CN111048405A - Product cleaning process for digitally cleaning chip wafer - Google Patents
Product cleaning process for digitally cleaning chip wafer Download PDFInfo
- Publication number
- CN111048405A CN111048405A CN202010013032.0A CN202010013032A CN111048405A CN 111048405 A CN111048405 A CN 111048405A CN 202010013032 A CN202010013032 A CN 202010013032A CN 111048405 A CN111048405 A CN 111048405A
- Authority
- CN
- China
- Prior art keywords
- cleaning
- wafer
- product
- cleaning process
- station
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Abstract
The invention provides the following technical scheme: a product cleaning process for digitally cleaning a chip wafer comprises the following steps: s1, starting equipment, automatically vacuumizing a system to enable chip wafers to be in a vacuum environment in a product cleaning process of digital cleaning, and automatically proportioning liquid medicine by the system according to chip wafer cleaning requirements; s2, automatically grabbing iron sheets attached to the wafer to a cleaning station by a manipulator, rotating the cleaning station, and brushing the wafer while spraying chemical proportioning liquid medicine; s3, stopping spraying the chemical proportioning liquid medicine, and communicating two fluids to wash the wafer; s4, cutting off two-fluid supply, and drying and baking the wafer by using hot nitrogen supply; s5, transferring the wafer dried and baked in the step S4 to a visual detection station for visual detection to determine whether the wafer is a good product; and S6, if the wafer is good, finishing the cleaning process, and transmitting the material through the material transmitting mechanism until the cleaning process is finished. The product cleaning process can be used for automatic cleaning, and the cleaning effect is improved.
Description
Technical Field
The invention relates to the technical field of chip wafer cleaning equipment, in particular to a product cleaning process for digitally cleaning a chip wafer.
Background
At present, the chip wafer cleaning in the market mainly uses artificially proportioned liquid medicine, and then the chip wafer is cleaned by using the modes of liquid medicine soaking, common blow-drying and external baking, although the process is simple, a plurality of problems exist, firstly, the liquid medicine proportioning is difficult to digitize, and great quality risks are caused to the product quality; secondly, the chip wafer cleaning requirement is difficult to meet in the soaking process, and the liquid medicine residue and the damage to the product are serious; thirdly, the liquid medicine cleaning tank has the risk of secondary pollution to the chip wafer; the re-cleaned wafer chip cannot ensure the drying of moisture and liquid medicine, so that the residue is serious; finally, after the traditional blow-drying, water stains are left on the surface of the wafer, so that the cleaning efficiency and the cleaning effect of the traditional process are poor.
Disclosure of Invention
The invention provides a product cleaning process for digitally cleaning a chip wafer, which aims to solve the technical problems of high cleaning quality, efficiency, yield, labor consumption, resource and cost and the like of the chip wafer in the traditional cleaning process.
In order to solve the technical problems, the invention provides the following technical scheme: a product cleaning process for digitally cleaning a chip wafer comprises the following steps:
s1, starting equipment, automatically vacuumizing a system to enable chip wafers to be in a vacuum environment in a product cleaning process of digital cleaning, and automatically proportioning liquid medicine by the system according to chip wafer cleaning requirements;
s2, automatically grabbing iron sheets attached to the wafer to a cleaning station by a manipulator, starting the cleaning station to rotate, and brushing the wafer while spraying chemical proportioning liquid medicine;
s3, stopping spraying the chemical proportioning liquid medicine, and communicating two fluids to wash the wafer;
s4, cutting off two-fluid supply, and drying and baking the wafer by using hot nitrogen gas supply;
s5, transferring the wafer dried and baked in the step S4 to a visual detection station for visual detection to determine whether the wafer is a good product;
and S6, if the wafer is good, finishing the cleaning process, transmitting the materials through the material transmission mechanism until the cleaning process is finished, and performing cleaning work on the next batch of materials in the circulation.
Further, the vacuum degree of the vacuum environment in the step S1 is-0.1 MPa.
Further, in step S2, the rotation speed of the cleaning station is 600-1200RPM, and the time for spraying the chemical solution and automatically brushing the wafer is 38-42 seconds.
Further, in step S3, the time for rinsing the wafer by the two fluids is 40-45 seconds, and the rotation speed of the cleaning station is 1200-3000 RPM.
Further, in step S4, the rotation speed of the cleaning station is 1800-3000RPM, and the drying and baking time is 30-40 seconds.
Further, the hot nitrogen temperature is 75-98 ℃.
Further, the visual inspection in step S5 is performed by using a CCD industrial camera.
