CN111060415A - In-situ indentation testing device and method considering deformation of force sensor - Google Patents
In-situ indentation testing device and method considering deformation of force sensor Download PDFInfo
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- 238000007373 indentation Methods 0.000 title claims abstract description 120
- 238000012360 testing method Methods 0.000 title claims abstract description 105
- 238000011065 in-situ storage Methods 0.000 title claims abstract description 52
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/40—Investigating hardness or rebound hardness
- G01N3/42—Investigating hardness or rebound hardness by performing impressions under a steady load by indentors, e.g. sphere, pyramid
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
- G01N3/06—Special adaptations of indicating or recording means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
- G01N3/06—Special adaptations of indicating or recording means
- G01N3/066—Special adaptations of indicating or recording means with electrical indicating or recording means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0016—Tensile or compressive
- G01N2203/0019—Compressive
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/003—Generation of the force
- G01N2203/005—Electromagnetic means
- G01N2203/0051—Piezoelectric means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0058—Kind of property studied
- G01N2203/0076—Hardness, compressibility or resistance to crushing
- G01N2203/0078—Hardness, compressibility or resistance to crushing using indentation
- G01N2203/0082—Indentation characteristics measured during load
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Abstract
The invention relates to an in-situ indentation testing device and method considering deformation of a force sensor. The indentation force loading and detecting unit is arranged on the z-axis precision positioning unit, the indentation depth detecting unit is arranged on the indentation force loading and detecting unit, and the two-degree-of-freedom stick-slip piezoelectric precision positioning platform is arranged on the z-axis precision positioning unit. Has the advantages that: the deformation of the force sensor is considered, and through the reasonable arrangement mode of the force sensor and the capacitive displacement sensor, the measuring error caused by the deformation of the force sensor is structurally avoided, more accurate indentation depth values can be obtained, and the testing precision is improved. The device has compact structure, small size, large-range high-precision two-degree-of-freedom positioning capability and can be conveniently arranged in a scanning electron microscope to carry out in-situ indentation test on the material.
Description
Technical Field
The invention relates to the field of mechatronic precision instruments, in particular to an in-situ indentation testing device and method considering deformation of a force sensor, which combine a precision driving technology and an in-situ testing technology, have higher detection precision and smaller external dimension, and can be used for carrying out in-situ indentation testing on different materials under the real-time monitoring of a scanning electron microscope so as to explore the mechanical property and the deformation mechanism of the materials under the micro-nano scale.
Background
The mechanical property of the material directly influences the application occasion and the service life of the material, the macroscopic damage of the material is derived from microscopic deformation, and the conventional mechanical property testing methods such as a tensile test, a hardness test and the like are difficult to directly research the microscopic mechanical property and the deformation mechanism of the material. On the basis of the traditional hardness test, the indentation test technology with the advantages of simple operation, high resolution, rich available information and the like is deeply developed, and along with the progress of the micro-nano technology and the electron microscopy technology, the in-situ indentation test method is brought forward, and the development of an instrumented in-situ indentation test device is also concerned by scholars at home and abroad. In 2004, r.rabe et al, Advanced engineering materials, volume 7, page 388-392, of the swiss laboratory, provides an in-situ indentation testing device with a relatively compact structure, which can be built in an SEM to realize in-situ indentation testing of a material to obtain a real-time indentation image and an indentation load-depth relationship, the structural arrangement is as shown in fig. 6, the distance between a test piece and an indenter is adjusted by manually adjusting a z-axis screw, a force sensor is placed on a stick-slip x-axis and y-axis piezoelectric precision positioning platform, and a strain gauge is built in the z-axis indenter as a