CN205881893U - Gas sensor and packaging structure based on multicore piece - Google Patents
Gas sensor and packaging structure based on multicore piece Download PDFInfo
- Publication number
- CN205881893U CN205881893U CN201620818426.2U CN201620818426U CN205881893U CN 205881893 U CN205881893 U CN 205881893U CN 201620818426 U CN201620818426 U CN 201620818426U CN 205881893 U CN205881893 U CN 205881893U
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- Prior art keywords
- gas sensor
- chip
- package substrate
- pad
- sensor based
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Abstract
The utility model discloses a gas sensor and packaging structure based on multicore piece, including encapsulated underlay, integrated circuit chip, at least one gas sensor chip, wire, a plurality of pad and pin, integrated circuit chip and each gas sensor chip bond respectively the front of encapsulated underlay, the pin sets up in the back of encapsulated underlay, the pad sets up respectively on integrated circuit chip, gas sensor chip and encapsulated underlay, pad on pin and the encapsulated underlay is linked together, pad on encapsulated underlay, integrated circuit chip and the gas sensor chip is realized the electricity through the wire bonded respectively and is connected. The utility model discloses an integrated circuit chip matches a plurality of gas sensor's mode, has not only improved the integrated level, integrates and unified the output signal of a plurality of gas sensor chips moreover, has improved general moderate degree and range of application that the sensor was used.
Description
Technical field
This utility model relates to a kind of gas detection technology based on MEMS technology, in particular a kind of based on multicore
The gas sensor of sheet and encapsulating structure thereof.
Background technology
Gas sensor is that composition specific in gas is detected by one by certain principle, and detecting
Certain signal be converted into the device of suitable electrical signal.Along with mankind's day to problems such as environmental protection, pollution and public safeties
Benefit is paid attention to, and people are for the improving constantly of requirement of living standard, and gas sensor is in industrial, civilian and environmental monitoring three
Achieve in big major domain and be widely applied.
The difference of the principle according to gas sensor detected gas, gas sensor mainly includes catalytic combustion type, electrification
Formula, heat-conducted, infrared absorption type and semiconductor-type gas sensor etc..Wherein, semiconductor-type gas sensor has sensitive
Spend the advantages such as high, easy to operate, volume is little, with low cost, response time is short and recovery time is short so that semiconductor-type gas passes
Sensor is widely applied, such as to flammable explosive gas (such as CH4, H2 etc.) and toxic and harmful (such as CO, NOx etc.)
Detection in play an important role.
Gas sensor, in the development course of over half a century in past, is widely used in petrochemical industry, colliery, medical treatment, aviation
The fields such as space flight, commercial production and life staying idle at home.Along with the development of technology of Internet of things, the application demand of gas sensor is the most continuous
Increase, particularly there is small size, low-power consumption, highly sensitive and fast-response gas sensor have urgent application demand.So
And traditional gas sensor manufacture and encapsulation technology, such as based on earthenware heating and the semiconductor-type gas of case package technology
Body sensor, has been difficult to meet the application demand of Internet of Things at aspects such as size, power consumption and sensitivity.It is now based on MEMS skill
The gas sensor of art, is expected to solve this problem, such as, Chinese utility model patent, and 201520757454.3 1 kinds have
Two resistance-type gas sensors supporting overarm six Rotating fields, it was recently reported that a kind of low-power consumption highly sensitive semiconductor-type gas sensing
Device.How MEMS gas sensor chip and corresponding supporting IC chip are packaged, are those skilled in the art
The problem paid close attention to.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, it is provided that a kind of gas sensing based on multi-chip
Device and encapsulating structure thereof, it is achieved small size, low-power consumption and high integration.
This utility model is achieved through the following technical solutions, and this utility model includes package substrate, ic core
Sheet, at least one gas sensor chip, wire, multiple pad and pin；Described IC chip and each gas sensing
Device chip is glued respectively to the front of described package substrate, and described pin is arranged at the back side of package substrate, and described pad is respectively
Being arranged in IC chip, gas sensor chip and package substrate, described pin is connected with the pad in package substrate
Logical, the pad in described package substrate, IC chip and gas sensor chip realizes being electrically connected by wire bonding respectively
Connect.
