JP2010172975A - Polishing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing apparatus capable of precisely polishing a plurality of workpieces to be polished at the same time. <P>SOLUTION: The polishing apparatus 1 includes a polishing pad 11 having a polishing surface capable of polishing the workpieces 5, 6; a polishing platen capable of rotating while holding the polishing pad 11 with its polishing surface facing up; and a plurality of head portions 20a-20c disposed above the polishing platen and holding the workpieces 5, 6 with their surfaces to be polished facing down. The polishing pad 11 is configured to be able to simultaneously polish the plurality of workpieces 5, 6 individually held by the plurality of head portions 20a-20c, and is provided with head drive mechanisms 30a-30c which move each of the plurality of head portions 20a-20c in a two-dimensional direction substantially parallel to the polishing surface of the polishing pad 11. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a polishing apparatus for polishing an object to be polished such as a glass substrate or a semiconductor wafer.

  A CMP apparatus is exemplified as a polishing apparatus for polishing an object to be polished. A CMP apparatus is widely used for polishing a glass substrate, a semiconductor wafer, and the like as a technique for polishing a surface of an object to be polished with high precision by chemical mechanical polishing (CMP). In such a polishing apparatus, the object to be polished held by the chuck and the polishing pad mounted on the polishing head are relatively rotated and pressed, and a contact portion between the object to be polished and the polishing pad corresponds to the polishing content. Slurry is supplied to cause a chemical / mechanical polishing action, and the surface of the object to be polished is polished flat (see, for example, Patent Document 1).

JP 2006-319249 A

  Among such polishing apparatuses, there is a polishing apparatus that increases a polishing pad and simultaneously polishes a plurality of objects to be polished in order to improve throughput. However, in such a polishing apparatus, since polishing was performed on a plurality of objects to be polished under the same polishing conditions, a polishing object having a relatively different initial shape before polishing, such as a glass substrate, is used. In some cases, the desired polishing accuracy cannot be obtained.

  This invention is made | formed in view of such a problem, and it aims at providing the grinding | polishing apparatus which can perform highly accurate grinding | polishing simultaneously with respect to a several grinding | polishing target object.

  In order to achieve such an object, a polishing apparatus according to the present invention is capable of rotating with a polishing pad having a polishing surface capable of polishing an object to be polished, and holding the polishing pad so that the polishing surface faces upward. A polishing surface plate, and a plurality of head portions that are disposed above the polishing surface plate and hold the polishing object such that a surface to be polished of the polishing object faces downward; In a polishing apparatus configured to polish the object to be polished by relatively moving the surface to be polished of the object to be held held in contact with the polishing surface of the polishing pad held by the polishing surface plate. The polishing pad is configured such that a polishing surface of the polishing pad is larger than a surface to be polished of the polishing object, and the plurality of polishing objects respectively held by the plurality of head portions can be simultaneously polished. And the plurality of heads Head driving mechanism is provided for moving parts of the two-dimensional direction approximately parallel to the polished surface of each of said polishing pad.

  According to the present invention, high-precision polishing can be simultaneously performed on a plurality of objects to be polished.

It is a top view of a polish device. It is a side view which shows a part of polishing apparatus. It is a sectional side view of a head part. It is a figure which shows the positional relationship of a head part and a nozzle.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. A schematic configuration of a polishing apparatus 1 according to the present embodiment is shown in FIG. The polishing apparatus 1 includes a pad rotating mechanism 10 that rotates a polishing surface plate 12 on which a polishing pad 11 is mounted, and first to third head portions 20a to 20c that hold an object to be polished such as a glass substrate 5 and a sample wafer 6. And first to third head drive mechanisms 30a to 30c for driving the first to third head portions 20a to 20c, respectively, and first to third dressing mechanisms 80a to 80c for dressing the polishing pad 11. The pad rotation mechanism 10, the first to third head drive mechanisms 30 a to 30 c, and the control unit 85 (see FIG. 2) that controls the operation of the first to third dressing mechanisms 80 a to 80 c are mainly configured. .

