CN111114062A - 一种适用于高温加热的复合电热膜及制备方法 - Google Patents
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Abstract
本发明公开了一种适用于高温加热的复合电热膜及制备方法,包括复合加热层和设置于复合加热层两侧的PI封装层,所述复合加热层包括复合电热膜片和设置于复合电热膜片表面的铜电极,所述复合电热膜片由电热膜浆料和PI膜高温固化而成,所述电热膜浆料由PBI粉末、N‑N二甲基乙酰胺溶液和导电炭黑组成。本发明制备工艺简单,电热膜可耐高温,柔性较强,安全性好,适用于高温加热领域。
Description
技术领域
本发明涉及电加热材料技术领域,特别涉及一种适用于高温加热的复合电热膜及制备方法。
背景技术
在当今时代科技智能化的迅速发展下,电热材料己被广泛应用于化工、电子、电器、机械制造、农业以及日常生活等领域。从目前国内外的研究发展趋势以及市场需求来看,电热材料的应用前景十分广阔,在日常家居生活中,可用于水杯加热器、电暖桌垫、电热地毯等;在汽车工业中,可用于汽车后视镜除霜片,天线或雷达的除雪、除霜加热元件以及调速电阻片;在电子军工工业中,可用于人造卫星、空间飞行器及飞机等仪器设施以及在高纬度地区使用的仪器、仪表的防低温等。
不同的应用场景对电热膜性能的要求也不尽相同。特别是在大功率、高温的电加热领域,目前电热膜仍存在诸多问题,例如控温性差、脆性大、不耐温、加工工艺复杂等。上述缺点极大程度限制了电热膜在高温加热领域的应用。因此,开发安全可靠、耐高温、发热稳定、长寿命的电热膜材料对新型大功率、高温电加热器件的发展和应用具有重大意义。
发明内容
针对现有技术存在的以上缺点,本发明的目的之一在于解决上述技术问题,提供一种适用于高温加热的基于聚苯并咪唑(PBI)/导电炭黑复合电热膜材料,该复合电热膜材料由聚苯并咪唑(PBI)和导电炭黑组成,较其普通电热膜材料相比,其具有比更好的耐高温性和安全性,并兼具柔韧性。
本发明的目的之二在于提供一种适用于高温加热的基于聚苯并咪唑(PBI)/导电炭黑复合电热膜材料的制备方法。
本发明解决其技术问题所采用的技术方案是:一种适用于高温加热的复合电热膜,包括复合加热层和设置于复合加热层两侧的聚酰亚胺封装层,所述复合加热层包括复合电热膜片和设置于复合电热膜片表面的铜电极,所述复合电热膜片由电热膜浆料和聚酰亚胺膜高温固化而成,所述电热膜浆料由聚苯并咪唑粉末、N-N二甲基乙酰胺溶液和导电炭黑组成。
作为优选,所述电热膜浆料由下述重量份的组分制成:5~15重量份的聚苯并咪唑粉末、1~5重量份的导电炭黑和80~90重量份的N-N二甲基乙酰胺溶液。
作为优选,所述封装层为聚酰亚胺封装层。
作为优选,所述复合电热膜片的膜厚为10μm~150μm。
一种适用于高温加热的复合电热膜的制备方法,包括以下步骤:
S1、将聚苯并咪唑粉末溶于N-N二甲基乙酰胺溶液中,在加热条件下,通过机械搅拌制备PBI-DMAc胶液;
S2、将适量的导电炭黑添加到步骤(S1)中制备的PBI-DMAc胶液中,通过机械搅拌,使导电炭黑充分与PBI-DMAc胶液混合均匀,形成电热膜浆料;
S3、采用浆料刮涂法将步骤(S2)中制备的电热膜浆料均匀涂覆于聚酰亚胺膜表面,经高温固化后形成复合电热膜片;
S4、将铜电极安置于步骤(S3)中制备的复合电热膜片表面,利用塑封机对其封装,获得“三明治”结构的封装层—PBI/导电炭黑复合加热层—封装层的复合电热膜。
作为优选,制备方法步骤(S1)中的加热温度范围为60~150℃。
作为优选,制备方法步骤(S3)中的固化温度范围为60~150℃。
与现有技术相比较,本发明具有如下有益效果:
