CN111710488B - Preparation method of chip precision resistor - Google Patents
Preparation method of chip precision resistor Download PDFInfo
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- CN111710488B CN111710488B CN202010570206.3A CN202010570206A CN111710488B CN 111710488 B CN111710488 B CN 111710488B CN 202010570206 A CN202010570206 A CN 202010570206A CN 111710488 B CN111710488 B CN 111710488B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 238000007639 printing Methods 0.000 claims abstract description 51
- 238000012360 testing method Methods 0.000 claims abstract description 43
- 239000011521 glass Substances 0.000 claims abstract description 33
- 239000002002 slurry Substances 0.000 claims abstract description 27
- 238000005245 sintering Methods 0.000 claims abstract description 22
- 238000005520 cutting process Methods 0.000 claims abstract description 14
- 239000002245 particle Substances 0.000 claims abstract description 12
- 230000035939 shock Effects 0.000 claims abstract description 10
- 238000007789 sealing Methods 0.000 claims abstract description 9
- 238000009954 braiding Methods 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims abstract description 6
- 238000004806 packaging method and process Methods 0.000 claims abstract description 6
- 238000004381 surface treatment Methods 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 18
- 230000000704 physical effect Effects 0.000 claims description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 238000010998 test method Methods 0.000 claims description 8
- 238000007650 screen-printing Methods 0.000 claims description 6
- 238000009707 resistance sintering Methods 0.000 claims description 5
- 230000007797 corrosion Effects 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000003487 electrochemical reaction Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 238000006479 redox reaction Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 238000009966 trimming Methods 0.000 claims description 3
- 238000011161 development Methods 0.000 abstract description 6
- 238000007581 slurry coating method Methods 0.000 abstract description 6
- 230000010354 integration Effects 0.000 abstract description 5
- 206010063385 Intellectualisation Diseases 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000007711 solidification Methods 0.000 abstract description 3
- 230000008023 solidification Effects 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 17
- 230000018109 developmental process Effects 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 230000011218 segmentation Effects 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000011895 specific detection Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/30—Apparatus or processes specially adapted for manufacturing resistors adapted for baking
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
The invention discloses a method for preparing a chip type precision resistor, which comprises the steps of back electrode printing, surface electrode printing, electrode sintering, resistor printing, resistor sintering, I-time glass printing, one-time glass sintering, laser resistance adjustment, II-time glass printing, mark printing, solidification, end sealing cutting, surface treatment, testing, reliability test, braiding and packaging in sequence to complete the production and preparation of the chip type precision resistor, wherein in the preparation method, the end sealing cutting directly cuts a product into particles, two ends of the particle product form connection back and front electrodes during the first slurry coating, then the particle product is inserted into a slurry tank during the second slurry coating, so that the slurry can wrap the end around, metal layers are formed on five surfaces of the product, the end strength and the shock resistance of the product can be improved by replacing the prior art, the internal resistance of the end is reduced, and the concentration resistance of the resistor is improved, can meet the development trend of miniaturization, integration and intellectualization of the electronic complete machine.
Description
Technical Field
The invention particularly relates to a preparation method of a chip precision resistor.
Background
With the continuous development of 5G communication, automotive electronics, high-end medical electronics, aerospace, instruments and meters and industrial control, the market demand and the quality requirement of high-precision chip resistors are higher and higher, microminiaturization and ultrahigh resistance are main directions, and main technical indexes relate to resistance accuracy, working voltage, temperature coefficient, voltage coefficient, power coefficient, stability and the like. The traditional pin resistor and the common thick film chip resistor have the defects of large volume, materials, processes and the like, and can not meet the requirements of high-end electronic equipment, particularly military electronic equipment in the fields of aerospace, aviation, ships and weapons, so that the precise resistor which is small in volume, high in precision, stable and reliable for a long time is urgently needed to replace.
The prior art has the following defects:
1. the traditional winding resistor is large in physique and cannot meet the development trend of miniaturization, integration and intellectualization of an electronic complete machine;
2. the conventional thick film chip resistor has low end strength and poor shock resistance; the internal resistance of the end is large, and the resistance of the ultra-low resistance section is dispersed; the corrosion resistance is low. Can not meet the harsh requirement of military products on resisting severe environment.
