CN103435001B - Mixed integrated circuit apparatus and method for packing - Google Patents
Mixed integrated circuit apparatus and method for packing Download PDFInfo
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- CN103435001B CN103435001B CN201310336288.5A CN201310336288A CN103435001B CN 103435001 B CN103435001 B CN 103435001B CN 201310336288 A CN201310336288 A CN 201310336288A CN 103435001 B CN103435001 B CN 103435001B
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Abstract
The present invention discloses a kind of mixed integrated circuit apparatus and method for packing, to solve hybrid integrated circuit miniaturization, light-weighted technical problem.A kind of mixed integrated circuit apparatus, comprise housing, housing inner bottom part is provided with insulated substrate, described insulated substrate is printed on conductive pattern, described conductive pattern is fixed with circuit element, inside and outside described housing bottom, both sides are respectively equipped with the upper lead-in wire and lower lead-in wire that are connected with conductive pattern, described enclosure interior is provided with the cover plate of band centre bore, described cover plate is provided with installing component, and described installing component is connected with upper lead-in wire, and described housing is connected with pipe cap.Hinge structure of the present invention has the following advantages: bottom inventive shell, upper and lower both sides are all provided with lead-in wire, housing is built with installing component, electrical connection is had with other module of system and installing component while of energy, can high-density installation element, reduce encapsulation volume and the thickness of overall package structure, hybrid component can be made miniaturized.
Description
Technical field
The present invention relates to a kind of mixed integrated circuit apparatus and method for packing.
Background technology
In recent years, along with electronic product is constantly towards light, thin, short, little future development, integrated circuit also to high density, compact future development, in addition, because the function of product gets more and more, makes most product all adopt modular mode Integration Design.But, integrate the module of multiple difference in functionality in the product, although made the function of product increase considerably, but under the demand being particular about product miniaturization and attractive appearance now, how will design and have the little and product that function is many of small product size concurrently, be the target that modern electronic product manufacturer does one's utmost to study.
In addition, in order to make electronic product be rapidly to miniaturization.In semiconductor manufacturing, be the chip or the element that are constantly produced small volume by more and more high-end technology, to make the module manufacturers of application relatively be designed less functional module, carry out allowing end product be used more effectively.
A kind of hybrid integrated circuit ceramic packaging shell is mentioned in patent CN202652063U, this patent comprises ceramic shell, upper substrate and subtegulum, described ceramic cartridge inside is provided with the exit welding stage of connecting circuit and inner welding stage, the outer wall of ceramic shell is provided with the pin be connected with exit welding stage, upper substrate is installed on inner welding stage, and subtegulum is installed on the bottom of ceramic cartridge.The hybrid integrated circuit of this ceramic packaging shell adopts the mode of multilager base plate layout, the solid that can realize element is arranged, reduce substrate area, reduce size and the volume of encapsulating products, but the shell size of this material is limited, be not suitable for the hybrid integrated circuit encapsulation that board area is larger.
In existing technology, although adopt different schemes to reach the object of product miniaturization, multifunction, the housing in these technology is all one-sided extraction lead-in wire, can only be electrically connected at the one-sided of housing and other module in system.But, in the application that some are special, when also needing to be electrically connected with installing component etc., need installing component to be placed in other device, and then be connected with hybrid integrated circuit, so just occupy the area that whole system is very large, this is miniaturized to hybrid integrated circuit, lightweight is a kind of restriction.
Summary of the invention
The object of this invention is to provide a kind of mixed integrated circuit apparatus, to solve hybrid integrated circuit miniaturization, light-weighted technical problem.
Another object of the present invention is to provide a kind of method for packing of mixed integrated circuit apparatus.
