CN111115553B - Double-cavity metal packaging shell based on energy storage welding mode and packaging method - Google Patents
Double-cavity metal packaging shell based on energy storage welding mode and packaging method Download PDFInfo
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- CN111115553B CN111115553B CN201911358954.9A CN201911358954A CN111115553B CN 111115553 B CN111115553 B CN 111115553B CN 201911358954 A CN201911358954 A CN 201911358954A CN 111115553 B CN111115553 B CN 111115553B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
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- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The utility model provides a two-chamber metal package shell based on energy storage welding mode, includes two encapsulation cavities of the sensitive component installation cavity that is located the top and the electronic components installation cavity that is located the below, and two encapsulation cavities components of a whole that can function independently processing are independently makeed, and independent preparation sensitive component installation cavity is applicable to energy storage welding process, and two cavities weld and get up and guarantee the gas tightness, have avoided the processing technology degree of difficulty and the cost that integrative stamping forming brought, and the gas tightness can effectively be ensured simultaneously, improves the reliability of encapsulation. The invention also provides a packaging method of the double-chamber metal packaging shell based on the energy storage welding mode. The invention meets the requirements of high integration, high reliability, low cost, small volume and the like of the product through the double-chamber design.
Description
Technical Field
The invention belongs to the field of MEMS (micro-electromechanical systems) packaging, and relates to a double-chamber metal packaging shell based on an energy storage welding mode and a packaging method.
Background
At present, due to the advantages of improved precision level, higher reliability and cost and volume, the MEMS sensor has more and more application fields, but also provides new requirements for MEMS packaging modes. Mainly embodied in the aspects of high integration, high reliability, low cost, small volume and the like. The MEMS sensor generally includes a MEMS sensing element and a matching circuit, where the sensing element is used to implement a sensing function of the sensor, and the matching circuit implements a function of converting a sensing physical signal into an electrical signal. The existing MEMS sensor is generally single in packaging form, relatively large in size, high in cost due to the adoption of integrated punch forming, and only sensitive elements in the MEMS sensor are packaged usually, and a matched circuit is only simply installed. With the increasing requirements on the performance of the MEMS sensor, such as integration, precision, stability and the like, the performance stability of key core electronic components of the supporting circuit directly influences the performance stability of the MEMS sensor, and the packaging protection requirement for the supporting circuit is obviously increased.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides the double-chamber metal packaging shell based on the energy storage welding mode, simultaneously meets the requirement of hybrid integrated packaging of sensitive elements and key electronic components of the MEMS sensor, simultaneously saves the cost by adopting a discrete processing mode, and has great advantages in the aspects of performance stability, volume, integration level and cost of the MEMS sensor.
The invention also aims to provide a packaging method of the double-chamber metal packaging shell based on an energy storage welding mode.
In order to realize the purpose, the technical scheme of the invention is as follows:
a double-chamber metal packaging shell based on an energy storage welding mode comprises a sensitive element mounting cavity sealing cap, a sensitive element mounting shell, an electronic component mounting shell and an electronic component mounting cavity sealing cap;
the electronic component mounting shell is of a groove-shaped structure, a through hole is processed on the bottom surface, and a plurality of outer lead posts are symmetrically arranged on the bottom surface and outside the through hole;
the shape of the sensitive element mounting shell is matched with that of a through hole in the bottom surface of the electronic component mounting shell, a mounting boss is arranged in the center of the upper surface of the sensitive element mounting shell, a plurality of inner lead posts are symmetrically arranged around the mounting boss, and a solder ring is arranged on the edge of the sensitive element mounting shell along the circumferential direction;
the electronic component mounting shell is inverted, the sensitive element mounting shell is placed on a through hole of the electronic component mounting shell and is connected with the electronic component mounting shell through welding, a double-chamber shell structure is formed after welding, the front side is a sensitive element mounting cavity, and the back side is an electronic component mounting cavity;
during packaging, the sensitive element is attached in the sensitive element mounting cavity and is connected with the inner lead post through a lead, the electronic element is attached in the electronic element mounting cavity and is connected with the inner lead post and the outer lead post through leads, the sensitive element mounting cavity sealing cap is used for sealing the sensitive element mounting cavity, and the cap edge of the sensitive element mounting cavity sealing cap is in contact with the solder ring; the electronic component mounting cavity sealing cap is used for sealing the electronic component mounting cavity.