displacement sensor, and in this arrangement, the displacement value measured by the displacement sensor substantially includes the deformation of the force sensor and is not equal to the indentation depth. On the basis of the structure, r.ghisleni proposed an improvement in 2009, microscopical Research and Technique, volume 72, pages 242 and 249, which is to adjust a manual adjustment z-axis screw knob into an automatic adjustment of a stepping motor. Alemnis corporation has commercialized their design. In 2015, J.M. wheel et al, CurrentOption in Solid State and Materials Science, volume 19, 354, 366, of the Federal institute of technology, Zurich et al, proposed an in-situ indentation testing device suitable for high temperature conditions, which is the same as the above, and which is characterized in that a force sensor is placed on a stick-slip x-axis and y-axis piezoelectric precision positioning platform, a strain gauge is used as a structural arrangement of a displacement sensor built in a z-axis indentation head, and a heating and cooling system is added, so that an in-situ indentation test under high temperature conditions can be realized. In 2011, yellow tiger et al, Advanced Materials Research 314, 316, 1792, 1795, of China's university, propose a miniaturized nanoindentation device, which adopts a direct-acting piezoelectric driving x-axis and y-axis moving platform, wherein force sensors are also placed on the x-axis and y-axis moving platform, the displacement sensors are not integrated in an indentation head like the nanoindentation instrument, but the distance between the displacement sensors and a test piece is adjusted by respectively using a manual spiral micro-driving translation table with the indentation head, and the device does not realize an in-situ indentation test in an SEM. The device is different from the traditional in-situ indentation testing device, a pressure head is fixed, a z-axis driving platform is installed below a test piece and a force sensor to drive the test piece to approach the pressure head, the coarse adjustment of the distance between the test piece and the pressure head is realized by a manual screw micro-driving translation platform, a displacement sensor is installed on the z-axis driving platform, the device realizes the in-situ indentation test built in the SEM, and the problem that an indentation depth measurement value contains the deformation of the force sensor is not solved by the installation mode. In summary, in the in-situ indentation testing device, the flexibility of the force sensor is often the greatest, the testing precision is seriously affected if the deformation of the force sensor is ignored, and the calibration difficulty is greatly increased if the included deformation of the force sensor is eliminated in a subsequent algorithm processing mode, so that the detection precision is improved, the experimental steps are simplified if the in-situ indentation testing device capable of structurally avoiding the indentation depth measuring error caused by the deformation of the force sensor is developed, and the in-situ indentation testing device has important significance for promoting the application of in-situ indentation testing.
Disclosure of Invention
The invention aims to provide an in-situ indentation testing device and method considering deformation of a force sensor, which solve the problems in the prior art, improve the detection precision, can conveniently realize in-situ indentation testing of materials, and have wide application prospects in the fields of aerospace, material science, ultra-precision machining and the like.
The above object of the present invention is achieved by the following technical solutions:
the in-situ indentation testing device considering the deformation of the force sensor comprises a z-axis precision positioning unit 1, an indentation force loading and detecting unit 2, an indentation depth detecting unit 3 and a two-degree-of-freedom stick-slip type piezoelectric precision positioning platform 4. Wherein the indentation force loading and detecting unit 2 is arranged on a guide rail sliding block component 102 of the z-axis precision positioning unit 1; the indentation depth detection unit 3 is installed on the flexible hinge mechanism b201 of the indentation force loading and detection unit 2; the two-degree-of-freedom stick-slip piezoelectric precision positioning platform 4 is arranged on the bottom plate 101 of the z-axis precision positioning unit 1. The overall dimensions of the device are 50mm by 90mm by 120 mm. After the device is assembled, the device can be arranged on an objective table of a vacuum cavity of a scanning electron microscope to perform an in-situ indentation test, and the micromechanical property and the deformation mechanism of the material can be visually analyzed by using an in-situ image obtained by the scanning electron microscope and load and depth data obtained by a sensor.
