CN205879838U - Miniature gas sensor's packaging structure - Google Patents
Miniature gas sensor's packaging structure Download PDFInfo
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- CN205879838U CN205879838U CN201620818444.0U CN201620818444U CN205879838U CN 205879838 U CN205879838 U CN 205879838U CN 201620818444 U CN201620818444 U CN 201620818444U CN 205879838 U CN205879838 U CN 205879838U
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- chip
- gas sensor
- encapsulating structure
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- cover plate
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Abstract
The utility model discloses a miniature gas sensor's packaging structure, including basement, frame, a plurality of pin, apron and chip unit, chip unit places the top surface in the basement, a plurality of pins set up respectively in the bottom surface of basement, the bottom pasting of frame is at the periphery of basement top surface, the apron bonding is at the top of frame, at least one detection gas pocket that is used for detection of gas is seted up at the top of apron. The utility model discloses to the micro -package scheme of MEMS gas sensor chip and integrated circuit chip design, have that the size is little, light in weight's advantage. Can get up a plurality of gas sensor chip and integrated circuit chip's encapsulation, improved the integrated level, further reduced the size of whole sensor, the array of a plurality of sensor chip constitution has been realized in a packaging body multi -gas's detection moreover, has improved the comprehensive properties of sensor.
Description
Technical field
This utility model relates to a kind of gas detection technology based on MEMS technology, in particular a kind of minitype gas
The encapsulating structure of sensor.
Background technology
Gas sensor is that composition specific in gas is detected by one by certain principle, and detecting
Certain signal be converted into the device of suitable electrical signal.Along with mankind's day to problems such as environmental protection, pollution and public safeties
Benefit is paid attention to, and people are for the improving constantly of requirement of living standard, and gas sensor is in industrial, civilian and environmental monitoring three
Achieve in big major domain and be widely applied.
The difference of the principle according to gas sensor detected gas, gas sensor mainly includes catalytic combustion type, electrification
Formula, heat-conducted, infrared absorption type and semiconductor-type gas sensor etc..Wherein, semiconductor-type gas sensor has sensitive
Spend the advantages such as high, easy to operate, volume is little, with low cost, response time is short and recovery time is short so that semiconductor-type gas passes
Sensor is widely applied, such as to flammable explosive gas (such as CH4, H2 etc.) and toxic and harmful (such as CO, NOx etc.)
Detection in play an important role.
Gas sensor, in the development course of over half a century in past, is widely used in petrochemical industry, colliery, medical treatment, aviation
The fields such as space flight, commercial production and life staying idle at home.Along with the development of technology of Internet of things, the application demand of gas sensor is the most continuous
Increase, particularly there is small size, low-power consumption, highly sensitive and fast-response gas sensor have urgent application demand.So
And traditional gas sensor manufacture and encapsulation technology, such as based on earthenware heating and the semiconductor-type gas of case package technology
Body sensor, has been difficult to meet the application demand of Internet of Things at aspects such as size, power consumption and sensitivity.It is now based on MEMS skill
The gas sensor of art, is expected to solve this problem, such as, Chinese utility model patent, and 201520757454.3 1 kinds have
Two resistance-type gas sensors supporting overarm six Rotating fields, it was recently reported that a kind of low-power consumption highly sensitive semiconductor-type gas sensing
Device.How MEMS gas sensor chip and corresponding supporting IC chip are packaged, are those skilled in the art
The problem paid close attention to.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, it is provided that the encapsulation of a kind of mini type gas sensor
Structure, it is achieved to MEMS gas sensor chip and the small-sized package of supporting IC chip.
This utility model is achieved through the following technical solutions, this utility model include substrate, frame, multiple pin,
Cover plate and chip unit, described chip unit is placed on the end face of substrate, and the plurality of pin is respectively arranged at the bottom surface of substrate,
The bottom adhe of described frame is at the periphery of basement top, and described cover plate is bonded in the top of frame, and the top of described cover plate is opened
If at least one is for the detection pore of probe gas.
As one of optimal way of the present utility model, the framework that described frame is plastics or pottery is made.
As one of optimal way of the present utility model, the size at described cover plate and frame top matches.
As one of optimal way of the present utility model, described cover plate is the rectangle cover plate that metal is made.
Bonding by insulative glue as one of optimal way of the present utility model, described cover plate and frame.
As one of optimal way of the present utility model, the surface of described pin is provided with Gold plated Layer.
Described chip unit includes IC chip and at least one gas sensor chip, described IC chip
Being glued respectively in substrate with gas sensor chip, described IC chip, gas sensor chip are led to respectively with substrate
Cross gold ball bonding and realize electrical connection.
