CN111128801B - Automatic placement system for semiconductor patches - Google Patents
Automatic placement system for semiconductor patches Download PDFInfo
- Publication number
- CN111128801B CN111128801B CN201911209821.5A CN201911209821A CN111128801B CN 111128801 B CN111128801 B CN 111128801B CN 201911209821 A CN201911209821 A CN 201911209821A CN 111128801 B CN111128801 B CN 111128801B
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- Prior art keywords
- frame
- module
- semiconductor
- rack
- lifting
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 23
- 238000009434 installation Methods 0.000 claims abstract description 7
- 238000007789 sealing Methods 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 8
- 238000007664 blowing Methods 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides an automatic placement system for semiconductor patches, which is suitable for automatically and accurately placing the semiconductor patches on a circuit board during welding in a large batch, and improves the production efficiency of mass production. The invention comprises a linear motion module, a material taking and placing module and a semi-automatic feeding module, wherein the linear motion module adopts a linear motor to build a three-coordinate moving platform, the material taking and placing module adopts a double-layer sleeve structure to take a discharger element, and the automatic feeding module is matched with the discharger element, so that a semiconductor patch can be automatically and accurately placed on a circuit board, and the work of the next procedure is facilitated; the picking and placing module adopts two-stage precise gear rack driving cooperation, so that the installation space and weight can be reduced, the inertia can be reduced, the vibration in use can be further reduced, and the accurate picking and placing of the patch can be completed.
Description
Technical Field
The invention provides an automatic placement system for semiconductor patches, and belongs to the field of design of automatic arrangement and placement equipment for semiconductor patch welding.
Background
The welding of semiconductor patches is always a very fine work, and both manual patches and machine patches require very high operation accuracy and stability, and then the existing manual patches are tired in work although workers with rich technical experience can be very good patches. The labor intensity is great; the robot patch cost is very high, and the robot patch can be applied by medium and large enterprises. For the reasons, designing related simplified equipment can well complete corresponding surface mounting work, and the cost is low, so that the surface mounting device is one key point of requirements.
Disclosure of Invention
In view of the above-mentioned situations, the present invention provides an automatic placement system for semiconductor chips, which can automatically complete the automatic placement work of semiconductor chips within an allowable accuracy range.
The invention comprises the following steps:
the utility model provides an automatic placement system of semiconductor paster adopts the modularized design, includes three-dimensional moving module, the circuit board, material loading module and gets the blowing module, and three-dimensional moving module adopts linear electric motor to constitute the revolute pair, and the fixed centre gripping of circuit board is on a certain base plate.
The feeding module comprises a feeding installation frame, a feeding motor is fixedly installed on the feeding installation frame, a feeding belt is further installed on the feeding installation frame to drive the feeding belt to circularly rotate through a belt pulley, a storage bin is arranged right above the feeding belt, the inside of the feeding belt is overlapped to store the semiconductor patches, and the feeding belt is provided with a groove capable of containing the semiconductor patches.
Get blowing module including installing in the mount of linear electric motor slider, another hoisting frame is through two guide rail slidable mounting in the spout of mount, fixed mounting has the rail head on the end of guide rail, rail head pressure is equipped with compression spring on the mount, still be provided with the rack on the hoisting frame, fixed mounting has the rack on the rack, still be provided with the scale on the rack side, fixed mounting has hoisting motor on the mount, fixed mounting has the promotion pinion on hoisting motor's the output shaft, and ensure that hoisting pinion meshes with fixed mounting's rack on the rack, simultaneously, still fixed mounting has vision module on the mount, be used for the scale of calibration hoisting frame to ensure the motion accuracy of hoisting frame.
The feeding module is further covered and buckled with a connecting frame arranged on the lifting frame, a sliding frame is sleeved outside the connecting frame in a sliding mode, a small rack is fixedly and vertically arranged on the sliding frame, a servo motor is fixedly clamped on the connecting frame through a clamping block, a small gear is fixedly arranged on the output shaft of the servo motor, and the small gear is meshed with the small rack.
Further, get blowing module adopts the sleeve pipe design, specifically, fixedly connected with outside slide tube on the carriage, outside slide tube fixedly connected with unloading head, link fixedly connected with center tube, the slide tube slides on the lateral surface of center tube to the two keep the central line collineation, be provided with four sets of slide of equipartition on the outside four sides of center tube, the ball holder cartridge has a plurality of balls, the ball holder passes through the ball cartridge on the slide of center tube lateral surface, the ball holder passes through the fixing screw to be fixed from top to bottom, is provided with the adjustment frame through adjusting bolt in the inside of outside slide tube in the position of the ball that corresponds the ball holder, adjusting bolt screw on the slide tube, the adjustment frame keeps compressing tightly on the ball through adjusting bolt's degree of screwing.
