CN111128499A - Method for manufacturing anti-vulcanization sheet type thick film fixed resistor - Google Patents
Method for manufacturing anti-vulcanization sheet type thick film fixed resistor Download PDFInfo
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- CN111128499A CN111128499A CN201911359825.1A CN201911359825A CN111128499A CN 111128499 A CN111128499 A CN 111128499A CN 201911359825 A CN201911359825 A CN 201911359825A CN 111128499 A CN111128499 A CN 111128499A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
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Abstract
The invention provides a method for manufacturing an anti-sulfuration sheet type thick film fixed resistor, which comprises the following steps: finishing the processing of the resistance adjusting procedure of the product according to the production process of the conventional chip thick film fixed resistor; and then the product is obtained by mask printing, sputtering of nickel-chromium alloy, aging, secondary glass and mark printing, curing, primary cutting, end sealing, secondary cutting and surface treatment. Aiming at the problem that silver in the opposite electrode is vulcanized by the vulcanizing gas in the air, after the resistance of the sheet type thick film fixed resistor is adjusted, a layer of nickel-chromium alloy film is sputtered on the silver-palladium surface electrode by the magnetron sputtering technology, so that the vulcanization prevention effect of the sheet type thick film fixed resistor is achieved, the performance reliability of the product is improved, and the service life of the product is prolonged.
Description
Technical Field
The invention relates to an electronic component, in particular to a manufacturing method of an anti-vulcanization sheet type thick film fixed resistor.
Background
At present, with the development of electronic technology and military electronic components and the demand of miniaturization, lightening and high performance of modern weaponry, higher requirements are put forward on the performance reliability of electronic components, and a chip type thick film fixed resistor is taken as an important basic electronic component, is widely applied to surface mounting of small complete machine electronic equipment such as mobile communication, notebook computers, palm computers, automobile electronics and the like, and is also widely applied to circuits of military electronic complete machines such as aviation, aerospace, satellites, missiles, sea (earth) cables, communication and the like.
The surface electrode of the existing chip type thick film fixed resistor is generally made of silver-palladium alloy, the palladium content of the surface electrode of the common thick film chip resistor is about 0.5 percent, and the surface electrode is an internal electrode for connecting a resistor body and a welding end according to the structure of the chip type thick film fixed resistor. Because there is a trace gap between the secondary protective layer and the welding end, when the air contains a large amount of sulfuration gas, the sulfuration gas will contact with the inner electrode along the gap, and the silver is sulfuration reacted into silver sulfide. Since silver sulfide is non-conductive, the resistance value gradually increases as the electrode is sulfided until it eventually becomes an open circuit, resulting in a failure of the resistor. In actual practice, not only resistors used in chemical plants are vulcanized, but also resistors in mining and thermal power plants are in danger of being vulcanized, and even in some cases, resistance vulcanization is caused only by sulfur released at high temperature due to the use of sulfur-containing rubber and oil in a closed environment, so that vulcanization prevention of resistors is becoming increasingly important in automotive electronics.
The anti-sulfuration resistor is used for avoiding sulfuration of an inner electrode, the anti-sulfuration of the thick film chip resistor is generally carried out from two aspects, firstly, the secondary protection layer is covered on a bottom electrode by improving the design of a secondary protection coating layer, and the bottom electrode reaches a certain size, and a secondary protection layer can be easily covered on a Ni layer and a Sn-Pb layer during electroplating, so that a trace gap between the secondary protection layer and a welding end can be reduced, the invasion of sulfuration gas is avoided, and the anti-sulfuration capability of a product is improved; and secondly, from the material perspective, the content of palladium in the surface electrode Ag/Pd slurry is improved, the content of palladium is improved from 0.5 percent to more than 5 percent, and the electrical impedance sulfuration capability is improved due to the stability of palladium because of the improvement of the content of palladium in the slurry. The first method only reduces the gap between the secondary protective layer and the surface electrode, only slows down the vulcanization speed, and can not completely prevent vulcanization; the second method increases the material cost of the chip resistor by a large amount due to the increased content of noble metal palladium in the surface electrode paste.