  As shown in FIG. 2, the pad rotating mechanism 10 includes a polishing pad 11 having a polishing surface capable of polishing an object to be polished such as a glass substrate 5 and a sample wafer 6, and a polishing constant capable of rotating while holding the polishing pad 11. And a board 12. The polishing pad 11 is formed in a disk shape having a diameter larger than that of the glass substrate 5 or the sample wafer 6. For example, the polishing pad 11 is formed using a hard polyurethane sheet having an independent foam structure and is attached to the upper surface of the polishing surface plate 12. It is attached and the polishing surface is held in an upward horizontal posture. The polishing surface of the polishing pad 11 is several times larger than the surface to be polished of the object to be polished such as the glass substrate 5 or the sample wafer 6 so that a plurality of objects to be polished can be polished simultaneously. The polishing surface plate 12 is formed in a disk shape with high flatness using a highly rigid material such as stainless steel, and the polishing pad 11 is affixed to the upper surface of the polishing surface plate 12 so that the polishing surface faces upward. A rotating shaft 13 extending in the vertical direction is connected to the lower side of the polishing surface plate 12, and the polishing surface plate 12 is rotatably supported by the rotating shaft 13 in a horizontal posture.

  As shown in FIG. 1, the first head portion 20a, the second head portion 20b, and the third head portion 20c are disposed above the polishing pad 11 and the polishing surface plate 12, respectively, and the surface to be polished is on the lower side. A polishing object such as the glass substrate 5 and the sample wafer 6 is held so as to face. The first to third head portions 20a to 20c have the same configuration, and as shown in FIG. 3, each head portion 20a to 20c is connected to the spindle 61 of each head drive mechanism 30a to 30c. A head body 21, a membrane sheet 23 attached to the lower surface of the head body 21, and a retainer ring 24 attached to the lower peripheral portion of the head body 21.

  The head main body 21 is formed in a disk shape with high flatness using a high rigidity material similar to that of the polishing surface plate 12, and is held rotatably by the spindle 61 in a horizontal posture. An air passage 22 is formed in the head main body 21 for vacuum-sucking an object to be polished such as the glass substrate 5 or the sample wafer 6. The membrane sheet 23 is formed in a disk shape having the same diameter as the glass substrate 5 and the sample wafer 6, and is attached to the lower surface of the head body 21. A plurality of small holes are formed in the membrane sheet 23 so as to be connected to the air passage 22 of the head main body 21, and the glass substrate 5 and the sample wafer 6 are vacuum-sucked by making the inside of the air passage 22 negative pressure. Configured to be possible. Thereby, the surface to be polished (that is, the surface to be polished) of the object to be polished that is adsorbed and held on the membrane sheet 23 is held in a downward horizontal posture. The retainer ring 24 is formed in a ring shape having a diameter larger than that of the glass substrate 5 or the sample wafer 6, and is attached to the lower peripheral portion of the head main body 21, and the polishing object adsorbed and held on the membrane sheet 23 is on the side. This prevents it from popping out (in addition, it suppresses edge sag of the object to be polished).

  As shown in FIG. 1, the first head driving mechanism 30a, the second head driving mechanism 30b, and the third head driving mechanism 30c are respectively equidistant above the polishing pad 11 and the polishing surface plate 12 (on the polishing surface plate 12). The first head portion 20a, the second head portion 20b, and the third head portion 20c are rotated, lifted, and lowered with respect to the pad rotating mechanism 10, respectively. The polishing pad 11 is held movably in a horizontal direction (two-dimensional direction) substantially parallel to the polishing surface of the polishing pad 11. The first to third head driving mechanisms 30a to 30c are similar in configuration to each other. As shown in FIG. 2, each head driving mechanism 30a to 30c includes a housing portion 31 and a first horizontal movement mechanism. 35, a second horizontal movement mechanism 45, an elevating mechanism 50, and a rotation mechanism 60. The casing 31 is formed in a long box shape with the lower side opened horizontally extending along the radial direction of the polishing pad 11 and the polishing surface plate 12.

  The first horizontal movement mechanism 35 includes a first traveling shaft 36 disposed inside the housing portion 31, a first traveling body 38 screwed with the first traveling shaft 36, and a first traveling. The first traveling shaft motor 39 that rotationally drives the shaft 36 is mainly configured so that the head portions 20a to 20c connected to the first traveling body 38 are horizontally moved along the first traveling shaft 36. It has become. Thereby, each head part 20a-20c can be moved to the horizontal direction along the radial direction of the polishing pad 11 and the polishing surface plate 12. FIG. The first travel shaft 36 is a so-called ball screw, and is attached so as to be rotatable around the central axis of the first travel shaft 36 across the vicinity of the distal end portion of the housing portion 31 to the base end portion. Note that the first traveling shaft 36 extends substantially parallel to the housing portion 31. A travel shaft driven pulley 37 is attached to the tip of the first travel shaft 36.