As one of optimal way of the present utility model, described wire is spun gold.
As one of optimal way of the present utility model, described IC chip is used for providing interface power, controlling letter
Number and the signal of acquisition process gas sensor chip, described gas sensor chip gather gas signal.
As one of optimal way of the present utility model, described package substrate, IC chip and gas sensor core
Pad on sheet is arranged along respective frame respectively, it is simple to gold wire bonding.
As one of optimal way of the present utility model, described package substrate is that ceramic material is made.
As one of optimal way of the present utility model, it is right that described pin is at least four.
As one of optimal way of the present utility model, described pin is provided with Gold plated Layer.
As one of optimal way of the present utility model, described IC chip and gas sensor chip are passed through respectively
Insulative glue bonds on the package substrate.
As one of optimal way of the present utility model, described IC chip is that IC processes forms, described gas
Body sensor chip is that MEMS technology is made.
The encapsulating structure of a kind of described gas sensor based on multi-chip, described encapsulating structure includes with exploration hole
Sealing cap, described sealing cap is encapsulated on described gas sensor.
First gas sensor chip and IC chip are bondd on the package substrate, may is that a gas passes
Sensor chip and an IC chip；Can also be two gas sensor chip and an IC chip；Also may be used
To be three gas sensor chip or more gas sensor chip and an IC chip.Then spun gold is passed through
The mode of welding, utilizes spun gold that the pad in gas sensor chip, IC chip and package substrate is chained up, real
Now electrically connect.Finally, by the sealing cap plus metal with holes, pottery or plastic material, after completing encapsulation.
This utility model has the advantage that this utility model uses advanced MEMS technology to make gas compared to existing technology
Body sensor chip, uses IC technique to make the IC chip of supporting gas sensor, compared with conventional art, the most greatly
The power consumption of amplitude reduction sensor and size, and improve the performances such as the sensitivity of gas sensor, Internet of Things can be met
The demand of the application such as net and wearable device.An IC chip is used to mate the mode of multiple gas sensors,
Not only increasing integrated level, and integrate and unified the output signal of multiple gas sensor chip, improve sensor should
Pervasive degree and range of application.
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiment 1；
Fig. 2 is the structural representation of embodiment 2；
Fig. 3 is the structural representation of embodiment 3；
Fig. 4 is the upward view of package substrate.
Detailed description of the invention
Elaborating embodiment of the present utility model below, the present embodiment is being front with technical solutions of the utility model
Put and implement, give detailed embodiment and concrete operating process, but protection domain of the present utility model does not limits
In following embodiment.
Embodiment 1
As shown in Figure 1 and Figure 4, the present embodiment includes package substrate 1,2, gas sensor chip of IC chip
3, spun gold 4, multiple pad 5 and pin 6；Described IC chip 2 and gas sensor chip 3 are glued by insulative glue respectively
Knot is in the front of described package substrate 1, and described pin 6 is arranged at the back side of package substrate 1, and described pad 5 is separately positioned on collection
Becoming in circuit chip 2, gas sensor chip 3 and package substrate 1, described pin 6 is connected with the pad 5 in package substrate 1,
Pad 5 in described package substrate 1, IC chip 2 and gas sensor chip 3 realizes electricity by spun gold 4 bonding respectively
Connect.
The gas sensor chip 3 of the present embodiment completes based on MEMS technology manufacture, and gas sensor chip 3 is a size of
2.2mm × 1.6mm, the gas of detection is: nitrogen oxides.IC chip 2 machines based on 0.18 micron process, integrated
Circuit chip 2 a size of 2.2mm × 1.6mm, provides working power and control signal for gas sensor chip 3, gathers and locates
The signal of process gases sensor senses.Package substrate 1 uses aluminium oxide ceramics, a size of 4.5 × 6.8mm.Package substrate 1
Having four pairs of pins 6 below, the size of pin 6 is 0.5mm × 1.0mm, and pin 6 surface is provided with Gold plated Layer 0.5 micron.
Assembling process: first IC chip 2 and gas sensor chip 3 are arranged in encapsulation by the way of bonding
On substrate 1, then by spun gold, pad 5 is chained up by the mode of gold ball bonding, finally enters with the plastic seal cap of band exploration hole
Row encapsulation.
