JP2009208212A - Processing device for thinning and flattening substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a processing device for thinning and flattening a substrate, which scarcely causes chipping or cracking during grinding the substrate. <P>SOLUTION: In the processing device for thinning and flattening the substrate, a cup wheel-type grinding stone 14 pivotally supported on a rotatable/linearly movable wheel axis of a flat rough grinding device 100 is slid on a surface of the substrate loaded on an index type porous ceramic rotary chuck table to roughly grind the surface of the substrate. Afterwards, a finishing tool pivotally supported on a rotatable/linear movable tool axis of a finishing device 200 is slid on the roughly ground surface of the substrate to finish the same. Cutting of the wheel axis and the tool axis into the substrate during processing the surface of the substrate is carried out by driving motion of a rotary/linear-motion actuator. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to a thin flattening apparatus having high rigidity that does not cause cracking or chipping of a substrate even when the substrate diameter is as large as 450 mm. This substrate thinning flattening apparatus is used for thinning flattening of workpieces such as silicon bare wafers, semiconductor substrates, ceramic substrates, GaAs plates, sapphire substrates, etc., improving the flattening of the workpieces and processing the substrates. It improves speed.

After placing a workpiece such as a silicon bare wafer or semiconductor substrate on a porous ceramic rotary chuck table, rotate the grindstone shaft that supports the cupwheel grindstone and lower it to place the cupwheel grindstone on the workpiece surface. Grinding and grinding the workpiece surface by first controlling the inclination angle and feed amount (cutting amount) of the grinding wheel shaft with respect to the workpiece, and gradually reducing it, and then polishing the ground surface. Thin flattening apparatuses that reduce the thickness of workpieces have been put into practical use.

For example, one semiconductor substrate is mounted on each of four sets of substrate chuck rotary table mechanisms provided on an index-type rotary table at equal intervals around the rotation axis of the rotary table. There has been proposed a substrate for thinning and flattening a substrate provided with a rough grinding cup wheel type diamond grinding wheel, a finish grinding cup wheel type diamond grinding wheel and a polishing pad. This substrate flattening apparatus is a porous ceramic chuck capable of vacuum chucking one semiconductor substrate on one index type rotary table partitioned into a loading / unloading stage, a rough grinding stage, a finish grinding stage and a polishing stage. This is a substrate thinning and flattening apparatus in which four sets of tables are arranged at equal intervals on the same circumference with respect to the axis of the index rotary table (see, for example, Patent Document 1).

Further, in a flattening apparatus including a substrate storage stage outside, an articulated transfer robot, a temporary positioning table, a grinding stage, a movable transfer pad, a polishing stage, and a cleaning stage. A substrate storage stage is provided on the right side outside the room from the front side to the back side of the calibrating apparatus. In the room, an articulated transfer robot is installed in the vicinity of the substrate storage stage in the front row of the room. A temporary positioning table for alignment and a movable transfer pad at the center of the rear row are installed on the right side of the rear row of the robot, and the substrate loading / unloading stage, rough grinding stage, and finish grinding stage are clockwise in the last row of these robots. The porous ceramic chuck table that constitutes the three stages is concentrically arranged on the first index type rotary table. A rotary chuck cleaner for cleaning the upper surface of the porous ceramic chuck table and a rotary type for cleaning the ground substrate surface are provided above the substrate chuck rotary table mechanism constituting the substrate loading / unloading stage. A cleaning device including a pair of cleaning brushes is provided so as to be movable in a direction perpendicular to and parallel to the upper surface of the porous ceramic chuck table, and a rough grinding cup wheel type diamond grindstone is disposed above the porous ceramic chuck table constituting the rough grinding stage. A spindle with a finish grinding cup wheel type diamond grindstone is provided above the porous ceramic chuck table constituting the finish grinding stage. The substrate is formed by a cleaning device including a porous ceramic chuck table, an articulated transfer robot, a movable transfer pad, a rotary chuck cleaner, and a rotary cleaning brush. A loading / unloading stage is constructed, a coarse grinding stage is constructed with a porous ceramic chuck table and a coarse grinding cup wheel diamond wheel, and a finishing grinding stage is constructed with a porous ceramic chuck table and a finishing grinding cup wheel diamond wheel. On the left side of the articulated transfer robot, a porous ceramic chuck table constituting a substrate loading / unloading / finish polishing stage and a porous ceramic constituting a coarse polishing stage A polishing stage in which the chuck table is concentrically arranged on another second index type rotary table is provided, and the cleaning liquid supply mechanism and the polishing pad can be rotated above the porous ceramic chuck table constituting the finish polishing stage. A spindle for bearing is provided so as to be movable up and down and swingable in parallel with the upper surface of the porous ceramic chuck table, the porous ceramic chuck table, the polishing pad, the cleaning liquid supply mechanism, the movable transfer pad, the articulated transfer robot, or A separate conveying page is formed, and the abrasive slurry liquid supply mechanism and the spindle that rotatably supports the polishing pad can be moved up and down relative to the upper surface of the porous ceramic chuck table above the porous ceramic chuck table constituting the rough polishing stage. And An apparatus for thinning and flattening a semiconductor substrate, which is provided so as to be capable of swinging in parallel and constitutes a substrate rough polishing stage with a porous ceramic chuck table, a polishing pad, and an abrasive slurry liquid supply mechanism, has also been proposed (for example, patents). See Reference 2. ).

On the other hand, although it is not a substrate grinding device, a spindle device for rotating a grinding wheel shaft, a workpiece holding means for holding a workpiece, and a workpiece held by the grinding wheel of the spindle device and the workpiece holding means are relatively moved. An internal cylindrical grinding device having a feed means for causing the spindle device to have a static pressure gas bearing and a magnetic bearing combined with each other so that a static pressure gas bearing and a magnetic bearing are combined with each other. A pressure sensor for measuring the pressure of the bearing surface of the hydrostatic gas bearing is provided as a displacement measuring means that is rotatably installed on the spindle device body via a magnetic composite bearing and obtains the displacement of the spindle. Also proposed is an internal cylindrical grinding device provided with magnetic bearing control means for controlling the magnetic force of the magnetic bearing by obtaining the displacement of the spindle from the value For example, see Patent Document 3.).

Further, although not disclosed for use in a grinding apparatus, a composite (rotation / linear motion) actuator that rotates and linearly moves a rotatable / linearly movable tool spindle has also been proposed (for example, Patent Document 4, Patent) (Refer to Literature 5, Patent Literature 6, and Patent Literature 7.)

There is also known a test apparatus including a height position adjusting tool using a kinematic coupling in which a male member and a female member are coupled (see, for example, Patent Document 8 and Non-Patent Document 1).

Furthermore, the grindstone shaft that supports the rotor of the built-in motor is supported by a hydrostatic thrust bearing and a hydrostatic radial bearing, and the grindstone shaft is constituted by a heat pipe, and the heat generation of the rotor is performed by the heat pipe in the longitudinal direction of the grindstone shaft. There is also known a grinding head that is supported by a hydrostatic bearing having a cooling structure that is transmitted to the previous stage and escapes from the hydrostatic bearing to the outside (see, for example, Patent Document 9). A work-use porous ceramic rotary chuck table supported by a hydrostatic bearing has also been proposed (see, for example, Patent Document 10 and Patent Document 11).

