CN111065488B - Processing device - Google Patents
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- CN111065488B CN111065488B CN201880058804.3A CN201880058804A CN111065488B CN 111065488 B CN111065488 B CN 111065488B CN 201880058804 A CN201880058804 A CN 201880058804A CN 111065488 B CN111065488 B CN 111065488B
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- magnetic coupling
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- 238000010168 coupling process Methods 0.000 claims abstract description 47
- 238000005859 coupling reaction Methods 0.000 claims abstract description 47
- 238000003754 machining Methods 0.000 claims abstract description 36
- 230000003068 static effect Effects 0.000 claims abstract description 19
- 230000002706 hydrostatic effect Effects 0.000 claims abstract description 15
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- 239000004065 semiconductor Substances 0.000 claims description 46
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- 230000007246 mechanism Effects 0.000 description 54
- 235000012431 wafers Nutrition 0.000 description 46
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/047—Grinding heads for working on plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C32/00—Bearings not otherwise provided for
- F16C32/06—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H49/00—Other gearings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Magnetic Bearings And Hydrostatic Bearings (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The processing device comprises: a chuck (23) which holds a machining tool (24) and can rotate; a chuck plate (1) for holding a workpiece (W); rotors (4, 5, 6, 12, 13) having the chuck plate (1) mounted thereon and having magnetically coupled driven magnets (13); a static pressure gas bearing (2) for rotatably supporting the rotor (4, 5, 6, 12, 13); a tilt adjusting member (19) for adjusting the attitude of the hydrostatic gas bearing (2); a motor (18); and transmission members (14, 17) for transmitting the rotational driving force of the motor (18) to the driving side magnet (16) of the magnetic coupling.
Description
Technical Field
The present invention relates to a machining apparatus including a rotating machining tool and a rotating table for holding a workpiece. In particular, the present invention relates to a processing apparatus including a rotary table for holding a workpiece such as a semiconductor wafer and a rotary tool for grinding the workpiece, and capable of adjusting the posture of a rotary shaft.
Background
In recent years, a rotating device capable of adjusting the posture of a rotating shaft has been demanded. For example, in the field of flat grinding machines for thinning silicon wafers, which are raw materials of semiconductor devices, it is necessary to adjust the posture of a rotating grinding tool or a wafer stage at appropriate timing in order to improve the flatness of the silicon wafers.
For example, patent document 1 discloses a grinding machine including a grinding tool that rotates by transmitting a rotational force of a motor via a belt, an air spindle that axially supports the grinding tool, and a magnetic bearing that controls the posture of the grinding tool. In this apparatus, the inclination state of the object to be ground and the grinding tool is calculated using a displacement sensor, and the relative posture of the object to be ground and the grinding tool is adjusted by controlling the excitation of an electromagnetic coil of a magnetic bearing based on the calculated inclination state.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2005-22059
Disclosure of Invention
Problems to be solved by the invention
In the rotating mechanism of the machining apparatus such as the grinding machine, even when the posture of the rotating shaft is adjusted, it is required that the rotational force is stably transmitted to the rotating shaft and that an excessive load is not applied to the shaft support mechanism of the rotating shaft.
However, in the grinding machine described in patent document 1, when the rotation shaft is tilted by controlling the excitation of the electromagnetic coil of the magnetic bearing, the tension of the belt transmitting the rotational force of the motor changes. Therefore, the tension of the belt changes every time the posture of the grinding tool is adjusted, and the rotational force cannot be stably transmitted to the rotational shaft, so that the rotation of the grinding tool becomes unstable. Further, since the periodic stretching motion of the belt acts on the rotary shaft, there is a possibility that unnecessary vibration is caused in the rotary shaft.
Further, if the magnetic bearing is intended to strongly act by inclining the rotation shaft, an excessive load may be applied to the shaft support mechanism of the air spindle, and the gap at the portion supported by the air pressure may become uneven, or the members may interfere with each other in some cases, and the life of the shaft support mechanism may be shortened.
Means for solving the problems
According to claim 1 of the present invention, a processing apparatus includes: a chuck that holds a machining tool and is rotatable; a chuck plate for holding a workpiece; a rotor having the chuck plate mounted thereon and including a magnetically coupled driven magnet; a static pressure gas bearing rotatably supporting the rotor shaft; a tilt adjusting member that adjusts a posture of the hydrostatic gas bearing; a motor; and a transmission member that transmits the rotational driving force of the motor to the magnetic coupling prime side magnet.
Further, according to claim 2 of the present invention, a processing apparatus includes: a chuck plate which holds a workpiece and is rotatable; a chuck holding a machining tool; a rotor having the chuck attached thereto and including a driven-side magnet magnetically coupled thereto; a static pressure gas bearing rotatably supporting the rotor shaft; a tilt adjusting member that adjusts a posture of the hydrostatic gas bearing; a motor; and a transmission member that transmits the rotational driving force of the motor to the magnetic coupling prime side magnet.
Effects of the invention
According to the present invention, it is possible to provide a compact rotating device capable of adjusting the posture of a rotating shaft and reducing variation in the rotational force transmitted from a motor to the rotating shaft even when the posture of the rotating shaft is adjusted.
Other features and advantages of the present invention will become apparent from the following description with reference to the accompanying drawings. In the drawings, the same or similar structures are denoted by the same reference numerals.
Drawings
Fig. 1 is a sectional view of a processing apparatus according to embodiment 1.
Fig. 2 is a plan view showing an example of the arrangement of the housing portion and the tilt adjusting mechanism.
Fig. 3 is a sectional view illustrating the posture of the rotary table in the initial state of embodiment 1.
Fig. 4 is a sectional view illustrating the posture of the rotary table at the time of tilt adjustment according to embodiment 1.
Fig. 5A is a plan view of the magnet portion according to embodiment 1.
Fig. 5B is a plan view of the magnet unit according to embodiment 2.
Fig. 6 is a sectional view showing a rotary table according to embodiment 2.
Fig. 7 is a plan view of a magnet portion according to embodiment 3.
Fig. 8 is a sectional view of a processing apparatus according to embodiment 4.
Detailed Description
[ embodiment 1]
Hereinafter, a machining apparatus according to embodiment 1 of the present invention will be described with reference to the drawings.
Fig. 1 is a cross-sectional view schematically showing the schematic configuration of a processing apparatus for grinding a semiconductor wafer according to embodiment 1.
