CN105470229A - Housing lead wire used for surface-mount package of microwave device and connecting structure thereof - Google Patents
Housing lead wire used for surface-mount package of microwave device and connecting structure thereof Download PDFInfo
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- CN105470229A CN105470229A CN201510986525.1A CN201510986525A CN105470229A CN 105470229 A CN105470229 A CN 105470229A CN 201510986525 A CN201510986525 A CN 201510986525A CN 105470229 A CN105470229 A CN 105470229A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The present invention relates to the field of surface mounting technology, and specially discloses a housing lead wire used for a surface-mount package of a microwave device and a connecting structure that uses the lead wire. The lead wire is flat and ribbon-shaped, is provided with a bending section that is omega-shaped and that has a radius of 0.10 mm - 0.30 mm, and the lead wire, except the bending section, is a straight line segment. The bending section is an arc that is a semicircle or greater than a semicircle. Two straight line end portions of the lead wire are a lead-in end and a lead-out end respectively; the lead-in end is used for connecting a package housing; the lead-out end is used for connecting a printed circuit board; and the bending section of the lead wire is close to the lead-out end. In the connecting structure, the distance between a bending degree and a ceramic base is 0.10 mm - 0.30 mm. According to the housing lead wire used for a surface-mount package of a microwave device and the connecting structure, a lead wire has better tensile and anti-plastic deformation performance, and also has a better microwave electric signal transmission capability; and by applying the lead wire to a microwave device, a tensile stress that the lead wire exerts on a housing when a temperature changes can be reduced or eliminated, and reliability of the device and better microwave performance can be ensured.
Description
Technical field
The present invention relates to microwave device surface mounting technology field, especially relate to the package casing technical field of microwave device.
Background technology
Cermet encapsulation as the representative of encapsulation highly reliable in semiconductor packaging, because its base is multi-layer ceramics, be applicable to high-density circuit wiring and device integrated, there is the advantage that high frequency characteristics is good, noise is low, and be widely used in microwave power device.
Go between as the part of package casing, play the transmission bridge beam action of the signal of telecommunication, signal is transferred on the holding wire the printed circuit board (PCB) (PCB) of device installation from package casing inside chip by it, most important for micro-electron packaging device reliability.The use material first-selection of Surface Mount microwave ceramics package lead is kovar alloy, and itself and ceramic expansion coefficient are more or less the same, and differs comparatively large with conventional PCB material such as Roger series material, easily causes occurring integrity problem during consumer usage device.
The form of the cermet surface mount packages package lead of conventional microwave device is mainly divided into straight-line wires and the large class of Z-shaped lead-in wire two, as depicted in figs. 1 and 2.In straight-line wires syndeton, lead-in wire is directly welded on the bottom of ceramic base, as shown in Figure 1, when plate level is installed, lead ends part is mounted on PCB by plumber's solder, due to the difference of package casing ceramic base and the PCB base material coefficient of expansion, each material (as temperature cycling test) when variations in temperature is caused to there will be the inconsistent situation of dilation, thus larger tension stress is produced to lead-in wire, because ceramic base fragility is large, toughness is little, often occur that ceramic floor is occurred by the situation of drawing crack, have a strong impact on the reliability of microwave device.And in Z-shaped lead link structure, there is larger deformation region, as shown in Figure 2, although can stress be experienced in temperature changing process, but its stress is by the distortion in wire squass region, eliminate the pulling force being added in ceramic bottom surface, ensure that the high reliability that Z-shaped lead-in wire connection microwave ceramics shell is installed in plate level.But, due to the particularity of microwave transmission, Z-shaped pin configuration microwave telecommunication laser propagation effect difference, microwave device poor-performing, and be not widely used in microwave cermet Surface Mount shell.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of package lead for microwave device surface mount packages, there is good tension and anti-plastic deformation ability, there is good microwave telecommunication transmittability simultaneously, it is applied in microwave device, the tension stress that when can weaken or eliminate variations in temperature, shell is gone between, ensures the reliability of device and good microwave property.
Another technical problem that the present invention will solve is to provide a kind of lead link structure of microwave device surface mount packages shell, it has high reliability and good microwave telecommunication laser propagation effect simultaneously, can prevent because ceramic base and PCB thermal coefficient of expansion gap cause greatly the excessive generation of drawing bad ceramic base phenomenon of lead-in wire tension stress.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of package lead for microwave device surface mount packages, goes between as flat belt-like, lead-in wire is provided with bending section, in Ω shape, its radius is 0.10mm ~ 0.30mm, and described lead-in wire is straightway beyond bending section.
Further, described bending section is semicircle.