Disclosure of Invention
The invention aims to provide a novel anti-vulcanization chip fixed resistor with strong anti-vulcanization capability and low manufacturing cost and a manufacturing method thereof.
In order to achieve the purpose, the technical scheme provided by the invention is as follows: the manufacturing method of the anti-sulfuration sheet type thick film fixed resistor comprises the following steps:
a. finishing the processing of the resistance adjusting procedure of the product according to the production process of the conventional chip thick film fixed resistor;
b. mask printing, namely selecting proper mask slurry, printing a layer of mask on the semi-finished product subjected to resistance adjustment by adopting a screen printing technology, covering the parts which do not need sputtering, and only reserving a surface electrode silver layer;
c. sputtering the nickel-chromium alloy, namely putting the semi-finished product printed with the mask into a magnetron sputtering machine for sputtering, cleaning and drying the mask by using ultrasonic waves after sputtering, forming a nickel-chromium alloy film on the surface of the silver electrode, and then aging to stabilize the nickel-chromium alloy film;
d. and (4) post-process manufacturing, namely, sequentially carrying out secondary glass and mark printing, curing, primary cutting, end sealing, secondary cutting, surface treatment and other post-process processing on the aged product according to the original processing technology of the chip thick film fixed resistor.
The resistance adjusting procedure in the step a comprises the following specific processing procedures: and (3) measuring the resistance of the product on a workbench of a resistance trimming machine by using a probe card, and then cutting the product by using laser to continuously increase the resistance of the product until the resistance of the product reaches the required range.
And step b, adopting I-9760 glass slurry as mask slurry, wherein the main components of the slurry are glass powder, resin carrier and solvent.
The sputtering technological parameters of the step c are as follows: sputtering for 20 minutes, sputtering current of 3A, working vacuum of 0.4 to 0.7Pa, aging for 1 to 3 hours, and aging temperature of 300 to 350 ℃;
d, printing secondary glass and marks: printing pressure is 2.5 +/-1 Kg, and screen release height is as follows: 0.75 ± 0.2mm, printing speed: 90 plus or minus 30 mm/S;
secondary glass and mark curing: the curing temperature is 200 +/-10 ℃, and the curing time is 30 min;
primary segmentation: pressure of 0.1 to 0.5MPa, and motor speed of 5 to 40
End capping: sputtering time is 15min, sputtering current is 3A, and working vacuum is 0.4 to 0.7 Pa;
and (3) secondary segmentation: the pressure is 0.1 to 0.5MPa, and the rotating speed of the motor is 5 to 40 r/min;
surface treatment: the nickel plating time is 100min, the tin plating time is 60min, the nickel plating current is 22 to 30A, and the tin plating current is 7 to 13A.
Aiming at the problem that silver in the opposite electrode is vulcanized by sulfuration gas in the air, after resistance adjustment, namely before printing a secondary protective layer, the chip thick film fixed resistor is sputtered with a nickel-chromium alloy film on the silver-palladium surface electrode by a magnetron sputtering technology, the main component of the film is nickel-chromium alloy which can not react with sulfuration gas in the air and can protect the silver-palladium surface electrode, so that the sulfuration prevention effect of the chip thick film fixed resistor is achieved, the performance reliability of a product is improved, and the service life of the product is prolonged.
Drawings
Fig. 1 is a schematic diagram of a fixed resistor structure according to the present invention.