The present apparatus is an apparatus for grinding a semiconductor wafer to a predetermined thickness by lowering a grinding wheel disposed above while rotating the grinding wheel, and bringing the grinding wheel into contact with the semiconductor wafer rotated by a chuck plate held on a rotary table.
The description is made in order from the rotary table. In fig. 1, reference numeral W denotes a semiconductor wafer as a workpiece, and reference numeral 1 denotes a chuck plate for holding the semiconductor wafer W.
The chuck plate 1 is a disk larger than the semiconductor wafer W and is made of, for example, ceramics such as alumina. A plurality of concentric grooves 25 are provided in the upper surface of the chuck plate 1, i.e., the surface holding the semiconductor wafer W. The groove 25 is connected to a communication passage, not shown, which penetrates to a predetermined position on the bottom surface or the side surface of the chuck plate 1, and a negative pressure is supplied to the communication passage from a vacuum pump, not shown. When the semiconductor wafer W is placed on the chuck plate, a space formed by the bottom surface of the semiconductor wafer W and the groove 25 becomes a negative pressure, and the semiconductor wafer W is attracted to the chuck plate 1.
The rotor portion includes a hollow shaft 4, a thrust plate 5, a thrust plate 6, a magnet holding portion 12, and a driven-side magnet portion 13. Reference numeral a1 in the drawing is a central axis of the rotor portion. The hollow shaft 4, the thrust plate 5, and the thrust plate 6 are made of a metal material.
A chuck plate 1 is attached above the thrust plate 5, and the chuck plate 1 and the rotor portion rotate integrally. A hollow magnet holding portion 12 is provided below the thrust plate 6, and a driven-side magnet portion 13 is fixed to the outer surface thereof. The driven-side magnet portion 13 and a driving-side magnet portion 16 described later constitute an internal/external magnetic coupling. That is, in the magnet holding portion 12, the driven-side magnet portion 13, which is a part of the magnetic coupling, is held concentrically around the central axis a 1. The plurality of magnets magnetized in advance to have N-poles in the driven-side magnet portion 13 and the same number of magnets magnetized in advance to have S-poles are alternately arranged at equal angular intervals.
The casing includes a main body 7, a radial bearing pad 8, a thrust bearing pad 9, and a thrust bearing pad 10. The radial bearing pad 8, the thrust bearing pad 9, and the thrust bearing pad 10 are made of porous bodies, and are fixed to the body 7 of the housing portion by shrink fitting, adhesion, or the like. The main body 7 of the case portion is annular, and has a pressurized gas supply hole 11 formed in a side surface thereof and connected to a pressurized gas supply source, not shown. The pressurized gas supplied from the pressurized gas supply source to the pressurized gas supply hole 11 is distributed and supplied to the radial bearing pad 8, the thrust bearing pad 9, and the thrust bearing pad 10 via the distribution flow path 11a, and the gas is ejected from the pads.
The radial bearing pad 8 is annularly provided so as to surround the hollow shaft 4 of the rotor portion, and faces the bearing surface 3 which is the outer surface of the hollow shaft 4. The thrust bearing pad 9 is provided in an annular shape so as to surround the central axis a1 of the rotor portion, and faces the bearing surface 5a, which is the lower surface of the thrust plate 5. The thrust bearing pad 10 is provided in an annular shape so as to surround the central axis a1 of the rotor portion, and faces the bearing surface 6a, which is the upper surface of the thrust plate 6. The rotor portion is supported so as to be rotatable by the pressure of the gas ejected from each pad, while being separated from the housing portion.
Graphite carbon is preferably used for each bearing pad, and each bearingThe surface coating of the surface is preferably made of alumina (Al)2O3). This is because, when the bearing surfaces facing each other are in contact with each other, friction can be greatly reduced due to unexpected overload, insufficient pressure of supplied gas, reduction in rotational speed, or the like, and seizure, scratches, or reduction in bearing accuracy can be prevented. Graphite carbon has an advantage that it is excellent in self-lubricity and wear resistance due to the sliding of crystal planes, and can further greatly reduce the occurrence of friction.
The main body 7 of the housing portion is supported on the rotary table frame 20 by the support posts 26 and the plurality of tilt adjusting mechanisms 19. Fig. 2 shows the arrangement of the main body 7, the support post 26, and the tilt adjusting mechanism 19, and therefore, in a plan view of the lower surface of the annular main body 7 viewed in the Z direction, the support post 26 and the two tilt adjusting mechanisms 19 are arranged at an angle of 120 degrees with respect to the center of the annular ring. The main body 7 is supported by a support column 26 having a constant height and two tilt adjusting mechanisms 19 capable of extending and contracting in the Z direction, and the posture of the main body 7 with respect to the rotary table frame 20 can be controlled by independently adjusting the extension and contraction in the Z direction of the two tilt adjusting mechanisms 19. As the tilt adjusting mechanism 19, an electric cylinder is used.
The supporting method capable of adjusting the posture of the main body 7 of the housing is not limited to the example of the present embodiment, and for example, 4 tilt adjusting mechanisms may be arranged in a square. The tilt adjusting mechanism may be one that can control the length in the Z direction, and for example, a system in which a movable pin supporting a hydrostatic bearing body is advanced and retreated by using a piezoelectric element or rotating a ball screw by an electric motor may be employed.
The reference point for the tilt adjustment is not limited to the illustrated front end position of the support post 26, and may be provided in another place.
The rotary table frame 20 is provided with a pulley 14, a bearing 15, a driving-side magnet portion 16, a belt 17, and a motor 18 as a driving mechanism for applying a rotary force to the rotor portion.
The pulley 14 is a hollow shaft member, and a driving-side magnet portion 16 is fixed to the inner diameter side thereof. The bearing 15 is, for example, a deep groove ball bearing, and rotatably supports the pulley 14 at a position where the driving-side magnet portion 16 is at a height opposite to the driven-side magnet portion 13. Fig. 5A is a plan view showing the arrangement of the magnets. The driving-side magnet portion and the driven-side magnet portion are magnets in which N poles and S poles are alternately arranged along side surfaces of cylinders having different diameters. The driving-side magnet portion 16 and the driven-side magnet portion 13 are arranged so that magnets magnetized with opposite magnetic poles face each other, and exert a coupling function by the action of magnetic force, and when the pulley 14 rotates, the rotor portion also rotates in a driven manner. The driving side magnet portion 16 and the driven side magnet portion 13 constitute an internal and external magnetic coupling. The lengths of the driven-side magnet portion 13 and the driving-side magnet portion 16 in the thrust direction (Z direction) are shown as the same length in fig. 1, but may not necessarily be the same.