Disclosure of Invention
In view of the above, the present invention provides a method for improving the strength and shock resistance of the terminal of the chip precision resistor, reducing the internal resistance of the terminal, and improving the concentration of the resistance value of the resistor, which can meet the development trend of miniaturization, integration, and intelligence of the electronic complete machine.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a preparation method of a chip precision resistor comprises the following steps:
step 2, printing a surface electrode: uniformly printing the slurry on the front surface (namely a groove scribing surface) of the substrate through the meshes of the silk screen by adopting a silk screen printer so as to obtain a required pattern with certain thickness and shape, and conducting and communicating the resistor body;
and 3, sintering the electrode: the electrode film layers on the back and the front are subjected to oxidation-reduction reaction by sintering at the high temperature of 850 ℃, so that the physical property and the electrical property are improved, a specific resistance value is formed, and the electrode film layers are well attached to the substrate and are not easy to fall off;
step 4, printing a resistor body: uniformly printing the prepared resistor paste with a specific resistance value between an upper electrode and a lower electrode through screen meshes by a screen printer so as to obtain a pattern with required thickness and shape, overlapping the upper electrodes at two ends, and overlapping the upper end and the lower end on the surface electrodes to form a resistor body with a specific resistance value;
and 5, resistance sintering: the physical property and the electrical property of the resistance film layer are improved by sintering at the high temperature of 850 ℃, a specific resistance value is formed, and the resistance film layer is well attached to the substrate and is not easy to fall off;
step 6, printing the glass I times: uniformly printing the slurry on the resistor body through the screen mesh by using a screen printer so as to obtain a pattern with required thickness and shape, covering the resistor body, preventing fine cracks from being generated on the resistor body when laser resistance adjustment is carried out, and ensuring the stability of resistance;
and 7, primary glass sintering: the glass film layer can reach the required physical property and electrical property by high-temperature sintering at 600 ℃, and is well adhered to the resistor body and is not easy to fall off;
step 8, laser resistance adjustment: the laser resistor trimming machine is adopted to perform laser dotting cutting to change the conductive section area of the resistor body, so that the chip resistor and the network resistor which are lower than the target resistance value are adjusted to be within the allowable deviation range of the target resistance value, and the product is ensured to meet the resistance value precision requirement required by a customer;
step 9, printing the glass II times: uniformly printing the slurry on the I-time glass through screen meshes by using a screen printing machine so as to obtain a pattern with required thickness and shape, covering the I-time glass and the resistor body, protecting the resistor body from being damaged, and improving the moisture resistance, corrosion resistance and insulation performance of the product;
step 11, curing: curing for 30 minutes at the temperature of 200 ℃ to ensure that the secondary glass and the marking film layer reach the required physical property and electrical property, and preserving the heat for 30 minutes at the peak value of 200 ℃;
step 12, cutting and end sealing: firstly, cutting the product solidified in the step 11 into strips by using a one-in-one and two-in-one machine, then cutting the blocky substrate into strips for the second time to form granular products, coating silver paste on two ends of the product by using a terminal capping machine to form end electrodes, connecting back and front electrodes, inserting the product into a slurry tank, so that the slurry can wrap the ends all around, and forming metal layers on five surfaces of the product;
step 13, surface treatment: covering a uniform nickel layer and a uniform tin layer on the electrode and the end head of the resistor chip after being divided into particles according to the principle of electrochemical reaction, wherein the thickness of the nickel layer is 3-4um and the nickel layer is used as a thermal barrier layer to ensure the thermal shock resistance of the product; the thickness of the tin layer is 3-5um, and the tin layer has good weldability so as to ensure that the product has good contact with an external circuit;
step 14, testing: sorting the surface-treated resistors according to appearance, testing resistance by adopting a full-automatic resistance testing machine, and removing unqualified products;
step 15, according to the product quality grade or technical protocol requirements provided by the client, completing the reliability test according to the requirements of the national military standard GJB 360B-2009 test method, which comprises the following specific steps: performing soldering installation according to 4.5.1.3a in GJB 1432B-2009, fixing the chip resistor in the middle of the test substrate, applying a force of 10-30N by a push rod for 30S, and finally checking whether the resistor has mechanical damage or not and rejecting unqualified products;
step 16, braiding: products which are qualified through testing and qualified through reliability testing are quickly filled into paper tape/adhesive tape holes and wound into a disc to form a finished product of the resistance braid after being further detected by a resistance tester and an appearance detector through a high-speed braider under the condition of meeting the requirements of customers;
step 17, packaging: and (5) loading the resistance finished product braided in the step (17) into a carton according to requirements, and attaching a factory inspection report.