In order to achieve the above object, the present invention is by the following technical solutions: a kind of mixed integrated circuit apparatus, comprise housing, housing inner bottom part is provided with insulated substrate, described insulated substrate is printed on conductive pattern, described conductive pattern is fixed with circuit element, inside and outside described housing bottom, both sides are respectively equipped with the upper lead-in wire and lower lead-in wire that are connected with conductive pattern, described enclosure interior is provided with the cover plate of band centre bore, described cover plate is provided with installing component, described installing component is connected with upper lead-in wire, and described housing is connected with pipe cap.
As improvement of the present invention, described conductive pattern and upper wire bonds, described conductive pattern and lower lead-in wire are that bonding is connected, and described installing component and upper lead-in wire are that bonding is connected.
As a further improvement on the present invention, upper lead-in wire bottom is 0.8-1.2mm to the distance of housing outer bottom, described upper lead-in wire bottom is by glass insulation subcovering, the diameter of described glass insulator is 3-4 times of upper diameter wire, described lower guide-wire tip exceeds housing inner bottom part, and lower guide-wire tip height is not less than 2 times of lower diameter wire.
As a further improvement on the present invention, step in the housing that described enclosure interior is provided with securing cover plate, in described housing, the width of step is 0.5-0.9mm, and described outside is provided with the housing outer step of fixing pipe cap, and the width of described housing outer step is 0.4-0.8mm.
As a further improvement on the present invention, described insulated substrate is provided with upper lead hole corresponding with upper lead-in wire and lower lead-in wire respectively and lower lead hole, the diameter of described upper lead hole and lower lead hole is 0.2-0.4mm larger than the diameter of upper lead-in wire and lower lead-in wire respectively, and described insulated substrate arranges two parallel sidebands.
As a further improvement on the present invention, described pipe cap is provided with sealing cap muscle and pipe cap outer rim, sealing cap muscle is 0.4-0.6mm apart from the distance at pipe cap edge, sealing cap muscle is 0.18-0.2mm apart from the height bottom pipe cap outer rim, the width of pipe cap outer rim equals the width L2 of housing outer step, and the outer edge thickness of pipe cap is less than 0.4mm.
As a further improvement on the present invention, described cover plate is provided with and the upper cover plate through hole going between corresponding, described cover plate through hole is corresponding with the position of described upper lead hole, the diameter 0.2-0.4mm larger than the diameter of upper lead-in wire of described cover plate through hole, on described cover plate, the diameter of centre bore is 0.1-0.3mm.
A method for packing for mixed integrated circuit apparatus, comprises the following steps:
A, fixed insulation substrate: the upper lead hole on insulating substrate and lower lead hole are aimed at upper lead-in wire and lower lead-in wire respectively, make lead-in wire and lower lead-in wire through insulating substrate, then be fixed on by insulating substrate on housing inner bottom part;
B, connecting circuit element: the circuit element comprising semiconductor chip and capacity cell is installed on an insulating substrate, the conductive pattern on insulating substrate is connected with upper lead-in wire and lower lead-in wire;
C, capping plate: make and the equirotal epoxy film of cover plate, epoxy film is placed on the cover board, light pressure epoxy film makes itself and cover plate be close to, then is fixed in housing on step by the cover plate being bonded with epoxy film, and putting into temperature is that the baking oven of 150-160 DEG C cures 115-125min;
D, store after inflated with nitrogen: the housing of capping is placed on temperature be 145-155 DEG C fill in nitrogen baking oven store 48 hours, nitrogen is filled with by the centre bore of cover plate, make the circuit element in housing cavity be in nitrogen protection state, finally again centre bore sealing resin is sealed;
E, fixed installation parts: make and the equirotal epoxy diaphragm of installing component, epoxy diaphragm is placed on below installing component, light pressure installing component makes itself and epoxy diaphragm be close to, putting into temperature is take out after the baking oven of 150-160 DEG C cures 115-125min to dry in the air to room temperature, then is connected with upper lead-in wire by installing component;
F, tube sealing cap: the housing and pipe cap that are provided with circuit element and installing component are put into temperature be 145-155 DEG C fill nitrogen baking oven store 4 hours, then putting into temperature is that the different in nature cap sealing machine baking oven of 120-130 DEG C cures 4 hours, curing environment is vacuum environment, vacuum degree is 85-95kPa, stop after curing vacuumizing, in baking oven, be filled with nitrogen encapsulation.
