CN113871117A - Low-cost long-life thick-film resistor plate for oil level sensor and manufacturing method thereof - Google Patents
Low-cost long-life thick-film resistor plate for oil level sensor and manufacturing method thereof Download PDFInfo
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- CN113871117A CN113871117A CN202111150404.5A CN202111150404A CN113871117A CN 113871117 A CN113871117 A CN 113871117A CN 202111150404 A CN202111150404 A CN 202111150404A CN 113871117 A CN113871117 A CN 113871117A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000004020 conductor Substances 0.000 claims abstract description 70
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 56
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052709 silver Inorganic materials 0.000 claims abstract description 33
- 239000004332 silver Substances 0.000 claims abstract description 33
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052737 gold Inorganic materials 0.000 claims abstract description 31
- 239000010931 gold Substances 0.000 claims abstract description 31
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 28
- 238000007747 plating Methods 0.000 claims abstract description 28
- 239000000126 substance Substances 0.000 claims abstract description 22
- 239000011521 glass Substances 0.000 claims abstract description 21
- 239000000919 ceramic Substances 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000001035 drying Methods 0.000 claims description 42
- 238000010438 heat treatment Methods 0.000 claims description 19
- 230000001681 protective effect Effects 0.000 claims description 18
- 238000005245 sintering Methods 0.000 claims description 13
- 238000007639 printing Methods 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 7
- 239000000446 fuel Substances 0.000 claims description 7
- 238000009966 trimming Methods 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 238000013035 low temperature curing Methods 0.000 claims description 6
- 238000001723 curing Methods 0.000 claims description 5
- 239000002002 slurry Substances 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 3
- 230000006870 function Effects 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000011056 performance test Methods 0.000 claims description 3
- 230000009993 protective function Effects 0.000 claims description 3
- 230000004048 modification Effects 0.000 claims description 2
- 238000012986 modification Methods 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 6
- 239000003960 organic solvent Substances 0.000 abstract description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 28
- 229910052763 palladium Inorganic materials 0.000 description 10
- 229910000510 noble metal Inorganic materials 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 238000007667 floating Methods 0.000 description 3
- 239000002828 fuel tank Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06526—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
- H01C17/14—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by chemical deposition
- H01C17/18—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by chemical deposition without using electric current
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
- H01C17/283—Precursor compositions therefor, e.g. pastes, inks, glass frits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/30—Apparatus or processes specially adapted for manufacturing resistors adapted for baking
Abstract
The invention discloses a thick film resistor plate with low cost and long service life for an oil level sensor and a manufacturing method thereof.A pure silver circuit film layer, a resistor body film layer, a glass protection film layer and a resin protection film layer are printed and sintered on a ceramic substrate in sequence, and then nickel and gold are plated on the pure silver conductor film layer in sequence through a chemical plating process; the pure silver circuit film comprises two bonding pads, an arc conductor and a plurality of comb conductors, a resistor film layer, a glass protection film layer and a resin protection film layer are sequentially printed on the comb conductors, laser resistance repairing is carried out after the glass protection film layer is printed, the whole ceramic substrate is divided into single pieces finally, and the single pieces are packaged and warehoused after being tested. The invention uses the pure Ag conductor paste with low cost to replace the Ag/Pd conductor paste with high cost, and the Ag conductor is chemically plated with the nickel film layer and the gold film layer in sequence, thereby maintaining good wear resistance and organic solvent corrosion resistance, ensuring the service life and reliability of the product and greatly reducing the cost of the product.
Description
Technical Field
The invention relates to the technical field of oil level sensors, in particular to a thick film resistor plate with low cost and long service life for an oil level sensor and a manufacturing method thereof.