The circumference of the inner side of the through hole at the bottom surface of the electronic component mounting shell is provided with a circle of convex edges.
The sensitive element mounting shell is arranged on the convex edge on the inner side of the through hole of the electronic component mounting shell and is connected with the electronic component mounting shell through welding.
A packaging method of a double-chamber metal packaging shell based on an energy storage welding mode comprises the following steps:
firstly, machining a sensitive element mounting shell by a machining method, punching a mounting boss at the center of the upper surface of the sensitive element mounting shell by a punching method, punching a solder ring at the edge of the sensitive element mounting shell along the circumferential direction, and machining a plurality of inner lead posts around the mounting boss;
step two, processing a groove-shaped electronic component mounting shell by a mechanical processing method, processing through holes on the bottom surface of the electronic component mounting shell, and processing a plurality of external lead posts on the bottom surface of the outer side of each through hole;
thirdly, inverting the electronic component mounting shell, placing the sensitive element mounting shell on a through hole of the electronic component mounting shell, welding the electronic component mounting shell and the sensitive element mounting shell to form a double-chamber shell structure, wherein the front surface is a sensitive element mounting cavity, the back surface is an electronic component mounting cavity, the two cavities are hermetically packaged respectively, one end of the inner lead post is positioned in the sensitive element mounting cavity, and the other end of the inner lead post is positioned in the electronic component mounting cavity; one end of the outer lead post is positioned in the electronic component mounting cavity, and the other end of the outer lead post is used for providing external electric signal connection;
fourthly, attaching the sensitive element on an installation boss of the sensitive element installation cavity, connecting the sensitive element with an inner lead post through a lead, providing electric signal connection for the electronic component installation cavity through the inner lead post, and welding a sealing cap of the sensitive element installation cavity with the sensitive element installation shell in an energy storage sealing welding mode to realize the airtight encapsulation of the sensitive element installation cavity;
fifthly, the electronic component is attached in the electronic component mounting cavity and connected with the inner lead post and the outer lead post through leads or a printed circuit, and then the electronic component is hermetically packaged by utilizing the electronic component mounting cavity sealing cap.
And in the fourth step, the sensitive element mounting cavity is filled with inert gas during energy storage sealing welding so as to improve the performance stability of the sensitive element.
And in the fifth step, the encapsulation mode of carrying out airtight encapsulation on the electronic component by utilizing the sealing cap of the electronic component mounting cavity is vacuum parallel seam welding or vacuum eutectic welding.
When the electronic component is hermetically packaged by the sealing cap of the electronic component mounting cavity, inert gas is filled to improve the performance stability of the electronic component.
Compared with the prior art, the invention has the following beneficial effects:
(1) The MEMS sensor comprises two packaging cavities, namely a sensitive element mounting cavity and an electronic component mounting cavity, the mixing integration packaging of an MEMS sensor sensitive element and a key electronic component is simultaneously met, the two packaging cavities are processed in a split mode and are independently manufactured, the sensitive element mounting cavity is independently manufactured to be positioned above the sensitive element mounting cavity and is suitable for an energy storage welding process, the electronic component mounting cavity is positioned below the electronic component mounting cavity, the two cavities are welded to ensure the air tightness, the processing technical difficulty and the cost caused by integral punch forming are avoided, meanwhile, the air tightness can be effectively guaranteed, and the packaging reliability is improved.
(2) The invention adopts a back-to-back double-chamber design, the two chambers are electrically interconnected through self lead posts, and compared with the traditional scheme that each chamber is independently processed and connected through leads, the invention greatly improves the integration and reliability of the product and reduces the volume.