As a further improvement on the present invention, in described steps A, insulating substrate is bonded on housing inner bottom part, and the housing being bonded with insulating substrate being put into temperature is that the baking oven of 150-160 DEG C cures 60-70min.
As a further improvement on the present invention, when making epoxy film in described step C, make mould according to the size of cover plate, mould is vertically placed on epoxy lamina membranacea, make the measure-alike face of mould and cover plate contact epoxy lamina membranacea, then knock mould formation size and the equirotal epoxy film of cover plate.
Hinge structure of the present invention has the following advantages: bottom inventive shell, upper and lower both sides are all provided with lead-in wire, housing is built with installing component, electrical connection is had with other module of system and installing component while of energy, do not need installing component to be placed in other device, but installing component is fixed on hybrid integrated circuit inside modules, the device formed a whole, can high-density installation element, reduce encapsulation volume and the thickness of overall package structure, hybrid component can be made miniaturized, can production process be simplified simultaneously, reduce costs.Novel structure of the present invention, design ingenious, encapsulation easily, lead-in wire connect reliable, be particularly suitable for producing in enormous quantities.
Accompanying drawing explanation
Fig. 1 is the structural representation of mixed integrated circuit apparatus;
Fig. 2 be mixed integrated circuit apparatus not mounting pipe cap time upward view;
Fig. 3 is the structural representation of the leaded housing in the upper and lower both sides of mixed integrated circuit apparatus;
Fig. 4 is the structural representation that mixed integrated circuit apparatus is provided with the insulating substrate of circuit element;
Fig. 5 is the structural representation of mixed integrated circuit apparatus cover plate;
Fig. 6 is the structural representation of mixed integrated circuit apparatus pipe cap;
Fig. 7 is A portion partial enlarged drawing in Fig. 6.
Fig. 8 is the schematic diagram that mixed integrated circuit apparatus method for packing makes epoxy film.
Reference numeral implication is as follows: 1. time lead-in wire, 2. insulating substrate, 3. housing inner bottom part, 4. housing outer bottom, 5A. semiconductor chip, 5B. capacity cell, 6. conductive pattern, 7. glass insulator, 8. housing cavity, 9. housing, 11. epoxy diaphragms, 12. installing components, go between on 13., 14. cover plates, step in 15. housings, 16. pipe caps, 17. housing outer step, 20. cover plate through holes, 21. centre bores, 22 parallel sidebands, 23. pipe cap outer rims, 24. epoxy lamina membranaceas, 25. epoxy films, 26. moulds, the upper lead hole of 19A., lead hole under 19B., the width of step in L1-housing, the width of L2-housing outer step, L3-above go between the distance of bottom to housing outer bottom, L4-lower guide-wire tip height, L5-sealing cap muscle is apart from the distance at pipe cap edge, L6-sealing cap muscle is apart from the height bottom pipe cap outer rim, the width of L7-pipe cap outer rim, the outer edge thickness of L8-pipe cap, the diameter of Φ d-cover plate, the internal diameter of step in Φ d1-housing, the external diameter of step in Φ d2-housing, the internal diameter of Φ d3-housing outer step, the diameter of Φ d4-glass insulator.
Embodiment
Execution mode below can further illustrate the present invention, but does not limit the present invention in any way.