Furthermore, in hydrostatic bearings, fluid bearings in which a fluid passage is provided on the inner wall of the cylindrical bush as a bearing housing (cylindrical bush) have also been proposed (see, for example, Patent Document 12, Patent Document 13, and Non-Patent Document 2). .)

For example, in the bearing surface that supports the rotating shaft, a plurality of static pressure pockets are arranged at appropriate intervals in the moving direction of the sliding surface of the rotating shaft, and lands are formed in areas other than the static pressure pockets. An oil supply hole communicating with the oil supply means opens in the static pressure pocket, and the land communicates with the discharge means. The rotation speed detection means detects the rotation shaft rotation speed, the pressure sensor detects the fluid pressure in the bearing, Lubricating oil is supplied via a variable throttle valve that is adjusted by a control means according to a detection signal from a displacement meter that detects the bearing gap between the bearing surface and the sliding surface of the rotating shaft and a temperature sensor that measures the fluid temperature in the bearing. An internal fluid bearing has been proposed in which one or more oil drain holes that flow out are opened (see, for example, Patent Document 13).

JP 11-132232 A US Pat. No. 7,238,087 JP 2000-24805 A US Patent Application Publication No. 2007/0222401 JP 2006-220196 A JP 2004-364348 A JP 2006-220178 A US Pat. No. 6,104,202 Bal-tec, “Kinema coupling design for Z-axis”, {on-line}, pages 430-434, {searched May 30, 2005}, Internet <URL: http://www.precisionballs.com /kinematic_repeatability.html> Japanese Patent Laid-Open No. 11-235643 US Patent Application Publication No. 2007/0286537 Japanese Patent Application Laid-Open No. 2000-240652 US Pat. No. 5,484,208 JP 2002-357222 A Slocum station, “Hydrostatic Journal Bearing”, magazine “Precision Engineering 25”, 2001, pp. 235-244

The grinding wheel shaft is installed on the columns described in Patent Document 1 and Patent Document 2 so that the grinding wheel shaft can be moved up and down, and the index type chuck rotary table is flattened. The semiconductor substrate (workpiece) has a diameter of 200 mm or 300 mm and a thickness of Although it is 100 to 770 μm, it is possible to provide a ground semiconductor substrate having a thickness distribution (thickness fluctuation is around 1 μm) that can withstand the practical use of DRAM even if the central part is thin and the edge part is thick. In the thinning process for obtaining a DRAM semiconductor substrate having a diameter of 450 mm, a thickness of 20 to 50 μm, and a thickness fluctuation of less than 0.5 μm, there is a defect that the semiconductor substrate is cracked or cracked during grinding or polishing. Realization of a thin and flattening apparatus for a highly rigid substrate is desired.

In addition, the semiconductor manufacturing industry dislikes that the substrate is soiled with oil during substrate processing, and the emergence of a substrate for thinning and flattening a hydrostatic pressure bearing substrate is desired.

A first object of the present invention is to provide a substrate flattening apparatus using the index type chuck rotary table described in Patent Document 1 and Patent Document 2, and Patent Document 4, Patent Document 5, Patent Document 6 and Patent Document 7 is used as a tool shaft driving means for a rough grinding apparatus and a finishing apparatus (finish grinding apparatus or polishing apparatus), and the kinema described in Patent Document 8 and Non-Patent Document 1 is used for this. It is an object of the present invention to provide a high-rigidity substrate thinning flattening apparatus by assembling a technique for adjusting the height position of a coupling.

A second object of the present invention is to provide a bearing for a tool shaft such as a grinding wheel spindle of a rough grinding device and a grinding wheel spindle of a finish grinding device or a platen spindle of a polishing device of the high-rigidity substrate thinning and flattening apparatus. An object of the present invention is to provide an environment-friendly hydrostatic bearing substrate thinning and flattening apparatus by applying the hydrostatic bearing technology described in 9 to Patent Document 13 or Non-Patent Document 2.

According to the first aspect of the present invention, there are provided three sets of substrate chucks provided at equal intervals on the circumference around the stage indicating shaft of the index type rotary table in the cylindrical bottomed portion of the machine frame having a cylindrical bottomed cavity. A rotary table mechanism, an index type rotary table mechanism in which the substrate chuck rotary table mechanism is rotatably provided around a stage indicating shaft of the index type rotary table, and a first porous ceramic rotary chuck table of the substrate chuck rotary table mechanism. A substrate transfer robot for mounting a substrate on the substrate or transferring a substrate from a first porous ceramic rotary chuck table, and a grindstone shaft that can rotate / linearly move above the second porous ceramic rotary chuck table of the substrate chuck rotary table mechanism Cup hoist supported by A rough grinding head that supports a rotating grindstone with a hydrostatic bearing and a magnetic bearing, and a tool shaft that can be rotated / directly moved above the third porous ceramic rotary chuck table of the substrate chuck rotary table mechanism. A finishing tool head that supports the finished finishing tool rotatably and linearly with a hydrostatic bearing and a magnetic bearing, and a regular triangular fixed plate with the rough grinding head suspended at the center is the center point of the lower surface of the fixed plate. On the other hand, three fixed plate elevating mechanisms including a kinema coupling and a cylinder rod that move the fixed plate up and down at three positions of the apex of the regular triangle, and an equilateral triangular fixed plate in which the finishing tool head is suspended in the center. A kinema coupling and a cylinder for moving the fixing plate up and down at three points of the apex position of an equilateral triangle with respect to the center point of the lower surface of the fixing plate A substrate thinning and flattening apparatus comprising three fixed plate lifting / lowering mechanisms including a lid, wherein the index-type rotary table is loaded with a rotary chuck table made of the first porous ceramic and a substrate transfer robot. The unloading stage is composed of the second porous ceramic rotary chuck table and the rough grinding head, and the coarse grinding stage is composed of the third porous ceramic rotary chuck table and the finishing tool head. An apparatus for thinning and flattening a substrate is provided.

The invention according to claim 2 is characterized in that the grinding wheel shaft supported by the hydrostatic bearing is supported through a composite bearing in which a magnetic bearing and a hydrostatic bearing are combined so that a combined portion is formed, and a porous ceramic rotary The apparatus for thinning and flattening a substrate according to claim 1, wherein a hollow spindle for bearing the chuck table is supported by a hydrostatic bearing.

