laser.
Background technique
Currently, fiber optic communication is because of many merits such as it is big with message capacity, long transmission distance, anti-electromagnetic interference capability are strong
One of and develop into Primary communication mode.Semiconductor laser is the principal light source of fiber optic communication, is the core of fiber optic communication
Heart device.The ceramic monolith and be arranged in the pottery that existing semiconductor laser generally comprises tube socket, is arranged on tube socket
Master chip and MPD (Monitoring Photodiode, monitor photo-diode) chip on ceramic carrier.Master chip and MPD core
The positive and negative electrode of piece passes through plain conductor respectively and is connected to corresponding pin on tube socket.
But, since plain conductor has biggish length, it will cause the interference between plain conductor under high-frequency signal,
Parasitic capacitance inductance can be generated simultaneously, influences the laser propagation effect of high-frequency signal.So it is urgent to provide a solution to come now
It solves the above problems.
Utility model content
A kind of laser carrier and laser provided by the embodiment of the utility model, mainly solving the technical problems that: it is existing
Have since the electrode of master chip and MPD can only be electrically connected by plain conductor with the pin on laser base in laser, because
The problem of this makes plain conductor in laser longer, is easy to interfere with each other, influences high frequency transmission signal laser propagation effect.
In order to solve the above technical problems, the utility model embodiment provides a kind of laser carrier, laser carrier is used for
Master chip and monitoring chip are set；Laser carrier includes carrier body and is laid on the coating laying face of carrier body
First coat of metal, second coat of metal, the third coat of metal and the 4th coat of metal；
First coat of metal is set to the side that coating lays face, for an electricity with the monitoring chip being disposed thereon
Pole electrical connection, the pin that first coat of metal is also used to by plain conductor and monitoring chip on laser tube socket are electrically connected
It connects；Another electrode of monitoring chip is electrically connected by plain conductor with another pin of the monitoring chip on laser tube socket；
Second coat of metal and the first coat of metal adjacent spaces are arranged, and second coat of metal is used for and is disposed thereon
One electrode of master chip is electrically connected；Second coat of metal and third coat of metal adjacent spaces are arranged, and by thin between the two
The connection of mould resistance；The third coat of metal is electrically connected by plain conductor with a pin of the master chip on laser tube socket；
4th coat of metal and the second coat of metal adjacent spaces are arranged, the 4th coat of metal be used for by plain conductor with
Another electrode of master chip is electrically connected, and is electrically connected by another pin of plain conductor and master chip on laser tube socket
It connects.
Optionally, the third coat of metal is set to the left side central portion or left upper portion that coating lays face.
Optionally, the 4th coat of metal is set to the left lower that coating lays face.
Optionally, carrier body is ceramic material.
Optionally, first coat of metal, at least one in second coat of metal are rectangle.
The utility model embodiment also provides a kind of laser, and laser includes master chip, monitoring chip, laser tube socket
And laser carrier any one of as above.
Optionally, two electrodes of monitoring chip are respectively positioned at the top of chip or an electrode is located at the top of chip, another
Electrode is located at chip bottom；Two electrodes of master chip are respectively positioned at the top of chip or an electrode is located at the top of chip, another
Electrode is located at chip bottom.
Optionally, monitoring chip is monitor photo-diode MPD；An electrode of MPD is located at the top of chip, another electricity
Pole is located at chip bottom, and first coat of metal is electrically connected by conducting resinl with the electrode for being located at chip bottom on MPD.
Optionally, an electrode of master chip is located at the top of chip, another electrode is located at chip bottom, the second metal-plated
Layer is electrically connected by conducting resinl with the electrode for being located at chip bottom on master chip.
The beneficial effects of the utility model are:
According to laser carrier provided by the embodiment of the utility model and laser, since the coating of laser carrier is laid
First coat of metal, second coat of metal, the third coat of metal and the 4th coat of metal are provided on face；Wherein, the first metal
Coating can be electrically connected with an electrode of the monitoring chip being disposed thereon and swashed by plain conductor and monitoring chip
Pin electrical connection on light device tube socket, to realize the electrical connection of one electrode and corresponding pin of monitoring chip.And second
The coat of metal with an electrode of the master chip being disposed thereon for being electrically connected, and second coat of metal can pass through Bao Mo electricity
Resistance is connect with the third coat of metal, then passes through one of plain conductor and master chip on laser tube socket by the third coat of metal
A pin electrical connection, to realize the electrical connection for corresponding to pin on one electrode of master chip and tube socket.For the another of master chip
A electrode can be electrically connected by the 4th coat of metal on laser carrier with the pin on tube socket.By being carried in laser
The coat of metal is set on body, and then substitutes plain conductor to a certain extent using the electric action of the coat of metal, and then reduce
Master chip, monitoring chip electrode to the plain conductor length of corresponding pin, reduce under high-frequency signal plain conductor in laser
The interference of generation.It also can be reduced parasitic capacitance inductance simultaneously, improving laser device enhances laser to the laser propagation effect of high-frequency signal
Transmission performance.