The z-axis precision positioning unit 1 is composed of a bottom plate 101, a guide rail slider assembly 102, a flexible hinge mechanism a103, a piezoelectric stack a104 and a wedge block combination a 105. Wherein the flexible hinge mechanism a103 and the guide rail slider assembly 102 are mounted to the base plate 101; the piezoelectric stack a104 is mounted in the square groove of the flexible hinge mechanism a103 and is pre-stressed by the wedge block combination a 105. The z-axis precision positioning unit 1 is essentially a stick-slip piezoelectric actuator, and applies a control voltage to the piezoelectric stack a104 to drive the guide rail slider assembly 102 to move forward and backward along the z-axis, so as to precisely adjust the distance between the diamond indenter 208 and the test piece in the indentation force loading and detecting unit 2. The specific adjusting method comprises the following steps: and adjusting the z-axis precision positioning unit 1 to enable the diamond indenter 208 to approach the test piece, initially judging the contact between the diamond indenter 208 and the test piece through the force sensor 204, when the indication number of the force sensor 204 changes, indicating that the diamond indenter 208 is in contact with the test piece, adjusting the z-axis precision positioning unit 1 in the reverse direction at the moment, enabling the indentation force loading and detecting unit 2 to move for a distance (5-10 mu m) in the reverse direction, and preparing to press the test piece after the initial position is adjusted.
The indentation force loading and detecting unit 2 is composed of a flexible hinge mechanism b201, a piezoelectric stack b202, a wedge block combination b203, a force sensor 204, a measuring plate 205, a pressure head clamp 206, a screw a207 and a diamond pressure head 208. The piezoelectric stack b202 is arranged in a square groove of the flexible hinge mechanism b201 and is pre-tightened through a wedge block combination b 203; the force sensor 204 is mounted on the flexible hinge mechanism b 201; the measurement plate 205 is mounted on the force sensor 204; the ram holder 206 is mounted on the force sensor 204; the diamond ram 208 is mounted on the ram holder 206 and pre-tensioned by a screw a 207. The piezo stack b202 provides the force and displacement required for the pressing motion. The flexible hinge mechanism b201 transmits the output of the piezoelectric stack b202 and serves as a power source for press-in motion, and meanwhile, the flexible link in the flexible hinge mechanism b201 serves as a decoupling link, so that the output displacement direction can be ensured to be in the vertical direction. The force sensor 204 is used to detect and record the magnitude of the indentation force in real time. The measurement plate 205 serves as a measurement target of the capacitive displacement sensor 305 pressed into the depth detection unit 3. The flexibility of the force sensor 204 is the greatest in the whole system, and the arrangement shown in fig. 6 is adopted in the device designed by the scholars, so that the measurement value of the displacement sensor includes the deformation of the force sensor and is not completely equal to the pressing depth, the arrangement can generate a measurement error, the error is eliminated, complicated subsequent algorithm processing is also needed, and the calibration difficulty is greatly increased. In the present embodiment, the arrangement shown in fig. 5 is adopted, and the measurement plate 205 is placed below the force sensor 204, so that the displacement value measured by the capacitive displacement sensor 305 avoids the deformation caused by the compliance of the force sensor 204, and the accurate depth value of the indentation can be obtained more conveniently. The data from the force sensor 204 is continuously collected during the continued indentation and unloading of the diamond indenter 208 into the test piece to facilitate subsequent indentation load-depth profiling.
The pressing depth detection unit 3 is composed of a manual precision translation stage 301, a displacement sensor holder 302, a screw b303, a screw c304 and a capacitance type displacement sensor 305. Wherein the displacement sensor holder 302 is mounted on the manual precision translation stage 301; the capacitive displacement sensor 305 is mounted in the displacement sensor holder 302 and is pre-tensioned by means of screws b303, c 304. The capacitive displacement sensor 305 is used for measuring the indentation depth, and the manual precision translation stage 301 is used for adjusting the distance between the capacitive displacement sensor 305 and the measurement plate 205 in the indentation force loading and detecting unit 2, so as to ensure that the measured indentation depth is within the range of the capacitive displacement sensor 305 during the indentation and unloading processes. The data from the capacitive displacement sensor 305 is continuously collected during the continued indentation and unloading of the diamond indenter 208 into the test piece to facilitate the subsequent formation of an indentation load-depth curve.