As Figure 1-3, a kind of mixed integrated circuit apparatus, comprise the cut down 4J29 housing 9 that material adopts more than 90%, housing inner bottom part 3 is provided with insulated substrate 2, insulated substrate 2 is printed on conductive pattern 6, conductive pattern 6 is fixed with circuit element, bottom housing 9, inside and outside both sides are respectively equipped with the upper lead-in wire 13 and lower lead-in wire 1 that are connected with conductive pattern 6, conductive pattern 6 welds with upper lead-in wire 13, conductive pattern 6 with lower lead-in wire 1 for bonding is connected, upper lead-in wire 13 does not stretch out housing outer bottom 4, upper lead-in wire bottom is 0.8-1.2mm to the distance L3 of housing outer bottom, upper lead-in wire 13 bottom is covered by glass insulator 7, prevent lead-in wire 13 from lifting one's head and cause electromagnetic interference, the diameter of phi d4 of glass insulator 7 is 3-4 times of upper lead-in wire 13 diameter, dielectric strength in raising between lead-in wire 13 and housing 9.The top of lower lead-in wire 1 exceeds housing inner bottom part, and lower guide-wire tip height height L4 is not less than 2 times for lower diameter wire, otherwise bond strength is affected.Housing 9 inside is provided with step 15 in housing, in housing, the width L1 of step is 0.5-0.9mm, in housing, step 15 is provided with the cover plate 14 of band centre bore 21, cover plate 14 is provided with the installing component 12 be connected with upper lead-in wire 13 bonding, housing 9 outside is provided with the outer step 17 of fixing pipe cap 16, and the width L2 of housing outer step is 0.4-0.8mm.
As shown in Figure 4, insulated substrate 2 is provided with upper lead hole 19A corresponding with upper lead-in wire 13 and lower lead-in wire 1 respectively and lower lead hole 19B, the diameter of upper lead hole 19A and lower lead hole 19B is 0.2-0.4mm larger than the diameter of upper lead-in wire 13 and lower lead-in wire 1 respectively, pass through insulating substrate 2 so that go between up and down simultaneously, the insulated substrate 2 of circle is arranged two parallel sidebands 22, so that fixed insulation substrate 2.In the present embodiment, upper lead hole 19A is identical with the quantity of upper lead-in wire 13, has 4, and lower lead hole 19B is identical with the quantity of lower lead-in wire 1, has 6.Certainly, the quantity basis of upper lead-in wire and lower lead-in wire needs and determines, and is not fixing.
As shown in Figure 5, cover plate 14 is provided with the cover plate through hole 20 corresponding with upper lead-in wire 13, and the diameter 0.2-0.4mm larger than the diameter of upper lead-in wire 13 of cover plate through hole 20, so that upper lead-in wire 13 passes through cover plate 14; And the diameter of phi d of cover plate 14 should in the centre of case inside step 15, i.e. Φ d=(Φ d1+ Φ d2)/2.Φ d1 is the internal diameter of step 15 in housing, and Φ d2 is the external diameter of step 15 in housing, and the diameter of the centre bore 21 on cover plate 14 is 0.1-0.3mm, is filled with nitrogen after being convenient to capping, makes the circuit element in housing cavity 8 be in nitrogen protection state.In addition, centre bore 21 also can in other position of cover plate 14.
As shown in Figure 7, described pipe cap 16 is provided with sealing cap muscle 10 and pipe cap outer rim 23, and the inside diameter of pipe cap 16 is arranged to
, and the internal diameter Φ d3 of housing outer step 17 is set to
, pipe cap 16 and housing 9 are just combined closely, realize seamless encapsulation.In order to products air tightness is good, sealing cap muscle is 0.4-0.6mm apart from the distance L5 at pipe cap edge, sealing cap muscle is 0.18-0.2mm apart from the height L6 bottom pipe cap outer rim, the width L7 of pipe cap outer rim equals the width L2 of housing outer step, make housing 9 and pipe cap 16 after sealing cap, form integration, whole device seems more attractive in appearance, and the outer edge thickness L8 of pipe cap is less than 0.4mm.