Other features of the utility model and corresponding beneficial effect are described in the aft section of specification, and are answered
Work as understanding, at least partly beneficial effect is apparent from from the record in the utility model specification.
Detailed description of the invention
Fig. 1 is a kind of schematic perspective view of the laser carrier provided in the utility model embodiment one；
Fig. 2 is the schematic perspective view of another laser carrier provided in the utility model embodiment one；
Fig. 3 is that the top view after master chip and monitoring chip is arranged in Fig. 1 on laser carrier；
Fig. 4 is a kind of top view of the laser tube socket provided in the utility model embodiment two；
Fig. 5 is a kind of top view of the laser carrier provided in the utility model embodiment two；
Fig. 6 is a kind of top view of the laser provided in the utility model embodiment two；
Fig. 7 is the top view of another laser provided in the utility model embodiment two.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below by specific embodiment party
Formula combination attached drawing is described in further detail the utility model embodiment.It should be appreciated that specific embodiment described herein
It is only used to explain the utility model, is not used to limit the utility model.
Embodiment one:
The master chip on laser carrier and monitoring chip can only be connected to laser by plain conductor in the prior art
Correspondence pin on tube socket, causes the plain conductor for electrical connection longer, under high-frequency signal, holds between these plain conductors
Easily cause to interfere；Meanwhile plain conductor length is also easy to produce parasitic capacitance inductance, influences the laser propagation effect of high-frequency signal.In order to
Solution solves these problems, and the utility model provides a kind of laser carrier:
In the present embodiment, laser carrier is for being arranged deployment master chip and monitoring chip.Wherein master chip can wrap
Laser diode is included but is not limited to, monitoring chip can include but is not limited to MPD.A kind of laser shown referring to Figure 1 carries
The schematic perspective view of body:
Laser carrier 10 include carrier body 100, carrier body 100 may include coating lay face 100a and with this
Coating lays the opposite tube socket stationary plane 100b of face 100a.When by the laser carrier 10 setting to laser tube socket, pipe
Seat stationary plane 100b is contacted with laser tube socket, for the laser carrier 10 to be fixed to laser tube socket.In general, carrier
Ontology 100 can be cuboid or square, and in this case, it can also be in rectangle that coating, which lays face,.Certainly, carrier body
100 other than in cube, can also be in halfpace shape, wherein tube socket stationary plane is the bottom surface of halfpace, and coating laying face is
The top surface of halfpace.Beyond all doubt, carrier body 100 can also be in inverted trapezoidal shape, and at this moment, tube socket stationary plane is inverted trapezoidal
Bottom surface, and coating lays the top surface that face is inverted trapezoidal, as shown in Figure 2.Even in some examples of the present embodiment, carrier sheet
Body 200 can also be in cylindrical body, and wherein it is rounded to lay face 200a and tube socket stationary plane 200b for coating.It continues with carrier
Ontology 100 be in cuboid for be illustrated:
Laser carrier 10 further includes being laid on the coating laying face 100a of the carrier body 100 in the present embodiment
First coat of metal 101, second coat of metal 102, the third coat of metal 103 and the 4th coat of metal 104.This four metal-plateds
Layer, which serves mainly to facilitate, realizes the master chip positive and negative electrode that is arranged on laser carrier 10 and monitoring chip positive and negative electrode to sharp
Light device tube socket corresponds to the electrical connection of pin, to realize the effect for reducing plain conductor.
The plan of establishment of master chip and monitoring chip on laser carrier 10 is introduced below, is please further tied
Fig. 3 is closed, Fig. 3 shows the top view of the laser carrier provided with master chip and monitoring chip:
Laser 3 includes laser carrier 10, master chip 20 and monitoring chip 30, laser tube socket.Wherein, master chip
20 and monitoring chip 30 be arranged on laser carrier 10, and laser carrier 10 be arranged on laser tube socket, in laser
It include at least four pins in device tube socket, this four pins are respectively the positive pin of master chip, the cathode pin of master chip, prison
Control the positive pin of chip and the cathode pin of monitoring chip.