  The first traveling body 38 is screwed with the first traveling shaft 36, and moves horizontally (reciprocating) according to the rotation of the first traveling shaft 36. The first traveling body 38 is connected to the elevating base member 51 of the elevating mechanism 50 via the second horizontal moving mechanism 45, whereby the second horizontal moving mechanism 45, the elevating mechanism 50, and the rotating mechanism 60 are connected to each other. It is possible to horizontally move the head portions 20 a to 20 c connected via the first traveling shaft 36.

  The first travel shaft motor 39 is attached to the inside of the casing 31, and the travel shaft drive pulley 40 is connected to the rotation shaft of the first travel shaft motor 39. A belt is wound between the travel shaft drive pulley 40 and the travel shaft driven pulley 37, and the rotational driving force of the first travel shaft motor 39 causes the travel shaft drive pulley 40 and the travel shaft driven pulley 37 to move. To the first travel shaft 36, and the first travel shaft 36 is rotationally driven by the first travel shaft motor 39.

  The second horizontal movement mechanism 45 includes a second traveling shaft 46 disposed on the first traveling body 38, a second traveling body 47 screwed with the second traveling shaft 46, and a second traveling. The head portion 20 a to 20 c connected to the second traveling body 47 is horizontally arranged along the second traveling shaft 46, mainly composed of a second traveling shaft motor (not shown) that rotationally drives the shaft 46. It is designed to move. Thereby, each head part 20a-20c can be moved to the horizontal direction along the tangent direction of the polishing pad 11 and the polishing surface plate 12. As shown in FIG. Therefore, by operating the first horizontal movement mechanism 35 and the second horizontal movement mechanism 45 in combination, the head portions 20a to 20c are substantially parallel to the polishing surface of the polishing pad 11, as indicated by a two-dot chain line in FIG. It is possible to move in an arbitrary horizontal direction (two-dimensional direction) (for example, so as to draw an 8-shaped trajectory).

  The second horizontal movement mechanism 45 has the same configuration as that of the first horizontal movement mechanism 35 and will not be described in detail. However, the second traveling shaft 46 has a direction in which the first traveling shaft 36 extends. The first traveling body 38 is rotatably attached in a vertical direction (that is, a tangential direction of the polishing pad 11 and the polishing surface plate 12). Also, the second traveling body 47 is connected to the elevating base member 51 of the elevating mechanism 50, whereby the head portions 20 a to 20 c connected via the elevating mechanism 50 and the rotating mechanism 60 are connected to the second traveling shaft 46. It is possible to move horizontally along. A second traveling shaft motor (not shown) is attached to the first traveling body 38.

  As shown in FIG. 2, the elevating mechanism 50 includes an elevating base member 51 connected to the second traveling body 47 in the second horizontal movement mechanism 45, and two elevating ball screws 52 attached to the elevating base member 51, 55, each of the head portions 20 a to 20 a connected to the elevating member 57 is mainly composed of an elevating member 57 screwed to the elevating ball screws 52, 55 and an elevating motor 58 that rotationally drives the elevating ball screws 52, 55. 20c is moved up and down along the ball screws 52 and 55 for raising / lowering. The elevating base member 51 is formed in a box shape and is configured to be horizontally movable by being connected to the second traveling body 47 in the second horizontal movement mechanism 45.

  The two lifting ball screws 52 and 55 are rotatably mounted inside the lifting base member 51, respectively. At this time, the elevating ball screws 52 and 55 are directed in the vertical direction so as to be parallel to each other. A first elevating driven pulley 53 is attached to the lower end of the first elevating ball screw 52, and a drive transmission pulley 54 is attached to the upper end of the first elevating ball screw 52. A second elevating driven pulley 56 is attached to the upper end portion of the second elevating ball screw 55, and a belt is wound between the second elevating driven pulley 56 and the drive transmission pulley 54.

  The elevating motor 58 is attached to the elevating base member 51, and an elevating drive pulley 59 is connected to the rotation shaft of the elevating motor 58. A belt is wound between the elevating drive pulley 59 and the first elevating driven pulley 53, and the rotational driving force of the elevating motor 58 is passed through the elevating drive pulley 59 and the first elevating driven pulley 53. The first elevating ball screw 52 is transmitted to the second elevating ball screw 55 via the drive transmission pulley 54 and the second elevating driven pulley 56, and the first and second elevating motors 58 transmit the first and second elevating ball screws 52. The lifting ball screws 52 and 55 are driven to rotate.

