CN108962859A - A kind of silver-base alloy bonding wire of plating nickel on surface and preparation method thereof - Google Patents
A kind of silver-base alloy bonding wire of plating nickel on surface and preparation method thereof Download PDFInfo
- Publication number
- CN108962859A CN108962859A CN201810782124.8A CN201810782124A CN108962859A CN 108962859 A CN108962859 A CN 108962859A CN 201810782124 A CN201810782124 A CN 201810782124A CN 108962859 A CN108962859 A CN 108962859A
- Authority
- CN
- China
- Prior art keywords
- silver
- alloy
- fine
- nickel
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 136
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 68
- 238000007747 plating Methods 0.000 title claims abstract description 57
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 47
- 239000000956 alloy Substances 0.000 title claims abstract description 47
- 238000002360 preparation method Methods 0.000 title claims description 21
- 229910001316 Ag alloy Inorganic materials 0.000 claims abstract description 53
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052709 silver Inorganic materials 0.000 claims abstract description 28
- 239000004332 silver Substances 0.000 claims abstract description 28
- 239000010946 fine silver Substances 0.000 claims abstract description 27
- 239000011159 matrix material Substances 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000011785 micronutrient Substances 0.000 claims abstract description 5
- 235000013369 micronutrients Nutrition 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims description 30
- 238000000137 annealing Methods 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 22
- 238000009749 continuous casting Methods 0.000 claims description 21
- 229910052684 Cerium Inorganic materials 0.000 claims description 18
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 18
- 229910000531 Co alloy Inorganic materials 0.000 claims description 17
- 229910017052 cobalt Inorganic materials 0.000 claims description 12
- 239000010941 cobalt Substances 0.000 claims description 12
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 12
- 229910001097 yellow gold Inorganic materials 0.000 claims description 12
- 239000010930 yellow gold Substances 0.000 claims description 12
- 229910000636 Ce alloy Inorganic materials 0.000 claims description 11
- 229910052757 nitrogen Inorganic materials 0.000 claims description 11
- 229910001254 electrum Inorganic materials 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 8
- 238000002791 soaking Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 5
- 239000007789 gas Substances 0.000 claims description 5
- 238000007711 solidification Methods 0.000 claims description 5
- 230000008023 solidification Effects 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 4
- XXOYNJXVWVNOOJ-UHFFFAOYSA-N fenuron Chemical compound CN(C)C(=O)NC1=CC=CC=C1 XXOYNJXVWVNOOJ-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000004321 preservation Methods 0.000 claims description 2
- 239000011573 trace mineral Substances 0.000 claims description 2
- 235000013619 trace mineral Nutrition 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 8
- 239000010931 gold Substances 0.000 abstract description 5
- 229910052737 gold Inorganic materials 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 description 5
- 102000002151 Microfilament Proteins Human genes 0.000 description 4
- 108010040897 Microfilament Proteins Proteins 0.000 description 4
- 210000003632 microfilament Anatomy 0.000 description 4
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical compound C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 3
- REPVLJRCJUVQFA-UHFFFAOYSA-N (-)-isopinocampheol Natural products C1C(O)C(C)C2C(C)(C)C1C2 REPVLJRCJUVQFA-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 229940116229 borneol Drugs 0.000 description 3
- CKDOCTFBFTVPSN-UHFFFAOYSA-N borneol Natural products C1CC2(C)C(C)CC1C2(C)C CKDOCTFBFTVPSN-UHFFFAOYSA-N 0.000 description 3
- 238000002485 combustion reaction Methods 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- DTGKSKDOIYIVQL-UHFFFAOYSA-N dl-isoborneol Natural products C1CC2(C)C(O)CC1C2(C)C DTGKSKDOIYIVQL-UHFFFAOYSA-N 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/04—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
- B21C37/047—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire of fine wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/001—Continuous casting of metals, i.e. casting in indefinite lengths of specific alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/005—Continuous casting of metals, i.e. casting in indefinite lengths of wire
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4889—Connection or disconnection of other leads to or from wire-like parts, e.g. wires
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electrochemistry (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of silver-base alloy bonding wires of plating nickel on surface; using pure silver alloy as matrix; nickel protection layer is coated on described matrix surface; wherein; according to the percentage of weight; fine silver content is 97.6%-98.99%, surface nickel content 1.0%-1.8%, micronutrient levels 0.0002%-0.0015%.In the LED of middle and high end and IC package, spun gold occupies very big ratio, and the cost of the silver based bonding wire of this plating nickel on surface is only spun gold 1/8, in part LED and IC package, greatly reduces packaging cost.Using the silver based bonding wire for the plating nickel on surface that the method for the present invention obtains, material is finer and close, and surface is smooth, and line style section circularity is consistent.