Further, a hollow self-adhesive head is fixedly arranged on the bottom end head of the central tube of the material taking and placing module, a sealing film piece is arranged on the top end head of the central tube, and a piezoelectric ceramic piece is fixedly arranged on the sealing film piece.
Further, in order to realize the requirement of stably sucking the semiconductor patch, after the self-adhesive head sticks the semiconductor patch, the piezoelectric ceramic plate is lifted upwards, and negative pressure inside the central tube is formed by outwards protruding the sealing film plate, so that the semiconductor patch is further stably sucked.
By adopting the technical scheme, the semiconductor patch can be accurately and rapidly taken and placed, the vibration is small, the working efficiency is greatly improved, and the labor intensity and the error rate of manpower are reduced.
Drawings
Fig. 1 is a schematic diagram of the overall structure of the present invention.
Fig. 2 is a schematic structural diagram of a feeding module according to the present invention.
Fig. 3 is a schematic structural view of a lifting portion of the pick-and-place module according to the present invention.
Fig. 4 is a schematic structural view of a sliding portion of the pick-and-place module according to the present invention.
Fig. 5 is a schematic diagram of an explosion structure of the pick-and-place module of the present invention.
Description of the drawings: 1-a three-coordinate movement module; 2-a circuit board; 3-mounting rack; 4-a feeding motor; 5-a storage bin; 6-a feeding belt; 601-grooves; 7-lifting a motor; 701-lifting pinion; 8-a vision module; 9-lifting frames; 901-guiding track; 902-a rack; 10-impounding; 1001-compression spring; 11-a connecting frame; 12-a carriage; 1201—small racks; 13-clamping blocks; 14-a servo motor; 1401-pinion; 15-outer slide tube; 16-blanking head; 17-a central tube; 18-a ball cage; 19-adjusting the frame; 20-adjusting bolts; 21-a set screw; 22-balls; 23-sealing the film piece; 24-piezoelectric ceramic plate.
Detailed Description
The invention will be further described with reference to specific examples, illustrative examples and illustrations of which are provided herein to illustrate the invention, but are not to be construed as limiting the invention.
As shown in fig. 1 to 5, an automatic placement system for semiconductor patches adopts a modular design, and comprises a three-coordinate moving module 1, a circuit board 2, a feeding module and a material taking and placing module, wherein the three-coordinate moving module 1 adopts a linear motor to form a moving pair, and the circuit board 2 is fixedly clamped on a certain substrate.
The material loading module includes material loading mounting bracket 3, and fixed mounting has material loading motor 4 on the material loading mounting bracket 3, and material loading belt 6 is still installed to material loading mounting bracket 3 and is passed through belt pulley drive material loading belt 6 circulation and rotate, is provided with storage silo 5 directly over material loading belt 6, and the semiconductor paster is deposited to the inside pile, and material loading belt 6 is provided with the recess 601 that can hold the semiconductor paster.
The material taking and placing module comprises a fixed frame 4 arranged on a linear motor sliding block 101, the other lifting frame 9 is slidably arranged in a sliding groove of the fixed frame 4 through two guide rails 901, a rail 10 is fixedly arranged on the end head of the guide rails 901, a compression spring 1001 is arranged on the fixed frame 4 in a pressing mode, a rack 902 is further arranged on the lifting frame 9, a rack is fixedly arranged on the rack 902, a graduated scale is further arranged on the side face of the rack 902, a lifting motor 7 is fixedly arranged on the fixed frame 4, a lifting pinion 701 is fixedly arranged on an output shaft of the lifting motor 7, the lifting pinion 701 is meshed with the rack fixedly arranged on the rack 902, and meanwhile, a vision module 8 is fixedly arranged on the fixed frame 4 and used for calibrating scales of the lifting frame 9 to ensure the movement precision of the lifting frame 9.
The material taking and placing module further comprises a connecting frame 11 which is arranged on the lifting frame 9 in a buckling mode, a sliding frame 12 is sleeved outside the connecting frame 11 in a sliding mode, a small rack 1201 is fixedly and vertically arranged on the sliding frame 12, a servo motor 14 is fixedly clamped on the connecting frame 11 through a clamping block 13, a small gear 1401 is fixedly arranged on the output shaft head of the servo motor 14, and the small gear 1401 is meshed with the small rack 1201.
