CN111001539A - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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Publication number
CN111001539A
CN111001539A CN201910909737.8A CN201910909737A CN111001539A CN 111001539 A CN111001539 A CN 111001539A CN 201910909737 A CN201910909737 A CN 201910909737A CN 111001539 A CN111001539 A CN 111001539A
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China
Prior art keywords
substrate
section
height
coating
holding
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CN201910909737.8A
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Chinese (zh)
Inventor
筱崎贤哉
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/06—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying two different liquids or other fluent materials, or the same liquid or other fluent material twice, to the same side of the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The invention provides a substrate processing apparatus and a substrate processing method. The substrate processing apparatus of an embodiment includes a holding section, a conveying section, an adjusting section, a coating section, and a control section. The holding portion has a plurality of suction pads for sucking the lower surface of the substrate and holding the substrate. The conveying section conveys the holding section in a conveying direction. The adjusting portion adjusts the inclination of the holding portion. The coating section applies the treatment liquid to the substrate. The control section controls the inclination of the holding section directly below the coating section by the adjusting section. The present invention enables uniform formation of a coating film.

Description

Substrate processing apparatus and substrate processing method
Technical Field
The present invention relates to a substrate processing apparatus and a substrate processing method.
Background
Patent document 1 discloses a technique for forming a coating film on a substrate while floating and transporting the substrate by using the pressure of a gas.
Documents of the prior art
Patent document
Patent document 1: japanese patent No. 5570464
Disclosure of Invention
Technical problem to be solved by the invention
The invention provides a technique for uniformly forming a coating film.
Technical solution for solving technical problem
A substrate processing apparatus according to an embodiment of the present invention includes a holding unit, a conveying unit, an adjusting unit, a coating unit, and a control unit. The holding portion has a plurality of suction pads for sucking the lower surface of the substrate and holding the substrate. The conveying section conveys the holding section in a conveying direction. The adjusting portion adjusts the inclination of the holding portion. The coating section applies the treatment liquid to the substrate. The control section controls the inclination of the holding section directly below the coating section by the adjusting section.
Effects of the invention
According to the present invention, a coating film can be formed uniformly.
Drawings
Fig. 1 is a schematic plan view of a part of a substrate processing apparatus according to an embodiment.
Fig. 2 is a schematic side view showing a transport section of the substrate processing apparatus according to the embodiment.
Fig. 3 is a diagrammatic view of section III-III of fig. 1.
Fig. 4 is a block diagram showing a configuration of a control device according to an embodiment.
Fig. 5 is a flowchart illustrating the height adjustment process of the embodiment.
Fig. 6 is a flowchart illustrating substrate processing in the second coating section of the embodiment.
Fig. 7 is a diagram showing an example of the height of the substrate immediately below the second coating section in the embodiment and the comparative example.
Fig. 8 is a plan view showing a part of a substrate processing apparatus according to a modification.
Description of the reference numerals
1 substrate processing apparatus
2 coating part
2A first coating part (predetermined coating part)
2B second coating section (Another coating section)
4 holding part
5 conveying part
6 regulating part
7 bed height regulating part
8 detection sensor
9 control device
41 adsorption pad
61 lifting actuator
92 control part
93 a storage section.
Detailed Description
Hereinafter, embodiments of a substrate processing apparatus and a substrate processing method according to the present disclosure will be described in detail with reference to the drawings. Further, the substrate processing apparatus and the substrate processing method disclosed by the embodiments shown below are not limited.
In the drawings referred to below, a rectangular coordinate system is given in which the X-axis direction, the Y-axis direction, and the Z-axis direction are defined to be orthogonal to each other and the positive Z-axis direction is set to be a vertical upward direction for ease of understanding of the description.
Here, the front-rear direction is defined with the positive Y-axis direction as the front and the negative Y-axis direction as the rear, and the left-right direction is defined with the negative X-axis direction as the right and the positive X-axis direction as the left. In addition, the vertical direction is defined with the positive Z-axis direction as the upper side and the negative Z-axis direction as the lower side. The substrate processing apparatus processes a substrate while conveying the substrate from the rear to the front in the front-rear direction. That is, the substrate processing apparatus performs processing while conveying the substrate in the conveying direction, which is the direction from the rear to the front.
< overall construction >
Referring to fig. 1 to 3, a substrate processing apparatus 1 according to an embodiment is described. Fig. 1 is a schematic plan view showing a part of a substrate processing apparatus 1 according to an embodiment. Fig. 2 is a schematic side view showing the transport unit 5 of the substrate processing apparatus 1 according to the embodiment. Fig. 3 is a diagrammatic view of section III-III of fig. 1.
The substrate processing apparatus 1 includes a plurality of coating units 2, a floating table 3, a pair of holding units 4, a pair of conveying units 5, a pair of adjusting units 6, a plurality of pad height adjusting units 7, a pair of detection sensors 8, and a control device 9. The substrate processing apparatus 1 applies a resist solution as a processing liquid to, for example, a glass substrate S for an LCD (liquid crystal display) (hereinafter referred to as "substrate S").
Here, although an example of 2 coating units 2 including the first coating unit 2A and the second coating unit 2B as the plurality of coating units 2 is described, the number of coating units 2 is not limited to 2, and may be 3 or more.
The first coating section 2A and the second coating section 2B are arranged in the order of the first coating section 2A and the second coating section 2B along the transport direction of the substrate S, i.e., from the rear to the front.
The first application portion 2A extends in the left-right direction. The first application section 2A is attached to a gate-shaped support member 12A. The first coating section 2A applies a resist solution (an example of a processing liquid) to the substrate S to form a resist film as a coating film on the substrate S. Further, the adhesion state of the resist liquid in the discharge ports of the first coating section 2A can be made uniform by a starting section (not shown) movable in the front-rear direction with respect to the first coating section 2A. This stabilizes the discharge state of the resist solution by the first coating section 2A.
The second application portion 2B extends in the left-right direction. The second application section 2B is attached to a gate-shaped support member 12B. The second coating section 2B coats the substrate S with a resist solution (an example of a processing liquid) to form a resist film on the substrate S. Similarly to the first coating section 2A, the second coating section 2B can stabilize the discharge state of the resist liquid by a priming section (not shown).
The substrate processing apparatus 1 can alternately apply the resist solution to the substrate S by the first application section 2A and the second application section 2B, for example. Thus, the substrate processing apparatus 1 can apply the resist liquid to the substrate S by the other coating section 2 while the discharge state of the resist liquid is stabilized by the start section for the one coating section 2.
The upper floating platform 3 includes a first upper floating platform 3A, a second upper floating platform 3B, a third upper floating platform 3C, a fourth upper floating platform 3D, and a fifth upper floating platform 3E.
The respective upper stages 3A to 3E are arranged in the order of a first upper stage 3A, a second upper stage 3B, a third upper stage 3C, a fourth upper stage 3D, and a fifth upper stage 3E in the conveying direction of the substrate S, i.e., from the rear to the front. The respective floating platforms 3A to 3E are disposed on the mount 13.
The first upper deck 3A has a plurality of discharge ports (not shown). The first upper floating table 3A blows compressed air from the discharge port toward the lower surface of the substrate S, and applies a force acting upward (hereinafter referred to as "upward buoyancy") to the substrate S. The first upper floating platform 3A adjusts the floating height of the substrate S held by the holding portion 4 by applying buoyancy. Specifically, the first upper floating stage 3A is adjusted so that the floating height of the substrate S is stabilized within a range of 200 to 2000 μm.
The second upper float stage 3B is disposed below the first coating section 2A. The second upper deck 3B has a plurality of discharge ports (not shown) and a plurality of suction ports (not shown). The second upper floating table 3B blows compressed air from the discharge port toward the lower surface of the substrate S, and applies a buoyancy to the substrate S. In addition, the second upper floating stage 3B sucks air existing between it and the substrate S from the suction port. Thereby, the second upper floating stage 3B can adjust the floating height of the substrate S with high accuracy. Specifically, the second upper floating stage 3B is adjusted so that the floating height of the substrate S is stabilized within a range of 30 to 60 μm.
The third upper deck 3C and the fifth upper deck 3E have the same configuration as the first upper deck 3A, and detailed description thereof is omitted. The fourth upper deck 3D is disposed below the second coating section 2B. The fourth upper deck 3D has the same configuration as the second upper deck 3B, and detailed description thereof is omitted.
The pair of holding portions 4 is arranged in the left-right direction. The holding portion 4 is provided so as to sandwich the upper deck 3 in the left-right direction. The holding section 4 includes a pad support member 40, a plurality of suction pads 41, and a plurality of dummy pads 42.
The pad supporting member 40 is a plate-shaped or rod-shaped member extending in the front-rear direction, and is formed to be deformable in the up-down direction. The pad support member 40 is provided with a suction pad 41 on the side surface of the upper deck 3. Further, a dummy pad 42 is attached to the pad support member 40 on the side opposite to the upper deck 3 side.
The pad supporting member 40 is connected to the guide member 51 of the conveying unit 5 via the substantially L-shaped engaging member 14, the pad height adjusting unit 7, and the elevation supporting member 60 of the adjusting unit 6. The plurality of engaging members 14 are connected to the lower end of the pad supporting member 40 in a front-rear direction.
The height of the pad supporting member 40 in the vertical direction can be changed by the adjusting portion 6. Further, the inclination of the pad supporting member 40 in the front-rear direction can be changed by the adjusting portion 6. Further, the height of the pad supporting member 40 in the vicinity of each pad height adjusting portion 7 can be changed by each pad height adjusting portion 7.
The suction pads 41 are arranged in the front-rear direction. Here, an example is given in which 6 adsorption pads 41 are arranged in a front-rear direction, but the number of adsorption pads 41 is not limited to this. The suction pads 41 are attached to the pad support member 40 to have the same height. The adsorption pad 41 has a plurality of adsorption ports formed on the upper surface side. The adsorption pad 41 adsorbs the lower surface of the substrate S through the adsorption port.
The dummy pads 42 are arranged in the front-rear direction. Here, an example is given in which 6 dummy pads 42 are arranged in the front-rear direction, but the number of dummy pads 42 is not limited to this. For example, the dummy pad 42 is attached to the pad supporting member 40 at the same position and height in the front-rear direction as the suction pad 41.
As described above, the holding portion 4 has the plurality of suction pads 41 that suck the lower surface of the substrate S, and holds the substrate S. The holding portion 4 is moved in the vertical direction by the adjusting portion 6, and the height can be changed. The holding portion 4 can be tilted with respect to the front-rear direction by the adjusting portion 6, and the height of the substrate S can be changed by changing the tilt of the substrate S. Further, the height of the holding portion 4 in the vicinity of each of the engaging members 14 can be individually adjusted by each of the pad height adjusting portions 7.
The conveying units 5 are provided in a pair aligned in the left-right direction. The conveyance unit 5 is provided so as to sandwich the upper deck 3 in the left-right direction. The conveying unit 5 moves on a guide rail 15 provided in the front-rear direction, and conveys the holding unit 4 in the conveying direction. The guide rail 15 is provided on the mount 13. The conveying unit 5 is moved in the front-rear direction along the guide rail 15 by a driving mechanism (not shown) such as a motor.
The conveying section 5 includes a slider 50 and a plurality of guide members 51. The slider 50 is formed in a gate shape, for example, and is slidable with respect to the guide rail 15.
The guide member 51 is attached to the upper end of the slider 50 and extends in the vertical direction. The guide members 51 are provided in the front-rear direction, for example, 2. The guide member 51 may be 1 plate-like member extending in the front-rear direction, or 3 or more. The guide member 51 vertically movably supports the elevating support member 60 of the adjusting section 6. Further, the guide member 51 tiltably supports the elevation supporting member 60.
The adjustment portions 6 are provided in a pair aligned in the left-right direction. The adjustment unit 6 is provided so as to sandwich the upper deck 3 in the left-right direction. The adjusting portion 6 adjusts the height of the holding portion 4 in the vertical direction. The adjusting unit 6 raises the holding unit 4 when the substrate S is transferred between the holding unit 4 and a transport device (not shown). Further, the adjusting portion 6 adjusts the inclination of the holding portion 4 with respect to the front-rear direction. The adjusting section 6 can adjust, for example, the height of the substrate S directly below the second coating section 2B by adjusting the inclination of the holding section 4.
The adjusting section 6 includes a lift supporting member 60 and 2 lift actuators 61. The elevation support member 60 is a plate-like member extending in the front-rear direction. The elevation support member 60 is supported by the guide member 51 of the conveying unit 5 in an elevatable and tiltable manner.
The lift actuators 61 are provided in 2 pieces in a row in the front-rear direction. The lift actuator 61 is constituted by, for example, a ball screw mechanism, a motor, and the like. The elevation actuator 61 adjusts the height of the elevation supporting member 60 with respect to the guide member 51 of the conveyance section 5.
Each lift actuator 61 is capable of adjusting the height of the lift support member 60 relative to the guide member 51. Therefore, the adjusting portion 6 can adjust the inclination of the holding portion 4 with respect to the front-rear direction. The lift actuator 61 may be changed with a lower accuracy than the pad height adjusting unit 7 described later, for example, with an accuracy of several meters.
The pad height adjusting portions 7 are arranged in a front-rear direction. In fig. 1 and 2, an example is given in which 4 pad height adjusting portions 7 are arranged in a row in the front-rear direction, but the number of pad height adjusting portions 7 is not limited to this.
The pad height adjusting section 7 is constituted by, for example, a vertical precision stage. In the pad height adjusting section 7, the height of the engaging member 14 with respect to the elevation supporting member 60 is changed by rotating a rotary manual knob with a tool or the like.
The pad height adjusting portions 7 can adjust the heights of the pad support member 40, i.e., the suction pad 41 and the dummy pad 42, and the substrate S in the vicinity of the pad height adjusting portions 7 via the bonding members 14, respectively. The pad height adjusting section 7 can change the height of the adsorption pad 41 and the like with accuracy of several μm or less.
A pair of detection sensors 8 is provided in a left-right direction. The detection sensor 8 is provided so as to sandwich the second application section 2B in the left-right direction. The detection sensor 8 is attached to a support member 12B in which the second application section 2B is installed.
The detection sensor 8 is, for example, an optical distance sensor, and the detection sensor 8 detects the height of the dummy pad 42 attached to the pad support member. By detecting the height of the dummy pad 42 with the detection sensor 8, the height of the suction pad 41 corresponding to the dummy pad 42 in the left-right direction, that is, the height of the substrate S can be detected. That is, the detection sensor 8 detects the height of the substrate S directly below the second coating portion 2B (an example of a coating portion).
In the substrate processing apparatus 1 of the embodiment, the heights of the plurality of suction pads 41 are adjusted by the plurality of pad height adjusting sections 7 so that the height of the substrate S directly below the first coating section 2A (an example of a predetermined coating section) is within a predetermined range. The predetermined range is a range between a preset lower limit height and an upper limit height.
In the substrate processing apparatus 1, the controller 9 controls the lift actuator 61 so that the height of the substrate S held by the holding unit 4 whose height of the super suction pad 41 has been adjusted falls within a predetermined range also directly below the second coating unit 2B. Specifically, the substrate processing apparatus 1 controls the inclination of the holding section 4 directly below the second coating section 2B.
The control device 9 controls the transport unit 5, the first coating unit 2A, and the like in order to perform various functions in the substrate processing apparatus 1.
Here, the function of the control device 9 for performing the process of adjusting the height of the substrate S directly below the second coating section 2B will be described, and the function of performing the other processes will be omitted.
The control device 9 of the embodiment will be described with reference to fig. 4. Fig. 4 is a block diagram showing the configuration of the control device 9 according to the embodiment.
The control device 9 includes an input section 90, an output section 91, a control section 92, and a storage section 93. The input section 90 is inputted with a signal regarding the height of the dummy pad 42 from the detection sensor 8. The output unit 91 outputs a signal for controlling each lift actuator 61.
The control Unit 92 includes, for example, a microcomputer having a CPU (Central Processing Unit), a ROM (read only Memory), a RAM (Random Access Memory), an input/output port, and various circuits.
The control unit 92 includes a plurality of processing units that function by the CPU using the RAM as an operation area and executing a program stored in the ROM. Specifically, the control unit 92 includes an adjustment amount calculation unit 95 and a control signal generation unit 96.
The program may be stored in a computer-readable recording medium, or may be installed from the recording medium to the storage unit 93 of the control device 9. Examples of the computer-readable storage medium include a Hard Disk (HD), a Flexible Disk (FD), an optical disk (CD), a magneto-optical disk (MO), and a memory card. A part or all of each processing unit included in the control unit 92 may be configured by hardware such as an ASIC (Application Specific Integrated Circuit) or an FPGA (field programmable Gate Array).
The adjustment amount calculation unit 95 calculates an adjustment amount of the lift actuator 61 for setting the height of the substrate S within a predetermined range immediately below the second coating unit 2B.
Specifically, when the substrate S reaches the position directly below the second coating section 2B, the adjustment amount calculation section 95 generates data that correlates the position of the substrate S with the height of the substrate S directly below the second coating section 2B. Further, the height of the substrate S can be calculated based on the height of the dummy pad 42 detected by the detection sensor 8.
The adjustment amount calculation unit 95 calculates the tilt of the holding unit 4, i.e., the tilt angle at which the height of the substrate S immediately below the second coating unit 2B is within a predetermined range, from the generated data, and calculates the adjustment amount of each lift actuator 61 for realizing the tilt angle. The adjustment amount calculation unit 95 calculates the adjustment amount of each lift actuator 61 for the position of the substrate S.
Further, in the substrate processing apparatus 1, the holding section 4 is inclined to adjust the height of the substrate S directly below the second coating section 2B. This is because the height of the substrate S is adjusted with high accuracy by reducing the amount of change in the height of the substrate S with respect to the amount of adjustment of the elevation actuator 61, that is, the amount of change in the vertical direction of the holding portion 4 that is changed by the elevation actuator 61. The substrate processing apparatus 1 can adjust the height of the substrate S with high accuracy, similarly to the pad height adjusting section 7, using the lift actuator 61 with lower accuracy than the pad height adjusting section 7.
The adjustment amount calculation unit 95 stores the calculated adjustment amount of each lift actuator 61 in the storage unit 93. The adjustment amount of each lift actuator 61 is calculated at a predetermined timing when the height of the substrate S directly below the first coating section 2A is adjusted by the pad height adjusting section 7, and is stored in the storage section 93. The predetermined timing is, for example, when the substrate processing apparatus 1 starts coating the substrate S with the resist film or when maintenance is performed.
When the resist film is applied to the substrate S by the second coating section 2B, the control signal generating section 96 reads the adjustment amount of the position of each lift actuator 61 with respect to the substrate S from the storage section 93, and generates a signal for controlling each lift actuator 61. The generated signal is sent from the output unit 91 to each lift actuator 61 of the adjustment unit 6, and the inclination of the holding unit 4 is adjusted by each lift actuator 61.
As described above, the control unit 92 controls the inclination of the holding unit 4 directly below the second application unit 2B (an example of an application unit) by the adjustment unit 6. Specifically, the controller 92 controls the inclination of the holding section 4 directly below the second coating section 2B (an example of a coating section different from the predetermined coating section) by the adjusting section 6 in a state where the heights of the plurality of suction pads 41 are adjusted by the plurality of pad height adjusting sections 7. Further, the control section 92 controls the inclination of the holding section 4 by the adjusting section 6 based on the height of the substrate S detected by the detection sensor 8 and stored in the storage section 93.
The storage unit 93 is realized by, for example, a semiconductor Memory element such as a RAM or a Flash Memory (Flash Memory) or a storage device such as a hard disk or an optical disk.
< height adjustment treatment >
Next, the height adjustment process in the substrate processing apparatus 1 will be described with reference to fig. 5. Fig. 5 is a flowchart illustrating the height adjustment process of the embodiment.
The substrate processing apparatus 1 adjusts each pad height adjusting section 7 so that the height of the substrate S directly below the first coating section 2A is within a predetermined range (S10).
The substrate processing apparatus 1 conveys the substrate S directly below the second coating section 2B in a state of being adjusted by the pad height adjusting sections 7, and detects the height of the substrate S directly below the second coating section 2B (S11).
The substrate processing apparatus 1 generates data associating the position of the substrate S with the height of the substrate S directly below the second coating section 2B (S12).
The substrate processing apparatus 1 calculates the tilt angle of the holding unit 4 in which the height of the substrate S directly below the second coating unit 2B is within a predetermined range (S13), and calculates the adjustment amount of each lift actuator 61 for realizing the tilt angle (S14).
The substrate processing apparatus 1 stores the adjustment amount of the position of each lift actuator 61 with respect to the substrate S (S15).
< substrate treatment >
Next, a substrate processing in which a resist solution is applied to the substrate S in the second application section 2B of the substrate processing apparatus 1 will be described with reference to fig. 6. Fig. 6 is a flowchart illustrating substrate processing in the second coating section 2B according to the embodiment.
When the resist liquid is applied to the substrate S by the second application unit 2B, the substrate processing apparatus 1 reads the adjustment amounts of the respective lift actuators 61 from the storage unit 93 (S20).