Another object of the present invention is to provide a method for performing in-situ indentation testing using an in-situ indentation apparatus considering deformation of a force sensor, comprising the steps of:
a) a preparation stage: the in-situ indentation testing device considering the deformation of the force sensor, which is described in claim 1, is installed on an object stage in a scanning electron microscope, and the two-degree-of-freedom stick-slip piezoelectric precision positioning platform 4 is adjusted so that the test piece is positioned right below the diamond indenter 208. The manual precision translation stage 301 of the indentation depth detection unit 3 is adjusted such that the position of the measurement plate 205 is always within the range of the capacitive displacement sensor 305 during the test. And adjusting the z-axis precision positioning unit 1 to enable the diamond indenter 208 to slowly contact the test piece, judging the contact between the test piece and the diamond indenter 208 by observing the indication number of the force sensor 204, wherein the indication number of the force sensor 204 is kept stable when the indication number of the force sensor 204 is not contacted, indicating that the test piece is contacted with the diamond indenter 208 when the indication number of the force sensor 204 is changed, and reversely adjusting the z-axis precision positioning unit 1 to enable the diamond indenter 208 to be separated from the surface of the test piece and keep a distance (5-10 mu m) with the surface of the test piece.
b) And (3) a test stage: trapezoidal wave loading voltage is applied to the piezoelectric stack b202 in the indentation force loading and detecting unit 2, readings of the force sensor 204 and the capacitance displacement sensor 305 are collected on an industrial personal computer in real time, measured indentation depth and load data do not need to be processed by eliminating errors, the measured indentation depth and load data can be directly used for drawing an indentation load-depth relation curve, and in combination with real-time recording of in-situ indentation images in the loading and unloading process through a scanning electron microscope, subsequent analysis is performed.
c) The process is repeated: if the test piece needs to be replaced to carry out the in-situ indentation test, the step a) and the step b) need to be repeated, and if the multi-point indentation test is carried out on the same test piece, the step b) needs to be repeated only after the central point is repositioned by adjusting the two-degree-of-freedom stick-slip type piezoelectric precise positioning platform 4 again.
The invention has the beneficial effects that: the in-situ indentation testing device and method considering the deformation of the force sensor provided by the invention avoid the error of the indentation depth caused by the deformation of the force sensor, improve the detection precision structurally, simplify the testing steps and conveniently carry out the in-situ indentation test of the material. The two-degree-of-freedom stick-slip piezoelectric precision positioning platform can be used for carrying out large-scale precision positioning on a test piece, and tests of various test conditions such as different loading rates, different pressing loads, different pressing depths and the like can be achieved by controlling the indentation force loading and detecting unit. The device has compact structure and small size, the overall size is 50mm multiplied by 90mm multiplied by 120mm, and the device can be arranged on an object stage in a vacuum cavity of a scanning electron microscope. Load data measured by the force sensor and press-in depth data measured by the capacitance displacement sensor are collected to form a press-in load-depth curve, and the mechanical property and the deformation mechanism of the material under the micro-nano scale can be analyzed conveniently by combining an in-situ indentation image obtained by a scanning electron microscope.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention.
FIG. 1 is a schematic diagram of the overall structure of the in-situ indentation testing apparatus and method of the present invention considering deformation of a force sensor;
FIG. 2 is a schematic structural diagram of a z-axis fine positioning unit according to the present invention;
FIG. 3 is a schematic structural diagram of an indentation force loading and detecting unit according to the present invention;
FIG. 4 is a schematic structural diagram of a pressing depth detecting unit according to the present invention;
FIG. 5 is a structural arrangement of an indentation testing device with consideration of force sensor deformation, as used in the present invention;
fig. 6 shows the structural arrangement of the indentation testing device without considering the deformation of the force sensor.