According to a third aspect of the present invention, there are provided four sets of substrate chucks provided at equal intervals on the circumference around the stage indicating shaft of the index type rotary table in the cylindrical bottomed portion of the machine frame having a cylindrical bottomed cavity. A rotary table mechanism, an index type rotary table mechanism in which the substrate chuck rotary table mechanism is rotatably provided around a stage indicating shaft of the index type rotary table, and a first porous ceramic rotary chuck table of the substrate chuck rotary table mechanism. A substrate transfer robot for mounting a substrate on the substrate or transferring a substrate from a first porous ceramic rotary chuck table, and a grindstone shaft that can rotate / linearly move above the second porous ceramic rotary chuck table of the substrate chuck rotary table mechanism Cup hoist supported by A rough grinding head that supports a rotary rough grinding wheel with a hydrostatic bearing and a magnetic bearing, and a tool shaft that can rotate / directly move above the third porous ceramic rotary chuck table of the substrate chuck rotary table mechanism. A semi-finished grinding head that supports a cup wheel type semi-finished grinding wheel that is supported by a hydrostatic bearing and a magnetic bearing so as to be rotatable and linearly movable, and rotates above the fourth porous ceramic rotary chuck table of the substrate chuck rotary table mechanism. / A finishing tool head that supports a polishing pad supported by a linearly movable tool shaft so that it can be rotated and linearly moved by a hydrostatic bearing and a magnetic bearing, and an equilateral triangular fixed plate in which the rough grinding head is suspended in the center. A kinemaca that moves the fixed plate up and down in three places at the apex position of the equilateral triangle with respect to the center point of the lower surface of the fixed plate Three fixed plate elevating mechanisms including a pulling and a cylinder rod, and an equilateral triangle fixed plate in which the intermediate finishing grinding head is suspended at the center, are fixed to the three points of the apex of the equilateral triangle with respect to the center point of the lower surface of the fixed plate. Three fixed plate elevating mechanisms including a kinema coupling and a cylinder rod for moving the plate up and down, and a regular triangle fixed plate with the finishing tool head suspended in the center, are equilateral triangles with respect to the center point of the lower surface of the fixed plate. A substrate thinning and flattening apparatus comprising a kinema coupling that moves the fixed plate up and down at three locations of the apex position and three fixed plate lifting and lowering mechanisms including a cylinder rod, wherein the index-type rotary table comprises: A loading / unloading stage with the first porous ceramic rotary chuck table and the substrate transfer robot, Rough grinding stage with 2nd porous ceramic rotary chuck table and coarse grinding head, intermediate finish grinding stage with 3rd porous ceramic rotary chuck table and intermediate finish grinding head, and finish with 4th porous ceramic rotary chuck table. The present invention provides an apparatus for thinning and flattening a substrate, characterized in that a finishing stage is constituted by a processing tool head.

By using a processing head structure in which a processing tool such as a cup wheel type grinding wheel or a polishing platen is supported by a grinding wheel shaft or polishing shaft that is rotated and linearly moved by a composite actuator, 0 to 0 of the grinding wheel shaft during surface grinding of a substrate. In order to move the grinding wheel head to the standby position by cutting or retreating from the substrate surface by a 1.5 mm forward / backward movement, the fixed plate is moved using a kinematic coupling and a fixed plate lifting mechanism equipped with a cylinder rod. Since it is performed by raising or lowering, the grinding time can be shortened. Also, during finishing, the tool axis is cut or moved back and forth from the substrate surface by moving the tool axis between 0 and 10 μm, and kinema coupling and cylinder rod are used to move the processing tool head to the standby position. Therefore, the finishing time can be shortened by moving the fixed plate up or down using a fixed plate lifting mechanism.

In addition, since the inclination angle of the grindstone shaft is set by the three fixed plate height position adjusting mechanisms, the inclination angle can be set easily and accurately, and the rigidity of the work chuck rotary table mechanism can withstand the load of the fixed plate. Rigidity prepared by expanding the diameter of a rotary table for a conventional column type grinding apparatus is 2 to 3 times higher than that of 2,000 to 2,500. . Therefore, even if the substrate diameter is as large as 450 mm, a flattened substrate having an excellent flat thickness distribution can be obtained.

Furthermore, rotation of the same porous ceramic rotary chuck table installed on the index-type rotary table is used for transporting the substrate to the loading / unloading stage, rough grinding stage and finishing stage, so that rough grinding and finishing are performed. There is no work to reverse the front and back of the substrate at the time of processing, and the opportunity to break the flattened substrate is reduced.

When hydrostatic pressure bearings are used as bearings for hollow spindles and tool spindles for bearing porous ceramic rotary chuck tables, an environment-friendly substrate thinning and flattening apparatus is obtained.

Hereinafter, the present invention will be described in more detail with reference to the drawings. FIG. 1 is a perspective view showing a main part of a substrate flattening apparatus of the present invention, FIG. 2 is a perspective view showing a main part of the substrate surface grinding apparatus, and is a view seen from the direction of the line I-I in FIG. Of the three fixed plate lifting mechanisms, two are shown with the ball screw housing material omitted. 3 is a front sectional view of the substrate surface grinding apparatus, FIG. 4 is a sectional view of a grinding head of the substrate surface grinding apparatus, FIG. 5 is a sectional view of a work chuck rotary table mechanism, and FIG. 6 is a kinema coupling portion of a fixed plate lifting mechanism. FIG. 7 is a side view of the kinema coupling portion of the fixed plate lifting mechanism.

As shown in FIG. 1, the substrate thinning and flattening apparatus 300 according to the present invention includes a substrate surface rough grinding apparatus 100, a finishing apparatus 200, and a cylindrical bottomed portion of a machine frame 9 having a cylindrical bottomed cavity 9c. The three types of substrate chuck rotary table mechanisms 2 provided at equal intervals on the circumference around the stage indicating axis of the index type rotary table are provided upright from the center of the cylindrical bottomed space 9c. Three types of substrate chuck rotary table mechanisms 2, 2, 2 provided at equal intervals around the stage indicating shaft 9 b of the index type rotary table, the stage indicating shaft 9 b of the index type rotary table, and the substrate chuck An index type rotary table mechanism 2a in which a rotary table mechanism is rotatably provided around the stage indicating shaft 9b of the index type rotary table; A substrate transfer robot 400 for mounting a substrate on the first porous ceramic rotary chuck table 21a of the substrate chuck rotary table mechanism or for transferring a substrate from the first porous ceramic rotary chuck table is installed on the machine base 9a. The substrate storage cassette 500 and the cleaning device 600 are provided.

In the index type rotary table mechanism 2a, the outer periphery of a stage indicating shaft (fixed shaft) 9b provided upright from the bottom of the machine frame is surrounded by a cylindrical bearing housing for thrust bearings and radial bearings. Surrounded by the housing 2c, the cylindrical bearing housing is fixed on the inner wall of the cylindrical outer housing. The substrate chuck rotary table mechanisms 3, 2, 2 are staged at equal intervals by the three arms 2 k protruding from the outer peripheral wall of the cylindrical outer housing 2 c in three directions at intervals of 120 degrees and protruding from the holding arms. It is supported around an indicating shaft (fixed shaft) 9b. Rotating index type rotary table mechanism 2a instructions shaft (fixed shaft) 9b around by transmitting a driving force of the servo motor M ₁ with an encoder E with pulley P surrounding the outer wall of the cylindrical outer housing cylindrical outer housing 2c .