In the case of a processing apparatus for grinding a semiconductor wafer, in order to planarize the semiconductor wafer with high accuracy, it is necessary to adjust and stabilize the posture of the rotary table. In this regard, in a contact coupling system in which a rotational force is transmitted by coupling with an elastic member such as a plate spring, for example, when the rotary table is tilted, resistance is generated by deformation of the elastic member of the coupling portion, and the posture of the rotary table may become unstable. Further, the elastic member may be deteriorated by repeated deformation, and sufficient durability may not be expected.
On the other hand, since the driving side and the driven side of the magnetic coupling used in embodiment 1 or another embodiment described later are not in contact with each other, the member is not deformed to generate resistance when the rotary table is tilted, and high durability can be achieved. Although not shown in embodiment 1 or in the description of another embodiment to be described later, a stopper for limiting the tilt angle may be provided in order to reliably prevent the driven-side magnet and the driving-side magnet, which are magnetically coupled, from coming into contact with each other.
A motor 18 is fixed to the rotary table frame 20, and an endless belt 17 for transmitting the rotational driving force of the motor 18 to the pulley 14 is wound around the rotating shaft of the motor 18 and the pulley 14. A belt driving mechanism is formed by the pulley 14, the belt 17, and the motor 18.
Next, the machining tool will be described. The machining tool section can lower the grindstone while rotating the grindstone, and bring the grindstone into contact with the semiconductor wafer W rotated by the chuck plate 1 held by the rotary table. The machining tool unit includes an embedded motor 21, a bearing 22, a chuck 23, and a grinding wheel 24. The rotation of the built-in motor 21 is transmitted to the grinding wheel 24 via the bearing 22. Reference symbol a2 in the drawing is a rotary shaft of the built-in motor 21. The grinding wheel 24 is, for example, a diamond grinding wheel having a diameter of 300mm and is rotated at a speed of 1000 to 4000 rpm. The grindstone 24 is supported by the chuck 23 and can rotate about the rotation axis a2 while applying a force to the semiconductor wafer W on the side opposite to the Z direction when the grindstone is lowered toward the semiconductor wafer W.
In the present embodiment, the bearing 22 is used to transmit the rotational force of the motor to the grinding wheel 24 as the machining tool, but the present invention is not limited thereto. For example, a combination of a belt and a pulley, and a gear may be used to transmit the rotational force.
The machining device of the present embodiment, which includes the above-described rotary table and the machining tool portion, performs feed machining for thinning the semiconductor wafer, but the flatness of the semiconductor wafer depends on the relative angle between the grindstone 24 and the semiconductor wafer W during machining. In the processing apparatus of the present embodiment, the relative angle between the grinding wheel 24 and the semiconductor wafer W is detected by a sensor, not shown, and the tilt of the rotor of the rotary table is adjusted by driving and controlling the tilt adjusting mechanism so that the angle becomes an appropriate angle.
Fig. 3 is a cross-sectional view for explaining the posture of the rotary table before the grinding wheel 24 is brought into contact with the semiconductor wafer W to start processing, that is, in an initial state.
The tilt adjusting mechanism 19 adjusts the posture of the main body 7 of the housing so that the semiconductor wafer W is parallel to the XY plane, which is a horizontal plane. In this state, the main surface of the rotor portion supported so as to be rotatable away from the housing portion is naturally parallel to the XY plane, which is a horizontal plane, and the central axis a1 of the rotor portion is parallel to the Z axis. The pulley 14 is supported by a bearing 15 so that the rotation axis direction is parallel to the Z axis, and the direction T in which the endless belt 17 for transmitting the rotational force of the motor 18 to the pulley 14 is stretched is parallel to the horizontal XY plane. In the figure, reference symbol C denotes the distance between the pulley 14 and the rotor in a state where the central axis a1 of the rotor portion is perpendicular, i.e., parallel to the Z axis, i.e., the distance between the driving-side magnet portion 16 and the driven-side magnet portion 13, which are magnetically coupled. Note that reference symbol H in the drawing is a distance in the Z direction from the tip of the support post 26, which is a reference point at the time of tilt adjustment, to the magnetic coupling, which is the lowest point of the rotor.
Next, fig. 4 is a cross-sectional view for explaining a state in which the inclination of the rotor of the rotary table is adjusted by driving and controlling the inclination adjustment mechanism when the grinding wheel 24 is brought into contact with the semiconductor wafer W to perform machining. For convenience of explanation, the working tool is not shown.
Fig. 4 shows a state in which the tilt adjustment mechanism 19 operates such that the housing portion is tilted by θ with respect to the horizontal plane. In this state, the main surface of the rotor portion supported so as to be rotatable away from the housing portion is naturally inclined by θ from the XY plane, which is a horizontal plane, and the central axis a1 of the rotor portion is inclined by θ from the Z axis. However, the pulley 14 is supported by the bearing 15 so that the rotation axis direction is parallel to the Z axis, and the direction T in which the endless belt 17 for transmitting the rotational force of the motor 18 to the pulley 14 is stretched is parallel to the horizontal XY plane.
That is, in the processing apparatus of the present embodiment, when the inclination of the rotor of the rotary table is adjusted, the arrangement of the pulley 14, the bearing 15, the driving-side magnet portion 16, the belt 17, and the motor 18, which are driving means for applying a rotational force to the rotor portion, is not affected. Therefore, even if the rotation axis of the rotor portion is inclined, the tension of the belt transmitting the rotational force of the motor does not change. Therefore, the tension of the belt does not change every time the posture of the grinding tool is adjusted, the rotational force can be stably transmitted to the rotational shaft, and the rotation of the semiconductor wafer does not become unstable. In addition, since the periodic stretching motion of the belt acts on the rotary shaft, it is also impossible to cause unnecessary vibration on the rotary shaft. Therefore, the processing accuracy of the semiconductor wafer can be made extremely high.
In the present embodiment, when the maximum value of the inclination angle θ of the hydrostatic gas bearing or the rotor that allows the inclination adjustment mechanism to incline is θ MAX [ degrees ], the following expressions 1 and 2 are satisfied.
