CN205820886U - A kind of gas sensor based on chip-stacked technology and encapsulating structure thereof - Google Patents
A kind of gas sensor based on chip-stacked technology and encapsulating structure thereof Download PDFInfo
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- CN205820886U CN205820886U CN201620814993.0U CN201620814993U CN205820886U CN 205820886 U CN205820886 U CN 205820886U CN 201620814993 U CN201620814993 U CN 201620814993U CN 205820886 U CN205820886 U CN 205820886U
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Abstract
The utility model discloses a kind of gas sensor based on chip-stacked technology and encapsulating structure thereof, including package substrate, IC chip, at least one gas sensor chip, wire, multiple pad and pin；Described IC chip is bonded in the front of described package substrate, described pin is arranged at the back side of package substrate, each gas sensor chip described is glued respectively on IC chip, described pad is separately positioned in IC chip, gas sensor chip and package substrate, described pin is connected with the pad in package substrate, and the pad in described package substrate, IC chip and gas sensor chip realizes electrical connection by wire bonding respectively.Use an IC chip to mate the mode of multiple gas sensor chip, not only increase integrated level, and integrate and unified the output signal of multiple gas sensor chip, improve pervasive degree and the range of application of sensor application.
Description
Technical field
This utility model relates to a kind of gas detection technology based on MEMS technology, in particular a kind of based on chip
The gas sensor of Stack Technology and encapsulating structure thereof.
Background technology
Gas sensor is that composition specific in gas is detected by one by certain principle, and detecting
Certain signal be converted into the device of suitable electrical signal.Along with mankind's day to problems such as environmental protection, pollution and public safeties
Benefit is paid attention to, and people are for the improving constantly of requirement of living standard, and gas sensor is in industrial, civilian and environmental monitoring three
Achieve in big major domain and be widely applied.
The difference of the principle according to gas sensor detected gas, gas sensor mainly includes catalytic combustion type, electrification
Formula, heat-conducted, infrared absorption type and semiconductor-type gas sensor etc..Wherein, semiconductor-type gas sensor has sensitive
Spend the advantages such as high, easy to operate, volume is little, with low cost, response time is short and recovery time is short so that semiconductor-type gas passes
Sensor is widely applied, such as to flammable explosive gas (such as CH4, H2 etc.) and toxic and harmful (such as CO, NOx etc.)
Detection in play an important role.
Gas sensor, in the development course of over half a century in past, is widely used in petrochemical industry, colliery, medical treatment, aviation
The fields such as space flight, commercial production and life staying idle at home.Along with the development of technology of Internet of things, the application demand of gas sensor is the most continuous
Increase, particularly there is small size, low-power consumption, highly sensitive and fast-response gas sensor have urgent application demand.So
And traditional gas sensor manufacture and encapsulation technology, such as based on earthenware heating and the semiconductor-type gas of case package technology
Body sensor, has been difficult to meet the application demand of Internet of Things at aspects such as size, power consumption and sensitivity.It is now based on MEMS skill
The gas sensor of art, is expected to solve this problem, such as, Chinese utility model patent, and 201520757454.3 1 kinds have
Two resistance-type gas sensors supporting overarm six Rotating fields, it was recently reported that a kind of low-power consumption highly sensitive semiconductor-type gas sensing
Device.How MEMS gas sensor chip and corresponding supporting IC chip are packaged, are those skilled in the art
The problem paid close attention to.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, it is provided that a kind of gas based on chip-stacked technology
Body sensor and encapsulating structure thereof, it is achieved small size, low-power consumption and high integration.
This utility model is achieved through the following technical solutions, and this utility model includes package substrate, ic core
Sheet, at least one gas sensor chip, wire, multiple pad and pin；Described IC chip is bonded in described encapsulation
The front of substrate, described pin is arranged at the back side of package substrate, and each gas sensor chip described is glued respectively to integrated
On circuit chip, described pad is separately positioned in IC chip, gas sensor chip and package substrate, described pin
Being connected with the pad in package substrate, the pad in described package substrate, IC chip and gas sensor chip divides
Tong Guo not realize electrical connection by wire bonding.
As one of optimal way of the present utility model, described wire is spun gold.
As one of optimal way of the present utility model, described IC chip is used for providing interface power, controlling letter
Number and the signal of acquisition process gas sensor chip, described gas sensor chip gather gas signal.
As one of optimal way of the present utility model, described package substrate, IC chip and gas sensor core
Pad on sheet is arranged along respective frame respectively, it is simple to gold wire bonding.
As one of optimal way of the present utility model, described package substrate is that ceramic material is made.
As one of optimal way of the present utility model, it is right that described pin is at least four.