  The rotation mechanism 60 is mainly composed of a spindle 61 rotatably attached to the elevating member 57 of the elevating mechanism 50 and a rotation motor 64 that rotationally drives the spindle 61, and is connected to the lower end portion of the spindle 61. The head portions 20a to 20c are rotated. The spindle 61 is formed in a hollow cylindrical shape, is rotatably attached to the lifting member 57 of the lifting mechanism 50, and is configured to be lifted and lowered together with the lifting member 57.

  The head portions 20a to 20c are connected to the lower end portion of the spindle 61, and an air passage for supplying and discharging air to and from the head portions 20a to 20c (air passage 22) is formed inside the spindle 61. The On the other hand, a rotary joint 63 is attached to the upper end portion of the spindle 61 and is connected to an air pressure supply source and a vacuum source (not shown). A driven pulley 62 for rotation is attached near the center of the spindle 61.

  The rotation motor 64 is attached to the elevating member 57 of the elevating mechanism 50, and the rotation drive pulley 65 is connected to the rotation shaft of the rotation motor 64. A belt is wound between the rotation driving pulley 65 and the rotation driven pulley 62, and the rotation driving force of the rotation motor 64 is transmitted to the spindle 61 via the rotation driving pulley 65 and the rotation driven pulley 62. The spindle 61 is rotationally driven by the rotation motor 64. Thus, each head drive mechanism 30a-30c can rotate, raise / lower, and horizontally move each head part 20a-20c, respectively.

  The first nozzle 71 and the second nozzle 72 of the slurry supply mechanism 70 are attached to the lifting member 57 of the lifting mechanism 50. As shown in FIG. 4, the slurry supply mechanism 70 supplies the slurry (polishing liquid) by flowing down from the first nozzle 71 or the second nozzle 72 provided at the tip onto the polishing surface of the polishing pad 11. The 1st nozzle 71 and the 2nd nozzle 72 are attached to the raising / lowering member 57 so that it may be located in the side of each head part 20a-20c, and the supply position of the slurry by the 1st nozzle 71 and the 2nd nozzle 72 is a polishing pad. 11 is set at a position where the slurry flowing down on the polishing surface 11 reaches the surface to be polished of the object to be polished held by the head portions 20a to 20c during polishing by the rotation of the polishing pad 11. As a result, the slurry can be efficiently supplied between the polishing surface of the polishing pad 11 and the surface to be polished of the object to be polished. In the case of FIG. 4, when the polishing pad 11 rotates so as to pass from the first nozzle 71 to the second nozzle 72, the slurry flows down from the first nozzle 71, and the polishing pad 11 moves from the second nozzle 72 to the first nozzle. When rotating so as to pass to 71, the slurry flows down from the second nozzle 72.

  As shown in FIG. 1, the first dressing mechanism 80a, the second dressing mechanism 80b, and the third dressing mechanism 80c are the first to third head driving mechanisms 30a to 30c above the polishing pad 11 and the polishing surface plate 12, respectively. Are arranged at equal intervals (120 degree intervals with the central axis of the polishing surface plate 12 as a rotation reference). The configurations of the first to third dressing mechanisms 80a to 80c are the same as each other, and are mainly configured of the first to third dressing tools 81a to 81c formed in a disk shape.

  The first dressing tool 81a is configured to be rotatable, lifted and moved horizontally in the radial direction of the polishing pad 11 by a drive mechanism (not shown) similar to the head drive mechanisms 30a to 30c. The polishing pad 11 positioned between the drive mechanism 30a and the second head drive mechanism 30b is dressed. The second dressing tool 81b has the same configuration as the first dressing tool 81a, and performs dressing on the polishing pad 11 located between the second head driving mechanism 30b and the third head driving mechanism 30c. ing. The third dressing tool 81c has the same configuration as the first dressing tool 81a, and performs dressing on the polishing pad 11 positioned between the first head driving mechanism 30a and the third head driving mechanism 30c. ing.

  Thus, dressing can be performed efficiently by performing dressing using the plurality of dressing tools 81 a to 81 c while rotating the polishing pad 11. In addition, since the first to third dressing mechanisms 80a to 80c are disposed in the gaps of the first to third head driving mechanisms 30a to 30c, respectively, if dressing is performed simultaneously with the polishing process, a plurality of dressings are provided. When simultaneously polishing the objects to be polished, it is possible to prevent the result of one polishing from affecting the results of the remaining polishing.