In the figure: 101. a base plate; 102. a guide rail slider assembly; 103. a flexible hinge mechanism a; 104. a piezoelectric stack a; 105. a wedge block combination a; 201. a flexible hinge mechanism b; 202. a piezoelectric stack b; 203. a wedge block combination b; 204. a force sensor; 205. measuring a plate; 206. a ram holder; 207. a screw a; 208. a diamond pressure head; 301. a manual precision translation stage; 302. a displacement sensor holder; 303. a screw b; 304. a screw c; 305. a capacitive displacement sensor.
Detailed Description
The details of the present invention and its embodiments are further described below with reference to the accompanying drawings.
Referring to fig. 1 to 4, the in-situ indentation testing apparatus considering deformation of a force sensor in the present invention includes a z-axis precision positioning unit 1, an indentation force loading and detecting unit 2, an indentation depth detecting unit 3, and a two-degree-of-freedom stick-slip type piezoelectric precision positioning platform 4. The indentation force loading and detecting unit 2 is arranged on a guide rail sliding block component 102 of the z-axis precision positioning unit 1; the indentation depth detection unit 3 is installed on the flexible hinge mechanism b201 of the indentation force loading and detection unit 2; the two-degree-of-freedom stick-slip piezoelectric precision positioning platform 4 is arranged on the bottom plate 101 of the z-axis precision positioning unit 1. After the device is assembled, the device can be arranged on an objective table of a vacuum cavity of a scanning electron microscope to perform an in-situ indentation test, and the micromechanical property and the deformation mechanism of the material can be visually analyzed by using an in-situ image obtained by the scanning electron microscope and pressure and depth data obtained by a sensor.
The z-axis precision positioning unit 1 is composed of a bottom plate 101, a guide rail slider assembly 102, a flexible hinge mechanism a103, a piezoelectric stack a104 and a wedge block combination a 105. Wherein the flexible hinge mechanism a103 and the guide rail slider assembly 102 are mounted to the base plate 101; the piezoelectric stack a104 is mounted in the square groove of the flexible hinge mechanism a103 and is pre-stressed by the wedge block combination a 105. The z-axis precision positioning unit 1 is essentially a stick-slip piezoelectric actuator, and applies a control voltage to the piezoelectric stack a104 to drive the guide rail slider assembly 102 to move forward and backward along the z-axis, so as to precisely adjust the distance between the diamond indenter 208 and the test piece in the indentation force loading and detecting unit 2.
The indentation force loading and detecting unit 2 is composed of a flexible hinge mechanism b201, a piezoelectric stack b202, a wedge block combination b203, a force sensor 204, a measuring plate 205, a pressure head clamp 206, a screw a207 and a diamond pressure head 208. The piezoelectric stack b202 is arranged in a square groove of the flexible hinge mechanism b201 and is pre-tightened through a wedge block combination b 203; the force sensor 204 is mounted on the flexible hinge mechanism b 201; the measurement plate 205 is mounted on the force sensor 204; the ram holder 206 is mounted on the force sensor 204; the diamond ram 208 is mounted on the ram holder 206 and pre-tensioned by a screw a 207. The flexible hinge mechanism b201 transmits the output of the piezoelectric stack b202 and serves as a power source of the press-in motion, the force sensor 204 is used for detecting and recording the size of the indentation force in real time, the measuring plate 205 serves as a measuring target of the capacitive displacement sensor 305 in the press-in depth detection unit 3, and the diamond indenter 208 is used for completing the press-in motion. The data from the force sensor 204 is continuously collected as the diamond indenter 208 is continuously pressed into the test piece for subsequent analysis.
The pressing depth detection unit 3 is composed of a manual precision translation stage 301, a displacement sensor holder 302, a screw b303, a screw c304 and a capacitance type displacement sensor 305. Wherein the displacement sensor holder 302 is mounted on the manual precision translation stage 301; the capacitive displacement sensor 305 is mounted in the displacement sensor holder 302 and is pre-tensioned by means of screws b303, c 304. The manual fine translation stage 301 is used to adjust the distance between the capacitive displacement sensor 305 and the measurement plate 205 in the indentation force loading and detection unit 2 such that the indentation depth is within the range of the capacitive displacement sensor 305. The data from the capacitive displacement sensor 305 is continuously collected as the diamond indenter 208 is continuously pressed into the test piece for subsequent analysis.