First coat of metal 101 is set to the side that coating lays face 100a, lays face 100a due to coating and is rectangle,
So first coat of metal 101 can be set coating lay the left side of face 100a, one in right side or upside with
One in downside.First coat of metal 101 can be used for being fixedly installed monitoring chip 30, other than fixed monitoring chip 30,
First coat of metal 101 can also be electrically connected with an electrode of the monitoring chip 30 being disposed thereon.For the ease of introducing, this
In by an electrode being electrically connected in monitoring chip 30 with first coat of metal 101 be known as " first electrode ", will be in monitoring chip
Another electrode is known as " second electrode ", it is to be understood that and first electrode can be any one in positive and negative or cathode,
Accordingly, when first electrode is anode, second electrode is the cathode of monitoring chip 30；When first electrode is cathode, the
Two electrodes are the cathode of monitoring chip.Here an electrode of so-called monitoring chip 30 can be the anode of monitoring chip 30
Or cathode.First coat of metal 101 is electrically connected with the first electrode of monitoring chip 30, can be by the first electricity of monitoring chip 30
Pole is guided on first coat of metal 101.But first coat of metal 101 finally needs to be accomplished that 30 first electricity of monitoring chip
Extremely with the connection of first pin on laser tube socket of monitoring chip 30, so, first coat of metal 101 is also used to pass through metal
Conducting wire is electrically connected with the first pin of the monitoring chip 30 on laser tube socket.In this way, being based on first coat of metal 101
It realizes and corresponds to the connection of pin on 30 1 electrodes to laser tube socket of monitoring chip, for another electrode of the chip of monitoring,
The electrical connection of corresponding second pin i.e. in second electrode to laser tube socket, can directly be realized by plain conductor.In this way, base
The electrical connection for corresponding to pin on monitoring chip 30 on first electrode electrode and laser tube socket is achieved that in laser carrier 10,
Directly realize what 30 electrode of monitoring chip was electrically connected with corresponding pin using the plain conductor of two root longs in compared with the existing technology
Scheme in scheme provided in this embodiment, by the electric action of first coat of metal 101, reduces prison to a certain extent
The total length for controlling plain conductor when chip 30 is electrically connected, reduces interfering with each other between plain conductor under high-frequency signal, reduces
The generation of parasitic capacitance is possible, improves the signal transmitting quality of laser.
The plan of establishment that monitoring chip 30 is set on laser carrier 10 is forgoing described, is carried below in the laser
The scheme that master chip 20 is arranged on body 10 is introduced:
Due to corresponding to the electrical connection of pin on monitoring chip 30 and laser tube socket merely with first coat of metal 101,
Therefore, in the present embodiment, second coat of metal 102, the third coat of metal 103 and the 4th coat of metal 104 can be used in
The electrical connection of master chip 20 is realized in help.Second coat of metal 102 is adjacent with first coat of metal 101 and interval is arranged, so-called
" adjacent spaces setting " refers to not to be contacted directly between second coat of metal 102 and first coat of metal 101, but therebetween
Also other coats of metal are not present.Master chip 20 can be set on second coat of metal 102.Second coat of metal 102 can be with
One electrode of master chip 20 thereon is electrically connected, and for the ease of introducing, this electrode of master chip is known as " third electrode ",
Accordingly, another electrode of master chip is known as " the 4th electrode ".Third electrode can be the anode of master chip 20 either
The cathode of master chip 20.When third electrode is the anode of master chip, the 4th electrode is the cathode of master chip；When third electrode
For master chip cathode when, the 4th electrode is the anode of master chip.It can be with master chip 20 by second coat of metal 102
The electrical connection of three electrodes can guide to the third electrode of master chip 20 on second coat of metal 102.In the present embodiment, it is
It realizes that master chip 20 third electrode corresponds to the electrical connection of third pin to laser tube socket, can also use the third coat of metal
103.The third coat of metal 103 and second coat of metal, 102 adjacent spaces are arranged, and are connected between the two by thin mould resistance 105；
The third coat of metal 103 can be further electrically connected by plain conductor and third pin of the master chip 20 on laser tube socket
It connects.
By the mutual cooperation of second coat of metal 102 and the third coat of metal 103 and plain conductor, main core is realized
The electrical connection of pin is corresponded on the one of electrode of piece 20 (i.e. third electrode) and laser tube socket.For the another of master chip 20
The electrical connection of pin is corresponded on a electrode (i.e. the 4th pin) to laser tube socket, is realized here based on the 4th coat of metal 104.
4th coat of metal 104 and second coat of metal, 102 adjacent spaces are arranged, and the 4th coat of metal 104 is for passing through plain conductor
It is electrically connected with the 4th electrode of master chip 20, and the 4th pin electricity by plain conductor and master chip 20 on laser tube socket
Connection, to realize the electrical connection of corresponding 4th pin on the 4th electrode to laser tube socket of master chip 20.It is understood that
Since the 4th coat of metal 104 is the connection in order to realize the 4th electrode to the 4th pin of master chip 20, so, by the 4th metal
Coating 104 and the second coat of metal adjacent spaces, which are provided with, to be conducive to reduce master chip the 4th electrode to the 4th coat of metal 104
The length of plain conductor, and then reduce the total length of plain conductor in laser.