In the surface grinding apparatus 100 shown in FIG. 1 and FIG. 2, a cup wheel type grindstone 14 supported by a grindstone shaft that can rotate / linearly move above the second porous ceramic rotary chuck table 21b of the substrate chuck rotary table mechanism 2 is provided. Rough grinding head 1 supported so as to be rotatable and linearly movable by a hydrostatic bearing and a magnetic bearing, and supported by a tool shaft capable of rotating / linearly moving above third porous ceramic rotary chuck table 21c of the substrate chuck rotary table mechanism. A polishing platen 41 supported by a grinding head or a rotatable / linearly movable tool shaft that supports a cup wheel type grindstone 41 rotatably and linearly by a hydrostatic bearing and a magnetic bearing. The finishing head 200a supported movably and the rough grinding head are suspended in the center. Three fixed plate elevating mechanisms 7 each having a kinematic coupling and a cylinder rod for moving the fixed plate 6 up and down at three positions at the apex position of the regular triangle with respect to the center point of the lower surface of the fixed plate. A kinema coupling and a cylinder rod for moving the fixing plate up and down at three positions of the apex of the equilateral triangle with respect to the center point of the lower surface of the fixing plate are the equilateral triangular fixing plate 6 with the finishing head 200a suspended in the center. Three fixed plate raising / lowering mechanisms 7 are provided. Of the three fixed plate elevating mechanisms 7, one is installed on the fixed shaft 9b of the index-type rotary table mechanism 2a.

Thin flattening apparatus 300 of the substrate, the loading / unloading stage s ₁ between the first porous ceramic rotary chuck table 21a and the substrate transfer robot 400, the second porous ceramic rotary chuck table 21b and crude the rough grinding stage s ₂ between the grinding head 1, constituting the finishing stage s ₃ between the processing head finishing the third porous ceramic rotary chuck table.

Index servomotor _{M 1} of the rotary table mechanism 2a is 120 degrees out housing member 2c, is rotated 120 degrees, by rotating 120 degrees clockwise, or 120 degrees, 120 degrees, to -240 ° clockwise Thus, each porous ceramic rotary chuck table 21a, 21b, 21c is moved to the loading / unloading stage s ₁ , the rough grinding stage s ₂ , or the finish grinding stage s ₃ .

Next, the substrate surface grinding apparatus 100 will be described with reference to FIGS. As shown in the figure, a substrate surface grinding apparatus 100 includes a work chuck table mechanism 2 installed in a central circular mold cavity of a machine frame 9 and a cup wheel grindstone 14 supported by a grindstone shaft 13 that can rotate / linearly move. Is supported by a hydrostatic bearing and a magnetic bearing so as to be able to rotate and linearly move, a rotary / linear actuator 18 that rotates / directly moves the grindstone shaft 13, and a center of the lower surface so that the grindstone shaft 13 is in a vertical direction. The fixed plate 6 with the grinding head 1 fixed at the position and the fixed plate 6 provided with the grinding wheel shaft 13 in the vertical direction. The fixed plate is moved up and down at three vertex positions of an equilateral triangle or an isosceles triangle with respect to the center point of the lower surface. Three of the kinema coupling to be moved and the fixed plate elevating mechanism 7 including the cylinder rod are configured as main assembly materials.

In the three work chuck rotary table mechanisms 2, a porous ceramic rotary chuck table 21 is supported by a hollow spindle 22, and the hollow spindle 22 is supported by a hydrostatic bearing. The horizontal surface is provided so as to be parallel to the bottom surface of the cup wheel type grindstone 14 supported by the grindstone shaft 13. The lower end of the hollow spindle 22 is connected to three supply pipes connected to a vacuum pump, a compressor, and a pure water supply pump (not shown) by a rotary joint 29. A switching valve is attached to the three supply pipes. Decompression during workpiece adsorption according to the substrate processing process, pressurization when the substrate is removed from the porous ceramic rotary chuck table, and cleaning of the porous ceramic rotary chuck table Switch when supplying pressurized water.

The machine frame 9 is made of marble, ceramic, black granite, resin concrete, cast steel, or the like.

Next, the structure of the grinding head 1 will be described in detail with reference to FIGS. As shown in the figure, the grinding head 1 that supports the cup wheel grinding wheel 14 below the grinding wheel shaft 13 has a porous ceramic rotary chuck whose bottom surface of the cutting edge 14a arranged in parallel with the ring of the cup wheel grinding wheel 14 is a porous ceramic. The grinding wheel shaft is set as a processing standby position so as to be parallel to the surface of the table 21.

The grinding head 1 is installed so that the cup wheel type diamond grinding wheel 14 is lowered from the center point of the bottom surface of the fixed plate 6 whose plane is an equilateral triangle.

The cutting edge 14a of the cup wheel grinding wheel 14 is annularly arranged on the lower surface of the grinding wheel flange 14b, and the grinding fluid is supplied from the grinding fluid supply nozzles 14c and 14c to the annular concave groove provided on the upper surface of the grinding wheel flange 14b. . The rotational speed of the grindstone shaft can be up to 5,000 rpm, and a rotational speed of 1,000 to 2,500 rpm is used during substrate grinding.

The grindstone shaft 13 is surrounded by a cylindrical housing 15, and the lower portion of the grindstone shaft 13 is hydrostatically radial bearinged. A water passage 15e is provided on the inner wall of the cylindrical housing 15, and water is supplied to the water passage 15e from the water supply port 15a. The water that flows between the inner wall of the cylindrical housing 15 and the outside of the grindstone shaft 13 and cools the grindstone shaft 13 is discharged from the vacuum suction pipe 15b. After the substrate grinding is finished, pressurized air is supplied from the compressed air supply port 15c, and cooling water and water droplets remaining in the water passage 15e are discharged from the cylindrical housing 15 through the drain pipe 15d.

A built-in motor 16 that rotates the grindstone shaft 13 in the horizontal direction is installed at the center of the grindstone shaft 13, and the built-in motor 16 is cylindrical with coolant supplied from a coolant introduction pipe 15 f provided in the cylindrical housing 15. Is led to the discharge pipe 15g through the coolant flow path 15h provided on the inner wall of the cylindrical housing 15.

The radial bearing part chamber and the coolant chamber of the built-in motor 16 are partitioned by the lip seal 15j so that the liquid supplied to the respective chambers is not mixed.

A position sensor 85, which is a position detection element of the ball target 17 provided at the upper end of the grindstone shaft 13, is mounted above the grindstone shaft 13, and the grindstone shaft 13 to which the mover (permanent magnet) 18a is fixed is vertically moved. A coil 18b for moving about 0 to 1.5 mm is installed.

The built-in motor 16 can rotate the grindstone shaft 13, and the motor 18, which is a combination of the mover 18 a and the coil 18 b, can perform a thrust linear movement of 1.5 mm or less of the grindstone shaft 13. This is called a combined rotary / linear actuator.

The structure of the grindstone shaft rotation / linear motion line combined actuator may be the structure of the spindle rotation / linear motion line composite actuator disclosed in Patent Document 4, Patent Document 5, Patent Document 6, and Patent Document 7.

The finishing finishing tool working stages s _3, the cup wheel type diamond vitrified bonded grinding wheel abrasive numbered 3,800～10,000, ceria abrasive grains fixed flat grindstone, urethane polishing pad, ceria and silica abrasive fixed nonwoven A polishing pad or the like is used. In finishing, the thickness of the processed substrate is about 0.5 to 10 μm. Therefore, the inclination angle of the fixed plate 6 on which the finishing head is suspended is 0 degrees (the bottom of the fixed plate and the substrate). The surface should be close to parallel. The rotational speed of the finishing grindstone shaft can be up to 5,000 rpm, and a rotational speed of 1,000 to 2,500 rpm is used during finish grinding of the substrate. The rotational speed of the finish polishing shaft can be up to 200 rpm, and a rotational speed of 50 to 120 rpm is preferable during finish polishing of the substrate.