Background
In the oil tank of non-electric vehicles and motorcycles, an oil level sensor assembly is installed. The fuel level sensor assembly is used for detecting the position condition of fuel in a fuel tank and displaying the position condition of the fuel in a meter of a cab in real time, so that a driver can know the fuel condition of a vehicle at any time. The thick film resistor plate for automobile and motorcycle oil level sensor is prepared with noble silver/palladium (Ag/Pd) slurry to form conductor circuit film layer for reaching the wear resistance and organic solvent corrosion resistance of the thick film resistor plate. The technology and products are the mainstream varieties of the oil level sensors of the automobiles and motorcycles at present.
However, in recent years, with the increasing market of precious metals year by year, especially the scarce precious metal resource such as palladium (Pd) as a raw material, the increasing range in recent three years is more than 5 times. The production cost of the thick-film resistor plate type oil level sensor using Ag/Pd noble metal conductor slurry as a conductor circuit is higher and higher, and the thick-film resistor plate type oil level sensor is difficult to accept by automobile and motorcycle sensor factories.
Disclosure of Invention
The invention aims to provide a thick-film resistor plate with low cost and long service life for an oil level sensor and a manufacturing method thereof, and solves the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides an oil level sensor is with low-cost long-life thick film resistance board, includes the conductor circuit rete, the conductor circuit rete is including having set gradually pure silver circuit rete, nickel rete and gold rete from bottom to top, ceramic substrate is installed to conductor circuit rete bottom.
A manufacturing method of a thick film resistor plate with low cost and long service life for an oil level sensor is characterized by comprising the following steps: the method comprises the following steps:
s1, selecting a ceramic substrate with transverse and longitudinal pre-cut grooves, wherein the pre-cut grooves are helpful for the later process to separate the whole jointed board product into single pieces;
s2: printing a pure silver line film layer on each unit small piece of the ceramic substrate by using pure silver conductor slurry, wherein the pure silver line film layer comprises two bonding pads, and an arc conductor and a comb conductor form lap joint;
s3: the comb-shaped conductors are uniformly distributed in a radian matched with the arc-shaped conductors, one end of each arc-shaped conductor is connected with one bonding pad, and the other bonding pad is connected with one end of each comb-shaped conductor;
s4: printing a layer of resistance paste on the upper parts of the comb-shaped conductors, wherein the resistance paste forms a resistor film layer, and the resistor film layers are connected in sequence;
s5: printing a glass protective film layer on the resistor body film layer;
s6: performing laser resistance trimming cutting on the resistor body film layer, and adjusting the initial resistance value of a product;
s7: after laser resistance trimming is finished, printing a resin protective film layer on the resistor body film layer and the glass protective film layer;
s8: carrying out chemical nickel plating and chemical gold plating treatment on an arc conductor, a comb-shaped conductor and a bonding pad of a pure silver circuit film layer which is not covered by a resistor body film layer, a glass protection film layer and a resin protection film layer, and then chemically plating a nickel plating film layer and a gold plating film layer, wherein the thickness of the nickel film layer is 3-5 mu m, the thickness of the gold film layer is 0.05-0.10 mu m, and cleaning and drying a product subjected to chemical nickel plating and gold plating;
s9: and (3) performing performance test on the finished product, dividing the whole ceramic substrate into single pieces according to the existing pre-cutting grooves to form a single piece finished product, and packaging and warehousing the finished product.
Preferably, the following steps may be further included between the completion of the steps S8 and S9:
s81: whether the chemical nickel-plated gold film layer is subjected to heat treatment or not can be determined according to the hardness requirements of different types of brush contacts used by the oil level sensor, so that the hardness of the chemical nickel-plated gold film layer is improved, and the hardness matching requirements of different types of brush contacts are met. The heat treatment conditions of the chemical nickel and gold plating film layer are preferably as follows: the heat treatment temperature is 200 ℃ to 400 ℃; the heat treatment atmosphere is that inert gas such as nitrogen is introduced under the condition of vacuum or air evacuation; the heat treatment time is 30 to 60 minutes, and the hardness of the nickel film layer 3 after the heat treatment can be increased by about 3 times.