(1)由于聚苯并咪唑的结构特点,所制成的复合电热膜可升温至650℃工作;并且可以在200~300℃高温中稳定工作。
(2)所制成的复合电热膜柔韧性较好,可根据需求进行不同形状的剪裁以及不同程度的弯曲。
(3)对于制成的膜进行燃烧测试,膜具有极高的阻燃性能,安全性能好。
(4)本发明制备工艺简单,电热膜可耐高温,柔性较强,安全性好,适用于高温加热领域。
附图说明
图1为本发明实施例1的复合电热膜结构示意图。
图2为本发明实施例1复合电热膜在20V电压下的电热性能图。
具体实施方式
下面通过具体实施例,并结合附图,对本发明的技术方案作进一步的具体说明。
一种适用于高温加热的复合电热膜,包括复合加热层和设置于复合加热层两侧的封装层,所述复合加热层包括复合电热膜片和设置于复合电热膜片表面的铜电极,所述复合电热膜片由电热膜浆料和聚酰亚胺膜高温固化而成,所述电热膜浆料由聚苯并咪唑粉末、N-N二甲基乙酰胺溶液和导电炭黑组成。
一种适用于高温加热的复合电热膜的制备方法,包括以下步骤:
S1、将5~15重量份的聚苯并咪唑粉末溶于80~90重量份的N-N二甲基乙酰胺溶液中,在60~150℃加热条件下,通过机械搅拌制备PBI-DMAc胶液;
S2、将1~5重量份的导电炭黑添加到步骤(S1)中制备的PBI-DMAc胶液中,通过机械搅拌,使导电炭黑充分与PBI-DMAc胶液混合均匀,形成电热膜浆料;
S3、采用浆料刮涂法将步骤S2制备的浆料均匀涂覆于聚酰亚胺膜表面,经60~150℃高温固化后形成10μm~150μm的复合电热膜片;
S4、将铜电极安置于步骤(S3)中制备的复合电热膜片表面,利用塑封机对其封装,获得“三明治”结构的封装层—PBI/导电炭黑复合加热层—封装层的复合电热膜。
实施例1:
制备PBI-DMAc胶液,将PBI粉末溶于N-N二甲基乙酰胺(DMAc)溶液中,在80℃加热条件下,通过机械搅拌制备PBI-DMAc胶液;
将适量的导电炭黑添加到PBI-DMAc胶液中,通过机械搅拌,使导电炭黑充分与PBI-DMAc胶液混合均匀,形成电热膜浆料;该电热膜浆料的重量配比为:10重量份的聚苯并咪唑粉末、5重量份的导电炭黑和85重量份的N-N二甲基乙酰胺溶液;
采用浆料刮涂法将制备的浆料均匀涂覆于聚酰亚胺膜表面,经80℃高温固化后形成50μm厚度的复合电热膜片;
将铜电极安置于复合电热膜片表面,利用塑封机对其封装,获得“三明治”结构的聚酰亚胺封装层—PBI/导电炭黑复合加热层—聚酰亚胺封装层的复合电热膜;
对所制得的复合电热膜进行电热性能测试。如图2所示,电热膜在20V的电压下,60s内达到恒温,最高温度为130℃,并可在最高温度下稳定工作。
实施例2:
制备PBI-DMAc胶液,将PBI粉末溶于N-N二甲基乙酰胺(DMAc)溶液中,在80℃加热条件下,通过机械搅拌制备PBI-DMAc胶液;
将适量的导电炭黑添加到PBI-DMAc胶液中,通过机械搅拌,使导电炭黑充分与PBI-DMAc胶液混合均匀,形成电热膜浆料;该电热膜浆料的重量配比为:12重量份的聚苯并咪唑粉末、3重量份的导电炭黑和85重量份的N-N二甲基乙酰胺溶液;
采用浆料刮涂法将制备的浆料均匀涂覆于聚酰亚胺膜表面,经80℃高温固化后形成70μm厚度的复合电热膜片;
将铜电极安置于复合电热膜片表面,利用塑封机对其封装,获得“三明治”结构的聚酰亚胺封装层—PBI/导电炭黑复合加热层—聚酰亚胺封装层的复合电热膜。
对所制得的复合电热膜进行电热性能测试。电热膜在45V的电压下,80 s内达到恒温,最高温度为170℃,并可在最高温度下稳定工作。
实施例3:
制备PBI-DMAc胶液,将PBI粉末溶于N-N二甲基乙酰胺(DMAc)溶液中,在80℃加热条件下,通过机械搅拌制备PBI-DMAc胶液;