Further, the width of the push rod in the step 15 should be 30% -70% of the length of the resistor.
The technical effects of the invention are mainly reflected in the following aspects: the production and preparation of the chip type precision resistor are completed by the steps of back electrode printing, face electrode printing, electrode sintering, resistor printing, resistance sintering, I-time glass printing, one-time glass sintering, laser resistance adjustment, II-time glass printing, mark printing, solidification, segmentation end sealing, surface treatment, testing, reliability test, braiding and packaging in sequence, in the preparation method, the segmentation end sealing directly segments the product into particles, two ends of the particle product form a connection back face electrode and a front face electrode during first slurry coating, and the particle product is inserted into a slurry tank during second slurry coating, so that the slurry can wrap the end around, metal layers are formed on five faces of the product, the existing process can be replaced, the strength and the shock resistance of the end of the product can be improved, the internal resistance of the end can be reduced, the concentration of the resistance of the end can be improved, and the miniaturization of an electronic whole machine can be met, The development trend of integration and intellectualization.
Drawings
FIG. 1 is a schematic view of the step 15 installation fixture of the present invention;
FIG. 2 is a table showing the force applied for securing the solder mounting in step 15.
Detailed Description
The embodiments of the present invention are described in further detail to make the technical solutions of the present invention easier to understand and master.
Examples
A preparation method of a chip precision resistor comprises the following steps:
step 2, printing a surface electrode: uniformly printing the slurry on the front surface (namely a groove scribing surface) of the substrate through the meshes of the silk screen by adopting a silk screen printer so as to obtain a required pattern with certain thickness and shape, and conducting and communicating the resistor body;
and 3, sintering the electrode: the electrode film layers on the back and the front are subjected to oxidation-reduction reaction by sintering at the high temperature of 850 ℃, so that the physical property and the electrical property are improved, a specific resistance value is formed, and the electrode film layers are well attached to the substrate and are not easy to fall off;
step 4, printing a resistor body: uniformly printing the prepared resistor paste with a specific resistance value between an upper electrode and a lower electrode through screen meshes by a screen printer so as to obtain a pattern with required thickness and shape, overlapping the upper electrodes at two ends, and overlapping the upper end and the lower end on the surface electrodes to form a resistor body with a specific resistance value;
and 5, resistance sintering: the physical property and the electrical property of the resistance film layer are improved by sintering at the high temperature of 850 ℃, a specific resistance value is formed, and the resistance film layer is well attached to the substrate and is not easy to fall off;
step 6, printing the glass I times: uniformly printing the slurry on the resistor body through the screen mesh by using a screen printer so as to obtain a pattern with required thickness and shape, covering the resistor body, preventing fine cracks from being generated on the resistor body when laser resistance adjustment is carried out, and ensuring the stability of resistance;
and 7, primary glass sintering: the glass film layer can reach the required physical property and electrical property by high-temperature sintering at 600 ℃, and is well adhered to the resistor body and is not easy to fall off;
step 8, laser resistance adjustment: the laser resistor trimming machine is adopted to perform laser dotting cutting to change the conductive section area of the resistor body, so that the chip resistor and the network resistor which are lower than the target resistance value are adjusted to be within the allowable deviation range of the target resistance value, and the product is ensured to meet the resistance value precision requirement required by a customer;
step 9, printing the glass II times: uniformly printing the slurry on the I-time glass through screen meshes by using a screen printing machine so as to obtain a pattern with required thickness and shape, covering the I-time glass and the resistor body, protecting the resistor body from being damaged, and improving the moisture resistance, corrosion resistance and insulation performance of the product;