  As shown in FIG. 2, the control unit 85 includes a first traveling shaft motor 39, a second traveling shaft motor (not shown), a lifting motor 58, and a rotation motor for each of the head driving mechanisms 30 a to 30 c. It is electrically connected to the motor 64 and outputs a drive signal to these to control the rotation, elevation and horizontal movement of the head units 20a to 20c by the head drive mechanisms 30a to 30c. The operations of the first to third head driving mechanisms 30a to 30c are controlled independently of each other. The control unit 85 controls the rotation operation of the polishing pad 11 by the pad rotation mechanism 10, the dressing operation by the first to third dressing mechanisms 80 a to 80 c, the slurry supply operation by the slurry supply mechanism 70, etc. It is designed to control the polishing process according to the situation.

  In the polishing apparatus configured as described above, in order to polish the glass substrate 5, first, the first head driving mechanism 30 a moves the first head portion 20 a to the outside of the polishing pad 11 under the control of the control portion 85. The back surface of the sample wafer 6 is vacuum-sucked to the membrane sheet 23 of the first head portion 20a at the retracted position. As a result, the first head portion 20a holds the sample wafer 6 by suction. The sample wafer 6 is formed in the same shape (disk shape) as the glass substrate 5. Similarly, the second and third head driving mechanisms 30b and 30c move the second and third head portions 20b and 20c to the retracted positions, respectively, and the back surfaces of the glass substrate 5 are respectively moved to the retracted positions at the retracted positions. Vacuum adsorption is performed on the membrane sheet 23 of the portions 20b and 20c. Thereby, the 2nd and 3rd head parts 20b and 20c adsorb and hold glass substrate 5, respectively.

  Next, the first to third head driving mechanisms 30a to 30c respectively position the first to third head portions 20a to 20c so as to face each other above the polishing pad 11, and the head portions 20a to 20c and the polishing pad 11 are moved to the upper side. While rotating together, the first to third head portions 20 a to 20 c are respectively lowered to the polishing position to bring the sample wafer 6 and the two glass substrates 5 into contact with the polishing pad 11. At this time, air pressure is supplied to the air passage 22 of each of the head portions 20a to 20c in the negative pressure state, and the sample wafer 6 and the two glass substrates 5 are pressed against the polishing pad 11 with a predetermined polishing pressure. At this time, the slurry is supplied from the first nozzle 71 or the second nozzle 72 to the polishing surface of the polishing pad 11 using the slurry supply mechanism 70.

  In such a state, the first to third head drive mechanisms 30a to 30c move the first to third head portions 20a to 20c in a two-dimensional direction with respect to the polishing pad 11, respectively (for example, an 8-shaped locus). While moving horizontally (as shown), the sample wafer 6 and the two glass substrates 5 are simultaneously polished. At this time, the operations of the first to third head driving mechanisms 30a to 30c are controlled independently of each other. Therefore, the movement pattern of each head part 20a-20c can be changed individually according to the initial shape of the glass substrate 5 (and the sample wafer 6) before polishing, and the glass substrate 5 (and the sample wafer 6). Since it is possible to individually perform shape correction (flattening) on the surface to be polished, highly accurate polishing can be simultaneously performed on a plurality of objects to be polished.

  Such a polishing process is repeatedly performed while measuring the state of the surface to be polished of the object to be polished (that is, the surface roughness of the surface to be polished, the polishing state such as the polishing amount) with a laser interferometer or the like (not shown). However, when the glass substrate 5 is polished, since the glass substrate 5 is transparent or translucent, a laser interferometer cannot be used. Therefore, in the present embodiment, the sample wafer 6 is polished simultaneously with the two glass substrates 5, and the control unit is controlled according to the state of the polished surface of the sample wafer 6 (that is, the polishing state) measured by the laser interferometer. 85 controls the operation of the head drive mechanisms 30a to 30c. Thereby, the transparent or translucent glass substrate 5 can be polished with high accuracy.

  Further, during such polishing process, while polishing is stopped or during polishing, the polishing surface of the polishing pad 11 while rotating the dressing tools 81a to 81c of the first to third dressing mechanisms 80a to 80c, respectively. The dressing of the polishing pad 11 is performed by reciprocating in the radial direction of the rotating polishing pad 11. At this time, in order to confirm the flatness of the polished surface, the contact surface measuring instrument (not shown) is used to measure the height of the polished surface at a plurality of points to determine the flatness of the polished surface.