(math formula 1)
|U×(1-cosθMAX)-V×sinθMAX|<C
(math figure 2)
|U×sinθMAX+V×(cosθMAX-1)|<D
Where C [ m ] is a distance between the pulley 14 and the rotor in a state where the central axis a1 of the rotor portion is parallel to the vertical direction, i.e., the gravity direction (Z axis), that is, a distance between the driving-side magnet portion 16 and the driven-side magnet portion 13 which are magnetically coupled. The central axis a1 of the rotor portion may be parallel to the gravity direction (Z axis), which is the vertical direction, in other words, the angle adjusted by the tilt adjustment mechanism may be 0[ degree ].
When the tip of the strut 26, which is a reference point for tilt adjustment, is a point G and the farthest point from the point G in the driven-side magnet portion 13 is a point P in a state where the central axis a1 of the rotor portion is parallel to the Z axis, which is vertical, U [ m ] is the distance in the horizontal direction (X direction) between the point G and the point P. Further, V [ m ] is the distance in the vertical direction (Z direction) between the G point and the P point.
When the farthest point from the G in the driven-side magnet unit 13 is defined as point Q in a state where the central axis a1 is inclined at an angle that reduces the torque magnetically transmitted by 30% from the state where the central axis a1 is parallel to the Z axis, D [ m ] is the distance in the Z direction between the point P and the point Q. In other words, the distance that the driven-side magnet moves in the vertical direction while the inclination adjustment member increases the inclination angle from 0 degrees to an angle at which the torque transmitted by the magnetic coupling decreases by 30% is D [ m ].
Alternatively, in the present embodiment, the above-described formula 1 and the following formula 3 are established.
(math figure 3)
Tq(θMAX)>Tq(θ0)×0.7
Wherein Tq (θ 0) [ N · m ] represents a torque transmitted by the magnetic coupling in a state where a tilt angle of the tilt adjustment mechanism is 0[ degree ], and Tq (θ MAX) [ N · m ] represents a torque transmitted by the magnetic coupling in a state where the tilt angle of the tilt adjustment mechanism is θ MAX [ degree ]. Here, Tq (θ 0) [ N · m ] and Tq (θ MAX) [ N · m ] are torques transmitted to the rotor when torques of the same magnitude are input to the driving side magnet portion in a state where the inclination angles are 0[ degree ] and θ MAX [ degree ], respectively.
In this way, the apparatus of the present embodiment is configured to satisfy at least one of the pair of equations 1 and 2 and the pair of equations 1 and 3. Therefore, the rotor portion does not contact the pulley of the drive mechanism, and the driving force can be stably transmitted regardless of the driving state of the tilt adjustment mechanism. Further, since the rotor portion does not contact the pulley of the drive mechanism, an excessive load is not applied to the shaft support mechanism of the static pressure air bearing, and the static pressure air bearing can operate stably and have a long life.
[ embodiment 2]
In the machining device according to embodiment 1, the driving mechanism for applying a rotational force to the rotor portion of the rotary table uses an internal-external magnetic coupling, but in embodiment 2, a disk-type magnetic coupling is used.
Fig. 6 is a cross-sectional view showing a rotary table according to embodiment 2, and includes a rotor portion and a housing portion similar to those of embodiment 1. The same portions as those of the rotary table of embodiment 1 shown in fig. 3 are denoted by the same reference numerals in fig. 6, and detailed description thereof is omitted.
In fig. 6, reference numeral 61 denotes a disk-shaped driven-side magnet portion, reference numeral 62 denotes a disk-shaped driving-side magnet portion, and magnets 51 are arranged as shown in a plan view of fig. 5B. That is, the driven-side magnet portion 61 is formed by alternately radially arranging a plurality of magnets magnetized to N poles in advance and the same number of magnets magnetized to S poles in advance at equal angular intervals around the central axis a 1. The motive-side magnet unit 62 is also configured such that a plurality of magnets magnetized in advance to N poles and the same number of magnets magnetized in advance to S poles are alternately arranged radially at equal angular intervals around the rotation axis. The driven-side magnet portion 61 and the driving-side magnet portion 62 are arranged such that the N-pole and the S-pole thereof face each other, and exert a coupling function by the action of magnetic force, and when the pulley 14 rotates, the rotor portion also rotates in a driven manner. The driving side magnet portion 62 and the driven side magnet portion 61 constitute a disk-shaped magnetic coupling.
In the processing apparatus of the present embodiment, when the inclination of the rotor of the rotary table is adjusted, the arrangement of the pulley 14, the bearing 15, the driving-side magnet portion 62, the belt 17, and the motor 18, which are driving means for applying a rotational force to the rotor portion, is not affected.
Therefore, even if the rotation axis of the rotor portion is inclined, the tension of the belt transmitting the rotational force of the motor does not change. Therefore, the tension of the belt does not change every time the posture of the grinding tool is adjusted, the rotational force can be stably transmitted to the rotational shaft, and the rotation of the semiconductor wafer does not become unstable. In addition, since the periodic stretching motion of the belt acts on the rotary shaft, it is also impossible to cause unnecessary vibration on the rotary shaft.
In the present embodiment, when the maximum value of the inclination angle θ of the hydrostatic bearing or the rotor that can be inclined by the inclination adjustment mechanism is θ MAX [ degrees ], the following equations 4 and 5 are satisfied.
(math figure 4)
|E×sinθMAX+F×(cosθMAX-1)|<DS
(math figure 5)
|E×(1-cosθMAX)-F×sinθMAX|<XS
Where DS m is the distance between the driving magnet portion 62 and the driven magnet portion 61 in a state where the central axis a1 of the rotor portion is parallel to the gravity direction (Z axis), which is the vertical direction. The central axis a1 of the rotor portion may be parallel to the gravity direction (Z axis), which is the vertical direction, in other words, the angle adjusted by the tilt adjustment mechanism may be 0[ degree ].
When the tip of the strut 26, which is a reference point for tilt adjustment, is a point G and the farthest point from the point G in the driven-side magnet portion 61 is a point P in a state where the central axis a1 of the rotor portion is parallel to the Z axis, which is vertical, the distance E [ m ] is the horizontal direction (X direction) between the point G and the point P. Moreover, Fm is the distance in the vertical direction (Z direction) between the G point and the P point.