step 11, curing: curing for 30 minutes at the temperature of 200 ℃ to ensure that the secondary glass and the marking film layer reach the required physical property and electrical property, and preserving the heat for 30 minutes at the peak value of 200 ℃;
step 12, cutting and end sealing: firstly, cutting the product solidified in the step 11 into strips by using a one-in-one and two-in-one machine, then cutting the blocky substrate into strips for the second time to form granular products, coating silver paste on two ends of the product by using a terminal capping machine to form end electrodes, connecting back and front electrodes, inserting the product into a slurry tank, so that the slurry can wrap the ends all around, and forming metal layers on five surfaces of the product;
step 13, surface treatment: covering a uniform nickel layer and a uniform tin layer on the electrode and the end head of the resistor chip after being divided into particles according to the principle of electrochemical reaction, wherein the thickness of the nickel layer is 3-4um and the nickel layer is used as a thermal barrier layer to ensure the thermal shock resistance of the product; the thickness of the tin layer is 3-5um, and the tin layer has good weldability so as to ensure that the product has good contact with an external circuit;
step 14, testing: sorting the surface-treated resistors according to appearance, testing resistance by adopting a full-automatic resistance testing machine, and removing unqualified products;
step 15, according to the product quality grade or technical protocol requirements provided by the client, completing the reliability test according to the requirements of the national military standard GJB 360B-2009 test method, which comprises the following specific steps: performing soldering installation according to the specification of 4.5.1.3a in GJB 1432B-2009, fixing the chip resistor 1 in the middle of the test substrate 2, applying a force of 10-30N by using the push rod 3 for 30S, and finally checking whether the resistor has mechanical damage or not and rejecting unqualified products;
step 16, braiding: products which are qualified through testing and qualified through reliability testing are quickly filled into paper tape/adhesive tape holes and wound into a disc to form a finished product of the resistance braid after being further detected by a resistance tester and an appearance detector through a high-speed braider under the condition of meeting the requirements of customers;
step 17, packaging: and (5) loading the resistance finished product braided in the step (17) into a carton according to requirements, and attaching a factory inspection report.
In this embodiment, the width of the push rod in step 15 should be 30% -70% of the length of the resistor, and the applied pushing force should conform to the specifications of the table in fig. 2.
The specific detection mode is as follows: the chip resistor specification is specified by Q/FH20026A-2016, and a screening test scheme is specifically carried out according to the following table:
4.2.3: temperature shock
Tests were performed according to 3.3.2 of QZJ840629, but with high precision thick and thin film resistances of-650-5 deg.C-150 deg.C + 4-0 deg.C and alloy resistances of-650-5 deg.C-150 deg.C + 4-0 deg.C.
4.2.4: short time overload
The test was performed as 3.3.3 in QZJ 840629.
4.2.5: high temperature storage
The 100% test was performed under the following conditions:
a) the test temperature is 125+ 4-0 ℃, but the high-precision thick film resistor and thin film resistor are 150+ 4-0 ℃, and the alloy resistor is 170+ 4-0 ℃.
b) The test time is 48 +/-4 h, but the high-precision thick film resistance, thin film resistance and alloy resistance of the product are 100 +/-4 h.
4.2.6: under normal temperature
The 100% test was performed under the following conditions:
a) the test temperature is 25 +/-5 ℃;
b) relative humidity of 93 plus or minus 3 percent;
c) test time 48 hours.
4.2.7: working at low temperatures
The 100% test was performed under the following conditions:
a) the test temperature is-550-5 ℃, but the high-precision thick film resistance, thin film resistance and alloy resistance are-650-5 ℃;
b) the test time is 45 min;
c) test voltage UR。
3.6: temperature shock
After the test of the test method 4.2.3, the product should have no visible damage.