Description
Technical field
The present invention relates to silver-base alloy bonding wire technical field more particularly to a kind of silver-base alloy bonding wires of plating nickel on surface
And preparation method thereof.
Background technique
Microelectronics wire bonding is a kind of using fine metal line, is to draw metal using heat, pressure, ultrasonic energy
The information mutual communication of the electric interconnection and chip chamber between chip and substrate is realized in line and the close soldering of substrate pads.It is controlled in ideal
Under the conditions of, it can occur that electronics is shared or the phase counterdiffusion of atom between lead and substrate, to make to realize atomic weight between two kinds of metals
Bonding in grade.
It is encapsulated at present in LED, COB and more pin integrated circuits, bonding line is mostly used gold thread and the silver alloy wire of other patterns.
Since bonding gold wire is on the high side, packaging cost is caused to increase.The silver alloy wire price of other patterns is relatively low, but LED,
In COB and more pin integrated circuit encapsulation technologies, need inert gas shielding, but will appear oxidation, material it is partially hard, one
The defects of solder joint slides ball, two solder joint line tails are too long.In this context, the silver based bonding wire with exploitation plating nickel on surface is developed, is used for
Replace bonding gold wire and the Silver alloy wire of other patterns.
When the silver-base alloy bonding wire of plating nickel on surface is especially used for white light LEDs, the brightness of LED is significantly increased.
Summary of the invention
The purpose of the present invention is to solve disadvantages existing in the prior art, and a kind of silver-based of the plating nickel on surface proposed
Alloy bonding silk and preparation method thereof.
To achieve the goals above, present invention employs following technical solutions:
A kind of silver-base alloy bonding wire of plating nickel on surface is coated with nickel on described matrix surface and protects using pure silver alloy as matrix
Sheath, wherein according to the percentage of weight, fine silver content 97.6%-98.99%, surface nickel content 1.0%-1.8%,
Micronutrient levels is 0.0002%-0.0015%.
Preferably, silver-colored purity >=99.99%.
The present invention also provides a kind of preparation methods of the silver-base alloy bonding wire of plating nickel on surface, include the following steps:
S1: the copper billet cleaning of the silver ingot and purity >=99.999% of purity >=99.99% is dried for standby；
S2: it prepares yellow gold stick: fine silver and fine copper being placed in vacuum drop-down continuous casting furnace, are prepared into diameterSilver
Copper alloy bar, the wherein content of copper are as follows: 5.0%-10.0%；
S3: it prepares Ag-Ce alloy stick: fine silver and microelement cerium being placed in vacuum drop-down continuous casting furnace, are prepared into diameterAg-Ce alloy bar, the wherein content of cerium are as follows: 0.5%-3.0%；
S4: it prepares silver-colored cobalt alloy stick: fine silver and trace element cobalt being placed in vacuum drop-down continuous casting furnace, are prepared into diameterSilver-colored cobalt alloy bar, the wherein content of cobalt are as follows: 0.5%-3.0%；
S5: it prepares silver alloy stick: the yellow gold stick prepared, Ag-Ce alloy stick, silver-colored cobalt alloy stick is placed under vacuum
Continuous casting furnace is drawn to obtain diameter using directional solidification continuous casting technologySilver alloy bar, wherein silver content be 99.99%-
99.4%, copper content 0.01%-0.6%, cerium content 0.0001%-0.0008%, cobalt content 0.0001%-0.0007%；
S6: silver alloy stick homogenizing annealing: after preparationSilver alloy stick be placed in heat-treatment furnace, temperature 1400
DEG C -1600 DEG C, soaking time 8h-20h, obtain inner alloy structure stability；
S7: rough to stretch: willElectrum stick be stretched to diameter
S8: crystal grain refinement annealing: by diameterSilver alloy wire is placed in heat-treatment furnace, and 600 DEG C -1100 DEG C of temperature,
Soaking time 1h-8h carries out alloy grain refinement heat treatment；
S9: middle stretching: by the diameter after heat treatmentSilver alloy wire is stretched to diameter
S10: thin to stretch: by diameterSilver alloy wire be stretched to diameter
S11: fine stretching: by diameterSilver alloy wire carry out fine stretching, be stretched to
DiameterBonding wire；
S12: plating nickel on surface: using special ultra-fine electroplating device, rightFine Silver alloy wire
The online nickel plating in surface, plating purity >=99.99% of nickel, take-up speed 20m-70m/min, current control is for 60-
120mA, voltage are controlled in 3-10V, and zinc coat thickness control is in 10-50nm；
S13: heat treatment: the silver alloy bonding wire of plating nickel on surface is placed in continuous annealing system, 300 DEG C -450 of temperature
DEG C, speed 40m-80m/min carries out continuous annealing treatment, during annealing, protects gas shielded using high pure nitrogen；
S14: by the micro-fine bonding wire monovolume scale after heat treatment.