As one of optimal way of the present utility model, described pin is provided with Gold plated Layer.
As one of optimal way of the present utility model, described IC chip is bonded in encapsulation lining by insulative glue
, described gas sensor chip is bondd on an integrated circuit die by insulative glue respectively at the end.
As one of optimal way of the present utility model, described IC chip is that IC processes forms, described gas
Body sensor chip is that MEMS technology is made.
The encapsulating structure of a kind of described gas sensor based on multi-chip, described encapsulating structure includes with exploration hole
Sealing cap, described sealing cap is encapsulated on described gas sensor.
First IC chip is bondd on the package substrate, then gas sensor chip is bonded in integrated circuit
On chip, may is that and a gas sensor chip is bondd on an integrated circuit die；Can also be by two gas sensings
Device chip bonds on an integrated circuit die；Can also is that three gas sensor chip or more gas sensor core
Sheet bonds on an integrated circuit die.Then, by the way of spun gold welds, utilize spun gold gas sensor chip, integrated electricity
Pad on road chip and package substrate is chained up, it is achieved electrical connection.Finally, by plus the metal of band exploration hole, pottery
Or the sealing cap of plastic material, after completing encapsulation.
This utility model has the advantage that this utility model uses advanced MEMS technology to make gas compared to existing technology
Body sensor chip, uses IC technique to make the IC chip of supporting gas sensor, compared with conventional art, the most greatly
The power consumption of amplitude reduction sensor and size, and improve the performances such as the sensitivity of gas sensor, Internet of Things can be met
The demand of the application such as net and wearable device.Being stacked up of multiple gas sensor chip and IC chip,
Reduce further the size of whole sensor, and the array of multiple sensor chip composition achieves in a packaging body
Detection to multiple gases, improves the combination property of sensor.An IC chip is used to mate multiple gas sensings
The mode of device, not only increases integrated level, and integrates and unified the output signal of multiple gas sensor chip, improve
The pervasive degree of sensor application and range of application.
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiment 1；
Fig. 2 is the structural representation of embodiment 2；
Fig. 3 is the structural representation of embodiment 3；
Fig. 4 is the upward view of package substrate.
Detailed description of the invention
Elaborating embodiment of the present utility model below, the present embodiment is being front with technical solutions of the utility model
Put and implement, give detailed embodiment and concrete operating process, but protection domain of the present utility model does not limits
In following embodiment.
Embodiment 1
As shown in Figure 1 and Figure 4, the present embodiment includes package substrate 1,2, gas sensor chip of IC chip
3, spun gold 4, multiple pad 5 and pin 6；Described IC chip 2 is just being bonded in described package substrate 1 by insulative glue
Face, gas sensor chip 3 is bonded on IC chip 2 by insulative glue, and described pin 6 is arranged at package substrate 1
The back side, described pad 5 is separately positioned in IC chip 2, gas sensor chip 3 and package substrate 1, described pin
6 are connected with the pad 5 in package substrate 1, in described package substrate 1, IC chip 2 and gas sensor chip 3
Pad 5 realizes electrical connection by spun gold 4 bonding respectively.
The gas sensor chip 3 of the present embodiment completes based on MEMS technology manufacture, and gas sensor chip 3 is a size of
1.0mm × 2.5mm, the gaseous species of detection is respectively as follows: nitrogen oxides, carbon dioxide, volatile organic matter, ammonia these four allusion quotation
Type gas.One IC chip 2, machines based on 0.18 micron process, and IC chip 2 a size of 2.2mm ×
3.3mm, provides working power and control signal for gas sensor chip 3, gathers and process the signal of gas sensor perception.
Package substrate 1 uses aluminium oxide ceramics, a size of 3.5 × 4.8mm.Four pairs of pins 6 are had below package substrate 1, pin 6
A size of 0.5mm × 1.0mm, pin 6 surface is provided with Gold plated Layer 0.5 micron.
Assembling process: first IC chip 2 is bonded in package substrate 1, then gas sensor chip 3 is led to
The mode crossing bonding is stacked on IC chip 2, then pad 5 is chained up by spun gold by the mode of gold ball bonding,
Finally it is packaged with the metal sealing cap of band exploration hole.
Embodiment 2
As in figure 2 it is shown, the two of the present embodiment gas sensor chip 3 complete based on MEMS technology manufacture, each gas
Sensor chip 3 a size of 1.0mm × 1.2mm, the gas of detection is: nitrogen oxides and carbon dioxide.
Other embodiments are identical with embodiment 1.