Further, the step of automatically grabbing the iron sheet attached to the wafer to the cleaning station by the manipulator comprises the following steps: a1 manipulator automatically picks the iron sheet attached to the wafer to the positioning mechanism for positioning the iron sheet; a2 transfer robot automatically picks the positioned wafer iron sheet to cleaning station.
Furthermore, the automatic grabbing precision of the manipulator is +/-0.01 mm; and the positioning precision and the positioning clamping precision of the transfer manipulator for automatically grabbing the positioned wafer iron sheet to the cleaning station are +/-0.01 mm.
Furthermore, when the rotating speed of the cleaning station is not less than 1200RPM, the positioning block on the cleaning station clamps and positions the iron sheet attached with the wafer for the second time.
Compared with the prior art, the invention has the following advantages:
1) the cleaning process adopts automatic closed-loop operation, and the whole process from feeding → cleaning → detection is fully automatically completed, so that the real-time monitoring, recording and alarming of data become possible;
2) the process steps and the personnel requirements in the cleaning process are reduced, and the energy waste is reduced;
3) the whole cleaning process can realize digital control and management, and important information in the whole cleaning process can be mastered in real time;
4) the conversion from traditional original cleaning to intelligent manufacturing digital cleaning is realized;
5) the traditional uncontrollable manual detection is replaced by digital visual detection;
6) the hot nitrogen is used for replacing the intermediate baking link of the traditional process, so that the cleaning efficiency and the quality are greatly improved;
7) the vacuum operation is utilized to improve the secondary pollution risk of the chip wafer caused by the cleaning of the original liquid medicine tank;
8) the whole cleaning process is totally closed, so that green and environment-friendly production is achieved;
9) the utilization rate of the liquid medicine is greatly improved;
10) the recovery and the reuse of the liquid medicine are never changed into the possibility;
11) establishing, storing and calling a process formula; the digital production of the process production is realized.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to examples.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
It is noted that the terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Now, exemplary embodiments according to the present application will be described in more detail. These exemplary embodiments may, however, be embodied in many different forms and should not be construed as limited to only the embodiments set forth herein. It is to be understood that these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of these exemplary embodiments to those of ordinary skill in the art, and that, for the sake of clarity, the thicknesses of layers and regions may be exaggerated and the same devices may be represented, and thus the description thereof will be omitted.
The embodiment of the invention discloses the following technical scheme: a product cleaning process for digitally cleaning a chip wafer comprises the following steps:
s1, starting equipment, automatically vacuumizing a system to enable chip wafers to be in a vacuum environment in a product cleaning process of digital cleaning, and automatically proportioning liquid medicine by the system according to chip wafer cleaning requirements;
s2, automatically grabbing iron sheets attached to the wafer to a cleaning station by a manipulator, starting the cleaning station to rotate, and brushing the wafer while spraying chemical proportioning liquid medicine;
s3, stopping spraying the chemical proportioning liquid medicine, and communicating two fluids to wash the wafer;
s4, cutting off two-fluid supply, and drying and baking the wafer by using hot nitrogen gas supply;
s5, transferring the wafer dried and baked in the step S4 to a visual detection station for visual detection to determine whether the wafer is a good product;
and S6, if the wafer is good, finishing the cleaning process, transmitting the materials through the material transmission mechanism until the cleaning process is finished, and performing cleaning work on the next batch of materials in the circulation.
Optionally, the vacuum degree of the vacuum environment in the step S1 is-0.1 Mpa.
Optionally, in the step S2, the rotation speed of the cleaning station is 600-1200RPM, and the time for spraying the chemical liquid and automatically brushing the wafer is 38-42 seconds.
Optionally, in step S3, the time for rinsing the wafer by the two fluids is 40 to 45 seconds, and the rotation speed of the cleaning station is 1200 and 3000 RPM.
Optionally, in the step S4, the rotation speed of the cleaning station is 1800-3000RPM, and the drying and baking time is 30-40 seconds.
Optionally, the hot nitrogen temperature is 75-98 ℃.
Optionally, in step S5, the visual inspection is performed by using a CCD industrial camera.
Optionally, the step of automatically grabbing the iron sheet attached to the wafer by the manipulator to the cleaning station includes the following steps: a1 manipulator automatically picks the iron sheet attached to the wafer to the positioning mechanism for positioning the iron sheet; a2 transfer robot automatically picks the positioned wafer iron sheet to cleaning station.