Next, the structure of the work chuck rotary table mechanism 2 will be described in detail with reference to FIGS. Workpiece chuck rotary table mechanism 2, hollow spindle 22 which journalled a porous ceramic rotary chuck table 21, the water passage 23a is a carbon nitride ceramic cylindrical bush 23 provided on the inner peripheral wall, the cylindrical S _{i C} Ceramic A water supply port 24a for supplying water to the water passage 23a of the bush made of water, a decompression / discharge port 24b for draining, and a compressed air supply port 24c for supplying compressed air to drain water remaining in the water passage 23a from the drain discharge port 24d. A cylindrical housing member 24, a thrust bearing 25 a provided above the hollow spindle 22, a radial bearing 25 b provided at the center of the hollow spindle 22, and a hollow spindle rotary drive mechanism provided below the hollow spindle 22. Built-in motor 27, encoder 28 and A rotary joint 29 connected at the lower end of the hollow spindle 22, a vacuum pump that is a pressure reducing mechanism for depressurizing the fluid in the hollow spindle 22 pipe through the rotary joint 29, and a pressurized gas supply mechanism for pressurizing the hollow spindle pipe It has pipes 22a and 22b connected to a certain compressor and a feed pump for supplying pure water into the hollow spindle 22 pipe.

The material of the hollow spindle 22 and the cylindrical bush 23 is preferably a ceramic such as silicon nitride, carbon nitride, silicon oxide, alumina, zirconia, etc., but a conventional stainless steel or chrome plated steel spindle surface is 100 to 500 μm by ceramic chemical vapor deposition. A thick coating may be used.

Wherein the water passage of the thrust bearing 25a, the pure water from the pure water supply nozzle 25a ₁ provided eight supplied, draining from the discharge pipe 25a _2. Water is supplied to the water passage 23a of the radial bearing 25b from the water supply port 24a and discharged from the decompression / discharge port 24b. The cooling water of the built-in motor 27 is supplied from the water supply port 26a and drained from the discharge port 26b. The cooling water for cooling the built-in motor 27 is supplied from the water supply port 26a and discharged from the drain port 26b.

The workpiece (substrate) is placed on the porous ceramic rotary chuck table 21, the vacuum pump is operated to fix the workpiece on the porous ceramic table 21, and the built-in motor 27 then holds the hollow spindle 22. Rotate horizontally. The rotation speed of the hollow spindle 22 can be up to 500 rpm, and is used at 50 to 200 rpm at the time of substrate rough grinding. The number of revolutions of the hollow spindle 22 during the substrate finishing process is 50 to 120 rpm.

The fixed plate elevating mechanism 7 will be described with reference to FIGS. 3, 6 and 7. The fixed plate elevating mechanism 7 includes a cross-section V-shaped coupling female member 73 having a hole through which a ball screw 72 passes in the center fixed to the upper surface of the outer peripheral cylindrical frame base 9a of the machine frame 9 of the work chuck rotary table mechanism 2. A coupling male member 74 having a hole through which the ball screw 72 passes in the center and having a V-shaped cross-sectional bottom portion that fits into the inner surface of the V concave portion of the coupling female member 73; The ball screw 72 installed through the through hole of the coupling female member on the vertical line and the lower end of the ball screw can be driven to rotate by the fixture 79a at the bottom of the machine base 9a of the work chuck rotary table mechanism 2 and the side wall recess of the rotary shaft 9b. The upper end of the ball screw can be rotationally driven by a fixed fitting plate 79b on the lower surface of the fixed plate 6 of the grinding head 1 Ri is fixed, the ball screw drive motor 71 and the encoder 76 and a ball screw threadably united 77 is attached to the upper end of the ball screw 72. A wedge 83 attached to the tip of a ball screw 81 is provided in the space 70 formed by the V recess of the coupling female member 73 and the bottom surface of the coupling male member 74 by driving the micro servo motor 82. 70 is provided so as to be able to move forward and backward.

A wedge attached to the tip of a ball screw 81 that can be moved forward and backward by driving the micro servo motor 82 in a space 70 formed by a V recess 73a of the coupling female member 73 and a bottom surface of the coupling male member 74. 83, and then the ball screw 72 is driven to push down the fixture 79a so that its lower convex portion comes into contact with the coupling male member 74 and its male member bottom surface comes into contact with the upper surface of the wedge 83. The height between the bottom surface and the surface of the porous ceramic rotary chuck table 21 is slightly increased. On the other hand, the wedge 83 is retracted from the space 70, and then the ball screw 72 is driven to push down the fixture 79a and push the lower convex portion of the coupling male member 74 so that the bottom surface of the male member abuts the upper surface of the wedge 83. As a result, the height between the bottom surface of the fixed plate 6 and the porous ceramic rotary chuck table 21 is slightly lowered. The contact between the top surface of the wedge 83 and the bottom surface of the coupling male member 74 fixes the height between the bottom surface of the fixed plate 6 and the horizontal surface of the porous ceramic rotary chuck table 21.

In the substrate surface grinding apparatus 100 shown in FIG. 3, a probe pin is brought into contact with the workpiece surface and the porous ceramic rotary chuck table 21 in the vicinity of the porous ceramic rotary chuck table 21 of the work chuck rotary table mechanism 2. A two-point process indicator 91 for measuring the thickness of the film is provided. The thickness of the substrate is used to determine an inclination angle of the grindstone shaft with respect to the substrate surface when the substrate is ground.

The ratio of the diameter _{r g} of the annular grinding blade of the cup wheel type grinding wheel 14 to the diameter _{r c} of the porous ceramic rotary chuck table 21 _(r g / r _c) is 1.01 to 1.25 times are preferred. The cup wheel type grindstone 14 is supported by the grindstone shaft 13 so that the annular grindstone blade of the cup wheel type grindstone 14 passes through the center point of the substrate. The cup wheel type grindstone 14 of the substrate surface rough grinding apparatus 100 is a cup wheel type diamond vitrified bond grindstone or a cup wheel type diamond metal bond grindstone having a grinding number of 1,000 to 2,000. As finishing tools, cup wheel type diamond vitrified bond grindstones with grinding numbers of 3,800 to 10,000, ceria abrasive fixed flat grindstones, polyurethane polishing pads, ceria and silica abrasive fixed nonwoven polishing pads, etc. are used. Is done. When the finishing tool is a flat grindstone or a polishing pad, the finishing tool is processed so as to cover the entire substrate surface.

The fixed plate elevating mechanism 7 has a fixed coupling female member 73 and movable coupling male members 74 and 79b attached to a cylinder plunger, and the movable coupling male member is fixedly coupled by moving the plunger up and down. This is a fixed plate lifting mechanism having a structure in which the female member is received or the movable coupling male member is separated from the fixed coupling female member. Three linear sensors 84 for measuring the height position of the bottom surface of the fixed plate are provided on the side of the coupling female member 73 of the fixed plate lifting mechanism 7. Before grinding, the height of the three points between the surface of the porous ceramic rotary chuck table 21 and the bottom surface of the fixed plate, the kinematic coupling portion cavity 70 entry and retract distances of the three wedges 83, and the porous ceramic of the grindstone shaft 13 Correlation data of the tilt angle with respect to the surface of the made rotary chuck table 21 is preliminarily compiled in a table and stored in the memory of the numerical control device, thereby changing the tilt angle of the grindstone shaft 13 according to the thickness of the ground substrate. A machining software program can be designed. The grinding wheel shaft tilt angle changing software program is a grinding wheel shaft tilt angle software program that adopts a system in which the ball screw 72 (cylinder rod) of the fixed plate lifting mechanism 7 supports the bottom surface of the fixed plate 6 at the three vertex positions of an equilateral triangle. Easy design.