A method for packing for mixed integrated circuit apparatus, comprises the following steps:
A, fixed insulation substrate: the upper lead hole 19A on insulating substrate 2 and lower lead hole 19B is aimed at upper lead-in wire 13 and lower lead-in wire 1 respectively, make lead-in wire 13 and lower lead-in wire 1 simultaneously through insulating substrate 2, then be bonded on housing inner bottom part 3 by insulating substrate 2; Insulating substrate 2 also can adopt the mode of welding to be fixed on housing inner bottom part 3, when the circuit element used in mixed integrated circuit apparatus is for non-power device, adopts bonding way; When this circuit element is power device, adopt welding manner.When adopting bonding way, the baking oven housing 9 being bonded with insulating substrate 2 being put into self-control 150-160 DEG C cures 60-70min.Adopt during welding manner and weld mode with current-carrying;
B, connecting circuit element: semiconductor chip (5A) is fixed on insulating substrate 2 by means of conductive adhesive, by welded and installed capacity cell (5B) on insulating substrate 2, conductive pattern 6 is connected with upper lead-in wire 13 by welding procedure, and is connected with lower lead-in wire 1 by bonding technology.In addition, conductive pattern 6 wherein also can be connected with lower lead-in wire 1 by welding procedure.
C, capping plate: as shown in Figure 8, when making epoxy film 25, mould 26 is made according to the size of cover plate 14, mould 26 is vertically placed on epoxy lamina membranacea 24, make mould 26 face measure-alike with cover plate 14 contact epoxy lamina membranacea 24, then knock mould 26 with iron hammer and form size and the equirotal epoxy film 25 of cover plate 14.Be placed on by epoxy film 25 on cover plate 14, light pressure epoxy film 25 makes itself and cover plate 14 be close to, then to be fixed to by the cover plate 14 being bonded with epoxy film 25 in housing on step 15, and putting into temperature is that the baking oven of 150-160 DEG C cures 115-125min;
D, store after inflated with nitrogen: the housing 9 of capping is placed on temperature be 145-155 DEG C fill in nitrogen baking oven store 48 hours, nitrogen is filled with by the centre bore 21 of cover plate 14, make the circuit element in housing cavity 8 be in nitrogen protection state, finally again centre bore 21 is sealed with sealing resin;
E, fixed installation parts: make and the equirotal epoxy diaphragm 11 of installing component 12, epoxy diaphragm 11 is placed on below installing component 12, light pressure installing component 12 makes itself and epoxy diaphragm 11 be close to, putting into temperature is take out after the baking oven of 150-160 DEG C cures 115-125min to dry in the air to room temperature, then is connected by bonding technology with upper lead-in wire 13 by installing component 12;
F, tube sealing cap: adopt ACW-WZCD5200 opposite sex cap sealing machine to encapsulate, this operation is by means of different in nature cap sealing system, under high-purity nitrogen environment under (99.9%), utilize the energy storage principle of electric capacity, charge storage is inner at electric capacity, when upper and lower mould contacts with pipe base, utilize sparking of electric capacity, will form at housing 9 and pipe cap 16 contact position the soldering and sealing ring that a contact resistance is evenly distributed, housing 9 and pipe cap 16 are welded together reliably.
The housing 9 and pipe cap 16 that are provided with circuit element and installing component 12 being put into temperature is that the cleaning of 145-155 DEG C is filled nitrogen baking oven and stored 4 hours, then putting into temperature is that the different in nature cap sealing machine baking oven of 120-130 DEG C cures 4 hours, curing environment is vacuum environment, and vacuum degree is 85-95kPa; Stop after curing vacuumizing, nitrogen is filled with by baking oven, for ensureing products air tightness requirement, supporting encapsulating mould is made according to housing 9, again according to stored energy welding optimum configurations experience, technological parameter setting is carried out to Guan Ji and examination envelope, strict control stored energy welding parameter, sealing cap charging voltage: 400 ~ 700V; System pressure: 50kPa ~ 70kPa; Time of contact: 50 ~ 70 cycles; Retention time: 50 ~ 70 cycles; Internal moisture diffusion < 5000ppm.
During soldering and sealing, temperature, pressure, time controling are wanted strict, clear and definite, prevent the air-tightness affecting product because optimum configurations is improper from even causing the damage of Guan Ji.