Particularly, the automatic grabbing precision of the manipulator is +/-0.01 mm; and the positioning precision and the positioning clamping precision of the transfer manipulator for automatically grabbing the positioned wafer iron sheet to the cleaning station are +/-0.01 mm.
Particularly, when the rotating speed of the cleaning station is not less than 1200RPM, the positioning block on the cleaning station clamps and positions the iron sheet attached with the wafer for the second time.
The equipment required by the product process provided by the embodiment of the invention comprises a cleaning station, a liquid medicine spraying system, a liquid medicine mixing system, a two-fluid flushing system, a nitrogen flushing system, a heating device, a grabbing mechanical arm, a transferring mechanical arm, a visual detection station, a material transfer-out mechanism and a positioning mechanism, wherein the liquid medicine spraying system is connected with the liquid medicine mixing system, the liquid medicine spraying system, the two-fluid flushing system and the nitrogen flushing system are respectively provided with a spray head structure, the spray head structures are arranged above the cleaning station, and a brush structure is further arranged above the cleaning station. The heating device is arranged at the nitrogen flushing system and used for heating the nitrogen. The visual detection station is a CCD industrial camera, the visual detection station and the grabbing manipulator are arranged between the cleaning station and the material transfer mechanism, the positioning mechanism is arranged between the cleaning station and the material transfer mechanism, and the transferring manipulator is positioned on one side of the positioning mechanism. The cleaning station is a rotating mechanism and is provided with a positioning block, and the wafer can be positioned in the rotating process of the cleaning station.
Cleaning station, liquid medicine sprinkler system, liquid medicine hybrid system, two fluid, nitrogen source, heating device, snatch the manipulator, transfer the manipulator, material spreads the mechanism and all sets up in airtight space, and airtight space has the evacuation system, can realize technology vacuum condition control, and airtight space department is equipped with inclosed open structure, and material spreads the open structure in mechanism one end and links to each other with airtight space.
Compared with the traditional process, the process provided by the embodiment of the invention has the following specific effects as shown in the following table:
| conventional process | Process of the embodiment of the invention | |
| Blending of liquid medicine | Repeating the experiment after manual blending until the mixture can be cleaned | The system automatically allocates according to the set value |
| Average dosage of cleaning single tablet | 800 to 900 ml | 300-400 ml |
| Cleaning efficiency | 30 to 35 tablets/hour | 55 to 65 tablets/hour |
| Detection of | Manual spot check | CCD on-line full-automatic detection |
| Water mark | Presence of water mark | Absence of water marks |
| Drying | Water still exists in centrifugal drying | Centrifugally drying with nitrogen, and drying to obtain a product without water |
| Cleaning, standing for 2-3 months | Mildew and hair growth | Mildew and hair growth |
| Waste liquid medicine | Direct discharge | Recycling and utilizing |
| Working ring mirror | The medicinal liquid has strong taste | The medicinal liquid has low irritation and taste |
| Rotational speed | Maximum 1800RPM | 3000RPM |
The embodiment of the invention has the following advantages:
1) the cleaning process adopts automatic closed-loop operation, and the whole process from feeding → cleaning → detection is fully automatically completed, so that the real-time monitoring, recording and alarming of data become possible;
2) the process steps and the personnel requirements in the cleaning process are reduced, and the energy waste is reduced;
3) the whole cleaning process can realize digital control and management, and important information in the whole cleaning process can be mastered in real time;
4) the conversion from traditional original cleaning to intelligent manufacturing digital cleaning is realized;
5) the traditional uncontrollable manual detection is replaced by digital visual detection;
6) the hot nitrogen is used for replacing the intermediate baking link of the traditional process, so that the cleaning efficiency and the quality are greatly improved;
7) the vacuum operation is utilized to improve the secondary pollution risk of the chip wafer caused by the cleaning of the original liquid medicine tank;
8) the whole cleaning process is totally closed, so that green and environment-friendly production is achieved;
9) the utilization rate of the liquid medicine is greatly improved;
10) the recovery and the reuse of the liquid medicine are never changed into the possibility;
11) establishing, storing and calling a process formula; the digital production of the process production is realized.
Finally, it should be noted that the above-mentioned embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the same, and although the present invention is described in detail with reference to the above-mentioned embodiments, it should be understood by those skilled in the art that the modifications and equivalents of the specific embodiments of the present invention can be made by those skilled in the art after reading the present specification, but these modifications and variations do not depart from the scope of the claims of the present application.
