CN105070442A - Encapsulation method for chip thick-film fixed resistor - Google Patents
Encapsulation method for chip thick-film fixed resistor Download PDFInfo
- Publication number
- CN105070442A CN105070442A CN201510437510.XA CN201510437510A CN105070442A CN 105070442 A CN105070442 A CN 105070442A CN 201510437510 A CN201510437510 A CN 201510437510A CN 105070442 A CN105070442 A CN 105070442A
- Authority
- CN
- China
- Prior art keywords
- low
- printing
- temperature
- fixed resistor
- film fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The invention provides an encapsulation method for a chip thick-film fixed resistor. The method comprises the following steps: (1) preparing a low-temperature resin encapsulating material and a curing agent matched with the low-temperature resin encapsulating material, and mixing and burdening the low-temperature resin encapsulating material and the curing agent; (2) putting a to-be-printed silk screen on a silk-screen printing machine, and preparing for initial counterpoint printing; (3) putting the low-temperature resin encapsulating material stirred in the step (1) in front of a pulp pusher above a silk screen; (4) setting related parameters of the silk-screen printing machine; (5) carrying out repeated printing twice; and (6) putting a substrate which is printed and encapsulated on the silk-screen printing machine on a chain of a drying furnace, and drying the substrate in the drying furnace. According to the encapsulation method, the problem of lead content in the original material is solved by the low-temperature resin encapsulating material; meanwhile, low-temperature curing is adopted by the curing process of the material; the resistance value stability of a resistance film is guaranteed; the problem of resistance value drift is reduced; and the cured low-temperature resin encapsulating material is relatively good in appearance.
Description
Technical field
The present invention relates to the manufacture method of chip thick film fixed resistor, be specifically related to a kind of encapsulating method of chip thick film fixed resistor.
Background technology
The high temperature packaging slurry system that chip thick film fixed resistor uses is all leaded, do not meet the requirement of ROHS environmental regulation, simultaneously due to will high temperature sintering be carried out, inevitably produce certain resistance drift after sintering, especially considerable influence is produced to the resistance qualification rate of high-precision product.The behaviour in service of high temperature encapsulating material is not ideal, easily occurs irregular cavity, cause serious open defect by the surface sintering rear vitreous body.At present, the situation that plate resistor manufacturing ubiquity is such, its negative effect brought is resistance drift and open defect.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of encapsulating method of chip thick film fixed resistor.
The present invention is achieved by the following technical programs.
The encapsulating method of a kind of chip thick film fixed resistor provided by the invention, comprises the following steps:
(1) prepare low-temperature resins encapsulating material, prepare curing agent supporting with it simultaneously; And carry out mix according to the proportioning that curing agent accounts for 8% ~ 15%, fully stir 20 ~ 45 minutes after slurry mixing;
(2) silk screen to be printed is positioned on screen process press, prepares just contraposition printing;
(3) the low-temperature resins packaging slurry be stirred in step (1) is put into the front pushing away slurry device above silk screen, prepare to carry out silk screen printing;
(4) the wire mark head pressure of screen process press is 2.0kg ~ 3.5kg, and silk screen printing speed is 80mm/S ~ 150mm/S, and snap-off-distance is 0.8mm ~ 1.5mm, and pushing away slurry device speed is 80mm/S; The speed pushing away slurry device refers to that silk screen printing covers the speed of slurry again, usually consistent with the speed of silk screen printing.
(5) repeat print twice, and period only drying oven;
(6) carrier of being undertaken the printing of by the resistor that printing on screen process press has been encapsulated is placed on the chain of drying oven, and at drying oven inner drying;
(7) whether the substrate after checking dry completing has figure deformation or does not dry phenomenon, and qualified product then proceed to next procedure and continue subsequent operations.
The slurry of mixing in described step (1) is placed after 10 ~ 25 minutes minutes and is used on the machine.
In described step (2), the order number of printing screen is 250 ~ 325 orders.
The amount being positioned over the low-temperature resins packaging slurry pushing away slurry device front in described step (3) is 60 ~ 90g.
In described step (6), the speed chain of drying oven is 120mm/min ~ 200mm/min, and in-furnace temperature is 150 DEG C ± 5 DEG C, and drying time is 1 ~ 2 hour.
Beneficial effect of the present invention is: the low-temperature resins encapsulating material selected is lead-free resinous material, solves the problem of lead tolerance in original material; The curing process of this material adopts low-temperature setting simultaneously, curing temperature is at 150 degrees Celsius, well below the curing temperature of category of glass encapsulated layer, the benefit of low-temperature setting technique is not need to carry out high-temperature process, the resistance stability of resistive layer is effectively guaranteed, greatly reduces the problem of resistance drift; Outward appearance after the solidification of low-temperature resins encapsulating material is better, needs hot setting unlike glass material, and its process can not produce the insufficient surface hole defect problem caused of burning, and the problem of outward appearance is effectively solved.
