CN111041845A - 一种有机硅导热绝缘片及其制备方法 - Google Patents
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Abstract
本发明公开了一种有机硅导热绝缘片,包括基材和涂覆在基材上的混合物料,混合物料由以下重量份的组分组成:基础树脂8‑10份、稀释剂10‑15份、交联剂0.1‑1.0份、补强剂0‑5份、阻燃剂5‑10份、催化剂0.1‑0.5份和抑制剂0.01‑0.1份。本发明的有益效果是:本发明的有机硅导热绝缘片材料是一种高导热,高抗穿刺、高撕裂强度的材料;具有优异的耐高低温性能、出色的电气绝缘性能,使得有机硅导热绝缘片材料可以在‑40~200℃的温度下连续工作,广泛应用于电源、新能源汽车电池包、电池组、路由器、通讯机柜、电焊机等常用家电,还可以应用于航空航天领域、智能传感器领域和工业电子领域等。
Description
技术领域
本发明涉及导热材料技术领域,尤其涉及一种有机硅导热绝缘片及其制备方法。
背景技术
有机硅导热绝缘片材料是一种高导热,高抗穿刺、高撕裂强度的材料,具有优异的耐高低温性能、出色的电气绝缘性能,有机硅导热绝缘片材料可以在-40~200℃的温度下连续工作,优良的电气绝缘性能保证原器件的安全使用材料,由于有机硅结构的特殊性,使之具有许多其他材料所不能同时具备的优异性能,与其他高分子材料相比,其具有卓越的耐高低温性、优良的电绝缘性和化学稳定性、良好的耐老化性、突出的憎水防潮性和生理惰性等。
发明内容
本发明提供一种有机硅导热绝缘片及其制备方法,具体技术方案如下:一种有机硅导热绝缘片,包括基材和涂覆在基材上的混合物料,所述混合物料由以下重量份的组分组成:基础树脂8-10份、稀释剂10-15份、交联剂0.1-1.0份、补强剂0-5份、阻燃剂5-10份、催化剂0.1-0.5份和抑制剂0.01-0.1份。
进一步,所述基材为经纬网玻璃纤维布,厚度为0.05mm,网眼为3*3mm。
更进一步,所述基础树脂为粘度150000-200000cps的乙烯基MQ树脂,MQ比值0.8;所述稀释剂为乙酸乙酯;所述交联剂为粘度200-2000cps的含氢硅油,氢含量为0.18%-1.6%;所述补强剂为气相白炭黑或沉淀白炭黑中的一种或两种;所述阻燃剂粒径为0.1-30μm,为三聚氰胺磷酸盐、聚多磷酸盐、三氧化二锑或氢氧化铝粉中的一种或多种的混合;所述催化剂为铂金含量为1000-10000ppm的铂金络合物;所述抑制剂为炔基环己醇。
本发明还涉及上述有机硅导热绝缘片的制备方法,步骤为:将基础树脂、稀释剂、交联剂、补强剂、阻燃剂、抑制剂、依次加入到高速搅拌釜中搅拌100-150min,转速为1500-2000rpm,加入催化剂,搅拌10-30min,转速为1000-1500rpm,将混合物料用震动过滤筛过滤,将物料灌入涂布机中,使用双线棒涂布工艺,将液体浆料涂覆在玻璃纤维布表面,135℃下固化30min,即得。
本发明的有益效果是:本发明的有机硅导热绝缘片材料是一种高导热,高抗穿刺、高撕裂强度的材料;具有优异的耐高低温性能、出色的电气绝缘性能,使得有机硅导热绝缘片材料可以在-40~200℃的温度下连续工作,优良的电气绝缘性能保证原器件的安全使用材料,由于有机硅结构的特殊性,使之具有许多其他材料所不能同时具备的优异性能,与其他高分子材料相比,其具有卓越的耐高低温性、优良的电绝缘性和化学稳定性、良好的耐老化性、突出的憎水防潮性和生理惰性等。该有机硅导热绝缘片材料,广泛应用于电源,新能源汽车电池包、电池组、路由器、通讯机柜、电焊机等常用家电,还可以应用于航空航天领域、智能传感器领域和工业电子领域等。
具体实施方式
以下结合实例对本发明进行描述,所举实例只用于解释本发明,并非用于限定本发明的范围。
实施例1
一种有机硅导热绝缘片,包括基材和涂覆在基材上的混合物料,基材为经纬网玻璃纤维布,厚度为0.05mm,网眼为3*3mm,混合物料由以下重量份的组分组成:粘度150000cps、MQ比值为0.8的乙烯基MQ树脂10份,乙酸乙酯13份,粘度2000cps、氢含量为1.6%的含氢硅油0.1份,气相白炭黑5份,粒径为0.1μm的三聚氰胺磷酸盐5份,铂金含量为10000ppm的铂金络合物0.1份和炔基环己醇0.01份。
实施例2
一种有机硅导热绝缘片,包括基材和涂覆在基材上的混合物料,基材为经纬网玻璃纤维布,厚度为0.05mm,网眼为3*3mm,混合物料由以下重量份的组分组成:粘度170000cps、MQ比值为0.8的乙烯基MQ树脂9份,乙酸乙酯10份,粘度1000cps、氢含量为0.9%的含氢硅油0.6份,沉淀白炭黑3份,粒径为30μm的聚多磷酸盐8份,铂金含量为5000ppm的铂金络合物0.3份和炔基环己醇0.1份。
实施例3
一种有机硅导热绝缘片,包括基材和涂覆在基材上的混合物料,基材为经纬网玻璃纤维布,厚度为0.05mm,网眼为3*3mm,混合物料由以下重量份的组分组成:粘度200000cps、MQ比值为0.8的乙烯基MQ树脂8份,乙酸乙酯15份,粘度200cps、氢含量为0.18%的含氢硅油1.0份,粒径为30μm的三氧化二锑或氢氧化铝粉10份,铂金含量为1000ppm的铂金络合物0.5份和炔基环己醇0.05份。
实施例1-3有机硅导热绝缘片的制备方法为:将基础树脂、稀释剂、交联剂、补强剂、阻燃剂、抑制剂、依次加入到高速搅拌釜中搅拌100-150min,转速为1500-2000rpm,加入催化剂,搅拌10-30min,转速为1000-1500rpm,将混合物料用震动过滤筛过滤,将物料灌入涂布机中,使用双线棒涂布工艺,将液体浆料涂覆在玻璃纤维布表面,135℃下固化30min,即得。
将实施例1-3所得有机硅导热绝缘片进行相关指标检测,如表1所示。从表中数据可以看出,实施例1-3有机硅导热绝缘片具有较好的热稳定性和机械性能。
表1.实施例1-3有机硅导热绝缘片性能测试数据
以上所述仅为本发明的较佳实施例,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (4)
1.一种有机硅导热绝缘片,包括基材和涂覆在基材上的混合物料,其特征在于,所述混合物料由以下重量份的组分组成:基础树脂8-10份、稀释剂10-15份、交联剂0.1-1.0份、补强剂0-5份、阻燃剂5-10份、催化剂0.1-0.5份和抑制剂0.01-0.1份。
2.根据权利要求1所述的有机硅导热绝缘片,其特征在于,所述基材为经纬网玻璃纤维布,厚度为0.05mm,网眼为3*3mm。
3.根据权利要求1所述的有机硅导热绝缘片,其特征在于,所述基础树脂为粘度150000-200000cps的乙烯基MQ树脂,MQ比值0.8;所述稀释剂为乙酸乙酯;所述交联剂为粘度200-2000cps的含氢硅油,氢含量为0.18%-1.6%;所述补强剂为气相白炭黑或沉淀白炭黑中的一种或两种;所述阻燃剂粒径为0.1-30μm,为三聚氰胺磷酸盐、聚多磷酸盐、三氧化二锑或氢氧化铝粉中的一种或多种的混合;所述催化剂为铂金含量为1000-10000ppm的铂金络合物;所述抑制剂为炔基环己醇。
4.一种如权利要求1-3任一项所述的有机硅导热绝缘片的制备方法,其特征在于,步骤为:将基础树脂、稀释剂、交联剂、补强剂、阻燃剂、抑制剂、依次加入到高速搅拌釜中搅拌100-150min,转速为1500-2000rpm,加入催化剂,搅拌10-30min,转速为1000-1500rpm,将混合物料用震动过滤筛过滤,将物料灌入涂布机中,使用双线棒涂布工艺,将液体浆料涂覆在玻璃纤维布表面,135℃下固化30min,即得。
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