When the farthest point from the G in the driven-side magnet portion 61 is defined as a point Q in a state where the central axis a1 is inclined at an angle that reduces the torque magnetically transmitted by 30% from the state where the central axis a1 is parallel to the Z axis, XS [ m ] is the distance in the X direction between the point P and the point Q. In other words, the distance that the driven-side magnet moves in the horizontal direction is XS [ m ] while the inclination adjustment member increases the inclination angle from 0[ degree ] to an angle at which the torque transmitted by the magnetic coupling decreases by 30%.
Alternatively, in the present embodiment, the above-described equation 4 and the following equation 6 are established.
(math figure 6)
Tq(θMAX)>Tq(θ0)×0.7
Wherein Tq (θ 0) [ N · m ] represents a torque transmitted by the magnetic coupling in a state where the tilt angle of the tilt adjustment mechanism is 0[ degree ], and Tq (θ MAX) [ N · m ] represents a torque transmitted by the magnetic coupling in a state where the tilt angle of the tilt adjustment mechanism is θ MAX [ degree ]. Here, Tq (θ 0) [ N · m ] and Tq (θ MAX) [ N · m ] are torques transmitted to the rotor when torques of the same magnitude are input to the driving side magnet portion in a state where the inclination angles are 0[ degree ] and θ MAX [ degree ], respectively.
In this way, the apparatus of the present embodiment is configured to satisfy at least one of the pair of equations 4 and 5 and the pair of equations 4 and 6. Therefore, the power-side magnet portion 62 does not contact the driven-side magnet portion 61, and the driving force can be stably transmitted regardless of the driving state of the tilt adjusting mechanism. Further, the operation of the hydrostatic air bearing can be stabilized and the life can be extended without applying an excessive load to the shaft support mechanism of the hydrostatic air bearing.
[ embodiment 3]
In the machining device according to embodiment 2, the disk-shaped magnetic coupling shown in fig. 5B is used as the drive mechanism for applying a rotational force to the rotor portion of the rotary table, but in embodiment 3, disk-shaped magnetic couplings having different magnet arrangements are used.
The rotary table according to embodiment 3 also includes a disk-shaped driven-side magnet portion and a disk-shaped driving-side magnet portion. The cross-sectional view of the rotary table is the same as that of fig. 6, and therefore, the description thereof is omitted.
Both the driven-side magnet portion and the driving-side magnet portion of embodiment 3 include a magnet 71 having a planar shape as shown in fig. 7. The same as embodiment 2 is true of the case where a plurality of magnets magnetized in advance to have N poles and the same number of magnets magnetized in advance to have S poles are alternately arranged radially at equal angular intervals around the rotation axis, but the arrangement of the N poles is different from that of the rotation axis. The driven-side magnet portion and the driving-side magnet portion are coupled to each other with their N-poles and S-poles facing each other in the circumferential portion, but generate a repulsive force in the rotating shaft portion due to the magnetic poles of the same polarity facing each other, and serve to support a load applied in the thrust direction. Therefore, the gap between the two magnet portions can be stabilized.
In the processing apparatus of the present embodiment, when the inclination of the rotor of the rotary table is adjusted, the arrangement of the pulley 14, the bearing 15, the driving-side magnet portion 62, the belt 17, and the motor 18, which are driving means for applying a rotational force to the rotor portion, is not affected.
Therefore, even if the rotation axis of the rotor portion is inclined, the tension of the belt transmitting the rotational force of the motor does not change. Therefore, the tension of the belt does not change every time the posture of the grinding tool is adjusted, the rotational force can be stably transmitted to the rotational shaft, and the rotation of the semiconductor wafer does not become unstable. In addition, since the periodic stretching motion of the belt acts on the rotary shaft, it is also impossible to cause unnecessary vibration on the rotary shaft.
Further, since the configuration satisfies the relationship of the above-described equation 2, the driving-side magnet portion 62 and the driven-side magnet portion 61 do not come into contact with each other in the device of the present embodiment, and the driving force can be stably transmitted regardless of the driving state of the tilt adjusting mechanism. Further, the operation of the hydrostatic air bearing can be stabilized and the life can be extended without applying an excessive load to the shaft support mechanism of the hydrostatic air bearing.
[ embodiment 4]
In the processing apparatuses according to embodiments 1 to 3, the static pressure gas bearing provided with the tilt adjustment mechanism and the magnetic coupling are used for the rotation mechanism of the rotary table for holding the workpiece, but in embodiment 4, the static pressure gas bearing provided with the tilt adjustment mechanism and the magnetic coupling are used for the rotation mechanism of the processing tool.
Fig. 8 is a cross-sectional view schematically showing the schematic configuration of a processing apparatus for grinding a semiconductor wafer according to embodiment 4.
The present apparatus is an apparatus for grinding a semiconductor wafer to a predetermined thickness by lowering a grinding wheel disposed above while rotating the grinding wheel, and bringing the grinding wheel into contact with the semiconductor wafer rotated by a chuck plate held on a rotary table.
The description is made in order from the rotary table. In fig. 8, reference numeral W denotes a semiconductor wafer as a workpiece, and reference numeral 1 denotes a chuck plate for holding the semiconductor wafer W.
The chuck plate 1 is a disk-like plate larger than the semiconductor wafer W and is made of a porous material such as alumina, for example. A plurality of concentric grooves 25 are provided in the upper surface of the chuck plate 1, i.e., the surface holding the semiconductor wafer W. The groove 25 is connected to a communication passage, not shown, which penetrates to a predetermined position on the bottom surface or the side surface of the chuck plate 1, and a negative pressure is supplied to the communication passage from a vacuum pump, not shown. When the semiconductor wafer W is placed on the chuck plate, a space formed by the bottom surface of the semiconductor wafer W and the groove 25 becomes a negative pressure, and the semiconductor wafer W is attracted to the chuck plate 1. The rotation of the built-in motor 21 is transmitted to the chuck plate 1 via the bearing 22. Reference symbol a2 in the drawing is a rotary shaft of the built-in motor 21.
Next, the machining tool will be described. The machining tool section can lower the grindstone while rotating the grindstone, and bring the grindstone into contact with the semiconductor wafer W that is held by the chuck plate 1 of the rotary table and is rotating. The grinding wheel 24 is, for example, a diamond grinding wheel having a diameter of 300mm and is rotated at a speed of 1000 to 4000 rpm. When the grindstone 24 is lowered toward the semiconductor wafer W, the grindstone 24 is supported by the thrust plate 5 and the thrust plate 6 in the Z direction via the chuck 23, and therefore can be rotated about the rotation axis a1 while applying a force to the semiconductor wafer W on the side opposite to the Z direction.