Drawings
FIG. 1 is an exploded view of a dual chamber metal package housing in accordance with the present invention;
FIG. 2 is a schematic view of a sensing element mounting housing;
fig. 3 is a schematic view of an electronic component mounting case, in which (a) is a schematic view of a surface in contact with a sensitive component mounting case and (b) is a schematic view of an inside of a channel structure;
FIG. 4 is a schematic view of a sensitive element mounting case and an electronic component mounting case being welded together;
FIG. 5 is a schematic view of a sensor mounting;
FIG. 6 is a schematic diagram of a seal cap of a sensitive element mounting cavity;
FIG. 7 is a schematic view of electronic component mounting;
in the figure: 100 denotes a sensor mounting cavity cap, 200 denotes a sensor mounting case, 300 denotes an electronic component mounting case, 400 denotes an electronic component mounting cavity cap, 500 denotes a two-chamber case structure, 201 denotes a mounting boss, 202 denotes a solder ring, 501 denotes a sensor, 502 denotes an inner lead post, 503 denotes an outer lead post, and 504 denotes an electronic component.
Detailed Description
Aiming at the current requirements, the invention provides the double-chamber metal packaging shell based on the energy storage welding mode, simultaneously meets the hybrid integrated packaging of the sensitive element of the MEMS sensor and the key electronic component, adopts the discrete processing mode to save the cost, and has great advantages in the aspects of the performance stability, the volume, the integration level and the cost of the MEMS sensor.
As shown in fig. 1, the dual-chamber metal package housing based on the energy storage welding manner of the present invention includes a sensitive element installation cavity sealing cap 100, a sensitive element installation shell 200, an electronic component installation shell 300, and an electronic component installation cavity sealing cap 400.
As shown in fig. 3, the electronic component mounting case 300 has a groove-shaped structure, a through hole is formed on a bottom surface, a circle of convex ribs is formed on a circumferential surface of an inner side of the through hole, and a plurality of outer lead posts 503 are arranged on the bottom surface and outside the through hole.
As shown in fig. 2, the shape of the sensing element mounting case 200 is matched with the shape of a through hole in the bottom surface of the electronic component mounting case 300, a mounting boss 201 is provided at the center of the upper surface of the sensing element mounting case 200, a plurality of inner lead posts 502 are provided around the mounting boss 201, and a solder ring 202 is provided at the edge of the sensing element mounting case 200 along the circumferential direction;
fig. 3 (a) is a schematic view of a surface in contact with the sensor mounting case, and (b) is a schematic view of an inside of the channel structure. The electronic component mounting case 300 is inverted, and the sensitive component mounting case 200 is placed on the rib on the inner side of the through hole of the electronic component mounting case 300 and connected to the electronic component mounting case 300 by welding to form a dual-chamber case structure 500 having a sensitive component mounting cavity on the front and an electronic component mounting cavity on the back. Fig. 4 is a schematic diagram illustrating welding of the sensitive element mounting housing and the electronic component mounting housing.
During packaging, the sensor 501 is mounted in a sensor mounting cavity and connected to the inner lead post 502 through a lead, as shown in fig. 5. The electronic component 504 is attached to the electronic component mounting cavity and connected to the inner lead post 502 and the outer lead post 503 through leads, as shown in fig. 7. The sensor mounting cavity cap 100 is used to seal the sensor mounting cavity, and the brim of the sensor mounting cavity cap 100 is in contact with the solder ring 202, as shown in fig. 6. The electronic component mounting cavity sealing cap 400 is used to seal the electronic component mounting cavity.