The material taking and placing module is designed by a sleeve, in particular, an outer sliding tube 15 is fixedly connected to a sliding frame 12, a discharging head 16 is fixedly connected to the outer sliding tube 15, a central tube 17 is fixedly connected to a connecting frame 11, the sliding tube 15 slides on the outer side face of the central tube 17, the central tubes are kept collinear, four groups of uniformly distributed slide ways are arranged on the outer side four faces of the central tube 17, a plurality of balls 22 are clamped to a ball retainer 18, the ball retainer 18 is clamped on the slide way on the outer side face of the central tube 17 through the balls 22, the ball retainer 18 is fixed up and down through fixing screws 21, an adjusting frame 19 is arranged at the position, corresponding to the balls 22 of the ball retainer 18, of the outer sliding tube 15 through adjusting bolts 20, the adjusting bolts 20 are screwed on the sliding tube 15, and the adjusting frame 19 is kept pressed on the balls 22 through the screwing degree of the adjusting bolts 20.
A hollow self-adhesive head 25 is fixedly arranged on the bottom end of the central tube 17 of the material taking and placing module, a sealing film piece 23 is arranged on the top end of the central tube 17, and a piezoelectric ceramic piece 24 is fixedly arranged on the sealing film piece 23.
In order to realize the requirement of stably sucking the semiconductor patch, after the self-adhesive head 25 sticks the semiconductor patch, the piezoelectric ceramic plate 24 is lifted upwards, and negative pressure inside the central tube 17 is formed by outwards protruding the sealing film piece 23, so that the semiconductor patch is further stably sucked.
When the invention is used for taking and placing materials, firstly, the lifting frame 9 is lifted by the lifting motor 7, then the central tube 17 is driven to be lifted by the connecting frame 11, then the semiconductor patch is stuck on the feeding belt 6 by the self-adhesive head 25, the semiconductor patch is moved to a designated position by the three-coordinate moving module 1, then the central tube 17 is put down by the lifting motor 7, so that the semiconductor patch is close to the position to be placed, then the sliding frame 12 is driven by the servo motor 14 to slide downwards, and further the semiconductor patch is placed on the corresponding position of the circuit board 2 by the external sliding tube 15, and the blanking head 16 is driven to press the semiconductor patch.
After the adhesive head 25 sticks the semiconductor patch, the piezoelectric ceramic plate 24 is lifted upwards, and negative pressure in the central tube 17 is formed by outwards protruding the sealing film piece 23, so that the semiconductor patch is further stably attracted.
Claims (4)
1. The utility model provides an automatic placement system of semiconductor paster adopts the modularized design, includes three-dimensional mobile module (1), circuit board (2), material loading module and gets blowing module, its characterized in that:
the three-coordinate moving module (1) adopts a linear motor to form a moving pair, and the circuit board (2) is fixedly clamped on a certain substrate;
the feeding module comprises a feeding installation frame (3), a feeding motor is fixedly installed on the feeding installation frame (3), a feeding belt (6) is further installed on the feeding installation frame (3) and driven by a belt pulley to circularly rotate, a storage bin (5) is arranged right above the feeding belt (6), semiconductor patches are stacked in the storage bin, and a groove (601) capable of containing the semiconductor patches is formed in the feeding belt (6);
the material taking and placing module comprises a fixing frame (4) arranged on a linear motor sliding block (101), the other lifting frame (9) is slidably arranged in a sliding groove of the fixing frame (4) through two guide rails (901), a rail (10) is fixedly arranged at the end of the guide rails (901), a compression spring (1001) is pressed on the fixing frame (4) by the rail (10), a rack (902) is further arranged on the lifting frame (9), a rack is fixedly arranged on the rack (902), a graduated scale is further arranged on the side surface of the rack (902), a lifting motor (7) is fixedly arranged on the fixing frame (4), a lifting pinion (701) is fixedly arranged on an output shaft of the lifting motor (7), the lifting pinion (701) is meshed with the rack fixedly arranged on the rack (902), and meanwhile, a vision module (8) is fixedly arranged on the fixing frame (4) and used for calibrating the graduation of the lifting frame (9) to ensure the movement precision of the lifting frame (9);
the material taking and placing module is further provided with a connecting frame (11) which is arranged on the lifting frame (9) in a covering mode, a sliding frame (12) is sleeved outside the connecting frame (11) in a sliding mode, a small rack (1201) is fixedly and vertically arranged on the sliding frame (12), a servo motor (14) is fixedly clamped on the connecting frame (11) through a clamping block (13), a small gear (1401) is fixedly arranged on the output shaft head of the servo motor (14), and the small gear (1401) is meshed with the small rack (1201).