  Thus, according to the polishing apparatus 1 of the present embodiment, the first to third heads that move the first to third head portions 20a to 20c in two-dimensional directions substantially parallel to the polishing surface of the polishing pad 11, respectively. Since the drive mechanisms 30a to 30c are provided, high-precision polishing can be simultaneously performed on a plurality of objects to be polished as described above. At this time, if the first to third head portions 20a to 20c are horizontally moved at a constant speed so as to draw an 8-shaped locus, uneven wear of the polished surface can be suppressed.

  In addition, the glass substrate 5 and the sample wafer 6 are vacuum-sucked to the membrane sheet 23 of each of the head portions 20a to 20c during conveyance, while the polishing substrate is used to polish the glass substrate 5 and the sample wafer 6 with a predetermined polishing pressure using air pressure during polishing. By being pressed by 11, it is possible to perform polishing with reference to the polishing surface of the polishing pad 11 regardless of the polishing amount. Further, if the first to third head driving mechanisms 30a to 30c are replaced according to the type of the polishing object, it is possible to deal with the polishing object having different shapes and sizes. Further, if the glass substrate 5 and the sample wafer 6 are brought into contact with the outer peripheral side of the polishing pad 11, the speed (linear speed) of the polishing pad 11 can be increased and the polishing rate can be improved.

  In the above-described embodiment, the two glass substrates 5 and the sample wafer 6 are polished simultaneously. However, the present invention is not limited to this, and depending on the number of the glass substrates 5, one glass substrate 5 and two glass substrates 5 are polished. The sample wafers 6 may be polished at the same time. The two sample wafers 6 are used in order to prevent the polishing pad 11 and the polishing surface plate 12 from being inclined due to an offset load. Further, not only the glass substrate 5 but also three semiconductor wafers may be polished simultaneously.

  In the above-described embodiment, three head units and three head drive mechanisms are provided. However, the present invention is not limited to this. For example, four head units and four head drive mechanisms may be provided (at intervals of 90 degrees). It is only necessary to provide a plurality.

1 Polishing device 5 Glass substrate (polishing object) 6 Sample wafer (polishing object)
DESCRIPTION OF SYMBOLS 10 Pad rotation mechanism 11 Polishing pad 12 Polishing surface plate 20a 1st head part 20b 2nd head part 20c 3rd head part 30a 1st head drive mechanism 30b 2nd head drive mechanism 30c 3rd head drive mechanism 70 Slurry supply mechanism (polishing) Liquid supply unit)
71 1st nozzle 72 2nd nozzle 85 Control part

Claims (3)

A polishing pad having a polishing surface capable of polishing an object to be polished, a polishing surface plate that is rotatable while holding the polishing pad so that the polishing surface faces upward, and disposed above the polishing surface plate. A plurality of head portions that hold the polishing object such that the surface to be polished of the polishing object faces downward, and the surface of the polishing object that is held by the head portion is the polishing surface plate. In a polishing apparatus configured to polish the object to be polished by moving relative to the polishing surface of the polishing pad held on the polishing pad,
The polishing pad is configured such that a polishing surface of the polishing pad is larger than a surface to be polished of the object to be polished, and the plurality of objects to be polished held by the plurality of head portions can be simultaneously polished. ,
A polishing apparatus, comprising: a head driving mechanism that moves each of the plurality of head portions in a two-dimensional direction substantially parallel to a polishing surface of the polishing pad. A polishing liquid supply unit for supplying the polishing liquid to the polishing pad held on the polishing plate by flowing down;
The polishing liquid supply position by the polishing liquid supply section is set to a position where the polishing liquid flowing down to the polishing pad reaches the surface to be polished of the object to be polished held by the head section by the rotation of the polishing pad. The polishing apparatus according to claim 1. A control unit for controlling the operation of the head drive mechanism;
The polishing object is a glass substrate and a wafer,
At least one of the plurality of head portions holds the glass substrate, and the other of the plurality of head portions holds the wafer, and the polishing pad polishes the glass substrate and the wafer simultaneously. Configured,
The polishing apparatus according to claim 1, wherein the control unit controls the operation of the head driving mechanism according to a polishing state of the wafer.

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