Embodiment 3
As it is shown on figure 3, the four of the present embodiment gas sensor chip 3 complete based on MEMS technology manufacture, each gas
Sensor chip 3 a size of 0.5mm × 1.0mm, the gas of detection is: nitrogen oxides, carbon dioxide, volatile organic matter, ammonia
Gas these four representative gases.
Other embodiments are identical with embodiment 1.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, all at this
Any amendment, equivalent and the improvement etc. made within the spirit of utility model and principle, should be included in this utility model
Protection domain within.
Claims (10)
1. a gas sensor based on chip-stacked technology, it is characterised in that include package substrate, IC chip,
At least one gas sensor chip, wire, multiple pad and pin；Described IC chip is bonded in described package substrate
Front, described pin is arranged at the back side of package substrate, and each gas sensor chip described is glued respectively to integrated circuit
On chip, described pad is separately positioned in IC chip, gas sensor chip and package substrate, described pin and envelope
Pad at the bottom of fitted lining is connected, and the pad in described package substrate, IC chip and gas sensor chip leads to respectively
Cross wire bonding and realize electrical connection.
A kind of gas sensor based on chip-stacked technology the most according to claim 1, it is characterised in that described wire
For spun gold.
A kind of gas sensor based on chip-stacked technology the most according to claim 1, it is characterised in that described integrated
Circuit chip is for providing interface power, control signal the signal of acquisition process gas sensor chip, described gas sensing
Device chip gathers gas signal.
A kind of gas sensor based on chip-stacked technology the most according to claim 1, it is characterised in that described encapsulation
Pad in substrate, IC chip and gas sensor chip is arranged along respective frame respectively.
A kind of gas sensor based on chip-stacked technology the most according to claim 1, it is characterised in that described encapsulation
Substrate is that ceramic material is made.
A kind of gas sensor based on chip-stacked technology the most according to claim 1, it is characterised in that described pin
At least four is right.
A kind of gas sensor based on chip-stacked technology the most according to claim 1, it is characterised in that described pin
It is provided with Gold plated Layer.
A kind of gas sensor based on chip-stacked technology the most according to claim 1, it is characterised in that described integrated
Circuit chip bonds on the package substrate by insulative glue, and described gas sensor chip is bonded in by insulative glue respectively
On IC chip.
A kind of gas sensor based on chip-stacked technology the most according to claim 1, it is characterised in that described integrated
Circuit chip is that IC processes forms, and described gas sensor chip is that MEMS technology is made.
10. an encapsulating structure for the gas sensor based on multi-chip as described in any one of claim 1～9, its feature
Being, described encapsulating structure includes that the sealing cap with exploration hole, described sealing cap are encapsulated on described gas sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620814993.0U CN205820886U (en) | 2016-07-29 | 2016-07-29 | A kind of gas sensor based on chip-stacked technology and encapsulating structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201620814993.0U CN205820886U (en) | 2016-07-29 | 2016-07-29 | A kind of gas sensor based on chip-stacked technology and encapsulating structure thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106932141A (en) * | 2017-04-28 | 2017-07-07 | 无锡永阳电子科技有限公司 | A kind of stacked package micro pressure sensor |
| CN108088955A (en) * | 2017-11-30 | 2018-05-29 | 苏州慧闻纳米科技有限公司 | A kind of anti-interference gas sensor |
| CN111115553A (en) * | 2019-12-25 | 2020-05-08 | 北京遥测技术研究所 | Double-cavity metal packaging shell based on energy storage welding mode and packaging method |
| CN115169276A (en) * | 2022-07-22 | 2022-10-11 | 北京云枢创新软件技术有限公司 | Pin area matching method based on stacking module |
-
2016
- 2016-07-29 CN CN201620814993.0U patent/CN205820886U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106932141A (en) * | 2017-04-28 | 2017-07-07 | 无锡永阳电子科技有限公司 | A kind of stacked package micro pressure sensor |
| CN108088955A (en) * | 2017-11-30 | 2018-05-29 | 苏州慧闻纳米科技有限公司 | A kind of anti-interference gas sensor |
| CN111115553A (en) * | 2019-12-25 | 2020-05-08 | 北京遥测技术研究所 | Double-cavity metal packaging shell based on energy storage welding mode and packaging method |
| CN111115553B (en) * | 2019-12-25 | 2023-04-14 | 北京遥测技术研究所 | Double-cavity metal packaging shell based on energy storage welding mode and packaging method |
| CN115169276A (en) * | 2022-07-22 | 2022-10-11 | 北京云枢创新软件技术有限公司 | Pin area matching method based on stacking module |
| CN115169276B (en) * | 2022-07-22 | 2023-04-07 | 北京云枢创新软件技术有限公司 | Pin area matching method based on stacking module |
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