According to above-mentioned introduction it is found that under the auxiliary of first coat of metal 101,30 first electrode of monitoring chip may be implemented
To the electrical connection of the first pin of laser tube socket；Second coat of metal 102, the third coat of metal 103 auxiliary under, Ke Yishi
The electrical connection of third pin on existing 20 third electrode to laser tube socket of master chip；It, can with the help of the 4th coat of metal 104
To realize the electrical connection of the 4th pin on the 4th electrode to laser tube socket of master chip 20.In this way, 30 two electrodes of monitoring chip
In one can be based on gold with two electrodes in the electrical connection of corresponding pin and master chip 20 with being electrically connected for corresponding pin
The electric action for belonging to coating realizes, so that reducing in being electrically connected of three electrodes and three pins makes plain conductor
With largely reducing the total length of plain conductor in laser, improve the performance of laser.
In some examples of the present embodiment, the chip of master chip can be arranged in two electrodes of master chip 20 simultaneously
Top one of can also be arranged at the top of chip, another is arranged in chip bottom；Similarly, the two of monitoring chip 30
A electrode can also be arranged at the top of chip or one of electrode is arranged at the top of chip, and the setting of another chip exists
Chip bottom.If two electrodes of master chip 20 are arranged at the top of chip, second coat of metal 102 and third electrode
Electrical connection can be realized by plain conductor.Similarly, if two electrodes of monitoring chip 30 are arranged at the top of chip,
First coat of metal 101 can also be realized with being electrically connected for first electrode by plain conductor.
Another laser is also provided in the present embodiment, in the laser, two electrodes of master chip 20 are respectively set
In the top and bottom of chip, wherein third electrode is the electrode that 20 bottom of master chip is arranged in；Same monitoring chip 30
Two electrodes are also set, respectively on the top and bottom of the chip.Wherein first electrode is the electricity that 30 bottom of monitoring chip is arranged
Pole.Since the setting of third electrode is in 20 bottom of master chip, the third electrode of master chip 20 can directly with it is to be electrically connected
Second coat of metal 102 contact, in such a case, it is possible to directly realize third electrode and second coat of metal by conducting resinl
102 electrical connection, to avoid using plain conductor between third electrode and second coat of metal 102.Similarly, due to
The bottom of monitoring chip 30 is arranged in one electrode, therefore, the first electrode of monitoring chip 30 can directly with first coat of metal
101 contacts, in such a case, it is possible to directly by being realized between first electrode and first coat of metal 101 to conducting resinl
Electrical connection, and then avoid using plain conductor between first electrode and first coat of metal 101.
It, can be with when 20 bottom of master chip is arranged in third electrode as it can be seen that when the bottom of monitoring chip 30 is arranged in first electrode
On the basis of aforementioned schemes, it is further reduced the use of plain conductor.It should be appreciated that working as master chip 20 and monitoring chip
Two electrodes of some in 30 set up separately in chip top and bottom, when another two electrodes are arranged at the top of chip,
Also the use to plain conductor, the properties of product of improving laser device can be reduced to a certain extent.
In a kind of example of the present embodiment, the material of laser carrier is ceramic material.Certainly, those skilled in the art
It is to be appreciated that the material of laser carrier other than ceramic material, can also be made of other insulating materials.
Laser carrier and laser provided in this embodiment, by the way that the coat of metal, base are arranged on laser carrier
It is realized in the electric conductivity of the coat of metal and the electricity for corresponding to pin on laser carrier on chip electrode to laser tube socket is set
Connection, reduces the use of plain conductor, reduces the total length of metallic conduction in laser, thereby reduce plain conductor and exist
The generating probability of interfering with each other under high frequency condition and parasitic capacitance inductance improves the quality of laser.
Further, laser carrier provided in this embodiment is not only suitable for installation electrode and is divided into bottom surface and positive
Chip is also suitable for installing electrode while chip front side/top surface chip is arranged in, therefore application scenarios are wide.
Embodiment two:
The advantages of in order to make those skilled in the art more understand the utility model and details, the present embodiment will combine
Laser carrier and laser is introduced in specific example:
It is understood that due to needing for laser carrier to be arranged on laser tube socket in the laser, and be arranged
Anode, the cathode needs of master chip and monitoring chip on laser carrier are electrically connected with corresponding pin on laser tube socket
Connect, and even can by laser carrier be arranged the coat of metal come reduce for realizing chip positive/negative with it is right
The electrical connection of pin is answered, but corresponds to the electrical connection of pin on the laser carrier coat of metal and laser tube socket also or needs logical
Cross plain conductor realization.Fig. 4 shows a kind of top view of laser tube socket:
Laser tube socket 40 be include the first pin 401, the second pin 402, third pin 403 and the 4th pin 404.