Preferably, the S12 plating nickel on surface controls surface nickel content 1.0-1.8%.
Preferably, described S2, S3, S4 prepare microelement silver alloy, the content of control trace copper, cerium, cobalt.
Preferably, fine silver and yellow gold, Ag-Ce alloy, silver-colored cobalt alloy are carried out secondary cast by the S5, and preparation contains
The electrum stick of microelement, to obtain the electrum stick that elemental copper, cerium, cobalt material structure are more evenly distributed, and it is accurate
Control microelement copper content 0.01%-0.6%, cerium content 0.0001%-0.0008%, cobalt content 0.0001%-
0.0007%.
Preferably, the S6 and S8, by homogenizing annealing and brilliant material refinement annealing, with improve alloy plasticity and
Structure stability, and refine material grains further.
Preferably, the S12 is right using special ultra-fine electroplating deviceIt is fine silver close
Spun gold carries out ultra-fine plating, controls the tension stability of retractable cable, guarantees that ultrafine wire runs smoothly and do not break；Control electric current and electricity
The stability of pressure guarantees the adhesive force of coating and the uniformity of coating.
Compared with prior art, the invention has the benefit that
1) in the LED of middle and high end and IC package, spun gold occupies very big ratio, and the silver-based of this plating nickel on surface is bonded
The cost of silk is only that spun gold 1/8 greatly reduces packaging cost in part LED and IC package.
2) silver based bonding wire of the plating nickel on surface obtained using the method for the present invention, material is finer and close, and surface is smooth, and line style is cut
Face circularity is consistent.
3) other kinds of bonding wire easily occurs push-pull effort deficiency in bonding wire, and two solder joints plant ball is bad and a solder joint is sliding
The binding affinity defect such as ball.The silver based bonding wire material of this plating nickel on surface effectively overcomes drawbacks described above, and solder joint can be well
Eutectic, bonding performance can reach the performance requirement of bonding gold wire.
4) microfilament is directly electroplated using ultra-fine electroplating technology, the stability of silk thread operation is higher when plating, this makes
Coating material density is relatively high, and coating adhesion is strong, when bonding wire avoids sliding ball phenomenon, thus improvement bonding performance.
5) in white-light LED encapsulation, the silver based bonding wire advantage of plating nickel on surface be still it is prominent, the light of LED can be greatly enhanced
Brightness.
Detailed description of the invention
Fig. 1 is preparation method schematic flow diagram of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with specific embodiment, to this
Invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, not
For limiting the present invention.
Embodiment 1
A kind of silver-base alloy bonding wire of plating nickel on surface is coated with nickel on described matrix surface and protects using pure silver alloy as matrix
Sheath, wherein according to the percentage of weight, fine silver content 97.6%%, surface nickel content 1.0%%, microelement contains
Amount is 0.0002%%.Purity >=99.99% of silver.