The method for carrying out the in-situ indentation test by utilizing the in-situ indentation test device considering the deformation of the force sensor comprises the following steps:
a) a preparation stage: the in-situ indentation testing device considering the deformation of the force sensor, which is described in claim 1, is installed on an object stage in a scanning electron microscope, and the two-degree-of-freedom stick-slip piezoelectric precision positioning platform 4 is adjusted so that the test piece is positioned right below the diamond indenter 208. The manual precision translation stage 301 of the indentation depth detection unit 3 is adjusted so that the position of the measurement plate 205 is within the range of the capacitive displacement sensor 305. And adjusting the z-axis precision positioning unit 1 to enable the diamond indenter 208 to slowly contact the test piece, judging the contact between the test piece and the diamond indenter 208 by observing the indication number of the force sensor 204, wherein the indication number of the force sensor 204 is kept stable when the indication number of the force sensor 204 is not contacted, indicating that the test piece is contacted with the diamond indenter 208 when the indication number of the force sensor 204 is changed, and reversely adjusting the z-axis precision positioning unit 1 to enable the diamond indenter 208 to be separated from the surface of the test piece and keep a distance (5-10 mu m) with the surface of the test piece.
b) And (3) a test stage: trapezoidal wave loading voltage is applied to the piezoelectric stack b202 in the indentation force loading and detecting unit 2, readings of the force sensor 204 and the capacitance displacement sensor 305 are collected on an industrial personal computer in real time, measured indentation depth and load values do not need to be processed by eliminating errors, the curve of the relationship between indentation load and indentation depth can be directly drawn, and in combination with real-time recording of in-situ indentation images in the loading and unloading process through a scanning electron microscope, subsequent analysis is performed.
c) The process is repeated: if the test piece needs to be replaced to carry out the in-situ indentation test, the step a) and the step b) need to be repeated, and if the multi-point indentation test is carried out on the same test piece, the step b) needs to be repeated only after the central point is repositioned by adjusting the two-degree-of-freedom stick-slip type piezoelectric precise positioning platform 4 again.
Referring to fig. 5 and 6, the structural difference of the in-situ indentation testing device considering the deformation of the force sensor can be clearly seen compared to the in-situ indentation testing device not considering the deformation of the force sensor. The arrangement of fig. 5 is such that the force sensor is integrated with the indentation head and the displacement measuring plate is placed under the force sensor, the displacement measured by the displacement sensor not including the deformation of the force sensor. And the structural arrangement mode of fig. 6 is that the force sensor is arranged below the test piece, the displacement sensor and the indentation head are on the same side, measurement is carried out above the test piece, and the displacement measured by the displacement sensor comprises deformation of the force sensor. The invention adopts the structural arrangement mode shown in figure 5, and effectively avoids the measurement error caused by the deformation of the force sensor.
The above description is only a preferred example of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like of the present invention shall be included in the protection scope of the present invention.
Claims (5)
1. The utility model provides a consider normal position indentation testing arrangement that force transducer warp which characterized in that: the device comprises a z-axis precision positioning unit (1), an indentation force loading and detecting unit (2), an indentation depth detecting unit (3) and a two-degree-of-freedom stick-slip piezoelectric precision positioning platform (4); wherein the indentation force loading and detecting unit (2) is arranged on a guide rail sliding block component (102) of the z-axis precision positioning unit (1); the indentation depth detection unit (3) is arranged on a flexible hinge mechanism b (201) of the indentation force loading and detection unit (2); the two-degree-of-freedom stick-slip piezoelectric precise positioning platform (4) is arranged on a bottom plate (101) of the z-axis precise positioning unit (1).