Embodiment
Further describe technical scheme of the present invention below, but described in claimed scope is not limited to.
An encapsulating method for chip thick film fixed resistor, comprises the following steps:
(1) prepare low-temperature resins encapsulating material, prepare curing agent supporting with it simultaneously; And carry out mix according to the proportioning that curing agent accounts for 8% ~ 15%, fully stir 20 ~ 45 minutes after slurry mixing;
(2) silk screen to be printed is positioned on screen process press, prepares just contraposition printing;
(3) the low-temperature resins packaging slurry be stirred in step (1) is put into the front pushing away slurry device above silk screen, prepare to carry out silk screen printing;
(4) the wire mark head pressure of screen process press is 2.0kg ~ 3.5kg, and silk screen printing speed is 80mm/S ~ 150mm/S, and snap-off-distance is 0.8mm ~ 1.5mm, and pushing away slurry device speed is 80mm/S; The speed pushing away slurry device refers to that silk screen printing covers the speed of slurry again, usually consistent with the speed of silk screen printing.
(5) repeat print twice, and period only drying oven;
(6) carrier of being undertaken the printing of by the resistor that printing on screen process press has been encapsulated is placed on the chain of drying oven, and at drying oven inner drying;
(7) whether the substrate after checking dry completing has figure deformation or does not dry phenomenon, and qualified product then proceed to next procedure and continue subsequent operations.
The low-temperature resins encapsulating material selected in the present invention is lead-free resinous material, solves the problem of lead tolerance in original material; The curing process of this material adopts low-temperature setting simultaneously, curing temperature is at 150 degrees Celsius, well below the curing temperature of category of glass encapsulated layer, the benefit of low-temperature setting technique is not need to carry out high-temperature process, the resistance stability of resistive layer is effectively guaranteed, greatly reduces the problem of resistance drift; Outward appearance after the solidification of low-temperature resins encapsulating material is better, needs hot setting unlike glass material, and its process can not produce the insufficient surface hole defect problem caused of burning, and the problem of outward appearance is effectively solved.
Criticize production continuously through process certification test and small batch, low temperature packaged products outward appearance after plating is good, and the resistance qualification rate of 1% resistance accuracy reaches 97.5%.Statistical computation is carried out to the consumption of cryogenic material simultaneously, and contrasted with high temp glass slurry.Every 100,000 of low-temperature pulp consumes 10.64 grams, every gram of purchasing price 0.15 yuan, and every 100,000 of temperature of high temperature slurry consumes 25.45, every gram of purchasing price 0.45 yuan.Be made as example with 3216 type thick-film resistors, the material cost of use high temp glass slurry is 7.2 times of low-temperature pulp.
Low temperature packaging slurry print trial sample completes performance test, respond well.Do SGS environmental protection tests, test result Total Product lead tolerance is 2000ppm.If low-temperature pulp is promoted the use of on thick-film resistor makes, only the cost of processed materials purchased one just will save tens thousand of unit; On the other hand, because the curing temperature of material is low, only need the drying nest of printing just can complete the step of solidification, save the complicated link of high temperature sintering, time saving and energy saving cost-saving.
Claims (5)
1. an encapsulating method for chip thick film fixed resistor, is characterized in that comprising the following steps:
(1) prepare low-temperature resins encapsulating material, prepare curing agent supporting with it simultaneously; And carry out mix according to the proportioning that curing agent accounts for 8% ~ 15%, fully stir 20 ~ 45 minutes after slurry mixing;
(2) silk screen to be printed is positioned on screen process press, prepares just contraposition printing;
(3) the low-temperature resins packaging slurry be stirred in step (1) is put into the front pushing away slurry device above silk screen, prepare to carry out silk screen printing;
(4) the wire mark head pressure of screen process press is 2.0kg ~ 3.5kg, and silk screen printing speed is 80mm/S ~ 150mm/S, and snap-off-distance is 0.8mm ~ 1.5mm, and pushing away slurry device speed is 80mm/S;
(5) repeat print twice, and period only drying oven;
(6) carrier of being undertaken the printing of by the resistor that printing on screen process press has been encapsulated is placed on the chain of drying oven, and at drying oven inner drying;
(7) whether the carrier of undertaking the printing of of the resistor after checking dry completing has figure deformation or does not dry phenomenon, and qualified product then proceed to next procedure and continue subsequent operations.
2. the encapsulating method of chip thick film fixed resistor as claimed in claim 1, is characterized in that: the slurry of mixing in described step (1) is placed after 10 ~ 25 minutes and used on the machine.
3. the encapsulating method of chip thick film fixed resistor as claimed in claim 1, is characterized in that: in described step (2), the order number of printing screen is 250 ~ 325 orders.
4. the encapsulating method of chip thick film fixed resistor as claimed in claim 1, is characterized in that: the amount being positioned over the low-temperature resins packaging slurry pushing away slurry device front in described step (3) is 60 ~ 90g.