Further, described bending section is the arc being greater than semicircle.
Further, two linear end of lead-in wire are respectively leading-in end and exit, and described leading-in end is used for connection encapsulation shell, and described exit is for connecting printed circuit board (PCB), and the bending section on described lead-in wire is near leading-in end.
Preferably, the material of described lead-in wire is kovar alloy.
A lead link structure for microwave device surface mount packages shell, comprises package casing, lead-in wire and printed circuit board (PCB) (PCB), and described package casing comprises the metal body of wall on top and the ceramic base of bottom; Described lead-in wire is flat belt-like, lead-in wire is provided with bending section, in Ω shape, its radius is 0.10mm ~ 0.30mm, described lead-in wire is straightway beyond bending section, the straightway of described lead-in wire is laid on printed circuit board (PCB), two linear end of lead-in wire are respectively leading-in end and exit, described leading-in end is welded in the bottom of described ceramic base, described exit is welded on printed circuit board (PCB), the bending section of described lead-in wire is unsettled, and the bending section of described lead-in wire is positioned at the outer 0.10mm ~ 0.30mm position of ceramic base.
Further, described bending section is semicircle or is greater than the arc of semicircle.
Preferably, the material of described lead-in wire is kovar alloy.
The beneficial effect adopting technique scheme to produce is: Ω shape lead-in wire straightway of the present invention can do good transmission to microwave telecommunication number, the diameter control of bending section is in 0.10mm ~ 0.30mm, to the interference of microwave telecommunication number transmission with lose little, meet the performance index requirement of microwave device, simultaneously, bending section has certain deformability, well release stress and weaken stress conduction can be played when the two ends deformation quantity of going between does not wait or do not wait by pulling force, effectively can avoid the conduction of wire breaking and stress greatly.
In Ω shape lead link structure of the present invention, Ω shape lead-in wire can ensure good Signal transmissions effect, makes microwave device have good microwave property; In temperature cycles change, the thermal expansion coefficient difference of PCB and shell ceramic base is large, the convergent-divergent of PCB and shell ceramic base is inconsistent to be caused going between and produces larger tension stress, this tension stress does not directly act on shell ceramic base, but by conducting to shell ceramic base again after lead-in wire bending section, in ess-strain transmittance process, bending section comparatively straightway has the anti-plastic deformation ability of better tension, the effect of ess-strain to ceramic base can be cushioned well, there is better thermal shock resistance, thus ensure the reliability of syndeton.Meanwhile, the straight-line wires mounting means that the mounting means that Ω shape of the present invention goes between can directly adopt prior art generally to adopt, easy for installation, simple, there is good applicability.
Accompanying drawing explanation
Fig. 1 is straight-line wires and syndeton schematic diagram thereof;
Fig. 2 is Z-shaped lead-in wire and syndeton schematic diagram thereof;
Fig. 3 is the structural representation of Ω shape of the present invention lead-in wire;
Fig. 4, Fig. 5 are the schematic diagrames of Ω shape lead link structure of the present invention;
Fig. 6 is a kind of packaging shell structure schematic diagram with Ω shape of the present invention lead-in wire;
Fig. 7, Fig. 8 are straight-line wires and Ω shape lead-in wire stress envelope under same temperature follows condition respectively.
Wherein, 1, metal body of wall; 2, Z-shaped lead-in wire; 3, ceramic base; 4, printed circuit board (PCB) (PCB); 5, straight-line wires; 6, Ω shape lead-in wire; 61, bending section; 62, leading-in end; 63, exit; 7, solder.
Embodiment
In order to clearly describe the present invention, below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Embodiment one
For a package lead for microwave device surface mount packages, see Fig. 3, go between as flat belt-like, lead-in wire is provided with bending section 61, and in Ω shape, its radius is 0.10mm ~ 0.30mm, and described lead-in wire is straightway beyond bending section 61.When the selection of bending section 61 radius size is installed with pottery and secondary, the thermal coefficient of expansion of the PCB4 material that user uses is relevant, thermal coefficient of expansion gap is larger, bending section 61 radius is selected larger, radius controls within the scope of 0.10mm ~ 0.30mm, and its transmission inductance produced does not affect the transmission of microwave signal.
To the further improvement of the technical program, described bending section 61 is semicircle or is greater than the arc of semicircle.Bending section 61 is semicircle convenient processing, if but the PCB4 that below is installed differs comparatively large with Surface Mount shell thermal coefficient of expansion, and when erection space is limited, preferred bending section 61 is the arcs being greater than semicircle, can increase deformation buffer amount.