Preferably, the pure silver circuit film layer is dried in a low-temperature drying furnace, the temperature of the drying furnace is 120-200 ℃, the drying furnace is kept for 10-15 minutes, the thickness of the drying film reaches 15-25 mu m, then the pure silver circuit film layer is sintered in a high-temperature tunnel furnace, and finally the conductor circuit functional film layer is formed, the peak temperature of the tunnel furnace is 850 ℃, and the sintering time is 30-60 minutes.
Preferably, the resistor film layer is dried in a low-temperature drying furnace at the temperature of 120-200 ℃ for 10-15 minutes, the thickness of the dried film is 10-18 mu m, and then the resistor film layer is sintered in a high-temperature tunnel furnace to finally form the resistor functional film layer, wherein the peak temperature of the tunnel furnace is 850 ℃ and the sintering time is 30-60 minutes.
Preferably, after the resistor film layer is formed, a glass protective film layer is printed on the resistor film layer, the glass protective film layer is placed in a low-temperature drying furnace for drying, the temperature of the drying furnace is 120-200 ℃, the drying furnace is kept for 10-15 minutes, the thickness of the drying film reaches 10-20 micrometers, then the glass protective film layer is placed in a high-temperature tunnel furnace for sintering in the air atmosphere, the protective function film layer is finally formed, the peak temperature of the tunnel furnace is 500-850 ℃, and the sintering time is 30-60 minutes.
Preferably, after the laser modification of the resistor film layer is completed, a second resin protective film layer is printed on the resistor film layer, the resin protective film layer is placed in a low-temperature drying oven for drying, the temperature of the drying oven is 120-200 ℃, the drying oven is kept for 10-15 minutes, the thickness of the dried film reaches 10-20 micrometers, then the film layers are placed in a low-temperature curing oven for curing in the air atmosphere, so that a protective function film layer is finally formed, the peak temperature of the low-temperature curing oven is 200-220 ℃, and the curing time is 30-60 minutes.
Preferably, the sensor is installed in the oil tank, a rotating frame is further arranged in the oil tank, a floating ball is connected to the lower end of the rotating frame, an electric brush is connected to the upper end of the rotating frame, two contact points are arranged on the electric brush, and the two contact points are respectively in contact connection with the arc conductor and the comb conductor.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, a pure silver circuit film layer is printed by a silver material, a nickel film layer and a gold film layer are plated in sequence by a chemical plating process, the hardness of the nickel film layer is improved by a heat treatment process technology according to the hardness requirements of different types of brush contacts of the oil level sensor, so that the wear resistance of the nickel film layer is improved, the gold film layer at the outermost layer can effectively improve the corrosion resistance of a thick film resistor plate product in a fuel environment, and the silver, nickel and gold conductor circuit film layers still keep good wear resistance and organic solvent corrosion resistance under the condition of canceling noble metal palladium, so that the service life and reliability of the product are ensured, the dependence of the thick film resistor plate product of the oil level sensor on the noble metal palladium for a long time is reduced, and the thickness of the gold film layer is only 0.05-0.10 mu m; compared with the traditional conductor circuit film layer made of silver and palladium noble metals, the thickness of the conductor circuit film layer is 12 microns, and the production cost of the product can be greatly reduced.
2. According to the invention, the ceramic substrate is arranged, the ceramic substrate is provided with the plurality of intersecting pre-cutting grooves, and the pre-cutting grooves are conveniently divided into the plurality of rectangular units after the ceramic substrate is printed and processed.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-section A-A of FIG. 1;
FIG. 3 is an enlarged view of a portion of FIG. 2 at B;
FIG. 4 is a partial schematic structural view of the present invention;
fig. 5 is a schematic view of the usage state of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 3, an embodiment of the present invention includes: the utility model provides a low-cost long-life thick film resistor board for oil level sensor, includes the conductor circuit rete, and the conductor circuit rete includes silver rete 2, nickel rete 3 and the gold rete 4 that set gradually from bottom to top, and ceramic substrate 1 is installed to conductor circuit rete bottom.