There is carrier that area 400 is set between the first pin 401, the second pin 402, third pin 403 and the 4th pin 404 4,
When by laser carrier setting to laser tube socket 40, laser carrier will be arranged in carrier setting area 400.This
In assume first to hang angle 401 and the second pin 402 be the pin for belonging to monitoring chip, and third pin 403 and the 4th pin 404
It is then the pin for belonging to master chip.One in first pin 401 and the second pin 402 be monitoring chip positive pin, separately
One is then cathode pin；Any one in third pin 403 and the 4th pin 404 can be the positive pin of master chip,
The other is the cathode pin of master chip.On the laser tube socket 40 shown in Fig. 4, the first pin 401 and the second pin 402 are set
Set the position on the right side of tube socket, wherein the first pin 401 is close to the upside in carrier setting area 400, and the second pin 402 is close to load
The downside in body setting area 400；The left side of laser tube socket 40 is arranged in third pin 403 and the 4th pin 404, wherein the
Three-prong 403 is close to the upside in carrier setting area 400, downside of the 4th pin 404 close to carrier setting area 400.
According to the introduction of embodiment one it is found that the first pin 401 can pass through first on plain conductor and laser carrier
Coat of metal electrical connection, the second pin 402 can then be connect by plain conductor with the second electrode on monitoring chip.So being
Reduction monitoring chip install used in plain conductor, the present embodiment first coat of metal can be arranged in laser carrier
Right side, as shown in Figure 5: since the right side that coating on laser carrier 50 lays face 500a is arranged in first coat of metal 501,
So first coat of metal 501 passes through gold after laser carrier 50 is arranged on the setting area of the carrier on laser tube socket 40
When category conducting wire is connected with the first pin 401, relative to the side that first coat of metal 501 is arranged in 50 left side of laser carrier
The length of case, this section of plain conductor is more shorter.Simultaneously as first coat of metal 501, which is arranged on coating, lays face 500a
Right side, therefore, the right side of laser carrier 50 will be arranged in monitoring chip, the second of monitoring chip on laser tube socket 40
Pin 402 when being electrically connected with monitoring chip second electrode used plain conductor be also shorter.
In view of first coat of metal 501 needs to be led with the first pin 401 for being located at 400 upside of carrier setting area with metal
Electricity electrical connection, and be located at first coat of metal 501 on monitoring chip third electrode then need by plain conductor be located at
The second pin 402 electrical connection of 400 downside of area or upside is arranged in carrier, so, it can minimize on first coat of metal 501
Edge is laid at a distance from face 500a upper edge with coating, while guaranteeing that setting monitors on first coat of metal 501 again
Chip second electrode on laser tube socket 40 at a distance from second pin 402 it is small as far as possible, therefore, the first metal-plated can be allowed
The lower edge of layer 501 lays the lower edge of face 500a also close to coating.First coat of metal 501 is rectangle in Fig. 5, ability
Field technique personnel are it is to be appreciated that in addition to rectangle, and first coat of metal 501 can also be in other regular shapes, such as just
Rectangular, diamond shape, circle, ellipse etc.；Even in some examples of the present embodiment, first coat of metal 501 can also be in
Irregular shape.
Continuing with the introduction of embodiment one: the third coat of metal 503 on laser carrier 50 needs to lead by metal
Line is electrically connected with the third pin 403 on laser tube socket 40.It therefore, in the present embodiment, can be by the third coat of metal 503
Laser carrier coating is set and lays face 500a left side central portion or left side position on the upper side, in this way, when by laser carrier
After 50 are arranged in the carriers setting area 400 of laser tube socket 40, the third coat of metal 503 can be closer on laser tube socket 40
Third pin 403.In this way, when using plain conductor connection third pin 403 and the third coat of metal 503, plain conductor
Length can greatly be shortened, advantageously reduce the total length of plain conductor in laser, reduce between plain conductor
It interferes with each other.
Similarly, since the 4th coat of metal 504 on laser carrier 50 is needed through plain conductor and laser tube socket
Therefore 4th coat of metal 504 can be arranged in the present embodiment and lay face in coating by the 4th pin 404 electrical connection on 40
500a left side central portion or left side position on the lower side, in this way, when set the carrier that laser tube socket 40 is arranged in laser carrier 50
After setting area 400, the 4th coat of metal 504 also can be closer to the 4th pin 403.In this case, connected using plain conductor
When connecing the 4th pin 404 and four coats of metal 504, the length of plain conductor also can be shorter.