To the further improvement of the technical program, two linear end of lead-in wire are respectively as leading-in end 62 and exit 63, described leading-in end 62 is for connection encapsulation shell, and described exit 63 is for connecting printed circuit board (PCB), and the bending section 61 on described lead-in wire is near leading-in end 62.
Preferably, the material of described lead-in wire is kovar alloy.
Embodiment two
A lead link structure for microwave device surface mount packages shell, is shown in Fig. 4 and Fig. 5, comprises package casing, lead-in wire and PCB4, and described package casing comprises the metal body of wall 1 on top and the ceramic base 3 of bottom; Described lead-in wire is flat belt-like, lead-in wire is provided with bending section 61, in Ω shape, its radius is 0.10mm ~ 0.30mm, described lead-in wire is straightway beyond bending section 61, the straightway of described lead-in wire is laid on PCB4, two linear end of lead-in wire are respectively leading-in end 62 and exit 63, described leading-in end 62 is welded in the bottom of described ceramic base 3, described exit 63 is welded on printed circuit board (PCB), the bending section 61 of described lead-in wire is unsettled, and the bending section 61 of described lead-in wire is positioned at the outer 0.10mm ~ 0.30mm position of ceramic base 3.The material of lead-in wire is kovar alloy.Described bending section 61 is semicircle.
In package casing, ceramic base 3 is provided with at itself and lead-in wire leading-in end 62 coupling part the string holes run through, and sees Fig. 5 and Fig. 6, and the microwave chip pin that in string holes, cloth wire is used in metal body of wall 1 realizes being electrically connected with lead-in wire.Wherein between metal body of wall 1 and ceramic base 3, between ceramic base 3 and lead-in wire be all welded and fixed by solder 7, it is identical that its assembling mode and straight-line wires 5 assemble mode.
Ω shape 6 bending section 61 Forming Quality that go between determine the height of final encapsulating products quality, and confirm in the processs of the test such as temperature cycles, the stress between shell and PCB4 is in transmittance process, and most of stress all acts on bending section 61.See Fig. 7 and Fig. 8, under equal conditions, shell after encapsulation is followed process stress by temperature compare, straight-line wires 5 stress concentrates on ceramic base 3 root, and maximum stress reaches 353MPa, adopts the present embodiment Ω shape lead-in wire 6, the stress of bending section 61 is 151MPa to the maximum, reduce stress obvious, effectively can improve the reliability of encapsulated device, prevent lead-in wire from drawing bad ceramic base 3.
Therefore the shaping of bending section 61 can not have the defects such as damage and crackle.Bending section 61 forming process, before the assembling of microwave Surface Mount ceramic packaging shell, can ensure product quality after mounting like this.
Better reduce lead-in wire tension stress effect to obtain, bending section 61 can select the arc being greater than semicircle, increases deformation buffer amount.
Claims (7)
1. for a package lead for microwave device surface mount packages, it is characterized in that: go between as flat belt-like, lead-in wire is provided with bending section (61), and in Ω shape, its radius is 0.10mm ~ 0.30mm, and described lead-in wire is straightway beyond bending section (61).
2. a kind of package lead for microwave device surface mount packages according to claim 1, is characterized in that, described bending section (61) is semicircle.
3. a kind of package lead for microwave device surface mount packages according to claim 1, is characterized in that, described bending section (61) is for being greater than the arc of semicircle.
4. a kind of package lead for microwave device surface mount packages according to claim 1, it is characterized in that, two linear end of lead-in wire are respectively leading-in end (62) and exit (63), described leading-in end (62) is for connection encapsulation shell, described exit (63) is for connecting printed circuit board (PCB) (4), and the bending section (61) on described lead-in wire is near leading-in end (62).
5. a lead link structure for microwave device surface mount packages shell, is characterized in that, comprises package casing, lead-in wire and printed circuit board (PCB) (4), and described package casing comprises the metal body of wall (1) on top and the ceramic base (3) of bottom, described lead-in wire is flat belt-like, lead-in wire is provided with bending section (61), in Ω shape, its radius is 0.10mm ~ 0.30mm, described lead-in wire is straightway beyond bending section (61), the straightway of described lead-in wire is laid on printed circuit board (PCB) (4), two linear end of lead-in wire are respectively leading-in end (62) and exit (63), described leading-in end (62) is welded in the bottom of described ceramic base (3), described exit (63) is welded on printed circuit board (PCB) (4), the bending section (61) of described lead-in wire is unsettled, the bending section (61) of described lead-in wire is positioned at the outer 0.10mm ~ 0.30mm position of ceramic base (3).
6. the lead link structure of a kind of microwave device surface mount packages shell according to claim 5, is characterized in that, described bending section (61) is semicircle or is greater than the arc of semicircle.
