TW201628790A - Vibration-assisted polishing machine - Google Patents

Abstract

The present invention provides a vibration-assisted polishing machine, in which a two polishing carrier, a measuring system, a dressing member and a flexible clean tube are disposed on a mechanical body. The vibration-assisted polishing machine can be used for in-situ gauging, in-situ cleaning and in-situ dressing. Moreover, the promotions of the polishing stability, the dressing rate and the removal rate can be provided with the voice coil motor and the air bearing.

Description

Grinding and polishing machine

The present invention relates to an abrasive polishing machine, and more particularly to an abrasive polishing machine having on-line measurement, in-line cleaning, and in-line finishing functions.

A chemical mechanical polishing machine is a device used in a semiconductor process, which is usually the last process of a wafer process. Since in the semiconductor manufacturing process, most of the wafers are required to have a flat surface, it is necessary to remove the surface defects of the wafer by a chemical mechanical polishing machine under the reaction of the polishing liquid and the mechanical polishing.

Among them, the most important parameters affecting the wafer removal rate are the stability of the polishing and the dressing rate of the polishing pad. When the polishing stability is insufficient, the removal rate of the wafer surface will be inconsistent. The surface roughness of the polishing pad not only affects the interaction of the polishing liquid, but also determines how much polishing liquid can be contained in the polishing pad. Therefore, after the wafer is polished and polished, subsequent measurement must be performed to calibrate the wafer removal rate and the polishing pad correction rate.

Therefore, in order to facilitate and integrate the wafer process, the inventors actively invested time and tried their best to complete a grinding and polishing machine with both on-line measurement, on-line cleaning and on-line finishing.

The object of the present invention is to provide a multi-functional grinding and polishing machine, in particular to a grinding and polishing machine having on-line measurement, on-line cleaning and on-line finishing functions.

According to a structural embodiment of the present invention, there is provided an abrasive polishing machine comprising a body, an air floating polishing seat, two polishing polishing heads, a grinding measuring system, a trimming member, a voice coil motor and a flexible cleaning tube. . The air floating grinding seat is disposed on the air body, and the air floating grinding seat is provided with an abrasive polishing pad for simultaneously grinding the two objects to be ground. The second polishing head is movably disposed on the body, and the second polishing head is used to respectively fix the object to be polished. The grinding measurement system is movably disposed on the body, and the grinding measurement system is configured to measure the thickness of one of the objects to be polished when the object is stopped, and the grinding measurement system can measure the grinding when the object is stopped. One of the polishing pads works at a removal rate. The trimming member is movably disposed on the body, and the trimming member compensates for the grinding and polishing pad according to the working removal rate. The voice coil motor is arranged on the body, and the voice coil motor drives two grinding and polishing heads to improve the trimming rate and the work removal rate of the polishing pad. The flexible cleaning tube is disposed on the body.

According to one embodiment of the foregoing structural embodiment, the air floating grinding seat comprises a body, a plurality of air bearing, a plurality of supporting frames, a grinding platform and a rotating bracket. The seat body is extended on the body, and a central hole is formed in the middle of the seat body. The air bearing is disposed around the center hole in the seat body. The support frame is distributed between the air bearing. The grinding platform is located on the air bearing and the support frame. The rotating bracket is movably disposed through the center hole and can drive the grinding platform to rotate.

According to another embodiment of the foregoing structural embodiment, the abrasive polishing head can be a porous ceramic chuck. One of the distances between the two polishing heads may correspond to a diameter of one of the polishing pads.