It is also adjacent in some examples of the present embodiment, between the third coat of metal 503 and the 4th coat of metal 504
Interval setting: the left upper portion that coating lays face 500a is arranged in the third coat of metal 503, while by the 4th coat of metal
504 are arranged in the left lower that coating lays face 500a, can reduce the third coat of metal 503 and the coat of metal simultaneously in this way
The length of 504 plain conductors used when being electrically connected with corresponding pin.
Furthermore, it is contemplated that the 4th coat of metal 504 needs to be electrically connected by plain conductor with the 4th electrode on master chip,
Therefore the 4th coat of metal 504 should also be as close as possible to the 4th electrode.Due to master chip setting second coat of metal 502 it
On, therefore, it may be considered that the 4th coat of metal 504 and second coat of metal, 502 adjacent spaces are arranged.In the present embodiment,
Second coat of metal 502, which can be set, lays the position that in the middle part of the 500a of face or middle part is to the left in coating.In the present embodiment
It is electrically connected between two coats of metal 502 and the third coat of metal 503 or by thin mould resistance 505, and second coat of metal 502
It is arranged with both the third coat of metal 503 adjacent spaces.
In Fig. 5, four coats of metal are rectangle, and this aspect is because the coat of metal to be arranged to rectangular, phase
For the coat of metal to be arranged to the other shapes either way of irregular shape, it is more advantageous to industrial production.It is another
Aspect, the coat of metal are rectangle, are also beneficial to that chip device is arranged on the coat of metal.But, in the present embodiment, other show
In example, the shape of four coats of metal can be arbitrarily arranged, such as in an example, the first gold medal in four coats of metal
Belonging in coating 501 and second coat of metal 502 can have at least one to be rectangle, the third coat of metal 503 and the 4th metal
The shape of coating 504 is random.
The present embodiment also provides a kind of laser, refers to Fig. 6, and Fig. 6 is shown including laser carrier shown in fig. 5
The laser 6 of laser tube socket 40 in 50 and Fig. 4:
Here with monitoring chip for MPD 61, while master chip is that laser diode 62 is introduced, it is assumed that the anode of MPD
At the top of chip, and cathode (Fig. 6 is not shown) is located at chip bottom.Laser diode is also that anode is located at chip top simultaneously
Portion, cathode (Fig. 6 is not shown) are located at chip bottom.MPD 61 is arranged on first coat of metal 501, and cathode passes through conducting resinl
It is electrically connected with first coat of metal 501, (plain conductor is in Fig. 6 with heavy line table by plain conductor for first coat of metal 501
Show) it is electrically connected with the first pin 401 on laser tube socket 40, so, the first pin 401 is the cathode pin of MPD 61.MPD
61 anode is directly electrically connected with the second pin 402 on laser tube socket 40 by plain conductor, so, laser tube socket 40
On the second pin 402 just at the positive pin of MPD 61.Laser diode 62 is arranged on second coat of metal 502,
Cathode is directly electrically connected with second coat of metal 502 by conducting resinl, due to second coat of metal 502 and the third coat of metal
It is electrically connected between 503 by thin mould resistance 505, therefore the typical case of 62 cathode of laser diode can be introduced to well third metal-plated
On layer 503.After the third coat of metal 503 is electrically connected with the third pin 403 on laser tube socket 40, third pin 403 is just
It can be used as the cathode pin of laser diode 62.For the anode of laser diode 62, it can directly pass through plain conductor
It is electrically connected, the electric signal of 62 anode of laser diode is guided on the 4th coat of metal 504, then with the 4th coat of metal 503
The 4th coat of metal 504 and the 4th pin 404 are connected by plain conductor, the 4th pin 404 is made to exist as laser diode 62
Positive pin on laser tube socket.
In the examples described above, the positive electrode and negative electrode of master chip set up the top and bottom in chip separately, and this master chip is usual
It is the chip within 10G.In another example of the present embodiment, a kind of laser is additionally provided, in the laser, main core
Piece is the Vcsel laser of 14G or more, and positive and negative anodes are arranged at the top of chip.Refer to the laser 7 shown in Fig. 7
Top view:
Laser 7 includes laser carrier 72, laser tube socket 71, and laser tube socket 71 includes the first pin 711, the
Two pins 712, third pin 713 and the 4th pin 714, wherein the first pin 711 and the second pin 712 are separately connected MPD
73 positive pin and cathode pin, third pin 713 and the 4th pin 714 respectively with the positive pin and cathode of master chip 74
Pin connection.