The rotor portion includes a hollow shaft 4, a thrust plate 5, a thrust plate 6, a magnet holding portion 12, and a driven-side magnet portion 13. Reference numeral a1 in the drawing is a central axis of the rotor portion. The hollow shaft 4, the thrust plate 5, and the thrust plate 6 are made of a metal material.
A grinding wheel 24 is attached to the lower side of the thrust plate 5 via a chuck 23, and the grinding wheel 24 and the rotor portion rotate integrally. A hollow magnet holding portion 12 is provided above the thrust plate 6, and a driven-side magnet portion 13 is fixed to the outer side surface thereof. The driven-side magnet portion 13 and the driving-side magnet portion 16 together constitute an internal-external magnetic coupling. That is, in the magnet holding portion 12, the driven-side magnet portion 13, which is a part of the magnetic coupling, is held concentrically around the central axis a 1. The driven-side magnet portion 13 has a plurality of magnets magnetized in advance to N poles and the same number of magnets magnetized in advance to S poles alternately arranged at equal angular intervals.
The casing includes a main body 7, a radial bearing pad 8, a thrust bearing pad 9, and a thrust bearing pad 10. The radial bearing pad 8, the thrust bearing pad 9, and the thrust bearing pad 10 are made of porous bodies, and are fixed to the body 7 of the housing portion by shrink fitting, adhesion, or the like. The main body 7 of the case portion is annular, and has a pressurized gas supply hole 11 formed in a side surface thereof and connected to a pressurized gas supply source, not shown. The pressurized gas supplied from the pressurized gas supply source to the pressurized gas supply hole 11 is distributed and supplied to the radial bearing pad 8, the thrust bearing pad 9, and the thrust bearing pad 10 via the distribution flow path 11a, and the gas is ejected from the pads.
The radial bearing pad 8 is annularly provided so as to surround the hollow shaft 4 of the rotor portion, and faces the bearing surface 3 which is the outer surface of the hollow shaft 4. The thrust bearing pad 9 is provided in an annular shape so as to surround the central axis a1 of the rotor portion, and faces the upper surface of the thrust plate 5. The thrust bearing pad 10 is provided in an annular shape so as to surround the central axis a1 of the rotor portion, and faces the lower surface of the thrust plate 6. The rotor portion is supported so as to be rotatable by the pressure of the gas ejected from each pad, while being separated from the housing portion.
Graphite carbon is preferably used for each bearing pad, and alumina (Al) is preferably used for coating the surface of each bearing surface2O3). This is because, when the bearing surfaces facing each other are brought into contact with each other, friction can be greatly reduced due to unexpected overload, insufficient pressure of supplied gas, reduction in rotational speed, or the like, and seizure, scratches, or reduction in bearing accuracy can be prevented. Graphite carbon has an advantage that it is excellent in self-lubricity and wear resistance due to sliding of crystal planes, and can further greatly reduce the occurrence of friction.
The main body 7 of the housing is suspended from the processing tool housing 80 by a plurality of tilt adjusting mechanisms 19. By independently adjusting the expansion and contraction of the tilt adjustment mechanism 19 in the Z direction, the posture of the main body 7 with respect to the processing tool housing 80 can be controlled. As a result, the attitude of the grinding wheel 24 rotating together with the rotor portion can be controlled. As the tilt adjusting mechanism 19, for example, an electric cylinder is used.
The machining tool housing 80 is provided with a pulley 14, a bearing 15, a driving-side magnet portion 16, a belt 17, and a motor 18 as a driving mechanism for applying a rotational force to the rotor portion.
The pulley 14 is a hollow shaft member, and a driving-side magnet portion 16 is fixed to the inner diameter side thereof. The bearing 15 is, for example, a deep groove ball bearing, and rotatably supports the pulley 14 at a position where the driving-side magnet portion 16 is at a height opposite to the driven-side magnet portion 13. Fig. 5A is a plan view showing the arrangement of the magnets. The driving-side magnet portion 16 and the driven-side magnet portion 13 are arranged so that magnets magnetized with opposite magnetic poles face each other, and exert a coupling function by the action of magnetic force, and when the pulley 14 rotates, the rotor portion also rotates in a driven manner. The driving side magnet portion 16 and the driven side magnet portion 13 constitute an internal and external magnetic coupling. The lengths of the driven-side magnet portion 13 and the driving-side magnet portion 16 in the thrust direction (Z direction) are shown as the same length in fig. 8, but may not necessarily be the same.
A motor 18 is fixed to the processing tool housing 80, and an endless belt 17 for transmitting the rotational driving force of the motor 18 to the pulley 14 is wound around the rotating shaft of the motor 18 and the pulley 14. A belt driving mechanism is formed by the pulley 14, the belt 17, and the motor 18.
In the machining device of the present embodiment, the arrangement of the pulley 14, the bearing 15, the driving-side magnet portion 16, the belt 17, and the motor 18, which are driving means for applying a rotational force to the rotor portion, is not affected when the inclination of the rotor of the machining tool portion is adjusted.
Therefore, even if the rotation axis of the rotor portion is inclined during the feeding process, the tension of the belt transmitting the rotational force of the motor does not change. Therefore, the tension of the belt does not change every time the grinding wheel 24 of the grinding tool is adjusted, the rotational force can be stably transmitted to the rotational shaft, and the rotation of the grinding wheel 24 does not become unstable. In addition, since the periodic stretching motion of the belt acts on the rotary shaft, it is also impossible to cause unnecessary vibration on the rotary shaft.
Further, since the device of the present embodiment is configured to satisfy the relationship of the above-described equation 1, the driving-side magnet portion and the driven-side magnet portion do not come into contact with each other, and the driving force can be stably transmitted regardless of the driving state of the tilt adjusting mechanism. Further, the operation of the hydrostatic air bearing can be stabilized and the life can be extended without applying an excessive load to the shaft support mechanism of the hydrostatic air bearing.
In the present embodiment, the inner and outer shapes shown in fig. 5A are used as the magnetic coupling, but a disk type shown in fig. 5B or 7 may be used.
[ other embodiments ]
The embodiments of the present invention are not limited to the above-described embodiments, and can be appropriately modified or combined.