According to another embodiment of the present invention, an abrasive polishing machine is provided, including a body, a first moving platform, a second moving platform, a third moving platform, an air floating polishing seat, and two polishing polishing heads. A grinding measurement system, a trimmer, a voice coil motor, and a flexible cleaning tube. The first moving platform is disposed on the body and moves in a first axial direction and a second axial direction. The second moving platform is disposed on the body and moves in the first axial direction. The third moving platform is disposed on the body and moves in a third axial direction. The air floating grinding seat is arranged on the air body, and the air floating grinding seat is provided with a grinding polishing pad for simultaneously grinding the two objects to be ground. The air floating grinding seat comprises a body, a six air bearing, a six supporting frame, a grinding platform and A rotating bracket, the base body is extended on the body, and a central hole is formed in the middle of the seat body. The six air bearing is arranged around the center hole in the seat body. Six support frames are distributed between the air bearing. The grinding platform is located on the air bearing and the support frame. The rotating bracket is movably disposed through the center hole and can drive the grinding platform to rotate. The two polishing and polishing heads are disposed on the first moving platform, and the two polishing polishing heads are used to respectively fix the two objects to be polished. The grinding measurement system is disposed on the second mobile platform, and the grinding measurement system comprises a non-contact displacement meter and a contact displacement meter. A non-contact displacement gauge is used to measure the thickness of one of the objects to be polished when the object is stopped. The contact displacement gauge measures the working removal rate of one of the abrasive polishing pads when the abrasive is stopped. The trimming piece is disposed on the third moving platform and is connected with the contact type displacement meter, and the trimming part compensates the grinding and polishing pad according to the working removal rate. The voice coil motor is arranged on the first moving platform, and the voice coil motor drives two grinding and polishing heads to improve the grinding and polishing. One of the mat trimming rate and work removal rate. The flexible cleaning tube is disposed on the first moving platform and between the two polishing heads.

According to one embodiment of the foregoing structural embodiment, the abrasive polishing head can be a porous ceramic chuck. One of the distances between the two polishing heads may correspond to a diameter of one of the polishing pads.

Therefore, it can be seen from the embodiments and the embodiments of the foregoing polishing and polishing machine that the second polishing polishing head, the grinding measuring system, the trimmer and the flexible cleaning tube are simultaneously mounted on the body, so that the polishing and polishing machine can simultaneously On-line measurement, on-line cleaning and on-line finishing, and simultaneous grinding of two objects, not only facilitates and saves repetitive process time. In addition, the grinding and polishing machine of the present invention further uses a voice coil motor to drive the polishing and polishing head, and uses the air bearing to carry the grinding platform, thereby increasing the stability of the grinding, and simultaneously improving the polishing pad dressing rate and the work removal rate. .

100‧‧‧ body

110‧‧‧Loading Department

120‧‧‧Extension

200‧‧‧Mobile Platform System

210‧‧‧First mobile platform

220‧‧‧Second mobile platform

230‧‧‧ Third mobile platform

300‧‧‧Air floating grinding seat

310‧‧‧ body

311‧‧‧ center hole

320‧‧‧Air bearing

330‧‧‧Support frame

340‧‧‧ Grinding platform

350‧‧‧Rotating bracket

400‧‧‧Abrasive polishing head

500‧‧‧Grinding measurement system

510‧‧‧ Non-contact displacement meter

520‧‧‧Contact Displacement Meter

600‧‧‧Repair

700‧‧‧ voice coil motor

800‧‧‧Flexible cleaning tube

M‧‧‧Abrased objects

CP‧‧‧Abrasive polishing pad

X‧‧‧first axial direction

Z‧‧‧second axial

Y‧‧‧third axial

The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; .

Fig. 2 is a partial schematic view showing the grinding and polishing machine of Fig. 1.

Fig. 3 is a schematic view showing the arrangement of the air-floating grinding seat in Fig. 1.

Fig. 4 is a schematic view showing the grinding and trimming of the polishing and polishing machine of Fig. 1 at the same time.

Fig. 5 is a side view showing the simultaneous grinding and trimming of the lapping and polishing machine of Fig. 4.

Fig. 6 is a schematic view showing the measurement of the grinding and polishing machine of Fig. 1.

Please refer to FIG. 1 , FIG. 2 and FIG. 3 , wherein FIG. 1 and FIG. 2 are respectively a schematic view and a partial schematic view of a polishing and polishing machine according to an embodiment of the present invention, and FIG. 3 is a schematic view. Fig. 1 is a schematic view showing the arrangement of an air floating polishing seat. The polishing and polishing machine comprises a body 100, a moving platform system 200, an air floating polishing seat 300, two polishing polishing heads 400, a grinding measuring system 500, a trimming unit 600, a voice coil motor 700 and a flexible cleaning tube 800. .

The body 100 is a rectangular base body, and the body 100 includes a bearing portion 110 and an extending portion 120.

A mobile platform system 200 includes a first mobile platform 210, a second mobile platform 220, and a third mobile platform 230. The first moving platform 210 is disposed on the extension portion 120 of the body 100 and moves in a first axial direction X and a second axial direction Z. The second moving platform 220 is disposed on the extension portion 120 of the body 100 and moves in the first axial direction X. The third moving platform 230 is disposed on the extension portion 120 of the body 100 and moves in a third axial direction Y.