The present invention also provides a kind of preparation methods of the silver-base alloy bonding wire of plating nickel on surface, include the following steps:
S1: the silver ingot of purity >=99.99% is chosen, is first cleaned with 10.0% sodium hydroxid of concentration, then rushed with deionized water
It washes, is put into baking oven and is dried for standby；
S2: it prepares yellow gold stick: 99.99% fine silver and high purity copper being placed in high purity graphite crucible, are placed in vacuum
Continuous casting furnace is pulled down, vacuumizes and is heated to 1000 DEG C, until completely melted, high pure nitrogen protection is filled, keeps the temperature 30min, pulled down
Continuous casting is oriented, diameter is obtainedYellow gold stick；
S3: Ag-Ce alloy stick: the same S2 of method is prepared；
S4: silver-colored cobalt alloy stick: the same S2 of method is prepared；
S5: it prepares silver-base alloy stick: a certain number of high-purity silver ingots is put into the black crucible of high-purity stone, be placed in vacuum drop-down and connect
It casts in furnace.Silver-bearing copper, silver-colored cerium, silver-colored cobalt alloy are put into the alloy funnel in vacuum drop-down continuous casting furnace according to the ratio.Vacuumize heating
Fine silver ingot is heated to 1000 DEG C, until completely melted, keeps the temperature 15min.Alloy funnel is opened, by silver-bearing copper, silver-colored cerium, silver-colored cobalt alloy
It pours into fine silver melt, fills high pure nitrogen and continue to be heated to 1100 DEG C, after temperature is stablized, refine 30min.Using directional solidification
Method, drop-down continuous casting obtain diameter and areSilver alloy stick；
S6: silver alloy stick homogenizing annealing: after preparationBillon stick be placed in heat-treatment furnace, temperature 1400
DEG C, soaking time 8h obtains inner alloy structure stability；
S7: rough to stretch: willElectrum stick rough extend to diameterAlloy wire；
S8: crystal grain refinement annealing: by diameterSilver alloy wire is placed in heat-treatment furnace, and 600 DEG C -1100 DEG C of temperature,
Soaking time 1h-8h carries out alloy grain refinement heat treatment；
S9: middle stretching: by the diameter after heat treatmentDiameter is stretched in silver alloy wire rodSilk；
S10: thin to stretch: by diameterSilver alloy wire be carefully stretched to diameter
Silk；
S11: fine stretching: by diameterSilver alloy wire carry out fine stretching, be stretched to
DiameterMicrofilament
S12: plating nickel on surface: special ultra-fine electroplating device is used, to the online nickel plating in billon microfilament surface.Nickel is used in plating
Purity >=99.99%, take-up speed 20m-70m/min, current control 60-120mA, voltage control in 3-10V, nickel plating
Layer thickness control is in 10-50nm；
S13: heat treatment: the silver alloy bonding wire of plating nickel on surface is placed in continuous annealing system, 300 DEG C -450 of temperature
DEG C, speed 40m-80m/min carries out continuous annealing treatment, during annealing, protects gas shielded using high pure nitrogen；
S14: after-combustion packing: by micro-fine bonding wire monovolume scale, controlling tension 0.8g-8.0g, described in monovolume 500m scale
Borneol is powdered after grinding, and powder mesh number is 800 mesh.
Embodiment 2
A kind of silver-base alloy bonding wire of plating nickel on surface is coated with nickel on described matrix surface and protects using pure silver alloy as matrix
Sheath, wherein according to the percentage of weight, fine silver content 97.6%-98.99%, surface nickel content 1.0%-1.8%,
Micronutrient levels is 0.0002%-0.0015%.Purity >=99.99% of silver.