For example, in embodiments 1 to 3, the rotational force is transmitted to the driving-side magnet portion using the belt and the pulley in the path for transmitting the rotational force of the motor to the rotary table, but the embodiment of the present invention is not limited to this example. For example, the rotational force may be transmitted from the motor to the magnetically coupled motive-side magnet portion via a gear or a reduction gear, or the motor and the motive-side magnet portion may be directly coupled to each other as the case may be. Even in such a case, according to the present invention, since the transmission system is separated by the action of the magnetic coupling, the driving side is not affected when the inclination of the rotor is adjusted.
The position of the reference point for tilt adjustment is not limited to the example shown in the above-described embodiment, and may be provided in another place.
In addition, a stopper for restricting the inclination may be provided in order to prevent the driven-side magnet of the magnetic coupling from coming into contact with the driving-side magnet.
The present invention is not limited to a grinding apparatus using a semiconductor wafer as a workpiece. The holding mechanism for the workpiece is not limited to the vacuum chuck, and other holding mechanisms such as an electrostatic chuck may be used depending on the nature of the workpiece.
The machining process performed by the machining apparatus according to the present invention is not limited to grinding for the purpose of planarization, and may be, for example, drilling, cutting, curved surface polishing, or the like. That is, the present invention can be applied to the shaft support of the rotating shaft by appropriately selecting the machining tool or the holding mechanism of the workpiece in accordance with the target machining process.
In the rotating device of the present invention including the rotor having the magnetically coupled driven-side magnets, the static pressure gas bearing for rotatably supporting the rotor, the inclination adjusting mechanism for adjusting the posture of the static pressure gas bearing, the motor, and the transmission member for transmitting the rotational driving force of the motor to the magnetically coupled driving-side magnets, the object to be rotated is not limited to the workpiece or the processing tool. That is, if the same rotating device as the mechanism included in the processing device described in the embodiment is used, the held object can be rotated with high accuracy, and therefore the rotating device of the present invention can also be applied to industrial equipment such as a measuring device.
Industrial applicability
The present invention can be implemented in a machining apparatus including a rotating machining tool and a rotating table that holds a workpiece. In particular, the present invention can be suitably implemented in a processing apparatus which includes a rotary table for holding a workpiece such as a semiconductor wafer and a rotary tool for grinding the workpiece, and which is capable of adjusting the orientation of a rotary shaft.
The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the present invention. Therefore, to clarify the scope of the present invention, the following claims are attached.
Description of reference numerals
1, chuck flat plate; 2 a hydrostatic gas bearing; 3 bearing surface; 4 a hollow shaft; 5, a thrust plate; 5a bearing surface; 6, a thrust plate; 6a bearing surface; 7 a body; 8 radial bearing pads; 9 a thrust bearing pad; 10 a thrust bearing pad; 11 pressurized gas supply holes; 11a distribution channel; 12 a magnet holding part; 13 a driven-side magnet part; 14 belt wheels; 15 bearing; 16 a motive-side magnet portion; 17 a belt; 18 a motor; 19 a tilt adjusting mechanism; 20 rotating the table frame; 21 a built-in motor; 22 bearings; 23, a chuck; 24 grinding wheel; 26 a support post; 51 a magnet; a 61-disk-shaped driven-side magnet portion; 62 disc-shaped motive side magnet portions; 71 a magnet; w a semiconductor wafer.
Claims (11)
1. A processing device is characterized in that a processing device is provided,
comprising:
a chuck that holds a machining tool and is rotatable;
a chuck plate for holding a workpiece;
a rotor having the chuck plate mounted thereon and including a magnetically coupled driven magnet;
a static pressure gas bearing rotatably supporting the rotor shaft;
a tilt adjusting member that adjusts a posture of the hydrostatic gas bearing;
a motor; and
and a transmission member that transmits the rotational driving force of the motor to the magnetic coupling motive side magnet.
2. The processing device according to claim 1,
the chuck plate is a vacuum chuck, the rotor has a hollow rotating shaft, and negative pressure is supplied to the chuck plate through the hollow portion of the rotating shaft.
3. A processing device is characterized in that a processing device is provided,
comprising:
a chuck plate which holds a workpiece and is rotatable;
a chuck holding a machining tool;
a rotor having the chuck attached thereto and including a driven-side magnet magnetically coupled thereto;
a static pressure gas bearing rotatably supporting the rotor shaft;
a tilt adjusting member that adjusts a posture of the hydrostatic gas bearing;
a motor; and
and a transmission member that transmits the rotational driving force of the motor to the magnetic coupling motive side magnet.
4. Machining device according to one of claims 1 to 3,
the transmission member includes a pulley to which the driving-side magnet is fixed, and an endless belt wound around the pulley and a rotary shaft of the motor.
5. Machining device according to one of claims 1 to 3,
the driving side magnet and the driven side magnet of the magnetic coupling are magnets in which N poles and S poles are alternately arranged along the side surfaces of cylinders having different diameters.
6. The processing device according to claim 5,
the maximum value of the angle at which the static pressure gas bearing is tilted by the tilt adjusting means is set to θ MAX degrees,
the distance between the driving magnet and the driven magnet of the magnetic coupling is set to Cm when the inclination angle of the inclination adjusting member is 0 degree,
v [ m ] is a distance in a vertical direction from a reference point of tilt adjustment to a farthest point of the driven-side magnet in a state where an angle of tilt adjustment of the tilt adjustment member is 0[ degree ], U [ m ] is a distance in a horizontal direction from the reference point of tilt adjustment to the farthest point of the driven-side magnet in a state where the angle of tilt adjustment of the tilt adjustment member is 0[ degree ],
when the distance that the driven-side magnet moves in the vertical direction during the period from the time when the tilt adjustment member increases the tilt adjustment angle from 0[ deg ] to the time when the torque transmitted by the magnetic coupling is reduced by 30% is defined as D [ m ],
|U×(1-cosθMAX)-V×sinθMAX|<C
and is
|U×sinθMAX+V×(cosθMAX-1)|<D
This is true.