3.7: short time overload
After the test of the test method of 4.2.4, the product should not have the phenomena of mechanical damage such as paint layer cracking, uncapping, porcelain body fracture and the like, arcing, burning and the like, and the allowable resistance value change is less than or equal to +/-2 percent.
3.8: high temperature storage
After the test of the test method 4.2.5, the product should have no visible damage.
3.9: under normal temperature
The product should have no visible damage after the 4.2.6 test method.
3.10: working at low temperatures
The product should have no visible damage after the 4.2.7 test method.
The sampling scheme is shown in the following table:
the technical effects of the invention are mainly reflected in the following aspects: the production and preparation of the chip type precision resistor are completed by the steps of back electrode printing, face electrode printing, electrode sintering, resistor printing, resistance sintering, I-time glass printing, one-time glass sintering, laser resistance adjustment, II-time glass printing, mark printing, solidification, segmentation end sealing, surface treatment, testing, reliability test, braiding and packaging in sequence, in the preparation method, the segmentation end sealing directly segments the product into particles, two ends of the particle product form a connection back face electrode and a front face electrode during first slurry coating, and the particle product is inserted into a slurry tank during second slurry coating, so that the slurry can wrap the end around, metal layers are formed on five faces of the product, the existing process can be replaced, the strength and the shock resistance of the end of the product can be improved, the internal resistance of the end can be reduced, the concentration of the resistance of the end can be improved, and the miniaturization of an electronic whole machine can be met, The development trend of integration and intellectualization.
The above are only typical examples of the present invention, and besides, the present invention may have other embodiments, and all the technical solutions formed by equivalent substitutions or equivalent changes are within the scope of the present invention as claimed.
Claims (2)
1. A preparation method of a chip precision resistor is characterized by comprising the following steps:
step 1, back electrode printing: uniformly printing the slurry on the back of the substrate through the meshes of the silk screen by using a silk screen printing machine so as to obtain a back electrode pattern with a certain thickness and shape, wherein the back electrode pattern is used for attaching a product on a circuit board;
step 2, printing a surface electrode: uniformly printing the slurry on the front surface of the substrate through the meshes of the silk screen by using a silk screen printing machine so as to obtain a required pattern with a certain thickness and shape, and conducting and communicating the resistor body;
and 3, sintering the electrode: the electrode film layers on the back and the front are subjected to oxidation-reduction reaction by sintering at the high temperature of 850 ℃, so that the physical property and the electrical property are improved, a specific resistance value is formed, and the electrode film layers are well attached to the substrate and are not easy to fall off;
step 4, printing a resistor body: uniformly printing the prepared resistor paste with a specific resistance value between an upper electrode and a lower electrode through screen meshes by a screen printer so as to obtain a pattern with required thickness and shape, overlapping the upper electrodes at two ends, and overlapping the upper end and the lower end on the surface electrodes to form a resistor body with a specific resistance value;
and 5, resistance sintering: the physical property and the electrical property of the resistance film layer are improved by sintering at the high temperature of 850 ℃, a specific resistance value is formed, and the resistance film layer is well attached to the substrate and is not easy to fall off;
step 6, printing the glass I times: uniformly printing the slurry on the resistor body through the screen mesh by using a screen printer so as to obtain a pattern with required thickness and shape, covering the resistor body, preventing fine cracks from being generated on the resistor body when laser resistance adjustment is carried out, and ensuring the stability of resistance;
and 7, primary glass sintering: the glass film layer can reach the required physical property and electrical property by high-temperature sintering at 600 ℃, and is well adhered to the resistor body and is not easy to fall off;
step 8, laser resistance adjustment: the laser resistor trimming machine is adopted to perform laser dotting cutting to change the conductive section area of the resistor body, so that the chip resistor and the network resistor which are lower than the target resistance value are adjusted to be within the allowable deviation range of the target resistance value, and the product is ensured to meet the resistance value precision requirement required by a customer;