The present invention also provides a kind of preparation methods of the silver-base alloy bonding wire of plating nickel on surface, include the following steps:
S1: the silver ingot of purity >=99.99% is chosen, is first cleaned with 15.0% sodium hydroxid of concentration, then rushed with deionized water
It washes, is put into baking oven and is dried for standby；
S2: it prepares yellow gold stick: 99.99% fine silver and high purity copper being placed in high purity graphite crucible, are placed in vacuum
Continuous casting furnace is pulled down, vacuumizes and is heated to 1200 DEG C, until completely melted, high pure nitrogen protection is filled, keeps the temperature 60min, pulled down
Continuous casting is oriented, diameter is obtainedYellow gold stick；
S3: Ag-Ce alloy stick: the same S2 of method is prepared；
S4: silver-colored cobalt alloy stick: the same S2 of method is prepared；
S5: it prepares silver-base alloy stick: a certain number of high-purity silver ingots is put into the black crucible of high-purity stone, be placed in vacuum drop-down and connect
It casts in furnace.Silver-bearing copper, silver-colored cerium, silver-colored cobalt alloy are put into the alloy funnel in vacuum drop-down continuous casting furnace according to the ratio.Vacuumize heating
Fine silver ingot is heated to 1100 DEG C, until completely melted, keeps the temperature 40min.Alloy funnel is opened, by silver-bearing copper, silver-colored cerium, silver-colored cobalt alloy
It pours into fine silver melt, fills high pure nitrogen and continue to be heated to 1250 DEG C, after temperature is stablized, refine 60min.Using directional solidification
Method, drop-down continuous casting obtain diameter and areSilver alloy stick；
S6: silver alloy stick homogenizing annealing: after preparationBillon stick be placed in heat-treatment furnace, temperature 1500
DEG C, soaking time 15h obtains inner alloy structure stability；
S7: rough to stretch: willElectrum stick rough extend to diameterAlloy wire；
S8: crystal grain refinement annealing: by diameterSilver alloy wire is placed in heat-treatment furnace, and 900 DEG C of temperature, soaking time
6h carries out alloy grain refinement heat treatment；
S9: middle stretching: by the diameter after heat treatmentDiameter is stretched in silver alloy wire rodSilk；
S10: thin to stretch: by diameterSilver alloy wire be carefully stretched to diameterSilk；
S11: fine stretching: by diameterSilver alloy wire carry out fine stretching, be stretched to diameterMicrofilament
S12: plating nickel on surface: special ultra-fine electroplating device is used, to the online nickel plating in billon microfilament surface.Nickel is used in plating
Purity >=99.99%, take-up speed 50m/min, current control 80mA, voltage control is in 7V, nickel plating layer thick control
In 30nm；
S13: heat treatment: the silver alloy bonding wire of plating nickel on surface is placed in continuous annealing system, 400 DEG C of temperature, speed
70m/min carries out continuous annealing treatment, during annealing, protects gas shielded using high pure nitrogen；
S14: after-combustion packing: by micro-fine bonding wire monovolume scale, controlling tension 6.0g, and borneol described in monovolume 500m scale is
It is powdered after grinding, and powder mesh number is 800 mesh.
Embodiment 3
A kind of silver-base alloy bonding wire of plating nickel on surface is coated with nickel on described matrix surface and protects using pure silver alloy as matrix
Sheath, wherein according to the percentage of weight, fine silver content 98.99%, surface nickel content 1.8%, micronutrient levels is
0.0002%-0.0015%.Purity >=99.99% of silver.
The present invention also provides a kind of preparation methods of the silver-base alloy bonding wire of plating nickel on surface, include the following steps:
S1: the silver ingot of purity >=99.99% is chosen, is first cleaned with 25.0% sodium hydroxid of concentration, then rushed with deionized water
It washes, is put into baking oven and is dried for standby；
S2: it prepares yellow gold stick: 99.99% fine silver and high purity copper being placed in high purity graphite crucible, are placed in vacuum
Continuous casting furnace is pulled down, vacuumizes and is heated to 1300 DEG C, until completely melted, high pure nitrogen protection is filled, keeps the temperature 90min, pulled down
Continuous casting is oriented, diameter is obtainedYellow gold stick；
S3: Ag-Ce alloy stick: the same S2 of method is prepared；
S4: silver-colored cobalt alloy stick: the same S2 of method is prepared；
S5: it prepares silver-base alloy stick: a certain number of high-purity silver ingots is put into the black crucible of high-purity stone, be placed in vacuum drop-down and connect
It casts in furnace.Silver-bearing copper, silver-colored cerium, silver-colored cobalt alloy are put into the alloy funnel in vacuum drop-down continuous casting furnace according to the ratio.Vacuumize heating
Fine silver ingot is heated to 1200 DEG C, until completely melted, keeps the temperature 60min.Alloy funnel is opened, by silver-bearing copper, silver-colored cerium, silver-colored cobalt alloy
It pours into fine silver melt, fills high pure nitrogen and continue to be heated to 1350 DEG C, after temperature is stablized, refine 90min.Using directional solidification