Laser carrier 72 is arranged on laser tube socket 71, and is arranged between four pins, so that the first pin
711, the second pin 712, third pin 713, the 4th pin 714 are enclosed in respectively around laser carrier 72.Laser carrier
First coat of metal 721, second coat of metal 722, the third coat of metal 723 and the 4th gold medal are provided on 72 coating laying face
Belong to coating 724.First coat of metal 721 is located at the side (in Fig. 7 be located at right side) that 72 coating of laser carrier lays face, and first
The coat of metal 721 is rectangle, and is provided with MPD 73, in its chip bottom, cathode setting exists for the anode setting of MPD 73
At the top of chip, so, first coat of metal 721 can be equal to the anode electrical connection of MPD 73 by conducting resinl, meanwhile, in order to incite somebody to action
The positive pin of the anode and MPD 73 on laser tube socket 71 of MPD 73 connects, so first coat of metal 721 can also
By gold thread with the first pin 711 electrical connection on laser tube socket 71.The cathode of MPD 73 is arranged at the top of its chip, therefore
The second pin 712 on 73 cathode of MPD and laser tube socket 71 can be directly connected by gold thread.
In the present embodiment, second coat of metal 722 of laser carrier 72, second coat of metal is arranged in master chip 74
722 are located at the middle part positions to the left of laser carrier 72, and second coat of metal 722 with pass through thin mould resistance 725 and setting
It is connected in the third coat of metal 723 that 72 coating of laser carrier lays face upper left side.4th coat of metal 724 is arranged in coating
The lower left side in laying face.In the present embodiment, second coat of metal 722 and the third coat of metal 723 and Bao Mo resistance 725 are total
With 74 anode of realization master chip with the electrical connection of third pin 713, and the 4th coat of metal 724 then helps to realize that master chip 74 is negative
Extremely with the electrical connection of the 4th pin 714 on laser tube socket 71.Since the positive and negative anodes of master chip 74 are arranged at its top, institute
To need to connect 74 anode of master chip and second coat of metal 722 by gold thread.In 74 anode of master chip and second coat of metal
It is arranged after conductive gold thread between 722, the anode of master chip 74 can be guided at the third coat of metal 723, then pass through third
The anode of master chip 74 can be guided to third by the gold thread between 71 third pin 713 of the coat of metal 723 and laser carrier
At pin 713.For the cathode of master chip 74 and being electrically connected for the 4th pin 714, it can be accomplished in that and pass through gold
Line connects 74 cathode of master chip and the 4th coat of metal 724, and connects the 4th coat of metal 714 and the 4th pin by gold thread
714。
It is understood that MPD is a pin at the top of chip, and a pin is in chip in above-mentioned example
Bottom surface, it will be appreciated by persons skilled in the art that be also adapted to fit positive and negative pin equal for laser carrier provided in this embodiment
Monitoring chip at the top of chip.
Laser carrier and laser provided in this embodiment, not only by being arranged on laser carrier coating laying face
The coat of metal reduces the length of plain conductor in laser, moreover, because laser carrier is adapted to fit the equal position of positive cathode
Master chip and/or monitoring chip in chip top surface are also adapted to fit the main core that positive cathode is divided into chip top surface and bottom surface
Piece and/or monitoring chip, so this laser carrier application scenarios are wide.
The above content is combining specific embodiment to be further described to made by the utility model embodiment, no
It can assert that the specific implementation of the utility model is only limited to these instructions.For the common skill of the utility model technical field
For art personnel, without departing from the concept of the premise utility, a number of simple deductions or replacements can also be made, all should
It is considered as belonging to the protection scope of the utility model.
Claims (10)
1. a kind of laser carrier, which is characterized in that the laser carrier is for being arranged master chip and monitoring chip；It is described to swash
Light device carrier includes carrier body and first coat of metal being laid on the coating laying face of the carrier body, second
The coat of metal, the third coat of metal and the 4th coat of metal；
First coat of metal is set to the side that the coating lays face, for one with the monitoring chip being disposed thereon
A electrode electrical connection, first coat of metal are also used to through plain conductor and the monitoring chip on laser tube socket
One pin electrical connection；Another electrode of the monitoring chip is by plain conductor and the monitoring chip on laser tube socket
Another pin electrical connection；
Second coat of metal and first coat of metal adjacent spaces are arranged, and second coat of metal is used for and setting
One electrode of master chip on it is electrically connected；Second coat of metal is set with the third coat of metal adjacent spaces
It sets, and is connected between the two by thin mould resistance；The third coat of metal is swashed by plain conductor and the master chip described
Pin electrical connection on light device tube socket；
4th coat of metal and second coat of metal adjacent spaces are arranged, and the 4th coat of metal is for passing through gold
Belong to conducting wire to be electrically connected with another electrode of the master chip, and by plain conductor and the master chip in the laser tube socket
On another pin electrical connection.
2. laser carrier as described in claim 1, which is characterized in that the third coat of metal is set to the coating cloth
If the left side central portion or left upper portion in face.