A manufacturing method of a thick film resistor plate with low cost and long service life for an oil level sensor comprises the following steps:
s1, selecting the ceramic substrate 1 with the transverse and longitudinal pre-cut grooves which are helpful for the later working procedure to divide the ceramic substrate into rectangular units;
s2: on each unit chip of the ceramic substrate 1, printing a conductor line by using pure silver conductor paste to form a pure silver line film layer 2, wherein the pure silver line film layer 2 comprises two bonding pads 21, an arc conductor 22 and a plurality of comb-shaped conductors 23;
s3: the comb-shaped conductors 23 are uniformly arranged in a radian matched with the arc-shaped conductors 22, one end of each arc-shaped conductor 22 is connected with one bonding pad 21, and the other bonding pad 21 is connected with one end of each comb-shaped conductor 23;
s4: printing a layer of resistance paste on the upper parts of the comb conductors 23, wherein the resistance paste forms a resistance body film layer 24, and the resistance body film layer 24 is sequentially overlapped with the comb conductors 23;
s5: a glass protective film layer is printed on the resistor film layer 24, so that the resistor film layer 24 is protected from generating micro-cracks when laser resistance trimming is carried out on the rear side of the resistor film layer 24;
s6: laser resistance trimming cutting is carried out on the resistor body film layer 24, and the initial resistance value of the product is adjusted, so that the resistance value can reach an accurate range, and the resistance value precision requirement of the product is met;
s7: printing a second resin protective film layer on the resistor body film layer 24 and the first glass protective film layer after the laser resistance trimming;
s8: carrying out chemical nickel plating and chemical gold plating treatment on the arc conductor 22, the comb conductor 23 and the bonding pad 21 of the pure silver line film layer 2 which is not covered by the resistor body film layer 24, the glass protection film layer and the resin protection film layer, and then chemically plating a nickel plating film layer and a gold plating film layer, wherein the thickness of the nickel film layer is 3-5 mu m, the thickness of the gold film layer is 0.05-0.10 mu m, and cleaning and drying a product after chemical nickel plating and gold plating;
the following steps may be further included after the step of S8 is completed:
s81: whether the chemical nickel-plated gold film layer is subjected to heat treatment or not can be determined according to the hardness requirements of different types of brush contacts used by the oil level sensor, so that the hardness of the chemical nickel-plated gold film layer is improved, and the hardness matching requirements of different types of brush contacts are met. The heat treatment conditions of the chemical nickel and gold plating film layer are preferably as follows: the heat treatment temperature is 200 ℃ to 400 ℃; the heat treatment atmosphere is that inert gas such as nitrogen is introduced under the condition of vacuum or air evacuation; the heat treatment time is 30 to 60 minutes, and the hardness of the nickel film layer 3 after the heat treatment can be increased by about 3 times.
S9: referring to fig. 4, in order to complete the above steps, a performance test is performed, and the monolithic ceramic substrate 1 is divided into individual pieces according to the existing pre-cut grooves, to form monolithic finished products, and the monolithic finished products are packaged and stored.
And (2) drying the pure silver circuit film layer 2 in a low-temperature drying furnace at the temperature of 120-200 ℃ for 10-15 minutes until the thickness of the dried film reaches 15-25 mu m, sintering the pure silver circuit film layer 2 in a high-temperature tunnel furnace to finally form a conductor circuit functional film layer, wherein the peak temperature of the tunnel furnace is 850 ℃ and the sintering time is 30-60 minutes.
Specifically, the resistor film layer 24 is dried in a low-temperature drying furnace at the temperature of 120-200 ℃ for 10-15 minutes, the thickness of the dried film is 10-18 mu m, and then the resistor film layer is sintered in a high-temperature tunnel furnace to finally form the resistor functional film layer, wherein the peak temperature of the tunnel furnace is 850 ℃ and the sintering time is 30-60 minutes.