step 9, printing the glass II times: uniformly printing the slurry on the I-time glass through screen meshes by using a screen printing machine so as to obtain a pattern with required thickness and shape, covering the I-time glass and the resistor body, protecting the resistor body from being damaged, and improving the moisture resistance, corrosion resistance and insulation performance of the product;
step 10, marking: uniformly printing the slurry on the glass for the second time by adopting a screen printing machine through screen meshes so as to obtain a code of a required resistance value and distinguish the resistance value of the resistor;
step 11, curing: curing for 30 minutes at the temperature of 200 ℃ to ensure that the secondary glass and the marking film layer reach the required physical property and electrical property, and preserving the heat for 30 minutes at the peak value of 200 ℃;
step 12, cutting and end sealing: firstly, cutting the product solidified in the step 11 into strips by using a one-in-one and two-in-one machine, then cutting the blocky substrate into strips for the second time to form granular products, coating silver paste on two ends of the product by using a terminal capping machine to form end electrodes, connecting back and front electrodes, inserting the product into a slurry tank, so that the slurry can wrap the ends all around, and forming metal layers on five surfaces of the product;
step 13, surface treatment: covering a uniform nickel layer and a uniform tin layer on the electrode and the end head of the resistor chip after being divided into particles according to the principle of electrochemical reaction, wherein the thickness of the nickel layer is 3-4um and the nickel layer is used as a thermal barrier layer to ensure the thermal shock resistance of the product; the thickness of the tin layer is 3-5um, and the tin layer has good weldability so as to ensure that the product has good contact with an external circuit;
step 14, testing: sorting the surface-treated resistors according to appearance, testing resistance by adopting a full-automatic resistance testing machine, and removing unqualified products;
step 15, according to the product quality grade or technical protocol requirements provided by the client, completing the reliability test according to the requirements of the national military standard GJB 360B-2009 test method, which comprises the following specific steps: performing soldering installation according to 4.5.1.3a in GJB 1432B-2009, fixing the chip resistor in the middle of the test substrate, applying a force of 10-30N by a push rod for 30S, and finally checking whether the resistor has mechanical damage or not and rejecting unqualified products;
step 16, braiding: products which are qualified through testing and qualified through reliability testing are quickly filled into paper tape/adhesive tape holes and wound into a disc to form a finished product of the resistance braid after being further detected by a resistance tester and an appearance detector through a high-speed braider under the condition of meeting the requirements of customers;
step 17, packaging: and (5) loading the resistance finished product braided in the step (17) into a carton according to requirements, and attaching a factory inspection report.
2. The method for preparing a chip precision resistor according to claim 1, characterized in that: the width of the push rod in step 15 should be 30% -70% of the length of the resistor.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US11875924B2 (en) | 2022-04-13 | 2024-01-16 | Yageo Corporation | Method of fabricating resistor in igniter |
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| CN1909122A (en) * | 2006-08-08 | 2007-02-07 | 深圳顺络电子股份有限公司 | Multiple field sheet type piezoresistor and its producing method |
| CN101593589A (en) * | 2009-04-30 | 2009-12-02 | 中国振华集团云科电子有限公司 | The manufacture method of JANS plate type thick film resistor |
| CN102687211A (en) * | 2009-12-17 | 2012-09-19 | 兴亚株式会社 | Mounting structure of electronic component |
| CN107785138A (en) * | 2016-08-26 | 2018-03-09 | E.I.内穆尔杜邦公司 | Chip resistor |
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2020
- 2020-06-21 CN CN202010570206.3A patent/CN111710488B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1909122A (en) * | 2006-08-08 | 2007-02-07 | 深圳顺络电子股份有限公司 | Multiple field sheet type piezoresistor and its producing method |
| CN101593589A (en) * | 2009-04-30 | 2009-12-02 | 中国振华集团云科电子有限公司 | The manufacture method of JANS plate type thick film resistor |
| CN102687211A (en) * | 2009-12-17 | 2012-09-19 | 兴亚株式会社 | Mounting structure of electronic component |
| CN107785138A (en) * | 2016-08-26 | 2018-03-09 | E.I.内穆尔杜邦公司 | Chip resistor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11875924B2 (en) | 2022-04-13 | 2024-01-16 | Yageo Corporation | Method of fabricating resistor in igniter |
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| CN111710488A (en) | 2020-09-25 |
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