Detailed Description
The invention will be further described with reference to the accompanying drawings, in which preferred embodiments of the invention are: referring to fig. 1, the method for manufacturing the anti-sulfuration sheet type thick film fixed resistor according to the embodiment is characterized in that: it comprises the following steps:
a. finishing the processing of the resistance adjusting procedure of the product according to the production process of the conventional chip thick film fixed resistor; the specific processing process of the resistance adjusting procedure comprises the following steps: and (3) measuring the resistance of the product on a workbench of a resistance trimming machine by using a probe card, and then cutting the product by using laser to continuously increase the resistance of the product until the resistance of the product reaches the required range.
b. Mask printing, namely selecting proper mask slurry, printing a layer of mask on the semi-finished product subjected to resistance adjustment by adopting a screen printing technology, covering the parts which do not need sputtering, and only reserving a surface electrode silver layer; the I-9760 glass slurry is used as a mask slurry, and the main components of the slurry are glass powder, a resin carrier and a solvent.
c. Sputtering the nickel-chromium alloy, namely putting the semi-finished product printed with the mask into a magnetron sputtering machine for sputtering, cleaning and drying the mask by using ultrasonic waves after sputtering, forming a nickel-chromium alloy film on the surface of the silver electrode, and then aging to stabilize the nickel-chromium alloy film; the parameters of the sputtering process are as follows: sputtering for 20 minutes, sputtering current of 3A, working vacuum of 0.4 to 0.7Pa, aging for 1 to 3 hours, and aging temperature of 300 to 350 ℃;
d. the post-process manufacturing, namely sequentially carrying out secondary glass and mark printing, curing, primary cutting, end sealing, secondary cutting, surface treatment and other post-process processing on the aged product; wherein the content of the first and second substances,
secondary glass and mark printing: printing pressure is 2.5 +/-1 Kg, and screen release height is as follows: 0.75 ± 0.2mm, printing speed: 90 plus or minus 30 mm/S;
secondary glass and mark curing: the curing temperature is 200 +/-10 ℃, and the curing time is 30 min;
primary segmentation: pressure of 0.1 to 0.5MPa, and motor speed of 5 to 40
End capping: sputtering time is 15min, sputtering current is 3A, and working vacuum is 0.4 to 0.7 Pa;
and (3) secondary segmentation: the pressure is 0.1 to 0.5MPa, and the rotating speed of the motor is 5 to 40 r/min;
surface treatment: the nickel plating time is 100min, the tin plating time is 60min, the nickel plating current is 22 to 30A, and the tin plating current is 7 to 13A.
The fixed resistor prepared according to the process comprises a ceramic substrate 1, a back electrode 2, a surface electrode 3, a nickel-chromium isolation layer 4, a resistor body 5, a primary glass layer 6, a secondary glass layer 7, a nickel plating layer 8, a tin plating layer 9 and a terminal electrode 10, wherein the back electrode 2 is arranged at the bottom of the ceramic substrate 1, the terminal electrode 10 is arranged at the end part of the ceramic substrate 1, the resistor body 5 is arranged at the center of the surface of the ceramic substrate 1, the surface of the ceramic substrate 1 at the edge of the resistor body 5 is provided with the surface electrode 3, the surface of the surface electrode 3 is provided with the nickel-chromium isolation layer 4, the surface of the resistor body 5 is sequentially covered with the primary glass layer 6 and the secondary glass layer 7 from bottom to top, and the back electrode 2, the terminal electrode 10, the nickel-chromium isolation layer.
Aiming at the problem that silver in an opposite electrode is vulcanized by sulfuration gas in the air, after resistance adjustment of a sheet type thick film fixed resistor, namely before printing a secondary protective layer, a nickel-chromium alloy film is sputtered on a silver-palladium surface electrode by a magnetron sputtering technology, the main component of the film is nickel-chromium alloy which cannot react with sulfuration gas in the air and plays a role in protecting the silver-palladium surface electrode, so that the sulfuration prevention effect of the sheet type thick film fixed resistor is achieved, the performance reliability of a product is improved, and the service life of the product is prolonged.