The method of grinding the substrate at three different contact point positions by changing the angle of the grindstone shaft 13 with respect to the substrate surface during the grinding of the substrate is even better than the method of grinding the substrate at one contact point position. A ground substrate having high flatness is provided.

In the coupling parts 73 and 74 of the fixed plate lifting mechanism 7 shown in FIGS. 6 and 7 except for the ball screw 72, the female member 73 is on the surface of the machine base 9a of the work chuck rotary table mechanism 2 and the index indicating shaft. It is fixed to 2b. The female member 73 has a V-shaped cross section, and the bottom 73a is inclined. The female member 73 has a hole through which the ball screw 72 passes in the center.

The male member 74 includes a plate 74a having a substantially V-shaped cross section that forms two bottom portions, a plate 74b having a small width provided above the plate 74, and a side wall plate 74c that fixes the two plates. And the bottom of the plate 74a having a substantially V-shaped cross section is also inclined. A space 70 is formed by the bottom surface of the plate 74 a having a substantially V-shaped cross section and the V-shaped recess of the female member 73.

The ball screw 72 is inserted into the through hole of the female member 73 and the through hole of the male member 74 in the vertical direction.

In the space 70 formed by the female member 73 and the male member 74, a wedge 83 attached to the tip of the ball screw 81 is provided so as to move forward and backward by driving the micro servo motor 82. A ball screw 81 for moving the wedge 83 back and forth in the space 70 is also installed with an inclination of 4 to 7 degrees with respect to the upper surface of the machine frame base 9a, similar to the inclination of the bottom of the female member 73.

As shown in FIGS. 3 and 6, three linear sensors 84 are installed on the opposite side where the micro servo motor 82 is installed. The linear sensors 84 are provided on the bottom surface of the fixed plate 6 and the rotary chuck table 21 made of porous ceramic. Measure the vertical distance between the surfaces.

The fixed plate elevating mechanism 7 may be a height adjusting device including a kinema coupling and a cylinder rod that can move the height position of the fixed plate 6. For example, instead of the servo motor drive ball screw 72 described above, a fixed plate lifting mechanism using a cylinder rod that can be moved up and down by a pneumatic or hydraulic cylinder can be used. Further, the ball screw drive motor position of the above-described fixed plate lifting mechanism 7 may be installed upside down on the bottom side of the machine base 9a. Further, a structure in which the structure of the female member 73, male member 74, and wedge 83 of the kinema coupling is changed to a known kinema coupling structure may be used.

A process of planarizing the substrate using the substrate thinning planarization apparatus 300 shown in FIG. 1 will be described below.

1) The transfer robot 400 grips / sucks the substrate in the cassette, then places the substrate on the porous ceramic rotary chuck table 21a at the loading / unloading stage s ₁ position, and then operates the vacuum pump. The pressure reducing chamber at the bottom of the porous ceramic rotary chuck table is depressurized, and the substrate is fixed on the porous ceramic rotary chuck table 21a.

2) The index type rotary table mechanism 2a is rotated 120 degrees clockwise around the fixed shaft 9b, and the porous ceramic rotary chuck table 21a at the loading / unloading stage s ₁ position is moved to the coarse grinding stage s ₂ position porous ceramic. The rotary chuck table 21b is moved to the position.

3) The built-in motor 27 is driven to rotate the hollow spindle 22 by 50 to 200 rpm.

4) The fixed plate elevating mechanism 7 of the fixed plate 6 for hanging and fixing the rough grinding head 1 in the standby position is driven to drive the three ball screws 72 to raise the fixed plate 6 and then the cup of the fixed plate elevating mechanism 7 A wedge 83 attached to the tip of a ball screw 81 which can be moved forward and backward by driving by one of the micro servo motors 82 is inserted into a space 70 formed by the ring female member 73 and the coupling male member 74, while another wedge 83 is advanced. The wedge 83 attached to the tip of the ball screw 81 that can be moved forward and backward by driving with two micro servo motors 82 is retracted, and then the ball screw 72 is driven to push down the fixture 79b to contact the male male member 74. As a result, the bottom surface of the male member is brought into contact with the top surface of the wedge 83 so that the bottom surface of the fixing plate 6 and the rotary chuck table 21b made of porous ceramics are displayed. Perform the height settings between.

5) The ball screw 72 of the fixed plate elevating mechanism 7 is lowered while the grindstone shaft 13 is rotated by 2,000 rpm by the built-in motor 16 to slide the cup wheel type diamond grinding grindstone 14 of the grinding number 1300 onto the rotating substrate surface. Rubbing is started to start grinding and cutting the substrate. At this time, the grinding liquid is supplied from the supply nozzle 14 c into the upper groove of the flange 14 b of the cup wheel type diamond grinding wheel 14, and the grinding liquid is supplied to the substrate surface via the through holes provided obliquely to the flange wall. The wheel blade 14a of the wheel-type diamond grinding wheel 14 and the substrate are cooled. The grinding wheel shaft lower feed for cutting the substrate is performed by grinding wheel shaft feeding by a combined rotary / linear motion actuator.

6) During the rough grinding process, the thickness of the substrate is measured by the two-point process indicator 91, and an instruction is given to a grinding wheel shaft tilting program that determines the tilt angle of the rough grinding wheel shaft 13 with respect to the substrate surface based on the thickness value. In order to reach the height position of the fixing plate 6, the fixing plate 6 is slightly raised by raising the ball screw 72 of the fixing plate raising / lowering mechanism 7 described above, so that the height of the space 70 in the female member 73 and the male member 74 is slightly increased. Next, the ball screw 81 which can be moved forward and backward by driving by one of the other micro servo motors 82 while the wedge 83 attached to the tip of the ball screw 81 which can be moved forward and backward by driving by two of the micro servo motors 82 is entered. Next, the wedge 83 attached to the tip of the screw is retracted, and then the ball screw 72 is driven to push down the fixture 79b so as to contact the coupling male member 74. The male member bottom surface is in contact with the wedge 83 upper surface by the height set between the fixed plate 6 bottom and porous ceramic rotary chuck table 21b surface (inclination angle 5-3 degrees) performed.

7) The angle-adjusted coarse grinding wheel shaft 13 is lowered by the ball screw 72 of the fixed plate elevating mechanism 7 and brought into contact with the substrate surface of the grinding wheel blade 14a of the cup wheel type diamond grinding wheel 14, and the substrate by the grinding wheel blade 14a. Resume surface rubbing. The grinding wheel shaft lower feed for cutting the substrate is performed by grinding wheel shaft feeding by a combined rotary / linear motion actuator.