The invention relates to a packaging method of a double-chamber metal packaging shell based on an energy storage welding mode, which comprises the following steps:
firstly, machining a sensitive element mounting shell 200 by a machining method, punching a mounting boss 201 at the center of the upper surface of the sensitive element mounting shell 200 by a punching method, punching a solder ring 202 at the edge of the sensitive element mounting shell 200 along the circumferential direction, and machining a plurality of inner lead posts 502 around the mounting boss 201;
secondly, processing a groove-shaped electronic component mounting shell 300 by a machining method, processing a through hole on the bottom surface of the electronic component mounting shell 300, and processing a plurality of outer lead posts 503 on the bottom surface of the outer side of the through hole;
thirdly, the electronic component mounting shell 300 is inverted, the sensitive element mounting shell 200 is placed on a through hole of the electronic component mounting shell 300 and is connected with the electronic component mounting shell 300 through welding, a double-chamber shell structure is formed after welding, the sensitive element mounting cavity is arranged on the front surface, the electronic component mounting cavity is arranged on the back surface, the two cavities are hermetically packaged respectively, one end of the inner lead column 502 is positioned in the sensitive element mounting cavity, and the other end of the inner lead column is positioned in the electronic component mounting cavity; one end of the outer lead post 503 is located in the electronic component mounting cavity, and the other end is used for connecting with the outside;
fourthly, the sensitive element is attached to the mounting boss 201 of the sensitive element mounting cavity, the sensitive element is connected with the inner lead post 502 through a lead, electrical connection is provided for the electronic element mounting cavity through the inner lead post 502, and then the sensitive element mounting cavity sealing cap 100 is welded with the sensitive element mounting shell 200 in an energy storage sealing mode to achieve airtight packaging of the sensitive element mounting cavity; the sensitive element mounting cavity can be filled with inert gas during energy storage sealing welding so as to improve the performance stability of the sensitive element.
Fifthly, the electronic component is attached in the electronic component mounting cavity and is connected with the inner lead post 502 and the outer lead post 503 through leads or printed circuits, then the electronic component is hermetically packaged by the electronic component mounting cavity sealing cap 400 in a vacuum parallel seam welding or vacuum eutectic welding mode, and inert gas can be filled during packaging to improve the performance stability of the electronic component.
The invention provides a double-chamber metal packaging shell by improving and designing the packaging of the existing product on the basis of considering the application development trend of an MEMS sensor, and the double-chamber metal packaging shell can meet the requirements of high integration, high reliability, low cost, small volume and the like of the product. The advantage of this design lies in two independent preparation encapsulation cavities, and two cavity structures adopt components of a whole that can function independently processing mode, and the independent preparation of sensing element installation cavity is applicable to energy storage welding process, gets up two cavities welding again and guarantees the gas tightness, avoids the processing technology degree of difficulty and the cost that integrative punching press brought, and the gas tightness can effectively be ensured simultaneously. By the method, the processing cost can be effectively saved, the processing difficulty is effectively reduced, and the packaging reliability is improved.
The invention is not described in detail and is within the knowledge of a person skilled in the art.
Claims (7)
1. The utility model provides a two-chamber metal package shell based on energy storage welding mode which characterized in that: the electronic component mounting device comprises a sensitive element mounting cavity sealing cap (100), a sensitive element mounting shell (200), an electronic component mounting shell (300) and an electronic component mounting cavity sealing cap (400);
the electronic component mounting shell (300) is of a groove-shaped structure, a through hole is processed on the bottom surface, and a plurality of outer lead posts (503) are symmetrically arranged on the bottom surface and outside the through hole;
the shape of the sensitive element mounting shell (200) is matched with that of a through hole in the bottom surface of the electronic component mounting shell (300), a mounting boss (201) is arranged in the center of the upper surface of the sensitive element mounting shell (200), a plurality of inner lead posts (502) are symmetrically arranged around the mounting boss (201), and a solder ring (202) is arranged on the edge of the sensitive element mounting shell (200) along the circumferential direction;
the electronic component mounting shell (300) is inverted, the sensitive element mounting shell (200) is placed on the through hole of the electronic component mounting shell (300) and is connected with the through hole in a welding mode, a double-chamber shell structure is formed after welding, the front side is a sensitive element mounting cavity, and the back side is an electronic component mounting cavity;
during packaging, a sensitive element is attached in a sensitive element mounting cavity and is connected with an inner lead column (502) through a lead, an electronic element is attached in the electronic element mounting cavity and is connected with the inner lead column (502) and an outer lead column (503) through leads, a sensitive element mounting cavity sealing cap (100) is used for sealing the sensitive element mounting cavity, and the brim of the sensitive element mounting cavity sealing cap (100) is in contact with a solder ring (202); the electronic component mounting cavity sealing cap (400) is used for sealing the electronic component mounting cavity.