Method, drop-down continuous casting obtain diameter and areSilver alloy stick；
S6: silver alloy stick homogenizing annealing: after preparationBillon stick be placed in heat-treatment furnace, temperature 1600
DEG C, soaking time 20h obtains inner alloy structure stability；
S7: rough to stretch: willElectrum stick rough extend to diameterAlloy wire；
S8: crystal grain refinement annealing: by diameterSilver alloy wire is placed in heat-treatment furnace, and 1100 DEG C of temperature, when heat preservation
Between 8h, carry out alloy grain refinement heat treatment；
S9: middle stretching: by the diameter after heat treatmentDiameter is stretched in silver alloy wire rodSilk；
S10: thin to stretch: by diameterSilver alloy wire be carefully stretched to diameterSilk；
S11: fine stretching: by diameterSilver alloy wire carry out fine stretching, be stretched to diameterMicrofilament
S12: plating nickel on surface: special ultra-fine electroplating device is used, to the online nickel plating in billon microfilament surface.Nickel is used in plating
Purity >=99.99%, take-up speed 70m/min, current control 120mA, voltage control in 10V, nickel plating layer thick control
System is in 50nm；
S13: heat treatment: the silver alloy bonding wire of plating nickel on surface is placed in continuous annealing system, 450 DEG C of temperature, speed
80m/min carries out continuous annealing treatment, during annealing, protects gas shielded using high pure nitrogen；
S14: after-combustion packing: by micro-fine bonding wire monovolume scale, controlling tension 8.0g, and borneol described in monovolume 500m scale is
It is powdered after grinding, and powder mesh number is 800 mesh.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (8)
1. a kind of silver-base alloy bonding wire of plating nickel on surface, it is characterised in that: using pure silver alloy as matrix, on described matrix surface
It is coated with nickel protection layer, wherein according to the percentage of weight, fine silver content 97.6%-98.99%, surface nickel content is
1.0%-1.8%, micronutrient levels 0.0002%-0.0015%.
2. a kind of silver-base alloy bonding wire of plating nickel on surface according to claim 1, it is characterised in that: silver-colored purity >=
99.99%.
3. a kind of preparation method of the silver-base alloy bonding wire of plating nickel on surface described in claim 1, it is characterised in that: including such as
Lower step:
S1: the copper billet cleaning of the silver ingot and purity >=99.999% of purity >=99.99% is dried for standby；
S2: it prepares yellow gold stick: fine silver and fine copper being placed in vacuum drop-down continuous casting furnace, are prepared into diameter Silver-bearing copper close
Golden bar, the wherein content of copper are as follows: 5.0%-10.0%；
S3: it prepares Ag-Ce alloy stick: fine silver and microelement cerium being placed in vacuum drop-down continuous casting furnace, are prepared into diameter's
Ag-Ce alloy bar, the wherein content of cerium are as follows: 0.5%-3.0%；
S4: it prepares silver-colored cobalt alloy stick: fine silver and trace element cobalt being placed in vacuum drop-down continuous casting furnace, are prepared into diameter's
Silver-colored cobalt alloy bar, the wherein content of cobalt are as follows: 0.5%-3.0%；
S5: it prepares silver alloy stick: by the yellow gold stick prepared, Ag-Ce alloy stick, silver-colored cobalt alloy stick, being placed in vacuum drop-down and connect
It casts furnace and diameter is obtained using directional solidification continuous casting technologySilver alloy bar, wherein silver content be 99.99%-
99.4%, copper content 0.01%-0.6%, cerium content 0.0001%-0.0008%, cobalt content 0.0001%-0.0007%；
S6: silver alloy stick homogenizing annealing: after preparationSilver alloy stick be placed in heat-treatment furnace, 1400 DEG C of temperature-
1600 DEG C, soaking time 8h-20h, obtain inner alloy
Structure stability；
S7: rough to stretch: willElectrum stick be stretched to diameter
S8: crystal grain refinement annealing: by diameterSilver alloy wire is placed in heat-treatment furnace, and 600 DEG C -1100 DEG C of temperature, heat preservation
Time 1h-8h carries out alloy grain refinement heat treatment；
S9: middle stretching: by the diameter after heat treatmentSilver alloy wire is stretched to diameter
S10: thin to stretch: by diameterSilver alloy wire be stretched to diameter
S11: fine stretching: by diameterSilver alloy wire carry out fine stretching, be stretched to diameterBonding wire；
S12: plating nickel on surface: using special ultra-fine electroplating device, rightFine Silver alloy wire surface
Online nickel plating, plating purity >=99.99% of nickel, take-up speed 20m-70m/min, current control for 60-120mA,
Voltage is controlled in 3-10V, and zinc coat thickness control is in 10-50nm；
S13: heat treatment: the silver alloy bonding wire of plating nickel on surface being placed in continuous annealing system, 300 DEG C -450 DEG C of temperature, speed
It spends 40m-80m/min and carries out continuous annealing treatment, during annealing, gas shielded is protected using high pure nitrogen；
S14: by the micro-fine bonding wire monovolume scale after heat treatment.