5. the encapsulating method of chip thick film fixed resistor as claimed in claim 1, it is characterized in that: in described step (6), the speed chain of drying oven is 120mm/min ~ 200mm/min, in-furnace temperature is 150 DEG C ± 5 DEG C, and drying time is 1 ~ 2 hour.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510437510.XA CN105070442B (en) | 2015-07-23 | 2015-07-23 | A kind of encapsulating method of chip thick film fixed resister |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510437510.XA CN105070442B (en) | 2015-07-23 | 2015-07-23 | A kind of encapsulating method of chip thick film fixed resister |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105070442A true CN105070442A (en) | 2015-11-18 |
| CN105070442B CN105070442B (en) | 2018-05-04 |
Family
ID=54499787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510437510.XA Expired - Fee Related CN105070442B (en) | 2015-07-23 | 2015-07-23 | A kind of encapsulating method of chip thick film fixed resister |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105070442B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109872925A (en) * | 2017-12-02 | 2019-06-11 | 中国振华集团云科电子有限公司 | A kind of appearance packaging printing process of JF chip fuse |
| CN111128499A (en) * | 2019-12-25 | 2020-05-08 | 株洲宏达电通科技有限公司 | Method for manufacturing anti-vulcanization sheet type thick film fixed resistor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101533697A (en) * | 2009-04-16 | 2009-09-16 | 天津大学 | Process for packaging metal-film resistors with coatings resisting high temperature and humidity |
| CN102558764A (en) * | 2010-12-14 | 2012-07-11 | 西安布瑞斯电子科技有限责任公司 | High-adhesion humidity-resistant organic polymer slurry |
| CN103632781A (en) * | 2013-12-13 | 2014-03-12 | 深圳顺络电子股份有限公司 | Chip component tip packaging paste and preparation method of chip component |
-
2015
- 2015-07-23 CN CN201510437510.XA patent/CN105070442B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101533697A (en) * | 2009-04-16 | 2009-09-16 | 天津大学 | Process for packaging metal-film resistors with coatings resisting high temperature and humidity |
| CN102558764A (en) * | 2010-12-14 | 2012-07-11 | 西安布瑞斯电子科技有限责任公司 | High-adhesion humidity-resistant organic polymer slurry |
| CN103632781A (en) * | 2013-12-13 | 2014-03-12 | 深圳顺络电子股份有限公司 | Chip component tip packaging paste and preparation method of chip component |
Non-Patent Citations (1)
| Title |
|---|
| 周蓉等: ""片式电阻用有机聚合物电子浆料研制"", 《电子元件与材料》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109872925A (en) * | 2017-12-02 | 2019-06-11 | 中国振华集团云科电子有限公司 | A kind of appearance packaging printing process of JF chip fuse |
| CN111128499A (en) * | 2019-12-25 | 2020-05-08 | 株洲宏达电通科技有限公司 | Method for manufacturing anti-vulcanization sheet type thick film fixed resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105070442B (en) | 2018-05-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105070442A (en) | Encapsulation method for chip thick-film fixed resistor | |
| CN107995797A (en) | High-accuracy PCB paster technique | |
| CN105363634A (en) | Glue dispenser with heating device | |
| CN102651374B (en) | Method for reducing tilt of transparent window during manufacturing of image sensor | |
| CN103681319B (en) | A kind of preparation technology of diode | |
| CN205146604U (en) | Automatic dispensing machine | |
| CN109263330A (en) | A kind of thermal transfer printable mold silica gel transfer target preparation method | |
| CN108492935A (en) | A method of preparing flexible extensible conducting resinl transparent conductive film | |
| CN105424240B (en) | A kind of observation comparative approach of IC plastic packagings residual stress | |
| CN109285785A (en) | It is a kind of based on infrared with hot wind Hybrid Heating technology BGA ball-establishing method | |
| CN201506859U (en) | Spinning component and spinneret plate device | |
| CN112060795A (en) | Production process of environment-friendly PVA water transfer film | |
| CN104538138B (en) | The preparation method of precision chip resistor device | |
| TWI641306B (en) | Electronic component packaging device and packaging method thereof | |
| CN100572313C (en) | The overflow chute inclusion and the restorative procedure that are used for display sheet glass forming | |
| CN105881900A (en) | Novel 3D printing consumable | |
| CN106639201A (en) | Manufacturing method for crystal drop glue wall sticker | |
| CN109872925A (en) | A kind of appearance packaging printing process of JF chip fuse | |
| CN108154982A (en) | A kind of chip type fixed resistance and preparation method thereof | |
| CN107480753B (en) | Printed antenna label and manufacturing method thereof | |
| CN103273754B (en) | Bottle heat-transferring method | |
| CN103118504A (en) | Hot wind heating device of printed circuit board (PCB) repair work station | |
| CN105443089B (en) | The preparation method of microcosmic oil drive glass model | |
| CN111168183A (en) | Welding method for components in cavity product | |
| CN202710236U (en) | Adhesive structure of pressure sensing chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180504 Termination date: 20190723 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |