CN111029243A - 基板清洗方法、基板清洗装置、基板处理装置、基板处理系统及机器学习器 - Google Patents

基板清洗方法、基板清洗装置、基板处理装置、基板处理系统及机器学习器 Download PDF

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Publication number
CN111029243A
CN111029243A CN201910953017.1A CN201910953017A CN111029243A CN 111029243 A CN111029243 A CN 111029243A CN 201910953017 A CN201910953017 A CN 201910953017A CN 111029243 A CN111029243 A CN 111029243A
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CN
China
Prior art keywords
substrate
cleaning
cleaning tool
atomic force
force microscope
Prior art date
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Withdrawn
Application number
CN201910953017.1A
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English (en)
Chinese (zh)
Inventor
嶋昇平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN111029243A publication Critical patent/CN111029243A/zh
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y35/00—Methods or apparatus for measurement or analysis of nanostructures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/30—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q10/00—Scanning or positioning arrangements, i.e. arrangements for actively controlling the movement or position of the probe
    • G01Q10/04—Fine scanning or positioning
    • G01Q10/06—Circuits or algorithms therefor
    • G01Q10/065—Feedback mechanisms, i.e. wherein the signal for driving the probe is modified by a signal coming from the probe itself
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q30/00—Auxiliary means serving to assist or improve the scanning probe techniques or apparatus, e.g. display or data processing devices
    • G01Q30/04—Display or data processing devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q60/00—Particular types of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
    • G01Q60/24—AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes
    • G01Q60/38—Probes, their manufacture, or their related instrumentation, e.g. holders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Radiology & Medical Imaging (AREA)
  • Nanotechnology (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201910953017.1A 2018-10-10 2019-10-09 基板清洗方法、基板清洗装置、基板处理装置、基板处理系统及机器学习器 Withdrawn CN111029243A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018191930A JP2020061469A (ja) 2018-10-10 2018-10-10 基板洗浄方法、基板洗浄装置、基板処理装置、基板処理システム、および機械学習器
JP2018-191930 2018-10-10

Publications (1)

Publication Number Publication Date
CN111029243A true CN111029243A (zh) 2020-04-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910953017.1A Withdrawn CN111029243A (zh) 2018-10-10 2019-10-09 基板清洗方法、基板清洗装置、基板处理装置、基板处理系统及机器学习器

Country Status (3)

Country Link
US (1) US20200116480A1 (https=)
JP (1) JP2020061469A (https=)
CN (1) CN111029243A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112992733A (zh) * 2021-02-08 2021-06-18 江苏亚电科技有限公司 一种用于晶圆加工的刷洗装置
CN114659456A (zh) * 2020-12-23 2022-06-24 中国科学院微电子研究所 一种软刷辊轴间距检测装置、调整系统及方法
CN118427784A (zh) * 2024-07-02 2024-08-02 深圳市林科超声波洗净设备有限公司 一种超声波清洗机运行多维度监测预警方法
US12358028B2 (en) 2020-12-16 2025-07-15 Ebara Corporation Cleaning apparatus for cleaning member, cleaning method for cleaning member, and substrate cleaning method
TWI906671B (zh) * 2022-10-27 2025-12-01 日商斯庫林集團股份有限公司 基板處理方法及基板處理裝置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7426898B2 (ja) * 2020-05-14 2024-02-02 アルバック成膜株式会社 洗浄体、洗浄装置および洗浄方法
JP7753124B2 (ja) * 2022-02-04 2025-10-14 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
JP7763140B2 (ja) * 2022-03-30 2025-10-31 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
JP2024034806A (ja) * 2022-09-01 2024-03-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及びブラシの脱落検知方法
JP2024090296A (ja) * 2022-12-22 2024-07-04 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
TW202544876A (zh) * 2023-11-06 2025-11-16 日商東京威力科創股份有限公司 資訊處理方法、資訊處理裝置及電腦程式
TWI904929B (zh) * 2024-02-20 2025-11-11 日商斯庫林集團股份有限公司 基板處理裝置以及基板處理方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12358028B2 (en) 2020-12-16 2025-07-15 Ebara Corporation Cleaning apparatus for cleaning member, cleaning method for cleaning member, and substrate cleaning method
TWI908945B (zh) * 2020-12-16 2025-12-21 日商荏原製作所股份有限公司 清洗構件用清洗裝置、清洗構件之清洗方法及基板清洗方法
CN114659456A (zh) * 2020-12-23 2022-06-24 中国科学院微电子研究所 一种软刷辊轴间距检测装置、调整系统及方法
CN114659456B (zh) * 2020-12-23 2024-06-18 中国科学院微电子研究所 一种软刷辊轴间距检测装置、调整系统及方法
CN112992733A (zh) * 2021-02-08 2021-06-18 江苏亚电科技有限公司 一种用于晶圆加工的刷洗装置
TWI906671B (zh) * 2022-10-27 2025-12-01 日商斯庫林集團股份有限公司 基板處理方法及基板處理裝置
CN118427784A (zh) * 2024-07-02 2024-08-02 深圳市林科超声波洗净设备有限公司 一种超声波清洗机运行多维度监测预警方法
CN118427784B (zh) * 2024-07-02 2024-10-25 深圳市林科超声波洗净设备有限公司 一种超声波清洗机运行多维度监测预警方法

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JP2020061469A (ja) 2020-04-16

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Application publication date: 20200417