Claims (10)
1. A product cleaning process for digitally cleaning a chip wafer is characterized by comprising the following steps:
s1, starting equipment, automatically vacuumizing a system to enable chip wafers to be in a vacuum environment in a product cleaning process of digital cleaning, and automatically proportioning liquid medicine by the system according to chip wafer cleaning requirements;
s2, automatically grabbing iron sheets attached to the wafer to a cleaning station by a manipulator, starting the cleaning station to rotate, and brushing the wafer while spraying chemical proportioning liquid medicine;
s3, stopping spraying the chemical proportioning liquid medicine, and communicating two fluids to wash the wafer;
s4, cutting off two-fluid supply, and drying and baking the wafer by using hot nitrogen gas supply;
s5, transferring the wafer dried and baked in the step S4 to a visual detection station for visual detection to determine whether the wafer is a good product;
and S6, if the wafer is good, finishing the cleaning process, transmitting the materials through the material transmission mechanism until the cleaning process is finished, and performing cleaning work on the next batch of materials in the circulation.
2. The product cleaning process for digital cleaning of chip wafers as claimed in claim 1, wherein the vacuum degree of the vacuum environment in step S1 is-0.1 Mpa.
3. The product cleaning process for digitally cleaning the chip wafer as claimed in claim 1, wherein the rotation speed of the cleaning station in step S2 is 600-1200RPM, and the time for spraying the chemical liquid and automatically brushing the wafer are 38-42 seconds.
4. The product cleaning process for digital cleaning of chip wafers as claimed in claim 1, wherein the time for rinsing the wafer with the two fluids in step S3 is 40-45 seconds, and the rotation speed of the cleaning station is 1200-3000 RPM.
5. The product cleaning process for digitally cleaning the chip wafer as claimed in claim 1, wherein the rotation speed of the cleaning station in step S4 is 1800-3000RPM, and the drying and baking time is 30-40 seconds.
6. The product cleaning process for digital cleaning of chip wafers as claimed in claim 1 or 5, wherein the hot nitrogen temperature is 75-98 degrees celsius.
7. The product cleaning process for digital cleaning of chip wafers as claimed in claim 1, wherein the visual inspection in step S5 is performed by using a CCD industrial camera.
8. The product cleaning process for digital cleaning of chip wafers as claimed in claim 1, wherein the robot arm automatically grabbing iron pieces attached to the wafers to the cleaning station comprises the steps of: a1 manipulator automatically picks the iron sheet attached to the wafer to the positioning mechanism for positioning the iron sheet; a2 transfer robot automatically picks the positioned wafer iron sheet to cleaning station.
9. The product cleaning process for digital cleaning of chip wafers as claimed in claim 8, wherein the automatic grabbing precision of the manipulator is ± 0.01 mm; and the positioning precision and the positioning clamping precision of the transfer manipulator for automatically grabbing the positioned wafer iron sheet to the cleaning station are +/-0.01 mm.
10. The product cleaning process for digital cleaning of chip wafers as claimed in claim 3, wherein when the rotation speed of the cleaning station is not less than 1200RPM, the positioning block on the cleaning station clamps and positions the iron sheet attached with the wafer for the second time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010013032.0A CN111048405A (en) | 2020-01-07 | 2020-01-07 | Product cleaning process for digitally cleaning chip wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010013032.0A CN111048405A (en) | 2020-01-07 | 2020-01-07 | Product cleaning process for digitally cleaning chip wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111048405A true CN111048405A (en) | 2020-04-21 |
Family
ID=70243908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010013032.0A Pending CN111048405A (en) | 2020-01-07 | 2020-01-07 | Product cleaning process for digitally cleaning chip wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111048405A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111477558A (en) * | 2020-04-28 | 2020-07-31 | 天津福莱迪科技发展有限公司 | Visual detection equipment of product |
| CN111672808A (en) * | 2020-06-18 | 2020-09-18 | 上海广奕电子科技股份有限公司 | Cleaning mechanism for ICP plasma etching |