将适量的导电炭黑添加到PBI-DMAc胶液中,通过机械搅拌,使导电炭黑充分与PBI-DMAc胶液混合均匀,形成电热膜浆料;该电热膜浆料的重量配比为:7重量份的聚苯并咪唑粉末、3重量份的导电炭黑和90重量份的N-N二甲基乙酰胺溶液;
采用浆料刮涂法将制备的浆料均匀涂覆于聚酰亚胺膜表面,经80℃高温固化后形成100μm厚度的复合电热膜片;
将铜电极安置于复合电热膜片表面,利用塑封机对其封装,获得“三明治”结构的聚酰亚胺封装层—PBI/导电炭黑复合加热层—聚酰亚胺封装层的复合电热膜。
对所制得的复合电热膜进行电热性能测试。电热膜在30V的电压下,40 s内达到恒温,最高温度为200℃,并可在最高温度下稳定工作。
实施例4:
制备PBI-DMAc胶液,将PBI粉末溶于N-N二甲基乙酰胺(DMAc)溶液中,在80℃加热条件下,通过机械搅拌制备PBI-DMAc胶液;
将适量的导电炭黑添加到PBI-DMAc胶液中,通过机械搅拌,使导电炭黑充分与PBI-DMAc胶液混合均匀,形成电热膜浆料;该电热膜浆料的重量配比为:15重量份的聚苯并咪唑粉末、5重量份的导电炭黑和80重量份的N-N二甲基乙酰胺溶液;
采用浆料刮涂法将制备的浆料均匀涂覆于聚酰亚胺膜表面,经80℃高温固化后形成50μm厚度的复合电热膜片;
将铜电极安置于复合电热膜片表面,利用塑封机对其封装,获得“三明治”结构的聚酰亚胺封装层—PBI/导电炭黑复合加热层—聚酰亚胺封装层的复合电热膜。
对所制得的复合电热膜进行电热性能测试。电热膜在20V的电压下,50 s内达到恒温,最高温度为130℃,并可在最高温度下稳定工作。
以上所述的实施例只是本发明的一种较佳的方案,并非对本发明作任何形式上的限制,在不超出权利要求所记载的技术方案的前提下还有其它的变体及改型。
Claims (7)
1.一种适用于高温加热的复合电热膜,其特征在于:包括复合加热层和设置于复合加热层两侧的封装层,所述复合加热层包括复合电热膜片和设置于复合电热膜片表面的铜电极,所述复合电热膜片由电热膜浆料和聚酰亚胺膜高温固化而成,所述电热膜浆料由聚苯并咪唑粉末、N-N二甲基乙酰胺溶液和导电炭黑组成。
2.根据权利要求1所述的一种适用于高温加热的复合电热膜,其特征在于,所述封装层为聚酰亚胺封装层。
3.根据权利要求1所述的一种适用于高温加热的复合电热膜,其特征在于,所述电热膜浆料由下述重量份的组分制成:5~15重量份的聚苯并咪唑粉末、1~5重量份的导电炭黑和80~90重量份的N-N二甲基乙酰胺溶液。
4.根据权利要求1所述的一种适用于高温加热的复合电热膜,其特征在于:所述复合电热膜片的膜厚为10μm~150μm。
5.一种权利要求1~4任意所述复合电热膜的制备方法,其特征在于,包括以下步骤:
S1、将聚苯并咪唑粉末溶于N-N二甲基乙酰胺溶液中,在加热条件下,通过机械搅拌制备PBI-DMAc胶液;
S2、将适量的导电炭黑添加到步骤(S1)中制备的PBI-DMAc胶液中,通过机械搅拌,使导电炭黑充分与PBI-DMAc胶液混合均匀,形成电热膜浆料;
S3、采用浆料刮涂法将步骤(S2)中制备的电热膜浆料均匀涂覆于聚酰亚胺膜表面,经高温固化后形成复合电热膜片;
S4、将铜电极安置于步骤(S3)中制备的复合电热膜片表面,利用塑封机对其封装,获得“三明治”结构的封装层—PBI/导电炭黑复合加热层—封装层的复合电热膜。
6.根据权利要求5所述的复合电热膜的制备方法,其特征在于:制备方法步骤(S1)中的加热温度范围为60~150℃。
7.根据权利要求5所述的复合电热膜的制备方法,其特征在于:制备方法步骤(S3)中的固化温度范围为60~150℃。
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