8) The substrate thickness measurement and the grinding wheel axis tilt angle adjustment in the above 6) step, and the substrate rubbing in the 7) step are repeated. When the thickness of the substrate reaches the desired final thickness, the coarse grinding wheel shaft 13 is raised by driving the rotary / linear motion combined actuator, and when it reaches the standby position, the rotation of the coarse grinding wheel shaft is stopped. On the other hand, the rotation of the hollow spindle 22 that supports the porous ceramic rotary chuck table 21b is stopped.

9) index type rotating table mechanism 2a around the fixed shaft 9b rotated 120 degrees clockwise, working stages s ₃ position of the porous ceramic rotary finishing a porous ceramic rotary chuck table 21b in the rough grinding stage s ₂ position The chuck table 21c is moved to the position.

10) The built-in motor 27 is driven to rotate the hollow spindle 22 by 50 to 100 rpm.

11) The finishing plate grinding head 1 in the standby position 1 is suspended and fixed. The fixing plate lifting mechanism 7 of the fixing plate 6 is driven to drive the three ball screws 72 to raise the fixing plate 6. While a wedge 83 attached to the tip of a ball screw 81 that can be moved forward and backward by driving by one of the micro servo motors 82 is inserted into a space 70 formed by a coupling female member 73 and a coupling male member 74, and the like. The wedge 83 attached to the tip of the ball screw 81 that can be moved forward and backward is driven by two micro servo motors 82, and then the ball screw 72 is driven to push down the fixture 79b so that it contacts the coupling male member 74. The bottom surface of the male member is brought into contact with the top surface of the wedge 83 by being brought into contact with the bottom surface of the fixed plate 6 and the rotary chuck table made of porous ceramic. Perform height setting between 1b surface (inclination angle 2 to 1 °).

12) The ball screw 72 of the fixed plate elevating mechanism 7 is lowered while the finish grinding wheel shaft 13 is rotated by 2,000 rpm by the built-in motor 16 to rotate the cup wheel type diamond vitrified bond grinding wheel 14 having the grinding number 4,500. The substrate surface is rubbed and grinding cutting of the substrate is started. At this time, the grinding liquid is supplied from the supply nozzle 14c into the upper groove of the flange 14b of the cup wheel type diamond vitrified bond grinding wheel 14, and the grinding liquid is supplied to the substrate surface through the through holes provided obliquely to the flange wall. Then, the grindstone blade 14a of the cup wheel type diamond vitrified bond grinding grindstone 14 and the substrate are cooled. The grinding wheel shaft lower feed for cutting the substrate is performed by grinding wheel shaft feeding by a combined rotary / linear motion actuator.

13) During the finish grinding process, the thickness of the substrate is measured by the two-point process indicator 91, and an instruction is given to a grinding wheel shaft tilting program that determines the tilt angle of the rough grinding wheel shaft 13 with respect to the substrate surface based on the thickness value. In order to reach the height position of the fixing plate 6, the fixing plate 6 is slightly raised by raising the ball screw 72 of the fixing plate raising / lowering mechanism 7 described above, so that the height of the space 70 between the female member 73 and the male member 74 is slightly increased. Next, the ball screw 81 which can be moved forward and backward by driving by one of the other micro servo motors 82 while the wedge 83 attached to the tip of the ball screw 81 which can be moved forward and backward by driving by two of the micro servo motors 82 is entered. Next, the wedge 83 attached to the tip of the screw is retracted, and then the ball screw 72 is driven to push down the fixing member 79b, thereby coupling the male member 74. The male member bottom by contact is abutted against the wedge 83 top performing height setting between the fixed plate 6 bottom and porous ceramic rotary chuck table 21b surface (inclination angle from 0.5 to 0 degrees). The inclination angle of the finish grinding wheel shaft 13 with respect to the substrate surface is 0 degree (the bottom surface of the fixed plate 6 or the ring wheel blade group 14a of the cup wheel type diamond vitrified bond grinding wheel, the horizontal surface of the substrate or the surface of the machine base 9a The grindstone axis tilt angle is decreased for a while so that

14) The finished grinding wheel shaft 13 whose angle has been adjusted is lowered by lowering the ball screw 72 of the fixed plate elevating mechanism 7, and is brought into contact with the substrate surface of the grinding wheel blade 14a of the cup wheel type diamond vitrified bond grinding wheel 14, and the grinding wheel blade 14a. Resume rubbing of the substrate surface due to. The grinding wheel shaft lower feed for cutting the substrate is performed by grinding wheel shaft feeding by a combined rotary / linear motion actuator.

15) The substrate thickness measurement and the grindstone axis tilt angle adjustment in step 13) described above, and the substrate rubbing in step 14) are repeated. When the thickness of the substrate reaches the desired final thickness, the finish grinding wheel shaft 13 is raised by driving the rotary / linear motion combined actuator, and when it reaches the standby position, the rotation of the finish grinding wheel shaft is stopped. On the other hand, the rotation of the hollow spindle 22 that supports the porous ceramic rotary chuck table 21c is stopped.

16) After finishing the finishing grinding of the substrate, the ball screw 72 of the fixed plate elevating mechanism 7 is raised to retract the grinding head 1 upward and return the standby position away from the grinding substrate. At the grinding head standby position, the distance to the bottom surface of the fixed plate 6 is measured using the linear sensor 84, and it is confirmed whether the inclination angle of the grindstone shaft 13 with respect to the substrate surface is 0 degree. When it is not 0 degree, the raising / lowering of the three ball screws 72 of the fixed plate raising / lowering mechanism 7 is adjusted, and the inclination angle with respect to the substrate surface of the grindstone shaft 13 is adjusted to 0 degree.

17) After the rotation of the porous ceramic rotary chuck table 21c is stopped, the operation of the vacuum pump is stopped, and then pressurized water is supplied to the bottom surface of the porous ceramic rotary chuck table 21c to provide a porous ceramic rotary chuck table for the ground substrate. The substrate can be easily peeled from the surface 21c.

18) The grinding substrate is held / adsorbed by the transfer robot, and the grinding substrate is transferred from the surface of the porous ceramic rotary chuck table 21c to the next cleaning step.

19) After cleaning the surface of the porous ceramic rotary chuck table 21c with a porous ceramic rotary chuck table cleaning device (not shown), pressurizing water (jetting) from the bottom surface of the porous ceramic rotary chuck table for 0.1 to 0.5 seconds. ) To clean the porous ceramic rotary chuck table.

20) index type rotating table mechanism 2a around the fixed shaft 9b is rotated 240 degrees to 120 degrees or opposite clockwise clockwise, the porous ceramic rotary chuck table 21c in the finishing stage s ₃ position loading / moving into the porous ceramic rotary chuck table 21a located at the unloading stage s ₁ position.

21) Hereinafter, returning to the above 1) step, the placement of the new substrate on the porous ceramic rotary chuck table 21a is resumed, and thereafter, the continuous operation is repeated from 2) to 20).

In the above embodiment, a cup wheel type diamond vitrified bond grinding wheel was used as a finishing tool, but a finishing tool such as a ceria abrasive fixed flat grindstone, a polyurethane polishing pad, a ceria or silica abrasive fixed nonwoven polishing pad, etc. It may be used.