The foregoing is only better possible embodiments of the present invention, not thereby limit the scope of the claims of the present invention.Therefore the equivalence techniques change that every utilization technical scheme of the present invention and accompanying drawing illustrate, be all contained within the technical scope of the present invention.
Claims (3)
1. a method for packing for mixed integrated circuit apparatus, is characterized in that: comprise the following steps:
A, fixed insulation substrate: the upper lead hole (19A) on insulating substrate (2) and lower lead hole (19B) are aimed at respectively lead-in wire (13) and lower lead-in wire (1), make lead-in wire (13) and lower lead-in wire (1) through insulating substrate (2), then insulating substrate (2) is fixed on housing inner bottom part (3);
B, connecting circuit element: be arranged on insulating substrate (2) by the circuit element comprising semiconductor chip (5A) and capacity cell (5B), make the conductive pattern (6) on insulating substrate (2) be connected with upper lead-in wire (13) and lower lead-in wire (1);
C, capping plate: make and cover plate (14) equirotal epoxy film (25), epoxy film (25) is placed on cover plate (14), light pressure epoxy film (25) makes itself and cover plate (14) be close to, be fixed on step in housing (15) by the cover plate (14) being bonded with epoxy film (25), putting into temperature is that the baking oven of 150-160 DEG C cures 115-125min again;
D, store after inflated with nitrogen: the housing (9) of capping is placed on temperature be 145-155 DEG C fill in nitrogen baking oven store 48 hours, nitrogen is filled with by the centre bore (21) of cover plate (14), make the circuit element in housing cavity (8) be in nitrogen protection state, finally again centre bore (21) is sealed with sealing resin;
E, fixed installation parts: make and the equirotal epoxy diaphragm (11) of installing component (12), epoxy diaphragm (11) is placed on below installing component (12), light pressure installing component (12) makes itself and epoxy diaphragm (11) be close to, putting into temperature is take out after the baking oven of 150-160 DEG C cures 115-125min to dry in the air to room temperature, then is connected with upper lead-in wire (13) by installing component (12);
Tube sealing cap: the housing (9) and pipe cap (16) that are provided with circuit element and installing component (12) are put into temperature be 145-155 DEG C fill nitrogen baking oven store 4 hours, then putting into temperature is that the different in nature cap sealing machine baking oven of 120-130 DEG C cures 4 hours, curing environment is vacuum environment, vacuum degree is 85-95kPa, stop after curing vacuumizing, in baking oven, be filled with nitrogen encapsulation.
2. the method for packing of a kind of mixed integrated circuit apparatus according to claim 1, it is characterized in that: in described steps A, insulating substrate (2) is bonded on housing inner bottom part (3), the housing (9) being bonded with insulating substrate (2) being put into temperature is that the baking oven of 150-160 DEG C cures 60-70min.