7. the lead link structure of a kind of microwave device surface mount packages shell according to claim 5, it is characterized in that, described lead-in wire is kovar alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510986525.1A CN105470229A (en) | 2015-12-26 | 2015-12-26 | Housing lead wire used for surface-mount package of microwave device and connecting structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510986525.1A CN105470229A (en) | 2015-12-26 | 2015-12-26 | Housing lead wire used for surface-mount package of microwave device and connecting structure thereof |
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| CN105470229A true CN105470229A (en) | 2016-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510986525.1A Pending CN105470229A (en) | 2015-12-26 | 2015-12-26 | Housing lead wire used for surface-mount package of microwave device and connecting structure thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110299898A (en) * | 2019-07-25 | 2019-10-01 | 北京无线电计量测试研究所 | A kind of Band-reject crystal filter coil reinforcement means and device |
| CN110797308A (en) * | 2019-10-31 | 2020-02-14 | 中国电子科技集团公司第十三研究所 | Ceramic leadless chip type packaging shell with leads and power device |
| CN111928954A (en) * | 2020-07-27 | 2020-11-13 | 青岛凯瑞电子有限公司 | Miniature dewar of infrared detector |
| CN112164949A (en) * | 2020-08-19 | 2021-01-01 | 山东航天电子技术研究所 | High-reliability assembling method for thin-wall through hole piece |
| CN115458497A (en) * | 2022-08-30 | 2022-12-09 | 石家庄银河微波技术股份有限公司 | Thermal shock resistance high-power transistor lead and performance verification method thereof |
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| JPH07297344A (en) * | 1994-04-25 | 1995-11-10 | Toshiba Corp | Lead frame |
| JPH08298305A (en) * | 1995-04-26 | 1996-11-12 | Nec Corp | Lead frame and wiring structure using the same |
| CN1610107A (en) * | 2003-10-17 | 2005-04-27 | 精工爱普生株式会社 | Semiconductor device and producing method thereof |
| JP2007258515A (en) * | 2006-03-24 | 2007-10-04 | Nec Electronics Corp | Semiconductor device and its manufcturing method |
| CN202712169U (en) * | 2012-06-11 | 2013-01-30 | 临海市志鼎电子科技有限公司 | Lead-out electrode structure for large power semiconductor module |
| CN204102882U (en) * | 2014-08-19 | 2015-01-14 | 无锡中微高科电子有限公司 | High density ceramic encapsulation Spring pins |
| CN205248261U (en) * | 2015-12-26 | 2016-05-18 | 中国电子科技集团公司第十三研究所 | A package lead for microwave device table pastes and encapsulates and connection structure thereof |
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2015
- 2015-12-26 CN CN201510986525.1A patent/CN105470229A/en active Pending
Patent Citations (7)
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| JPH07297344A (en) * | 1994-04-25 | 1995-11-10 | Toshiba Corp | Lead frame |
| JPH08298305A (en) * | 1995-04-26 | 1996-11-12 | Nec Corp | Lead frame and wiring structure using the same |
| CN1610107A (en) * | 2003-10-17 | 2005-04-27 | 精工爱普生株式会社 | Semiconductor device and producing method thereof |
| JP2007258515A (en) * | 2006-03-24 | 2007-10-04 | Nec Electronics Corp | Semiconductor device and its manufcturing method |
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| CN205248261U (en) * | 2015-12-26 | 2016-05-18 | 中国电子科技集团公司第十三研究所 | A package lead for microwave device table pastes and encapsulates and connection structure thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110299898A (en) * | 2019-07-25 | 2019-10-01 | 北京无线电计量测试研究所 | A kind of Band-reject crystal filter coil reinforcement means and device |
| CN110797308A (en) * | 2019-10-31 | 2020-02-14 | 中国电子科技集团公司第十三研究所 | Ceramic leadless chip type packaging shell with leads and power device |
| CN111928954A (en) * | 2020-07-27 | 2020-11-13 | 青岛凯瑞电子有限公司 | Miniature dewar of infrared detector |
| CN111928954B (en) * | 2020-07-27 | 2024-06-14 | 青岛凯瑞电子有限公司 | Miniature Dewar of infrared detector |
| CN112164949A (en) * | 2020-08-19 | 2021-01-01 | 山东航天电子技术研究所 | High-reliability assembling method for thin-wall through hole piece |
| CN115458497A (en) * | 2022-08-30 | 2022-12-09 | 石家庄银河微波技术股份有限公司 | Thermal shock resistance high-power transistor lead and performance verification method thereof |
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Application publication date: 20160406 |