The air floating polishing seat 300 is disposed on the bearing portion 110 of the body 100. The air floating polishing seat 300 is provided with an abrasive polishing pad CP for simultaneously grinding the two workpieces M. The air floating polishing seat 300 includes a body 310 and six gas. Floating bearing 320, six support frame 330, a grinding platform 340 and a rotating bracket 350, the base body 310 is extended The support body 110 of the body 100 is extended, and a central hole 311 is defined in the middle of the base body 310. The six air bearing 320 is disposed on the base 310 around the center hole 311. Six support frames 330 are distributed between the air bearings 320 (Fig. 3, in which part of the support frames 330 are covered by the base 310). The grinding platform 340 is located on the air bearing 32 and the support frame 330, and the polishing pad CP is located on the grinding platform 340. The rotating bracket 350 is movably disposed through the central hole 311 and can support the rotation of the grinding platform 340.

The two polishing heads 400 are disposed on the first moving platform 210, and the two polishing heads 400 are used to respectively fix the two objects M to be polished. The lapping and polishing head 400 taken in the present embodiment may be a porous ceramic chuck, and the lapping and polishing head 400 fixes the object M by vacuum adsorption.

The grinding measurement system 500 is disposed on the second moving platform 220. The grinding measurement system 500 includes a non-contact displacement meter 510 and a contact displacement meter 520. The non-contact displacement meter 510 is for measuring the thickness of the workpiece M when the workpiece M stops grinding. The contact displacement meter 520 measures the working removal rate of the polishing pad CP when the workpiece M stops grinding. In the present embodiment, the non-contact displacement meter 510 can be a laser displacement meter, an eddy current displacement meter, a capacitive displacement meter or a fiber displacement meter, and the contact displacement meter 520 can be a linear differential change. A pressure displacement gauge (LVDT) or a pull-type displacement gauge, the foregoing examples are of a possible implementation type, but the scope of the invention is not limited thereto.

The trimming member 600 is disposed on the third moving platform 230 and connected to the contact displacement meter 520. The trimming member 600 compensates the polishing polishing pad CP according to the working removal rate measured by the contact displacement meter 520.

The voice coil motor 700 is disposed on the first moving platform 210, and the voice coil motor 700 serves as an actuating source for the two polishing and polishing heads 400 to improve the trimming rate and the work removal rate of the polishing polishing pad CP.

The flexible cleaning tube 800 is disposed on the first moving platform 210 and between the two polishing heads 400.

Please refer to FIG. 4, FIG. 5 and FIG. 6 . FIG. 4 and FIG. 5 are schematic and side views showing the simultaneous polishing and trimming of the polishing and polishing machine 100 of FIG. 1 . Fig. 6 is a schematic view showing the measurement of the lapping and polishing machine 100 of Fig. 1. As shown in FIG. 4, when the polishing and polishing machine 100 performs grinding, the second moving platform 220 is controlled to face downward in the second axial direction Z, so that the workpiece M on the second polishing polishing head 400 touches the polishing polishing pad CP. Since the voice coil motor 700 has the advantages of linear transmission and no vibrating thrust, and the grinding platform 340 is provided with a six-air floating bearing 320 simultaneously blowing high-pressure gas to suspend it, the grinding stability can be enhanced and the grinding process can be activated. As shown in FIG. 5, the third moving platform 230 carries the trimming member 600 to the third axial direction Y to advance above the polishing polishing pad CP, so that the two workpieces M can be simultaneously polished, and at the same time, the polishing pad is simultaneously polished. CP trimming. It is noted here that one of the two abrasive polishing heads 400 may correspond to a diameter equal to one of the abrasive polishing pads CP, and the trimming member 600 extends just between the two polishing polishing heads 400 without affecting each other.

As shown in FIG. 6, when the lapping and polishing machine 100 performs the measurement, the lapping and polishing head 400 and the trimming member 600 have been moved to the initial position by the first moving platform 210 and the third moving platform 230. Receiving, the second moving platform 220 is moved to the first axial direction X to move under the polishing polishing head 400 and above the polishing polishing pad CP, while the non-contact displacement meter 510 is used to polish the polishing head 400. The thickness of the object to be polished M is measured, and the contact type displacement meter 520 touches the polishing pad CP to measure the work removal rate and returns the trimming member 600 to confirm the dressing rate.