7. The processing device according to claim 5,
the maximum value of the angle at which the static pressure gas bearing is tilted by the tilt adjusting means is set to θ MAX degrees,
the distance between the driving magnet and the driven magnet of the magnetic coupling is set to Cm when the inclination angle of the inclination adjusting member is 0 degree,
v [ m ] is a distance in a vertical direction from a reference point of tilt adjustment to a farthest point of the driven-side magnet in a state where an angle of tilt adjustment of the tilt adjustment member is 0[ degree ], U [ m ] is a distance in a horizontal direction from the reference point of tilt adjustment to the farthest point of the driven-side magnet in a state where the angle of tilt adjustment of the tilt adjustment member is 0[ degree ],
the torque transmitted by the magnetic coupling is Tq (theta 0) [ N.m ] when the inclination adjustment angle of the inclination adjustment component is 0[ degree ],
when the torque transmitted by the magnetic coupling is Tq (theta MAX) [ N.m ] in a state that the tilt adjustment angle of the tilt adjustment member is theta MAX [ degree ],
|U×(1-cosθMAX)-V×sinθMAX|<C
and is
Tq(θMAX)>Tq(θ0)×0.7
This is true.
8. Machining device according to one of claims 1 to 3,
the driving side magnet and the driven side magnet of the magnetic coupling are magnets in which N poles and S poles are alternately arranged in a radial shape along the main surfaces of the disks different from each other.
9. The processing device according to claim 8,
the maximum value of the angle at which the static pressure gas bearing is tilted by the tilt adjusting means is set to θ MAX degrees,
the distance between the driving magnet and the driven magnet of the magnetic coupling is set to DS m when the inclination angle of the inclination adjusting component is 0 degree,
the distance in the vertical direction from the reference point of the tilt adjustment to the farthest point of the driven-side magnet in the state where the tilt adjustment angle of the tilt adjustment member is 0[ degree ] is represented by Fm, the distance in the horizontal direction from the reference point of the tilt adjustment to the farthest point of the driven-side magnet in the state where the tilt adjustment angle of the tilt adjustment member is 0[ degree ] is represented by Em,
when the distance that the driven-side magnet moves in the horizontal direction is XS [ m ] while the inclination adjustment member increases the inclination adjustment angle from 0[ deg ] to an angle at which the torque transmitted by the magnetic coupling is reduced by 30%,
|E×sinθMAX+F×(cosθMAX-1)|<DS
and is
|E×(1-cosθMAX)-F×sinθMAX|<XS
This is true.
10. The processing device according to claim 8,
the maximum value of the angle at which the static pressure gas bearing is tilted by the tilt adjusting means is set to θ MAX degrees,
the distance between the driving magnet and the driven magnet of the magnetic coupling is set to DS m when the inclination angle of the inclination adjusting component is 0 degree,
the distance in the vertical direction from the reference point of the tilt adjustment to the farthest point of the driven-side magnet in the state where the tilt adjustment angle of the tilt adjustment member is 0[ degree ] is represented by Fm, the distance in the horizontal direction from the reference point of the tilt adjustment to the farthest point of the driven-side magnet in the state where the tilt adjustment angle of the tilt adjustment member is 0[ degree ] is represented by Em,
the torque transmitted by the magnetic coupling is Tq (theta 0) [ N.m ] when the inclination adjustment angle of the inclination adjustment component is 0[ degree ],
when the torque transmitted by the magnetic coupling is Tq (theta MAX) [ N.m ] in a state that the tilt adjustment angle of the tilt adjustment member is theta MAX [ degree ],
|E×sinθMAX+F×(cosθMAX-1)|<DS
and is
Tq(θMAX)>Tq(θ0)×0.7
This is true.
11. Machining device according to one of claims 1 to 3,
the workpiece is a semiconductor wafer, the processing tool is a grinding wheel, and the semiconductor wafer is ground by feed processing using the grinding wheel.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017176111 | 2017-09-13 | ||
| JP2017-176111 | 2017-09-13 | ||
| PCT/JP2018/033112 WO2019054280A1 (en) | 2017-09-13 | 2018-09-06 | Processing device |
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| CN111065488A CN111065488A (en) | 2020-04-24 |
| CN111065488B true CN111065488B (en) | 2021-10-08 |
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| JP (1) | JP6878605B2 (en) |
| KR (1) | KR102352534B1 (en) |
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| CN111823084B (en) * | 2020-07-30 | 2021-11-26 | 华海清科(北京)科技有限公司 | Grinding apparatus with differential thread structure |
| CN112008595A (en) * | 2020-09-02 | 2020-12-01 | 珠海市中芯集成电路有限公司 | Wafer grinding device and grinding method |
| CN112303121B (en) * | 2020-10-27 | 2021-09-28 | 浙江大学 | Magnetic suspension pump with three-degree-of-freedom magnetic bearing |
| CN112428138B (en) * | 2020-11-20 | 2022-07-29 | 西安奕斯伟材料科技有限公司 | Single-side polishing device and method |
| SE2051385A1 (en) | 2020-11-27 | 2022-05-28 | Climeon Ab | Turbine and turbine-generator assembly with magnetic coupling |
| JP2022108920A (en) * | 2021-01-14 | 2022-07-27 | Ntn株式会社 | Spindle device |
| CN113997128A (en) * | 2021-11-01 | 2022-02-01 | 辽宁科技大学 | Aviation pipeline inside pipe wall washs magnetism grinding and polishing equipment |
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| JP2002303322A (en) * | 2001-04-04 | 2002-10-18 | Canon Inc | Rotating device |
| JP2009095913A (en) * | 2007-10-15 | 2009-05-07 | Nisshin Seisakusho:Kk | Machining tool protection device of machine tool and honing machine |
| JP5166064B2 (en) * | 2008-02-19 | 2013-03-21 | 株式会社岡本工作機械製作所 | Work chuck rotary table mechanism |
| CN201235486Y (en) * | 2008-08-07 | 2009-05-13 | 无锡开源机床集团有限公司 | Workbench structure for vertical grinder |
| JP2010188433A (en) * | 2009-02-16 | 2010-09-02 | Disco Abrasive Syst Ltd | Machining device with rotary tool |
| CN103831712A (en) * | 2014-03-07 | 2014-06-04 | 宇环数控机床股份有限公司 | Lower disc device for two-sided precision grinding and polishing combined machine tool |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111065488A (en) | 2020-04-24 |
| JPWO2019054280A1 (en) | 2020-11-12 |
| KR102352534B1 (en) | 2022-01-19 |
| JP6878605B2 (en) | 2021-05-26 |
| WO2019054280A1 (en) | 2019-03-21 |
| KR20200052929A (en) | 2020-05-15 |
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