In the above embodiment, the first porous ceramic rotary chuck table and the substrate transfer robot are used for the loading / unloading stage, the second porous ceramic rotary chuck table and the rough grinding head are used for the rough grinding stage. Although the substrate-thinning and flattening processing apparatus constituting the finishing stage is shown by the porous ceramic rotary chuck table and the finishing tool head, as described in Patent Document 1, the first porous ceramic rotary chuck table and A loading / unloading stage with the substrate transfer robot, a coarse grinding stage with the second porous ceramic rotary chuck table and the coarse grinding head, and a third porous ceramic rotary chuck table and intermediate finish grinding. A medium finishing stage and de may be a thin planarization substrate processing device constituting the finishing stage and the polishing pad and the fourth porous ceramic rotary chuck table.

In the substrate thinning and flattening processing apparatus using the four porous ceramic rotary chuck tables, the index rotary movement of each porous ceramic rotary chuck table to each stage is 90 degrees and 90 degrees in the clockwise direction. 90 degrees, 90 degrees, or 90 degrees, 90 degrees, 90 degrees, and -270 degrees in the clockwise direction.

The substrate flattening processing apparatus 300 of the present invention has kinema couplings and ball screws (elevating cylinder rods) at three locations on the lower surface of the fixed plate 6 on which the processing tool head 1 is suspended for adjusting the tilt angle of the tool shaft 13 with respect to the substrate surface. Since the fixed plate lift mechanism with 3 is arranged, the substrate load (grinding and polishing) is applied to the substrate surface through the grinding wheel and polishing pad, and the high rigidity substrate chuck rotary It is a table mechanism. Therefore, a processed substrate having excellent flatness can be obtained even with a workpiece having a large substrate diameter of 450 mm.

In addition, the rotation of the same porous ceramic rotary chuck table installed on the index-type rotary table is used for transporting the substrate to the loading / unloading stage, rough grinding stage, and finishing stage, so that rough grinding and finishing are performed. There is no work to reverse the front and back of the substrate at the time of processing, and the opportunity to break the flattened substrate is reduced.

It is a perspective view which shows the principal part of the thin planarization processing apparatus of the board | substrate of this invention. It is a perspective view which shows the principal part of a substrate surface grinding apparatus. It is front sectional drawing of a substrate surface grinding apparatus. It is sectional drawing of the grinding head of a substrate surface grinding apparatus. It is sectional drawing of a work chuck rotary table mechanism. It is a top view of the kinema coupling part of a fixed plate raising / lowering mechanism. It is a side view of the kinema coupling part of a fixed plate raising / lowering mechanism.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Surface rough grinding apparatus 200 Finish processing apparatus 300 Substrate thinning flattening apparatus 400 Substrate conveyance robot s ₁ Loading / unloading stage s ₂ Rough grinding stage s ₃ Finishing processing stage 1 Grinding head 13 Grinding wheel axis 14 Cup wheel type grindstone 14c Grinding liquid supply nozzle 15 Cylindrical housing 18 Rotary / linear motion combined actuator 2 Work chuck rotary table mechanism 2a Index type rotary table mechanism 21 Porous ceramic rotary chuck table 22 Hollow spindle 23 Cylindrical bush 24 Cylindrical housing member 25a Thrust bearing 25b Radial bearings 23a, 25a ₁ Water passage 27 Built-in motor 28 Encoder 29 Rotary joint 6 Grinding head fixed plate 7 Fixed plate lifting mechanism 70 Empty 71 Ball screw drive motor 72 Ball screw 73 Coupling female member 74 Coupling male member 76 Encoder 79a Fixing tool 79b Fixed fitting plate 81 Ball screw
82 Micro Servo Motor 83 Wedge 84 Linear Sensor 85 Height Position Measurement Sensor 9 Machine Frame 9a Cylindrical Bottom Machine Frame Base 9b Index Type Rotary Table Fixed Shaft 91 Two-point Process Indicator

Claims (3)

A machine frame comprising a cylindrical bottomed base frame having a fixed shaft of an index-type rotary table provided upright from the center of the machine frame and an upper opening provided upright on the outer peripheral edge of the machine frame , Three sets of substrate chuck rotary table mechanisms provided at equal intervals on the circumference around the fixed axis of the index type rotary table, and the substrate chuck rotary table mechanism rotates around the fixed axis of the index type rotary table An index-type rotary table mechanism provided freely, a substrate transfer robot for placing a substrate on the first porous ceramic rotary chuck table of the substrate chuck rotary table mechanism or transferring a substrate from the first porous ceramic rotary chuck table The second porous cera of the substrate chuck rotary table mechanism Coarse grinding head that supports a cup wheel type grindstone supported on a grindstone shaft that can be rotated / directly moved above the rotary chuck table made of steel so that it can be rotated and linearly moved by a hydrostatic bearing and a magnetic bearing, and the substrate chuck rotary table mechanism Finishing tool head, which supports a finishing tool supported by a hydrostatic bearing and a magnetic bearing so as to be rotatable and linearly movable on a tool shaft that can be rotated / directly moved above the third porous ceramic rotary chuck table of the above-mentioned rough grinding A fixed plate elevating mechanism comprising a kinema coupling and a cylinder rod for moving the fixed plate vertically moving the fixed plate in three positions at the apex position of the regular triangle with respect to the central point of the lower surface of the fixed plate. Three sets of equilateral triangle fixing plates with the finishing tool head suspended in the center are set to the center point of the lower surface of the fixing plate. A substrate thinning and flattening apparatus comprising a kinema coupling for moving the fixed plate up and down at three positions at the apex of an equilateral triangle and three fixed plate lifting mechanisms provided with cylinder rods, the index type rotary table The first porous ceramic rotary chuck table and substrate transfer robot are used for loading / unloading stages, the second porous ceramic rotary chuck table and rough grinding heads are used for rough grinding stages, and the third porous ceramics are used for manufacturing. A substrate thinning and flattening apparatus characterized in that a rotary chuck table and a finishing tool head constitute a finishing stage. A hollow spindle that supports a rotary chuck table made of porous ceramic, with the grinding wheel shaft supported by the hydrostatic bearing supported through a composite bearing in which the magnetic bearing and the hydrostatic bearing are combined so that they can be combined with each other. The apparatus for thinning and flattening a substrate according to claim 1, wherein the substrate is supported by a hydrostatic bearing. The fixed plate elevating mechanism has a cross-section V-shaped coupling female member having a hole through which a ball screw passes in the center and fixed to the surface of the machine base of the work chuck rotary table mechanism, and a hole through which the ball screw passes in the center. A coupling male member having a V-shaped bottom section fitting to the inner wall of the V recess of the ring female member, the through hole of the coupling female member and the through hole of the coupling female member are installed through the vertical line. It is a ball screw, and its lower end is fixed to the bottom of the machine base of the work chuck rotary table mechanism by a fixing tool so that it can be rotated. The upper end is fixed to the bottom surface of the grinding head fixing plate by a fixed fitting plate. A ball screw having a ball screw drive motor, an encoder and a ball screw screwed body attached to the upper end side of the ball screw; And a wedge attached to the tip of a ball screw capable of moving forward and backward by driving a micro servo motor in a space formed by a V recess of the coupling female member and a bottom surface of the coupling male member, 2. The substrate flattening process according to claim 1, wherein the substrate is a fixed plate height position adjusting mechanism capable of determining a height position of the fixed plate by contact between a wedge and a bottom surface of the coupling male member. apparatus.

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