2. The dual-chamber metal packaging shell based on the energy storage welding mode as claimed in claim 1, wherein: a circle of convex ribs are arranged on the inner circumferential surface of the through hole on the bottom surface of the electronic component mounting shell (300).
3. The dual-chamber metal packaging shell based on the energy storage welding mode as claimed in claim 2, wherein: the sensitive element mounting shell (200) is arranged on the convex edge on the inner side of the through hole of the electronic component mounting shell (300) and is connected with the electronic component mounting shell (300) through welding.
4. A packaging method of a double-chamber metal packaging shell based on an energy storage welding mode is characterized by comprising the following steps:
firstly, machining a sensitive element mounting shell (200) by a machining method, punching a mounting boss (201) at the center of the upper surface of the sensitive element mounting shell (200) by a punching method, punching a solder ring (202) at the edge of the sensitive element mounting shell (200) along the circumferential direction, and machining a plurality of inner lead posts (502) around the mounting boss (201);
secondly, processing a groove-shaped electronic component mounting shell (300) by a mechanical processing method, processing a through hole on the bottom surface of the electronic component mounting shell (300), and processing a plurality of outer lead posts (503) on the bottom surface of the outer side of the through hole;
thirdly, the electronic component mounting shell (300) is inverted, the sensitive element mounting shell (200) is placed on a through hole of the electronic component mounting shell (300), the electronic component mounting shell and the sensitive element mounting shell are connected through welding to form a double-chamber shell structure after welding, the front surface of the double-chamber shell structure is a sensitive element mounting cavity, the back surface of the double-chamber shell structure is an electronic component mounting cavity, the two cavities are respectively hermetically packaged, one end of an inner lead column (502) is located in the sensitive element mounting cavity, and the other end of the inner lead column is located in the electronic component mounting cavity; one end of the outer lead post (503) is positioned in the electronic component mounting cavity, and the other end is used for providing external electric signal connection;
fourthly, the sensitive element is attached to an installation boss (201) of the sensitive element installation cavity, the sensitive element is connected with an inner lead post (502) through a lead, electric signal connection is provided for the electronic component installation cavity through the inner lead post (502), and then a sealing cap (100) of the sensitive element installation cavity is welded with the sensitive element installation shell (200) in an energy storage sealing welding mode to achieve airtight packaging of the sensitive element installation cavity;
fifthly, the electronic component is attached in the electronic component mounting cavity and is connected with the inner lead column (502) and the outer lead column (503) through leads or printed circuits, and then the electronic component is hermetically packaged by utilizing the electronic component mounting cavity sealing cap (400).
5. The method for encapsulating the double-chamber metal encapsulation shell based on the energy storage welding mode as claimed in claim 4, wherein the method comprises the following steps: and in the fourth step, inert gas is filled into the sensitive element mounting cavity during energy storage sealing welding so as to improve the performance stability of the sensitive element.
6. The packaging method of the double-chamber metal packaging shell based on the energy storage welding mode as claimed in claim 4, characterized in that: and in the fifth step, the encapsulation mode of carrying out airtight encapsulation on the electronic component by utilizing the sealing cap (400) of the electronic component mounting cavity is vacuum parallel seam welding or vacuum eutectic welding.
7. The method for encapsulating the double-chamber metal encapsulation shell based on the energy storage welding mode as claimed in claim 6, wherein the method comprises the following steps: when the electronic component is hermetically packaged by using the electronic component mounting cavity sealing cap (400), inert gas is filled to improve the performance stability of the electronic component.
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