2. The automatic placement system for semiconductor patches of claim 1, wherein the pick-and-place module is designed as a sleeve, and is characterized in that: the utility model provides a sliding frame (12) on fixedly connected with outside slide tube (15), outside slide tube (15) fixedly connected with unloading head (16), link (11) fixedly connected with center tube (17), slide tube (15) slip on the lateral surface of center tube (17) to the two keep the central line collineation, be provided with four sets of slide of equipartition on the outside four sides of center tube (17), ball holder (18) cartridge has a plurality of balls (22), ball holder (18) cartridge is on the slide of center tube (17) lateral surface through ball (22), ball holder (18) are fixed from top to bottom through set screw (21), be provided with adjustment frame (19) through adjusting bolt (20) in the inside of outside slide tube (15) in the position of ball (22) of corresponding ball holder (18), adjusting bolt (20) screw on slide tube (15), adjustment frame (19) keep compressing tightly on ball (22) through the degree of screwing of adjusting bolt (20).
3. An automated placement system for semiconductor patches as defined in claim 2, wherein: the bottom end of a central tube (17) of the material taking and placing module is fixedly provided with a hollow self-adhesive head (25), the top end of the central tube (17) is provided with a sealing film piece (23), and the sealing film piece (23) is fixedly provided with a piezoelectric ceramic piece (24).
4. A semiconductor patch automatic placement system as recited in claim 3, wherein: after the adhesive head (25) glues the semiconductor patch, the piezoelectric ceramic sheet (24) is lifted upwards, and negative pressure in the central tube (17) is formed by outwards protruding the sealing film sheet (23), so that the semiconductor patch is further stably attracted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911209821.5A CN111128801B (en) | 2019-12-01 | 2019-12-01 | Automatic placement system for semiconductor patches |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911209821.5A CN111128801B (en) | 2019-12-01 | 2019-12-01 | Automatic placement system for semiconductor patches |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111128801A CN111128801A (en) | 2020-05-08 |
| CN111128801B true CN111128801B (en) | 2024-04-05 |
Family
ID=70497121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911209821.5A Active CN111128801B (en) | 2019-12-01 | 2019-12-01 | Automatic placement system for semiconductor patches |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111128801B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2692830A1 (en) * | 1992-06-25 | 1993-12-31 | Kitenic Systeme Numerique Sarl | Linear guide module for the translation and handling of all parts and accessories. |
| KR20000009371A (en) * | 1998-07-23 | 2000-02-15 | 유무성 | Chip mounter head |
| CN105252251A (en) * | 2015-11-02 | 2016-01-20 | 西北工业大学 | Device and method for achieving automatic grabbing and accurate attaching of aircraft thermal insulation piece |
| WO2018006506A1 (en) * | 2016-07-07 | 2018-01-11 | 东莞市鸿企机械有限公司 | Fully automatic die-cutting device |
| CN108100640A (en) * | 2018-01-04 | 2018-06-01 | 泰山玻璃纤维有限公司 | The pinpoint chopped strand of view-based access control model goes up yarn system automatically |
| CN110381717A (en) * | 2019-06-20 | 2019-10-25 | 滕吉美 | A kind of semiconductor patch welding automatic placement equipment |
-
2019
- 2019-12-01 CN CN201911209821.5A patent/CN111128801B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2692830A1 (en) * | 1992-06-25 | 1993-12-31 | Kitenic Systeme Numerique Sarl | Linear guide module for the translation and handling of all parts and accessories. |
| KR20000009371A (en) * | 1998-07-23 | 2000-02-15 | 유무성 | Chip mounter head |
| CN105252251A (en) * | 2015-11-02 | 2016-01-20 | 西北工业大学 | Device and method for achieving automatic grabbing and accurate attaching of aircraft thermal insulation piece |
| WO2018006506A1 (en) * | 2016-07-07 | 2018-01-11 | 东莞市鸿企机械有限公司 | Fully automatic die-cutting device |
| CN108100640A (en) * | 2018-01-04 | 2018-06-01 | 泰山玻璃纤维有限公司 | The pinpoint chopped strand of view-based access control model goes up yarn system automatically |
| CN110381717A (en) * | 2019-06-20 | 2019-10-25 | 滕吉美 | A kind of semiconductor patch welding automatic placement equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111128801A (en) | 2020-05-08 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20240208 Address after: 518000, Building 501, Building B, 317 Huating Road, Langkou Community, Dalang Street, Longhua District, Shenzhen, Guangdong Province Applicant after: Shenzhen Jiawangda Technology Co.,Ltd. Country or region after: Zhong Guo Address before: No. 268 Beihuan Road, Haigang District, Qinhuangdao City, Hebei Province, 066004 Applicant before: Zhao Hanzhang Country or region before: Zhong Guo |
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