Specifically, a first glass protective film layer and a second resin protective film layer are printed on resistor film layer 24 after it is formed. Wherein, the first layer of glass protective film layer is placed in a low-temperature drying furnace for drying, the temperature of the drying furnace is 120-200 ℃, and the drying furnace is kept for 10-15 minutes. The thickness of the dried film is 10-20 μm, then the dried film is put into a high-temperature tunnel furnace and sintered in air atmosphere to finally form the glass protective film, the peak temperature of the tunnel furnace is 500-850 ℃, and the sintering time is 30-60 minutes. And placing the second resin protection film layer into a low-temperature drying furnace for drying, wherein the temperature of the drying furnace is 120-200 ℃, the drying furnace is kept for 10-15 minutes, the thickness of the dried film reaches 10-20 mu m, then placing the film layers into a low-temperature curing furnace, and curing the film layers in an air atmosphere to finally form the protection function film layer, wherein the peak temperature of the low-temperature curing furnace is 200-220 ℃, and the curing time is 30-60 minutes.
Wherein, the drying furnace can be replaced by the stoving case, and the tunnel furnace can be replaced by the muffle furnace.
The product of the invention is a technical scheme for manufacturing a conductor circuit by using pure silver conductor slurry and solving the problems of wear resistance and organic solvent corrosion resistance of a conductor material of a thick film resistor plate by a chemical nickel-gold plating process, and replaces the current expensive silver/palladium (Ag/Pd) conductor material technical scheme. The product of the invention not only keeps the advantages of simple manufacture procedure, high precision of product resistance value, convenient installation and the like of the original structure of the silver/palladium (Ag/Pd) thick film resistor plate, but also achieves the same or even more obvious wear resistance and organic solvent corrosion resistance of the silver/palladium (Ag/Pd) conductor thick film resistor plate. Moreover, the chemical nickel plating and the thin gold film are used for replacing noble metal palladium (Pd), so that the dependence of the oil level sensor product on the noble metal palladium (Pd) for a long time is reduced, the cost is saved, and the method has obvious cost advantage and market promotion and competition capability.
Referring to fig. 5, the low-cost and long-life fuel level sensor comprises a thick film resistor plate 10, wherein the thick film resistor plate 10 is installed in a fuel tank 5, a rotating frame 6 is further arranged in the fuel tank 5, a floating ball 7 is connected to the lower end of the rotating frame 6, an electric brush 8 is connected to the upper end of the rotating frame 6, two contact points 9 are arranged on the electric brush, and the two contact points 9 are respectively in contact connection with an arc conductor 22 and a comb conductor 23; the floating ball 7 can be driven by the oil level to float up and down, when the contact 9 of the electric brush 8 slides on the arc-shaped conductor 22 and the comb-shaped conductor 23, different segmented resistance values can be connected, different voltages can be generated, and the voltages are transmitted to an electronic control unit ECU through a line and a bonding pad 21, so that the effect of detecting the oil level in real time is achieved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The utility model provides an oil level sensor is with low-cost long-life thick film resistor board, includes the conductor circuit rete, its characterized in that: the conductor circuit film layer comprises a pure silver circuit film layer, a nickel film layer and a gold film layer which are sequentially arranged from bottom to top, and a ceramic substrate is installed at the bottom of the conductor circuit film layer.