Described gas sensor chip is that MEMS technology is made, and described IC chip is that 0.18 micron process is made,
Described gas sensor chip gathers gas signal, and described IC chip collection also processes the letter of gas sensor chip
Number.
Described chip unit includes IC chip and at least one gas sensor chip, described IC chip
Being bonded in substrate, described gas sensor chip bonds on an integrated circuit die, described IC chip, gas sensing
Device chip realizes electrically connecting by gold ball bonding with substrate respectively.
Described gas sensor chip is that MEMS technology is made, and described IC chip is that 0.25 micron process is made,
Described gas sensor chip gathers gas signal, and described IC chip collection also processes the letter of gas sensor chip
Number.
It is as follows that this utility model realizes process: first gas sensor chip and IC chip is placed in substrate,
And with spun gold, corresponding pad is coupled together by the way of gold ball bonding, it is achieved electrical connection.Then frame and substrate are glued
Altogether, chip unit is internally positioned, and pin is externally-located.Finally cover plate and frame are glued together.
This utility model have the advantage that compared to existing technology this utility model for MEMS gas sensor chip and
The microencapsulated scheme of design of integrated circuit, has size advantage little, lightweight, can meet Internet of Things and wearable
The demand of the applications such as equipment.Can being encapsulated multiple gas sensor chip and IC chip, improve collection
Cheng Du, reduce further the size of whole sensor, and the array of multiple sensor chip composition achieves an envelope
Fill the internal detection to multiple gases, improve the combination property of sensor.
Accompanying drawing explanation
Fig. 1 is the encapsulating structure schematic diagram of embodiment 1；
Fig. 2 is embodiment 1 gas sensor chip and IC chip is bonded in suprabasil schematic diagram；
Fig. 3 is the structural representation after Fig. 2 assembles frame；
Fig. 4 is the structural representation of cover plate；
Fig. 5 is the structural representation after encapsulation；
Fig. 6 is the upward view of the substrate after encapsulation；
Fig. 7 is the structural representation of embodiment 2.
Detailed description of the invention
Elaborating embodiment of the present utility model below, the present embodiment is being front with technical solutions of the utility model
Put and implement, give detailed embodiment and concrete operating process, but protection domain of the present utility model does not limits
In following embodiment.
Embodiment 1
As shown in figs. 1 to 6, the present embodiment includes substrate 1,2, five pairs of pins 3 of frame, cover plate 4 and chip unit, described core
Blade unit is placed on the end face of substrate 1, and described pin 3 is respectively arranged at the bottom surface of substrate 1, and the bottom adhe of described frame 2 exists
The periphery of basement top, described cover plate 4 is bonded in the top of frame 2, and the top of described cover plate 4 offers one for probe gas
Detection pore 41.
The chip unit of the present embodiment includes IC chip 5, gas sensor chip 6 and spun gold 7, described integrated electricity
Road chip 5 and gas sensor chip 6 are glued respectively in substrate 1, described IC chip 5, gas sensor chip 6 with
Substrate 1 realizes electrical connection by gold ball bonding respectively.
The substrate 1 a size of 3.5 × 4.8mm of the present embodiment.The size of pin 3 is 0.4mm × 1.0mm, and pin 3 surface sets
There is Gold plated Layer 0.5 micron.Gas sensor chip 6 completes based on MEMS technology manufacture, and gas sensor chip 6 is a size of
1.5mm × 1.0mm, the gaseous species of detection is respectively as follows: nitrogen oxides.IC chip 5 is processed based on 0.18 micron process
Complete, IC chip 5 a size of 1.5mm × 1.0mm, provide working power and control signal for gas sensor chip 6,
Gather and process the signal of gas sensor chip 6 perception.The material of cover plate 4 is copper, and the aperture of detection pore 41 is 0.5mm.
Encapsulation step is: first gas sensor chip 6 and IC chip 5 are bonded in by insulative glue respectively
In substrate 1, and couple together with 7 pads of spun gold by the way of spun gold 7 ball bonding, it is achieved electrical connection.Then frame 2 and base
The end 1, is glued together, and chip unit is positioned at the inside of whole framework, and pin 3 is externally-located.Finally cover plate 4 and frame 2 are bonded
Come.
Embodiment 2
As it is shown in fig. 7, the chip unit of the present embodiment includes IC chip 5, gas sensor chip 6 and spun gold 7,
Described IC chip 5 bonds on the base 1, and described gas sensor chip 6 is bonded on IC chip 5, described
IC chip 5, gas sensor chip 6 realize electrically connecting by spun gold 7 ball bonding with substrate 1 respectively.