| CN113555274A (en) * | 2021-07-21 | 2021-10-26 | 江西圆融光电科技有限公司 | Chip cleaning method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1527364A (en) * | 2003-04-29 | 2004-09-08 | ̨������·����ɷ�����˾ | Wafer cleaning method and apparatus |
| US20060048792A1 (en) * | 2004-09-09 | 2006-03-09 | Tokyo Electron Limited | Substrate cleaning method and developing apparatus |
| CN109962028A (en) * | 2019-04-18 | 2019-07-02 | 上海允哲机电科技有限公司 | A kind of Full-automatic and its cleaning process for chip |
| CN110190013A (en) * | 2019-06-06 | 2019-08-30 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer feeding device, wafer charging method and wafer cleaning equipment |
| CN209513661U (en) * | 2018-11-28 | 2019-10-18 | 华南理工大学 | A kind of double-station high speed and precision vision detection system |
| CN110473818A (en) * | 2019-09-25 | 2019-11-19 | 广东先导先进材料股份有限公司 | A kind of chip automatic corrosion sprinkling equipment |
-
2020
- 2020-01-07 CN CN202010013032.0A patent/CN111048405A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1527364A (en) * | 2003-04-29 | 2004-09-08 | ̨������·����ɷ�����˾ | Wafer cleaning method and apparatus |
| US20060048792A1 (en) * | 2004-09-09 | 2006-03-09 | Tokyo Electron Limited | Substrate cleaning method and developing apparatus |
| CN209513661U (en) * | 2018-11-28 | 2019-10-18 | 华南理工大学 | A kind of double-station high speed and precision vision detection system |
| CN109962028A (en) * | 2019-04-18 | 2019-07-02 | 上海允哲机电科技有限公司 | A kind of Full-automatic and its cleaning process for chip |
| CN110190013A (en) * | 2019-06-06 | 2019-08-30 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer feeding device, wafer charging method and wafer cleaning equipment |
| CN110473818A (en) * | 2019-09-25 | 2019-11-19 | 广东先导先进材料股份有限公司 | A kind of chip automatic corrosion sprinkling equipment |
Non-Patent Citations (2)
| Title |
|---|
| 肖国玲等: "《微电子制造工艺技术》", 30 September 2008, 西安电子科技大学出版社 * |
| 高宏伟等: "《电子封装工艺与装备技术基础教程》", 30 June 2017, 西安电子科技大学出版社 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111477558A (en) * | 2020-04-28 | 2020-07-31 | 天津福莱迪科技发展有限公司 | Visual detection equipment of product |
| CN111477558B (en) * | 2020-04-28 | 2020-12-25 | 天津福莱迪科技发展有限公司 | Visual detection equipment of product |
| CN111672808A (en) * | 2020-06-18 | 2020-09-18 | 上海广奕电子科技股份有限公司 | Cleaning mechanism for ICP plasma etching |
| CN113555274A (en) * | 2021-07-21 | 2021-10-26 | 江西圆融光电科技有限公司 | Chip cleaning method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111048405A (en) | Product cleaning process for digitally cleaning chip wafer | |
| CN110273517B (en) | Automatic production line for heat-insulating decorative composite board | |
| CN111715455B (en) | Equipment for spraying PTFE on framework oil seal lip and spraying method thereof | |
| CN109732410B (en) | Control method for cylinder burr sleeve production line | |
| CN110815035B (en) | Chemical mechanical planarization equipment combining grinding and single-wafer cleaning module | |
| US11550303B2 (en) | Robotic production line and methods of flexible and chaotic production | |
| CN207541491U (en) | A kind of heliostat automatic production line | |
| WO2012003715A1 (en) | Mocvd system having multiple epitaxial reactor chambers and operation method thereof | |
| CN108788630A (en) | Petrol engine wheel hub full automatic processing device and process | |
| CN110752271A (en) | Processing method of PERC battery | |
| CN110600406A (en) | Cleaning and laminating all-in-one machine for ceramic disc and wafer | |
| KR20010034990A (en) | Multifunctional integration manufacturing apparatus for semiconductor and flat panel displays | |
| CN103606518A (en) | A wet etching method and a wet etching apparatus | |
| TWM596394U (en) | Dispatch system for mold manufacturing | |
| CN207009480U (en) | A kind of perovskite thin film equipment for after-treatment | |
| CN110774165B (en) | Polishing method of semiconductor material wafer | |
| CN112582498A (en) | Method for continuously producing crystalline silicon solar cells | |
| JP2001009713A (en) | Polishing device | |
| CN111162443B (en) | Welding method and welding apparatus | |
| CN213674686U (en) | Full-automatic sanitary appliance intelligent robot glazing equipment | |
| CN207224310U (en) | A kind of work pieces process production line | |
| CN112091533A (en) | Production method of high-temperature-resistant grate bars | |
| TW201626595A (en) | Substrate automatic conveying system | |
| CN113451114A (en) | Chip wafer cleaning process | |
| CN209755593U (en) | Wine bottle biscuit bottle soaks outer glaze equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200421 |
|
| RJ01 | Rejection of invention patent application after publication |