2. A manufacturing method of a thick film resistor plate with low cost and long service life for an oil level sensor is characterized by comprising the following steps: the method comprises the following steps:
s1, selecting a ceramic substrate with transverse and longitudinal pre-cut grooves, wherein the pre-cut grooves are helpful for the later process to separate the whole jointed board product into single pieces;
s2: printing a pure silver line film layer on each unit small piece of the ceramic substrate by using pure silver conductor slurry, wherein the pure silver line film layer comprises two bonding pads, and an arc conductor and a comb conductor form lap joint;
s3: the comb-shaped conductors are uniformly distributed in a radian matched with the arc-shaped conductors, one end of each arc-shaped conductor is connected with one bonding pad, and the other bonding pad is connected with one end of each comb-shaped conductor;
s4: printing a layer of resistance paste on the upper parts of the comb-shaped conductors, wherein the resistance paste forms a resistor film layer, and the resistor film layers are connected in sequence;
s5: printing a glass protective film layer on the resistor body film layer;
s6: performing laser resistance trimming cutting on the resistor body film layer, and adjusting the initial resistance value of a product;
s7: after laser resistance trimming is finished, printing a resin protective film layer on the resistor body film layer and the glass protective film layer;
s8: carrying out chemical nickel plating and chemical gold plating treatment on an arc conductor, a comb-shaped conductor and a bonding pad of a pure silver circuit film layer which is not covered by a resistor body film layer, a glass protection film layer and a resin protection film layer, and then chemically plating a nickel plating film layer and a gold plating film layer, wherein the thickness of the nickel film layer is 3-5 mu m, the thickness of the gold film layer is 0.05-0.10 mu m, and cleaning and drying a product subjected to chemical nickel plating and gold plating;
s9: and (3) performing performance test on the finished product, dividing the whole ceramic substrate into single pieces according to the existing pre-cutting grooves to form a single piece finished product, and packaging and warehousing the finished product.
3. The method of manufacturing a low-cost long-life thick-film resistor plate for an oil level sensor according to claim 2, wherein: the following steps may be further included between the completion of the steps of S8 and S9:
s81: whether the chemical nickel-plated gold film layer is subjected to heat treatment or not can be determined according to the hardness requirements of different types of brush contacts used by the oil level sensor, so that the hardness of the chemical nickel-plated gold film layer is improved, and the hardness matching requirements of different types of brush contacts are met. The heat treatment conditions of the chemical nickel and gold plating film layer are preferably as follows: the heat treatment temperature is 200 ℃ to 400 ℃; the heat treatment atmosphere is that inert gas such as nitrogen is introduced under the condition of vacuum or air evacuation; the heat treatment time is 30 to 60 minutes, and the hardness of the nickel film layer 3 after the heat treatment can be increased by about 3 times.
4. The method of manufacturing a low-cost long-life thick-film resistor plate for an oil level sensor according to claim 2, wherein: and (2) drying the pure silver circuit film layer in a low-temperature drying furnace at the temperature of 120-200 ℃ for 10-15 minutes until the thickness of the dried film reaches 15-25 mu m, sintering the pure silver circuit film layer in a high-temperature tunnel furnace to finally form a conductor circuit functional film layer, wherein the peak temperature of the tunnel furnace is 850 ℃ and the sintering time is 30-60 minutes.
5. The method of manufacturing a low-cost long-life thick-film resistor plate for an oil level sensor according to claim 2, wherein: and placing the resistor body film layer into a low-temperature drying furnace for drying, wherein the temperature of the drying furnace is 120-200 ℃, keeping for 10-15 minutes, the thickness of the drying film is 10-18 mu m, and then placing the resistor body film layer into a high-temperature tunnel furnace for sintering to finally form a resistor function film layer, wherein the peak temperature of the tunnel furnace is 850 ℃, and the sintering time is 30-60 minutes.
6. The method of manufacturing a low-cost long-life thick-film resistor plate for an oil level sensor according to claim 2, wherein: after the resistor body film layer is formed, a glass protection film layer is printed on the resistor body film layer, the glass protection film layer is placed in a low-temperature drying furnace to be dried, the temperature of the drying furnace is 120-200 ℃, the drying furnace is kept for 10-15 minutes, the thickness of the drying film is 10-20 micrometers, then the glass protection film layer is placed in a high-temperature tunnel furnace to be sintered in the air atmosphere, the protection function film layer is finally formed, the peak temperature of the tunnel furnace is 500-850 ℃, and the sintering time is 30-60 minutes.