Therefore, the abrasive polishing machine of the present invention has the following advantages:

1. On the same machine, it has the functions of online measurement, online cleaning and online finishing.

2. With two abrasive polishing heads, the two objects to be ground can be simultaneously polished in the range of the diameter of the polishing pad.

3. With voice coil motor and air bearing, increase the stability of grinding, can improve the polishing pad dressing rate and work removal rate.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

100‧‧‧ body

110‧‧‧Loading Department

120‧‧‧Extension

200‧‧‧Mobile Platform System

210‧‧‧First mobile platform

220‧‧‧Second mobile platform

230‧‧‧ Third mobile platform

300‧‧‧Air floating grinding seat

400‧‧‧Abrasive polishing head

500‧‧‧Grinding measurement system

510‧‧‧ Non-contact displacement meter

520‧‧‧Contact Displacement Meter

600‧‧‧Repair

700‧‧‧ voice coil motor

800‧‧‧Flexible cleaning tube

CP‧‧‧Abrasive polishing pad

M‧‧‧Abrased objects

X‧‧‧first axial direction

Z‧‧‧second axial

Y‧‧‧third axial

Claims (7)

An abrasive polishing machine comprising: a body; an air floating polishing seat disposed on the body, the air floating polishing seat is provided with an abrasive polishing pad for simultaneously grinding two objects to be ground; and two grinding polishing heads are movable Disposed on the body, the two abrasive polishing heads are respectively used to fix the two objects to be polished; a grinding measurement system is movably disposed on the body, and the grinding measurement system is used for the workpiece Measuring a thickness of the object to be polished when the grinding is stopped, and the grinding measuring system measures a working removal rate of the polishing pad when the object is stopped; and a trimming member is movably disposed on the a body, the trimming part is compensated for the grinding and polishing pad according to the working removal rate; a voice coil motor is disposed on the body, the voice coil motor drives the two grinding and polishing heads; and a flexible cleaning tube is provided On the body. The grinding and polishing machine of claim 1, wherein the air-floating grinding seat comprises: a body extending on the body, the central body having a central hole; and a plurality of air bearing around the central hole Provided in the seat body; a plurality of support frames disposed between the air bearing; a grinding platform located on the air bearing and the support frame; A rotating bracket is movably disposed through the central hole and can drive the grinding platform to rotate. The grinding and polishing machine of claim 1, wherein each of the grinding and polishing heads is a porous ceramic chuck. The abrasive polishing machine of claim 1, wherein a distance between the two abrasive polishing heads corresponds to a diameter of one of the abrasive polishing pads. An abrasive polishing machine comprising: a body; a first moving platform disposed on the body and moving in a first axial direction and a second axial direction; and a second moving platform disposed on the body and moving on the body The first axial direction; a third moving platform is disposed on the body and moves in a third axial direction; an air floating polishing seat is disposed on the body, and the air floating polishing seat is provided with an abrasive polishing pad. The air-floating grinding seat comprises: a body extending over the body, the center of the body has a central hole; a six-air bearing is disposed around the central hole; Six support frames, distributed between the air bearing; a grinding platform is disposed on the air bearing and the support frame; and a rotating bracket is movably disposed in the center hole and can drive the grinding platform to rotate; and the second polishing head is disposed on the first a mobile platform, the two abrasive polishing heads are respectively used to fix the two objects to be polished; a grinding measurement system is disposed on the second moving platform, the grinding measurement system comprises: a non-contact displacement meter for Measuring the thickness of the object to be polished when the object is stopped; and a contact type displacement meter, measuring the working removal rate of the one of the polishing pad when the object is stopped; and a trimming piece Provided on the third mobile platform and connected to the contact displacement meter, the trimming part is compensated and trimmed according to the working removal rate; a voice coil motor is disposed on the first mobile platform, the voice coil The motor drives the two abrasive polishing heads; and a flexible cleaning tube is disposed on the first moving platform and between the two polishing polishing heads. The grinding and polishing machine of claim 5, wherein each of the abrasive polishing heads is a porous ceramic chuck. The abrasive polishing machine of claim 5, wherein a distance between the two abrasive polishing heads corresponds to a diameter of one of the abrasive polishing pads.