2. The in-situ indentation testing device considering force sensor deformation according to claim 1, wherein: the z-axis precision positioning unit (1) is composed of a bottom plate (101), a guide rail sliding block assembly (102), a flexible hinge mechanism a (103), a piezoelectric stack a (104) and a wedge block combination a (105); wherein the flexible hinge mechanism a (103) and the guide rail slider assembly (102) are mounted to the base plate (101); the piezoelectric stack a (104) is arranged in a square groove of the flexible hinge mechanism a (103) and is pre-stressed through a wedge block combination a (105).
3. The in-situ indentation testing device considering force sensor deformation according to claim 1, wherein: the indentation force loading and detecting unit (2) consists of a flexible hinge mechanism b (201), a piezoelectric stack b (202), a wedge block combination b (203), a force sensor (204), a measuring plate (205), a pressure head clamp holder (206), a screw a (207) and a diamond pressure head (208); the piezoelectric stack b (202) is arranged in a square groove of the flexible hinge mechanism b (201) and is pre-tightened through a wedge block combination b (203); the force sensor (204) is arranged on the flexible hinge mechanism b (201); the measuring plate (205) is mounted on the force sensor (204); the pressure head clamp (206) is arranged on the force sensor (204); the diamond indenter (208) is mounted on the indenter holder (206) and pre-tensioned by a screw a (207).
4. The in-situ indentation testing device considering force sensor deformation according to claim 1, wherein: the pressing depth detection unit (3) consists of a manual precision translation table (301), a displacement sensor holder (302), a screw b (303), a screw c (304) and a capacitive displacement sensor (305); wherein the displacement sensor holder (302) is arranged on the manual precision translation stage (301); the capacitive displacement sensor (305) is mounted in a displacement sensor holder (302) and is pre-tensioned by a screw b (303) and a screw c (304).
5. The method for performing in-situ indentation testing by using the in-situ indentation testing device considering deformation of the force sensor, according to claim 1, is characterized in that: the method comprises the following steps:
a) a preparation stage: installing the in-situ indentation testing device considering force sensor deformation according to claim 1 on an object stage in a scanning electron microscope, and adjusting a two-degree-of-freedom stick-slip piezoelectric precision positioning platform (4) to enable a test piece to be positioned right below a diamond indenter (208); adjusting a manual precision translation table (301) of the press-in depth detection unit (3) to enable the position of the measurement plate (205) to be always within the measuring range of the capacitive displacement sensor (305) in the test process; adjusting the z-axis precision positioning unit (1) to enable the diamond indenter (208) to slowly contact the test piece, judging the contact between the test piece and the diamond indenter (208) by observing the indication number of the force sensor (204), wherein the indication number of the force sensor (204) is kept stable when the indication number of the force sensor (204) is not contacted, and when the indication number of the force sensor (204) is changed, the test piece is indicated to be contacted with the diamond indenter (208), and at the moment, reversely adjusting the z-axis precision positioning unit (1) to enable the diamond indenter (208) to be away from the surface of the test piece and keep a distance (5-10 mu m) with the surface of the test;
b) and (3) a test stage: trapezoidal wave loading voltage is applied to a piezoelectric stack b (202) in the indentation force loading and detecting unit (2), readings of a force sensor (204) and a capacitance displacement sensor (305) are collected on an industrial personal computer in real time, measured indentation depth and load data do not need to be subjected to error elimination processing, an indentation load-depth relation curve can be directly drawn, and in-situ indentation images in the loading and unloading process are recorded in real time through a scanning electron microscope for subsequent analysis;
c) the process is repeated: if the test piece needs to be replaced to carry out the in-situ indentation test, the step a) and the step b) need to be repeated, and if the multi-point indentation test is carried out on the same test piece, the step b) needs to be repeated only after the central point is repositioned by adjusting the two-degree-of-freedom sticky sliding type piezoelectric precise positioning platform (4).
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