4. the preparation method of the silver-base alloy bonding wire of plating nickel on surface according to claim 3, it is characterised in that: described
S12 plating nickel on surface controls surface nickel content 1.0-1.8%.
5. the preparation method of the silver-base alloy bonding wire of plating nickel on surface according to claim 3, it is characterised in that: described
S2, S3, S4 prepare microelement silver alloy, the content of control trace copper, cerium, cobalt.
6. the preparation method of the silver-base alloy bonding wire of plating nickel on surface according to claim 3, it is characterised in that: described
Fine silver and yellow gold, Ag-Ce alloy, silver-colored cobalt alloy are carried out secondary cast, prepare the electrum containing microelement by S5
Stick to obtain the electrum stick that elemental copper, cerium, cobalt material structure are more evenly distributed, and accurately controls microelement copper content
0.01%-0.6%, cerium content 0.0001%-0.0008%, cobalt content 0.0001%-0.0007%.
7. the preparation method of the silver-base alloy bonding wire of plating nickel on surface according to claim 3, it is characterised in that: the S6
And S8 to improve the plasticity and structure stability of alloy, and keeps material brilliant by homogenizing annealing and brilliant material refinement annealing
Grain further refinement.
8. the preparation method of the silver-base alloy bonding wire of plating nickel on surface according to claim 3, it is characterised in that: described
S12 is right using special ultra-fine electroplating deviceFine Silver alloy wire carry out ultra-fine plating, control
The tension stability of retractable cable processed guarantees that ultrafine wire runs smoothly and does not break；The stability of electric current and voltage is controlled, guarantees coating
Adhesive force and coating uniformity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810782124.8A CN108962859A (en) | 2018-07-17 | 2018-07-17 | A kind of silver-base alloy bonding wire of plating nickel on surface and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810782124.8A CN108962859A (en) | 2018-07-17 | 2018-07-17 | A kind of silver-base alloy bonding wire of plating nickel on surface and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108962859A true CN108962859A (en) | 2018-12-07 |
Family
ID=64481481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810782124.8A Pending CN108962859A (en) | 2018-07-17 | 2018-07-17 | A kind of silver-base alloy bonding wire of plating nickel on surface and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108962859A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111041419A (en) * | 2019-12-25 | 2020-04-21 | 江苏金蚕电子科技有限公司 | Preparation method of gold-silver alloy wire |
| CN118166406A (en) * | 2024-05-13 | 2024-06-11 | 烟台一诺电子材料有限公司 | Preparation method of nickel-silver plated bonding wire |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474408A (en) * | 2013-09-26 | 2013-12-25 | 辽宁凯立尔电子科技有限公司 | Gold and silver alloy bonding wire with gold-plated layer on surface and preparation method thereof |
| CN104465587A (en) * | 2014-12-04 | 2015-03-25 | 安徽华晶微电子材料科技有限公司 | Super-fine nickel-clad copper alloy wire and manufacturing method thereof |
| CN104716250A (en) * | 2015-03-02 | 2015-06-17 | 安徽华晶微电子材料科技有限公司 | Extremely fine gold free silver alloy gold-plating bonding wire and manufacture method thereof |
| JP2018064050A (en) * | 2016-10-14 | 2018-04-19 | 田中電子工業株式会社 | Copper alloy wire for ball bonding |
-
2018
- 2018-07-17 CN CN201810782124.8A patent/CN108962859A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474408A (en) * | 2013-09-26 | 2013-12-25 | 辽宁凯立尔电子科技有限公司 | Gold and silver alloy bonding wire with gold-plated layer on surface and preparation method thereof |
| CN104465587A (en) * | 2014-12-04 | 2015-03-25 | 安徽华晶微电子材料科技有限公司 | Super-fine nickel-clad copper alloy wire and manufacturing method thereof |
| CN104716250A (en) * | 2015-03-02 | 2015-06-17 | 安徽华晶微电子材料科技有限公司 | Extremely fine gold free silver alloy gold-plating bonding wire and manufacture method thereof |
| JP2018064050A (en) * | 2016-10-14 | 2018-04-19 | 田中電子工業株式会社 | Copper alloy wire for ball bonding |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111041419A (en) * | 2019-12-25 | 2020-04-21 | 江苏金蚕电子科技有限公司 | Preparation method of gold-silver alloy wire |
| CN118166406A (en) * | 2024-05-13 | 2024-06-11 | 烟台一诺电子材料有限公司 | Preparation method of nickel-silver plated bonding wire |
| CN118166406B (en) * | 2024-05-13 | 2024-07-16 | 烟台一诺电子材料有限公司 | Preparation method of nickel-silver plated bonding wire |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103474408B (en) | A kind of surface electrum bonding wire having Gold plated Layer and preparation method thereof | |
| CN106992164B (en) | A kind of microelectronics Packaging copper alloy monocrystal bonding wire and preparation method thereof | |
| CN103194637B (en) | Bonding alloy filamentary silver and preparation method thereof | |
| CN106011516B (en) | One kind doping billon bonding wire and its subzero treatment preparation method | |
| CN107799496A (en) | A kind of high reliability copper alloy bonding wire used for electronic packaging and preparation method thereof | |
| CN103199073B (en) | Silver palladium alloy single crystal bonding wire and manufacture method thereof | |
| CN102776405A (en) | Preparation method of bonded gold-silver alloy wire | |
| CN106486450B (en) | Ball bonding is coated copper wire with palladium | |
| CN109266874B (en) | The preparation method of one Albatra metal bonding wire | |
| CN108962859A (en) | A kind of silver-base alloy bonding wire of plating nickel on surface and preparation method thereof | |
| CN104835797B (en) | A kind of copper palladium-silver bonding wire and preparation method thereof | |
| CN105132735A (en) | Ultra-thin copper alloy bonding wire for microelectronic packaging and preparing method of ultra-thin copper alloy bonding wire | |
| CN109767991A (en) | A kind of preparation method of high gold-content alloy bonding wire | |
| CN104377185A (en) | Gold-plated palladium-silver alloy single crystal bonding wire and manufacturing method thereof | |
| CN103779309A (en) | Gold-plating gold and silver palladium alloy single-crystal bonding filament and manufacturing method thereof | |
| JPS6254048A (en) | Copper alloy for lead frame | |
| CN106811617A (en) | A kind of preparation method for being bonded electrum | |
| CN103199072A (en) | Gold-plated palladium-copper single-crystal bonding wire and manufacturing method thereof | |
| CN110066938A (en) | A kind of wire for microencapsulated | |
| CN109473413A (en) | Oxidation resistant copper-based bonding wire of one kind and preparation method thereof | |
| KR101912983B1 (en) | Ag-Au ALLOY BONDING WIRE | |
| CN104022095A (en) | Gold-plated silver lanthanum calcium alloy bonding wire and manufacture method thereof | |
| CN104294359A (en) | Monocrystal copper gold-plated composite bonding wire and preparation method thereof | |
| CN104218012A (en) | Metal bonding wire and manufacturing method thereof | |
| CN105489506A (en) | Chip frame with high bonding wire quality and manufacturing method of chip frame |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181207 |
|
| RJ01 | Rejection of invention patent application after publication |