7. The method of manufacturing a low-cost long-life thick-film resistor plate for an oil level sensor according to claim 2, wherein: after the laser modification of the resistor film layer is finished, a second resin protection film layer is printed on the resistor film layer, the resin protection film layer is placed in a low-temperature drying furnace to be dried, the temperature of the drying furnace is 120-200 ℃, the drying furnace is kept for 10-15 minutes, the thickness of the dried film reaches 10-20 mu m, then the film layers are placed in a low-temperature curing furnace to be cured in the air atmosphere, the protective function film layer is finally formed, the peak temperature of the low-temperature curing furnace is 200-220 ℃, and the curing time is 30-60 minutes.
8. A low cost long life fuel level sensor comprising the thick film resistor plate of claims 1 to 7, wherein: the sensor is installed in the oil tank, still is provided with the swivel mount in this oil tank, and this swivel mount lower extreme is connected with the floater, and the swivel mount upper end is connected with the brush, is provided with two contact points on the brush, and these two contact points are connected with arc conductor and pectination conductor contact respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111150404.5A CN113871117A (en) | 2021-09-29 | 2021-09-29 | Low-cost long-life thick-film resistor plate for oil level sensor and manufacturing method thereof |
Applications Claiming Priority (1)
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI831415B (en) * | 2022-10-13 | 2024-02-01 | 天二科技股份有限公司 | Thick film resistor element manufacturing method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101553888A (en) * | 2006-10-12 | 2009-10-07 | Abb研究有限公司 | Layered electrically conductive structure and potentiometer comprising such a structure |
| CN103616058A (en) * | 2013-12-06 | 2014-03-05 | 安徽江淮汽车股份有限公司 | Sealed fuel quantity transducer |
| CN104427778A (en) * | 2013-09-10 | 2015-03-18 | 龚伶 | Gold plating method for printed circuit board |
| CN111128499A (en) * | 2019-12-25 | 2020-05-08 | 株洲宏达电通科技有限公司 | Method for manufacturing anti-vulcanization sheet type thick film fixed resistor |
| CN111192732A (en) * | 2020-03-12 | 2020-05-22 | 上海双腾电子电器有限公司 | Thick film platinum palladium silver resistor disc and manufacturing method thereof |
| CN112216655A (en) * | 2020-11-03 | 2021-01-12 | 中国电子科技集团公司第四十三研究所 | LTCC-based SiP packaging shell and preparation method thereof |
-
2021
- 2021-09-29 CN CN202111150404.5A patent/CN113871117A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101553888A (en) * | 2006-10-12 | 2009-10-07 | Abb研究有限公司 | Layered electrically conductive structure and potentiometer comprising such a structure |
| CN104427778A (en) * | 2013-09-10 | 2015-03-18 | 龚伶 | Gold plating method for printed circuit board |
| CN103616058A (en) * | 2013-12-06 | 2014-03-05 | 安徽江淮汽车股份有限公司 | Sealed fuel quantity transducer |
| CN111128499A (en) * | 2019-12-25 | 2020-05-08 | 株洲宏达电通科技有限公司 | Method for manufacturing anti-vulcanization sheet type thick film fixed resistor |
| CN111192732A (en) * | 2020-03-12 | 2020-05-22 | 上海双腾电子电器有限公司 | Thick film platinum palladium silver resistor disc and manufacturing method thereof |
| CN112216655A (en) * | 2020-11-03 | 2021-01-12 | 中国电子科技集团公司第四十三研究所 | LTCC-based SiP packaging shell and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 董允等: "《现代表面工程技术》", 31 March 2000 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI831415B (en) * | 2022-10-13 | 2024-02-01 | 天二科技股份有限公司 | Thick film resistor element manufacturing method |
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Application publication date: 20211231 |