3. the method for packing of a kind of mixed integrated circuit apparatus according to claim 2, it is characterized in that: when making epoxy film (25) in described step C, mould (26) is made according to the size of cover plate (14), mould (26) is vertically placed on epoxy lamina membranacea (24), make mould (26) face measure-alike with cover plate (14) contact epoxy lamina membranacea (24), then form size and cover plate (14) equirotal epoxy film (25) with knocking mould (26).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310336288.5A CN103435001B (en) | 2013-08-05 | 2013-08-05 | Mixed integrated circuit apparatus and method for packing |
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|---|---|---|---|
| CN201310336288.5A CN103435001B (en) | 2013-08-05 | 2013-08-05 | Mixed integrated circuit apparatus and method for packing |
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| CN103435001A CN103435001A (en) | 2013-12-11 |
| CN103435001B true CN103435001B (en) | 2016-03-02 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105322317B (en) * | 2014-11-18 | 2017-08-25 | 中国计量科学研究院 | A kind of vacuum system, multi-stage vacuum system and their feedthrough electrical connection methods |
| CN110289245B (en) * | 2019-05-09 | 2021-12-07 | 北京新雷能科技股份有限公司 | Three-dimensional packaging structure of hybrid integrated circuit and manufacturing method thereof |
| CN110854087B (en) * | 2019-11-27 | 2021-10-01 | 南通优睿半导体有限公司 | Heat-dissipation type packaging mechanism with adjusting structure for double-base-island DSOP chip |
| CN111180436B (en) * | 2020-01-22 | 2022-09-06 | 北京新雷能科技股份有限公司 | Double-layer packaging structure of hybrid integrated circuit and manufacturing method thereof |
| CN111834353B (en) * | 2020-07-17 | 2023-03-24 | 北京市科通电子继电器总厂有限公司 | SIP laminated structure |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101049904A (en) * | 2006-04-07 | 2007-10-10 | 甘志银 | Vacuum packaging method and equipment |
| CN101253627A (en) * | 2005-08-31 | 2008-08-27 | 三洋电机株式会社 | Circuit device and method for manufacturing same |
| CN101562944A (en) * | 2008-04-16 | 2009-10-21 | 欣兴电子股份有限公司 | Circuit board and manufacturing technology thereof |
| CN102297741A (en) * | 2010-06-25 | 2011-12-28 | 中国科学院电子学研究所 | Silicon resonant air pressure sensor based on Micro-Electro-Mechanical Systems |
| CN102420223A (en) * | 2010-09-24 | 2012-04-18 | 安森美半导体贸易公司 | Circuit device and method for manufacturing the same |
| CN202269122U (en) * | 2011-10-28 | 2012-06-06 | 天水七四九电子有限公司 | Anti-interference double-cavity parallel soldering and sealing metal shell mixed assembly structure |
| CN202616238U (en) * | 2012-01-16 | 2012-12-19 | 江苏科融电子技术有限公司 | Semiconductor packaging structure component used for pyroelectric infrared sensor and sensor thereof |
| CN202652063U (en) * | 2012-07-06 | 2013-01-02 | 陕西省电子技术研究所 | Ceramic encapsulating tube shell for hybrid integrated circuit |
| CN203398107U (en) * | 2013-08-05 | 2014-01-15 | 天水华天微电子股份有限公司 | Hybrid integrated circuit device |
-
2013
- 2013-08-05 CN CN201310336288.5A patent/CN103435001B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101253627A (en) * | 2005-08-31 | 2008-08-27 | 三洋电机株式会社 | Circuit device and method for manufacturing same |
| CN101049904A (en) * | 2006-04-07 | 2007-10-10 | 甘志银 | Vacuum packaging method and equipment |
| CN101562944A (en) * | 2008-04-16 | 2009-10-21 | 欣兴电子股份有限公司 | Circuit board and manufacturing technology thereof |
| CN102297741A (en) * | 2010-06-25 | 2011-12-28 | 中国科学院电子学研究所 | Silicon resonant air pressure sensor based on Micro-Electro-Mechanical Systems |
| CN102420223A (en) * | 2010-09-24 | 2012-04-18 | 安森美半导体贸易公司 | Circuit device and method for manufacturing the same |
| CN202269122U (en) * | 2011-10-28 | 2012-06-06 | 天水七四九电子有限公司 | Anti-interference double-cavity parallel soldering and sealing metal shell mixed assembly structure |
| CN202616238U (en) * | 2012-01-16 | 2012-12-19 | 江苏科融电子技术有限公司 | Semiconductor packaging structure component used for pyroelectric infrared sensor and sensor thereof |
| CN202652063U (en) * | 2012-07-06 | 2013-01-02 | 陕西省电子技术研究所 | Ceramic encapsulating tube shell for hybrid integrated circuit |
| CN203398107U (en) * | 2013-08-05 | 2014-01-15 | 天水华天微电子股份有限公司 | Hybrid integrated circuit device |
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| CN103435001A (en) | 2013-12-11 |
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