The substrate 1 a size of 3.0 × 3.8mm of the present embodiment.The size of pin 3 is 0.3mm × 1.0mm, and pin 3 surface sets
There is Gold plated Layer 0.5 micron.Substrate 1 stacked on top arrangement gas sensor chip 6 and IC chip 5.Gas sensor core
Sheet 6 completes based on MEMS technology manufacture, gas sensor chip 6 a size of 0.5mm × 1.0mm, and the gaseous species of detection is respectively
For: carbon dioxide.IC chip 5 machines based on 0.25 micron process, and IC chip 5 a size of 2.2mm ×
3.3mm, provides working power and control signal for gas sensor chip 6, gathers and process gas sensor chip 6 perception
Signal.The material of cover plate 4 is copper, and the aperture of detection pore 41 is 0.5mm.
Encapsulation step is: first IC chip 5 is bondd on the base 1 by insulative glue, then gas sensing
Device chip 6 stacking is bonded on IC chip 5, then connects with 7 pads of spun gold by the way of spun gold 7 ball bonding
Come, it is achieved electrical connection.Then frame 2 and substrate 1 being glued together, whole chip unit is positioned at the inside of whole framework, pin 3
Externally-located.Finally cover plate 4 and frame 2 are glued together.
Other embodiments are identical with embodiment 1.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, all at this
Any amendment, equivalent and the improvement etc. made within the spirit of utility model and principle, should be included in this utility model
Protection domain within.
Claims (10)
1. the encapsulating structure of a mini type gas sensor, it is characterised in that include substrate, frame, multiple pin, cover plate and core
Blade unit, described chip unit is placed on the end face of substrate, and the plurality of pin is respectively arranged at the bottom surface of substrate, described frame
Bottom adhe at the periphery of basement top, described cover plate is bonded in the top of frame, and the top of described cover plate offers at least one
The individual detection pore for probe gas.
The encapsulating structure of a kind of mini type gas sensor the most according to claim 1, it is characterised in that described frame is for moulding
The framework that material or pottery are made.
The encapsulating structure of a kind of mini type gas sensor the most according to claim 1, it is characterised in that described cover plate and limit
The size of arch matches.
The encapsulating structure of a kind of mini type gas sensor the most according to claim 1, it is characterised in that described cover plate is gold
Belong to the rectangle cover plate made.
The encapsulating structure of a kind of mini type gas sensor the most according to claim 1, it is characterised in that described cover plate and limit
Frame is bonding by insulative glue.
The encapsulating structure of a kind of mini type gas sensor the most according to claim 1, it is characterised in that the table of described pin
Face is provided with Gold plated Layer.
The encapsulating structure of a kind of mini type gas sensor the most according to claim 1, it is characterised in that described chip unit
Including IC chip and at least one gas sensor chip, described IC chip and gas sensor chip respectively
Being bonded in substrate, described IC chip, gas sensor chip realize electrically connecting by gold ball bonding with substrate respectively.
The encapsulating structure of a kind of mini type gas sensor the most according to claim 7, it is characterised in that described gas sensing
Device chip is that MEMS technology is made, and described IC chip is that 0.18 micron process is made, and described gas sensor chip is adopted
Collection gas signal, described IC chip collection also processes the signal of gas sensor chip.
The encapsulating structure of a kind of mini type gas sensor the most according to claim 1, it is characterised in that described chip unit
Including IC chip and at least one gas sensor chip, described IC chip is bonded in substrate, described gas
Body sensor chip bonds on an integrated circuit die, and described IC chip, gas sensor chip are led to respectively with substrate
Cross gold ball bonding and realize electrical connection.
The encapsulating structure of a kind of mini type gas sensor the most according to claim 9, it is characterised in that described gas passes
Sensor chip is that MEMS technology is made, and described IC chip is that 0.25 micron process is made, described gas sensor chip
Gathering gas signal, described IC chip collection also processes the signal of gas sensor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620818444.0U CN205879838U (en) | 2016-07-29 | 2016-07-29 | Miniature gas sensor's packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620818444.0U CN205879838U (en) | 2016-07-29 | 2016-07-29 | Miniature gas sensor's packaging structure |
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| CN205879838U true CN205879838U (en) | 2017-01-11 |
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| CN201620818444.0U Active CN205879838U (en) | 2016-07-29 | 2016-07-29 | Miniature gas sensor's packaging structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109991300A (en) * | 2018-01-02 | 2019-07-09 | 三星电子株式会社 | Gas sensor packaging part |
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2016
- 2016-07-29 CN CN201620818444.0U patent/CN205879838U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109991300A (en) * | 2018-01-02 | 2019-07-09 | 三星电子株式会社 | Gas sensor packaging part |
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