Claims (5)
1. The manufacturing method of the anti-vulcanization sheet type thick film fixed resistor is characterized by comprising the following steps of: it comprises the following steps:
a. finishing the processing of the resistance adjusting procedure of the product according to the production process of the conventional chip thick film fixed resistor;
b. mask printing, namely selecting proper mask slurry, printing a layer of mask on the semi-finished product subjected to resistance adjustment by adopting a screen printing technology, covering the parts which do not need sputtering, and only reserving a surface electrode silver layer;
c. sputtering the nickel-chromium alloy, namely putting the semi-finished product printed with the mask into a magnetron sputtering machine for sputtering, cleaning and drying the mask by using ultrasonic waves after sputtering, forming a nickel-chromium alloy film on the surface of the silver electrode, and then aging to stabilize the nickel-chromium alloy film;
d. and (4) performing post-process manufacturing, namely sequentially performing secondary glass and mark printing, curing, primary cutting, end sealing, secondary cutting and surface treatment on the aged product.
2. The method of manufacturing an anti-sulfuration sheet type thick film fixed resistor according to claim 1, wherein: the resistance adjusting procedure in the step a comprises the following specific processing procedures: and (3) measuring the resistance of the product on a workbench of a resistance trimming machine by using a probe card, and then cutting the product by using laser to continuously increase the resistance of the product until the resistance of the product reaches the required range.
3. The method of manufacturing an anti-sulfuration sheet type thick film fixed resistor according to claim 1, wherein: and step b, adopting I-9760 glass slurry as mask slurry, wherein the main components of the slurry are glass powder, resin carrier and solvent.
4. The method of manufacturing an anti-sulfuration sheet type thick film fixed resistor according to claim 1, wherein: the sputtering technological parameters of the step c are as follows: sputtering for 20 min, sputtering current of 3A, working vacuum of 0.4-0.7 Pa, aging time of 1-3 h, and aging temperature of 300-350 deg.C.
5. The method of manufacturing an anti-sulfuration sheet type thick film fixed resistor according to claim 1, wherein: d, printing secondary glass and marks: printing pressure is 2.5 +/-1 Kg, and screen release height is as follows: 0.75 ± 0.2mm, printing speed: 90 plus or minus 30 mm/S;
secondary glass and mark curing: the curing temperature is 200 +/-10 ℃, and the curing time is 30 min;
primary segmentation: pressure of 0.1 to 0.5MPa, and motor speed of 5 to 40
End capping: sputtering time is 15min, sputtering current is 3A, and working vacuum is 0.4 to 0.7 Pa;
and (3) secondary segmentation: the pressure is 0.1 to 0.5MPa, and the rotating speed of the motor is 5 to 40 r/min;
surface treatment: the nickel plating time is 100min, the tin plating time is 60min, the nickel plating current is 22 to 30A, and the tin plating current is 7 to 13A.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201911359825.1A CN111128499A (en) | 2019-12-25 | 2019-12-25 | Method for manufacturing anti-vulcanization sheet type thick film fixed resistor |
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| CN201911359825.1A CN111128499A (en) | 2019-12-25 | 2019-12-25 | Method for manufacturing anti-vulcanization sheet type thick film fixed resistor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113871117A (en) * | 2021-09-29 | 2021-12-31 | 东莞市东思电子技术有限公司 | Low-cost long-life thick-film resistor plate for oil level sensor and manufacturing method thereof |
| CN115295262A (en) * | 2022-07-14 | 2022-11-04 | 捷群电子科技(淮安)有限公司 | Anti-vulcanization thick film sheet type fixed resistor and use method thereof |
| CN115762938A (en) * | 2022-11-28 | 2023-03-07 | 北京东方计量测试研究所 | Metal foil resistor comprehensive performance improvement method and metal foil resistor |
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| CN109872925A (en) * | 2017-12-02 | 2019-06-11 | 中国振华集团云科电子有限公司 | A kind of appearance packaging printing process of JF chip fuse |
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2019
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Patent Citations (5)
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113871117A (en) * | 2021-09-29 | 2021-12-31 | 东莞市东思电子技术有限公司 | Low-cost long-life thick-film resistor plate for oil level sensor and manufacturing method thereof |
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| CN115762938A (en) * | 2022-11-28 | 2023-03-07 | 北京东方计量测试研究所 | Metal foil resistor comprehensive performance improvement method and metal foil resistor |
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Application publication date: 20200508 |