Embodiment 2
As in figure 2 it is shown, the two of the present embodiment gas sensor chip 3 complete based on MEMS technology manufacture, each gas
Sensor chip 3 a size of 0.5mm × 1.0mm, the gas of detection is: nitrogen oxides and carbon dioxide.
Other embodiments are identical with embodiment 1.
Embodiment 3
As it is shown on figure 3, the four of the present embodiment gas sensor chip 3 complete based on MEMS technology manufacture, each gas
Sensor chip 3 a size of 0.5mm × 1.0mm, the gas of detection is: nitrogen oxides, carbon dioxide, volatile organic matter, ammonia
Gas these four representative gases.
Other embodiments are identical with embodiment 1.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, all at this
Any amendment, equivalent and the improvement etc. made within the spirit of utility model and principle, should be included in this utility model
Protection domain within.
Claims (10)
1. a gas sensor based on multi-chip, it is characterised in that include package substrate, IC chip, at least one
Individual gas sensor chip, wire, multiple pad and pin；Described IC chip and each gas sensor chip are respectively
Being bonded in the front of described package substrate, described pin is arranged at the back side of package substrate, and described pad is separately positioned on integrated
In circuit chip, gas sensor chip and package substrate, described pin is connected with the pad in package substrate, described encapsulation
Pad in substrate, IC chip and gas sensor chip realizes electrical connection by wire bonding respectively.
A kind of gas sensor based on multi-chip the most according to claim 1, it is characterised in that described wire is gold
Silk.
A kind of gas sensor based on multi-chip the most according to claim 1, it is characterised in that described ic core
Sheet is for providing interface power, control signal the signal of acquisition process gas sensor chip, described gas sensor chip
Gather gas signal.
A kind of gas sensor based on multi-chip the most according to claim 1, it is characterised in that described package substrate,
Pad on IC chip and gas sensor chip is arranged along respective frame respectively.
A kind of gas sensor based on multi-chip the most according to claim 1, it is characterised in that described package substrate is
Ceramic material is made.
A kind of gas sensor based on multi-chip the most according to claim 1, it is characterised in that described pin is at least
Four pairs.
A kind of gas sensor based on multi-chip the most according to claim 1, it is characterised in that described pin is provided with
Gold plated Layer.
A kind of gas sensor based on multi-chip the most according to claim 1, it is characterised in that described ic core
Sheet and gas sensor chip are bondd on the package substrate by insulative glue respectively.
A kind of gas sensor based on multi-chip the most according to claim 1, it is characterised in that described ic core
Sheet is that IC processes forms, and described gas sensor chip is that MEMS technology is made.
10. an encapsulating structure for the gas sensor based on multi-chip as described in any one of claim 1～9, its feature
Being, described encapsulating structure includes that the sealing cap with exploration hole, described sealing cap are encapsulated on described gas sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620818426.2U CN205881893U (en) | 2016-07-29 | 2016-07-29 | Gas sensor and packaging structure based on multicore piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620818426.2U CN205881893U (en) | 2016-07-29 | 2016-07-29 | Gas sensor and packaging structure based on multicore piece |
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| Publication Number | Publication Date |
|---|---|
| CN205881893U true CN205881893U (en) | 2017-01-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201620818426.2U Active CN205881893U (en) | 2016-07-29 | 2016-07-29 | Gas sensor and packaging structure based on multicore piece |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110455899A (en) * | 2019-07-16 | 2019-11-15 | 广州钰芯传感科技有限公司 | A kind of electrochemical gas sensor and its device packaging method |
| CN111668167A (en) * | 2019-03-06 | 2020-09-15 | 复凌科技（上海）有限公司 | Packaging method of chip module |
-
2016
- 2016-07-29 CN CN201620818426.2U patent/CN205881893U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111668167A (en) * | 2019-03-06 | 2020-09-15 | 复凌科技（上海）有限公司 | Packaging method of chip module |
| CN111668167B (en) * | 2019-03-06 | 2023-08-29 | 复凌科技（上海）有限公司 | Packaging method of chip module |
| CN110455899A (en) * | 2019-07-16 | 2019-11-15 | 广州钰芯传感科技有限公司 | A kind of electrochemical gas sensor and its device packaging method |
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