3. laser carrier as described in claim 1, which is characterized in that the 4th coat of metal is set to the coating cloth
If the left lower in face.
4. laser carrier as described in claim 1, which is characterized in that first coat of metal is set to the coating cloth
If the right side in face.
5. laser carrier according to any one of claims 1-4, which is characterized in that the carrier body is ceramic material.
6. laser carrier according to any one of claims 1-4, which is characterized in that first coat of metal, the second gold medal
Belong at least one in coating to be rectangle.
7. a kind of laser, which is characterized in that the laser includes master chip, monitoring chip, laser tube socket and such as weighs
Benefit requires the described in any item laser carriers of 1-6.
8. laser as claimed in claim 7, which is characterized in that two electrodes of the monitoring chip are respectively positioned on chip top
Portion or an electrode are located at the top of chip, another electrode is located at chip bottom；Two electrodes of the master chip are respectively positioned on core
At the top of piece or an electrode is located at the top of chip, another electrode is located at chip bottom.
9. laser as claimed in claim 8, which is characterized in that the monitoring chip is monitor photo-diode MPD；It is described
An electrode of MPD is located at the top of chip, another electrode is located at chip bottom, and first coat of metal is same by conducting resinl
It is electrically connected on the MPD positioned at the electrode of chip bottom.
10. laser as claimed in claim 8, which is characterized in that an electrode of the master chip is located at the top of chip, separately
One electrode is located at chip bottom, and second coat of metal is by conducting resinl with the electricity for being located at chip bottom on the master chip
Pole electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821833530.4U CN209266840U (en) | 2018-11-07 | 2018-11-07 | A kind of laser carrier and laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821833530.4U CN209266840U (en) | 2018-11-07 | 2018-11-07 | A kind of laser carrier and laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209266840U true CN209266840U (en) | 2019-08-16 |
Family
ID=67554240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821833530.4U Active CN209266840U (en) | 2018-11-07 | 2018-11-07 | A kind of laser carrier and laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209266840U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111193181A (en) * | 2020-01-08 | 2020-05-22 | 索尔思光电（成都）有限公司 | TO packaged TOSA and optical module |
| WO2022156489A1 (en) * | 2021-01-25 | 2022-07-28 | 华为技术有限公司 | Laser carrier and manufacturing method therefor |
-
2018
- 2018-11-07 CN CN201821833530.4U patent/CN209266840U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111193181A (en) * | 2020-01-08 | 2020-05-22 | 索尔思光电（成都）有限公司 | TO packaged TOSA and optical module |
| WO2022156489A1 (en) * | 2021-01-25 | 2022-07-28 | 华为技术有限公司 | Laser carrier and manufacturing method therefor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11855239B2 (en) | Electrode assembly having lower electrode directly on the surface of a base substrate, a first electrode on the lower electrode, and the second electrode formed on and spaced apart from the first electrode | |
| CN209266840U (en) | A kind of laser carrier and laser | |
| CN110137329B (en) | Method for manufacturing subminiature light emitting diode electrode assembly including selective metal resistor layer | |
| CN104795700B (en) | Audio-video signal transmission connector | |
| US20170200859A1 (en) | Solvent For Manufacture Of Self-Assembled Nano-Scale LED Electrode Assembly And Method For Manufacturing Self-Assembled Nano-Scale LED Electrode Assembly By The Same | |
| CN104576871A (en) | Led chip | |
| KR20130121279A (en) | Light emitting device | |
| CN109659812A (en) | A kind of upside-down mounting VCSEL chip and preparation method thereof with ODR | |
| TW201138169A (en) | Light emitting device, light emitting device package, and lighting system | |
| WO2019045435A1 (en) | Light emitting diode apparatus and method of manufacturing the same | |
| CN103298171B (en) | The heating board of electromagnetic-radiation-free | |
| CN203180271U (en) | Network connector | |
| CN203405483U (en) | Test wire clamp | |
| CN211062853U (en) | Wound-rotor TWS earphone antenna | |
| CN106409701A (en) | Electrode structure for gold wire bonding | |
| CN104562160A (en) | Electroplating clamp conductive device | |
| CN208797219U (en) | Two contact point connector terminal, connector body, connector and communication equipment | |
| CN208768275U (en) | A kind of headset system of wireless charging | |
| CN209389031U (en) | A kind of LED component | |
| WO2016036067A1 (en) | Light emitting diode | |
| CN206148189U (en) | High -speed armoring machine | |
| WO2013122328A1 (en) | Method for manufacturing light-emitting device and light-emitting device manufactured using same | |
| CN205159679U (en) | Electric connector | |
| CN205355493U (en) | Flat power cord of anti -interference bilayer | |
| CN110238816A (en) | Mechanical arm, manipulator and transmission equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |