CN111041419A - Preparation method of gold-silver alloy wire - Google Patents
Preparation method of gold-silver alloy wire Download PDFInfo
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- CN111041419A CN111041419A CN201911354040.5A CN201911354040A CN111041419A CN 111041419 A CN111041419 A CN 111041419A CN 201911354040 A CN201911354040 A CN 201911354040A CN 111041419 A CN111041419 A CN 111041419A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/04—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
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- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Wire Bonding (AREA)
- Metal Extraction Processes (AREA)
Abstract
The invention discloses a preparation method of gold-silver alloy wires, which comprises the following steps: (1) weighing raw materials, (2) casting twice, (3) drawing, (4) cleaning and intermediate annealing, (5) plating gold, (6) drawing twice, (7) heat treatment and (8) rewinding, wherein in the process of producing metal bars, the two metals of gold and silver can be mixed more uniformly by casting twice, so that the problems of overhigh cost, nonuniform mixing of gold and silver alloy wires and poor drawability of the traditional bonding gold wire are solved, the product performance is more stable, the subsequent production and processing are facilitated, and the production efficiency is greatly improved; the gold-silver alloy wire is plated with gold on the surface by a vacuum ion plating method, so that a gold metal material is saved, the product cost is reduced, and no environmental pollution is caused; the performance index of the gold-silver alloy bonding wire produced in the way is superior to that of a gold-silver alloy bonding wire containing 80% of gold in the market, and the cost of the bonding wire is greatly reduced.
Description
Technical Field
The invention relates to the technical field of metal bonding wires.
Background
The gold bonding wire is a key lead material for connecting an integrated circuit or a transistor chip with a lead frame, along with the rapid development of the semiconductor industry in recent years, the integrated degree of the integrated circuit is higher and higher, the thickness of a circuit board is smaller and smaller, the number of electrodes on a device is higher and higher, the electrode spacing is narrower and narrower, the packaging density is correspondingly smaller and smaller, and the gold bonding wire serving as the lead is required to have the performances of high strength, low long radian, very high arc stability and the like. The gold-silver alloy wires containing 80% of gold in the market have uneven mixing, poor drawability and unstable performance due to high gold content in the alloys, and the production cost is high because the gold-silver alloy wires in the market mainly contain 4N gold-silver bonding wires (the mass percentage of gold is more than or equal to 99.99%) and 2N gold-silver bonding wires (the mass percentage of gold is more than or equal to 99.0%).
Disclosure of Invention
The invention aims to solve the technical problem of providing a preparation method of the gold-silver alloy wire, which has the advantages of excellent performance, good drawability and high production efficiency.
The technical scheme of the invention is as follows:
a preparation method of gold-silver alloy wires comprises the following steps:
(1) weighing the following raw materials: uses two noble metal elements of gold and silver with purity requirement more than or equal to 99.99 percent,
(2) and (3) casting twice: forming a gold-silver alloy metal bar wire blank with the diameter of 8mm through secondary casting;
(3) drawing: drawing 8mm wire blanks to 1.0mm by using a single-mode wire drawing machine, and drawing the wire to 0.05mm by using a multi-mode wire drawing machine;
(4) cleaning and intermediate annealing: carrying out intermediate annealing on the gold-silver alloy wire with the thickness of 0.05mm by using a horizontal annealing furnace with cleaning;
(5) gold plating by vacuum ion plating at vacuum degree of 1.0 x 10-2In the vacuum furnace, 3 to 5 percent of gold is plated on the surface of the gold-silver alloy wire by vacuum ion plating;
(6) secondary wire drawing: drawing the wire rod to a finished wire rod with the diameter of 0.016mm at the drawing speed of 300-600 m/min by using a multi-mode drawing machine;
(7) and (3) heat treatment: carrying out stress relief recrystallization heat treatment on the finished wire by using a controllable paying-off tension and an automatic paying-off horizontal continuous heat treatment furnace, wherein inert gas N2+ H2 is required for protection in the process; the heat treatment temperature is 500-700 ℃;
(8) rewinding: and rewinding the bonded gold-silver alloy wire subjected to heat treatment.
The invention has the beneficial effects that: according to the invention, through secondary casting in the process of producing the 8mm metal bar, two metals of gold and silver can be mixed more uniformly, so that the problems of uneven mixing of gold and silver and poor drawability of the gold-silver alloy wire in the market are solved, the product performance is more stable, the subsequent production and processing are more facilitated, and the production efficiency is greatly improved; the gold-silver alloy wire is plated with gold on the surface by a vacuum ion plating method, so that the metal material is saved, the product cost is reduced compared with a 4N pure gold wire, and the environment pollution is avoided; the performance index of the gold-silver alloy bonding wire produced in the way is superior to that of the bonding wire containing 80% of gold in the market, and the cost of the bonding wire is greatly reduced. The production process improves the production efficiency of the gold-silver alloy bonding wire, and the produced wire has good and stable use performance and can meet the requirements of the high-end packaging field of semiconductors on the quality of the gold-silver alloy bonding wire.
Detailed Description
The present invention will be further described with reference to the following specific examples.
(1) Weighing the following raw materials: uses two noble metal elements of gold and silver with purity requirement more than or equal to 99.99 percent,
(2) and (3) casting twice: forming a gold-silver alloy metal bar wire blank with the diameter of 8mm through secondary casting;
(3) drawing: drawing 8mm wire blanks to 1.0mm by using a single-mode wire drawing machine, and drawing the wire to 0.05mm by using a multi-mode wire drawing machine;
(4) cleaning and intermediate annealing: carrying out intermediate annealing on the gold-silver alloy wire with the thickness of 0.05mm by using a horizontal annealing furnace with cleaning;
(5) gold plating by vacuum ion plating at vacuum degree of 1.0 x 10-2In the vacuum furnace, 3 to 5 percent of gold is plated on the surface of the gold-silver alloy wire by adopting vacuum ion plating;
(6) secondary wire drawing: drawing the wire rod to a finished wire rod with the diameter of 0.016mm at the drawing speed of 300-600 m/min by using a multi-mode drawing machine;
(7) and (3) heat treatment: carrying out stress relief recrystallization heat treatment on the finished wire by using a controllable paying-off tension and an automatic paying-off horizontal continuous heat treatment furnace, wherein inert gas N2+ H2 is required for protection in the process; the heat treatment temperature is 500-700 ℃;
(8) rewinding: and rewinding the bonded gold-silver alloy wire subjected to heat treatment.
Example 1
(1) Weighing the following raw materials: weighing 190g of pure gold with the purity of more than or equal to 99.99 percent and 500g of silver with the purity of more than or equal to 99.99 percent;
(2) casting: the gold and silver are weighed and subjected to intermediate frequency heating, the furnace temperature is set to 1300 ℃, and the vacuum degree is not more than 1.0 x 10- 3pa, refining time is 30 minutes, cooling water pressure is 0.4Mpa, cooling water flow is 10LPM, the first continuous casting speed is 100 mm/minute, the second continuous casting speed is 70 mm/minute, and the diameter of the formed wire blank is 8 mm;
(3) drawing: drawing 8mm wire blank to 1mm by using a single-mode wire drawing machine, and drawing the wire to 0.05mm in diameter by using a multi-mode wire drawing machine
(4) Cleaning and intermediate annealing: annealing the bonding wire of 0.05mm at a set temperature of 600 ℃ by a horizontal annealing furnace with cleaning and nitrogen protection, wherein the annealing speed is 60 mpm;
(5) gold plating by vacuum ion plating at vacuum degree of 1.0 x 10-2Plating gold of 0.0005-0.001 mm on a gold-silver alloy wire of 0.05mm in a vacuum furnace, and controlling the wire-rewinding speed to plate gold with the mass percentage of 3% +/-0.5;
(6) performing secondary wire drawing, drawing the wire to the diameter of 0.025mm by using a multi-die wire drawing machine, and controlling the wire drawing speed to be 300 m/min;
(7) and (3) heat treatment: carrying out stress relief recrystallization heat treatment on the finished wire by using a controllable paying-off tension and an automatic paying-off horizontal continuous heat treatment furnace, wherein inert gas N2+ H2 is required for protection; the heat treatment temperature is 500 ℃, and the annealing speed is 60 mpm;
(8) rewinding: and (5) repeating the bonding wire subjected to heat treatment into a finished product with the axis of 500m according to the requirements of customers.
Table 1: example 1 composition inspection and comparison table of primary casting and secondary casting
It is obvious from the table that the deviation 0.0039% of the second melting and casting is far less than 0.0891% of the deviation of the first melting and casting, and the gold-silver alloy bar after the second melting and casting is more uniform.
Example 2
(1) Weighing the following raw materials: 380g of pure gold with the purity of more than or equal to 99.99 percent and 1000g of silver with the purity of more than or equal to 99.99 percent are weighed;
(2) casting: the gold and silver are weighed and subjected to intermediate frequency heating, the furnace temperature is set to 1300 ℃, and the vacuum degree is not more than 1.0 x 10- 3pa, refining time is 30 minutes, cooling water pressure is 0.4Mpa, cooling water flow is 10LPM, the first continuous casting speed is 100 mm/minute, the second continuous casting speed is 70 mm/minute, and the diameter of the formed wire blank is 8 mm;
(3) drawing: drawing 8mm wire blank to 1mm by using a single-mode wire drawing machine, and drawing the wire to 0.05mm in diameter by using a multi-mode wire drawing machine
(4) Cleaning and intermediate annealing: annealing the bonding wire of 0.05mm at a set temperature of 600 ℃ by a horizontal annealing furnace with cleaning and nitrogen protection, wherein the annealing speed is 60 mpm;
(5) gold plating by vacuum ion plating at vacuum degree of 1.0 x 10-2In the vacuum furnace, gold of 0.0005-0.001 mm is plated on a gold-silver alloy wire of 0.05mm, and the mass percent of gold plating is controlled to be 5% +/-0.5 at the take-up speed.
(6) Performing secondary wire drawing, drawing the wire to the diameter of 0.025mm by using a multi-die wire drawing machine, and controlling the wire drawing speed to be 500 m/min;
(7) and (3) heat treatment: carrying out stress relief recrystallization heat treatment on the finished wire by using a controllable paying-off tension and an automatic paying-off horizontal continuous heat treatment furnace, wherein inert gas N2+ H2 is required for protection; the heat treatment temperature is 700 ℃, and the annealing speed is 60 mpm;
(8) rewinding: and (5) repeating the bonding wire subjected to heat treatment into a finished product with the axis of 500m according to the requirements of customers.
Example 3
(1) Weighing the following raw materials: 760g of pure gold with the purity of more than or equal to 99.99 percent and 2000g of silver with the purity of more than or equal to 99.99 percent are weighed;
(2) casting: the gold and silver are weighed and subjected to intermediate frequency heating, the furnace temperature is set to 1300 ℃, and the vacuum degree is not more than 1.0 x 10- 3pa refining time 30 minutes, cooling water pressure 0.4Mpa, cooling water flow 10LPM, firstThe secondary continuous casting speed is 100 mm/min, the secondary continuous casting speed is 70 mm/min, and the diameter of the formed wire blank is 8 mm;
(3) drawing: drawing 8mm wire blank to 1mm by using a single-mode wire drawing machine, and drawing the wire to 0.05mm in diameter by using a multi-mode wire drawing machine
(4) Cleaning and intermediate annealing: annealing the bonding wire of 0.05mm at a set temperature of 600 ℃ by a horizontal annealing furnace with cleaning and nitrogen protection, wherein the annealing speed is 60 mpm;
(5) gold plating by vacuum ion plating at vacuum degree of 1.0 x 10-2In the vacuum furnace, gold of 0.0005-0.001 mm is plated on a gold-silver alloy wire of 0.05mm, and the mass percent of gold plating is controlled to be 4% +/-0.5 at the take-up speed.
(6) Performing secondary wire drawing, drawing the wire to the diameter of 0.025mm by using a multi-die wire drawing machine, and controlling the wire drawing speed to be 600 m/min;
(7) and (3) heat treatment: carrying out stress relief recrystallization heat treatment on the finished wire by using a controllable paying-off tension and an automatic paying-off horizontal continuous heat treatment furnace, wherein inert gas N2+ H2 is required for protection; the heat treatment temperature is 650 ℃, and the annealing speed is 60 mpm;
(8) rewinding: and (5) repeating the bonding wire subjected to heat treatment into a finished product with the axis of 500m according to the requirements of customers.
Table 2: ingredient inspection comparison table of example 1, example 2 and example 3
| Item | Gold Au | Silver Ag |
| Example 1 | 29.6598％ | 70.3402％ |
| Example 2 | 30.9801％ | 69.0199％ |
| Example 3 | 30.3315％ | 69.6685％ |
Table 3 shows a comparison table of technical data of 0.025mm (1mil)4N gold wire, gold-silver alloy wire containing 80% gold and silver, example 1, example 2 and example 3
From the table, the gold-silver alloy gold-plating bonding wire product manufactured by the invention contains 30 +/-1% of gold, has mechanical property and electrical property indexes superior to those of gold-silver alloy wire containing 80% of gold, has moderate hardness and fine crystal grains, can be used for IC packaging instead of the gold-silver alloy wire containing 80% of gold, greatly reduces the material cost, and meets the requirements of partial high-end semiconductor packaging field on the quality of the gold-silver alloy bonding wire.
Claims (1)
1. A preparation method of gold-silver alloy wires comprises the following steps:
(1) weighing the following raw materials: uses two noble metal elements of gold and silver with purity requirement more than or equal to 99.99 percent,
(2) and (3) casting twice: forming a gold-silver alloy metal bar wire blank with the diameter of 8mm through secondary casting;
(3) drawing: drawing 8mm wire blanks to 1.0mm by using a single-mode wire drawing machine, and drawing the wire to 0.05mm by using a multi-mode wire drawing machine;
(4) cleaning and intermediate annealing: carrying out intermediate annealing on the gold-silver alloy wire with the thickness of 0.05mm by using a horizontal annealing furnace with cleaning;
(5) gold plating by vacuum ion plating at vacuum degree of 1.0 x 10-2In the vacuum furnace, 3 to 5 percent of gold is plated on the surface of the gold-silver alloy wire by vacuum ion plating;
(6) secondary wire drawing: drawing the wire rod to a finished wire rod with the diameter of 0.016mm at the drawing speed of 300-600 m/min by using a multi-mode drawing machine;
(7) and (3) heat treatment: carrying out stress relief recrystallization heat treatment on the finished wire by using a controllable paying-off tension and an automatic paying-off horizontal continuous heat treatment furnace, wherein inert gas N2+ H2 is required for protection in the process; the heat treatment temperature is 500-700 ℃;
(8) rewinding: and rewinding the bonded gold-silver alloy wire subjected to heat treatment.
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| CN201911354040.5A CN111041419A (en) | 2019-12-25 | 2019-12-25 | Preparation method of gold-silver alloy wire |
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| CN201911354040.5A CN111041419A (en) | 2019-12-25 | 2019-12-25 | Preparation method of gold-silver alloy wire |
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Cited By (2)
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| CN112958627A (en) * | 2021-02-01 | 2021-06-15 | 陈保庆 | Processing technology based on jewelry gold |
| CN116705745A (en) * | 2023-08-04 | 2023-09-05 | 烟台一诺电子材料有限公司 | Bond alloy wire and production process thereof |
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Application publication date: 20200421 |