The substrate processing apparatus 1 adjusts the height of each lift actuator 61 based on the read adjustment amount of each lift actuator 61, and adjusts the inclination of the holding portion 4 (S21). Specifically, the substrate processing apparatus 1 adjusts the height of the lift actuator 61 and the inclination of the holding portion 4 so that the height of the substrate S falls within a predetermined range according to the position of the substrate S.
As described above, when the resist solution is applied to the substrate S by the second coating section 2B, the substrate processing apparatus 1 adjusts the inclination of the holding section 4 immediately below the second coating section 2B based on the stored adjustment amounts of the respective elevation actuators 61.
When the height of the substrate S is adjusted so that the height of the substrate S falls within a predetermined range by the pad height adjusting section 7 directly below the first coating section 2A, the height of the substrate S may fall outside the predetermined range directly below the second coating section 2B.
Fig. 7 shows an example of the height of the substrate S directly below the second coating portion 2B without using the second coating portion 2B in the comparative example of the present embodiment by a broken line. In contrast, in the substrate processing apparatus 1 of the present embodiment, the holding unit 4 is tilted by the elevation actuator 61, so that the height of the substrate S can be set within a predetermined range as shown by the solid line in fig. 7. Fig. 7 is a diagram showing an example of the height of the substrate S directly below the second coating section 2B in the embodiment and the comparative example.
< effects >
The substrate processing apparatus 1 includes: a holding portion 4 having a plurality of suction pads 41 for sucking the lower surface of the substrate S and holding the substrate S; a conveying unit 5 for conveying the holding unit 4 in a conveying direction; an adjusting section 6 for adjusting the inclination of the holding section 4; a second coating section 2B (an example of a coating section) for coating a resist solution (an example of a processing liquid) on the substrate S; and a control unit 92 for controlling the inclination of the holding unit 4 directly below the second coating unit 2B by the adjustment unit 6.
In other words, the substrate processing apparatus 1 includes, as a substrate processing method: a step of holding the substrate S by a holding portion 4, wherein the holding portion 4 has a plurality of suction pads 41 which suck the lower surface of the substrate S; a step of conveying the holding portion 4 in a conveying direction; a step of applying a resist solution (an example of a processing solution) to the substrate S by the second coating section 2B (an example of a coating section); and adjusting the inclination of the holding part 4 directly below the second coating part 2B.
Thus, the substrate processing apparatus 1 can adjust the inclination of the substrate S, which is the inclination of the holding portion 4 directly below the second coating portion 2B, and can set the height of the substrate S within a predetermined range, for example. Therefore, the substrate processing apparatus 1 can uniformly form the resist film as the coating film.
In addition, the substrate processing apparatus 1 can reduce the amount of change in the height of the substrate S with respect to the amount of adjustment of the elevation actuator 61 by adjusting the inclination of the holding portion 4. Therefore, the substrate processing apparatus 1 can adjust the height of the substrate S with high accuracy using the lift actuator 61. That is, in the substrate processing apparatus 1, when the substrate S is transferred between the holding unit 4 and the transport device (not shown), the height of the substrate S is accurately adjusted by the lift actuator 61 that moves the substrate S up and down.
The substrate processing apparatus 1 includes a plurality of pad height adjusting units 7 capable of adjusting the heights of the plurality of suction pads 41 so that the height of the substrate S directly below the first coating unit 2A (an example of a predetermined coating unit) falls within a predetermined range. The controller 92 controls the inclination of the holding section 4 directly below the second coating section 2B (another coating section different from the predetermined coating section) by the adjusting section 6 in a state where the heights of the plurality of suction pads 41 are adjusted by the plurality of pad height adjusting sections 7.
Thus, when the substrate processing apparatus 1 includes the first coating section 2A and the second coating section 2B as the plurality of coating sections 2, the height of the substrate S can be set within a predetermined range directly below the coating sections 2A and 2B. Therefore, the substrate processing apparatus 1 can uniformly form a resist film when the resist solution is applied to the substrate S by the first application section 2A or the second application section 2B.
The substrate processing apparatus 1 further includes a detection sensor 8 for detecting the height of the substrate S directly below the second coating section 2B (an example of a coating section). The control section 92 controls the inclination of the holding section 4 by the adjusting section 6 based on the height of the substrate S detected by the detection sensor 8 and stored in the storage section 93.
Thus, the substrate processing apparatus 1 can adjust the inclination of the holding portion 4 based on the height of the substrate S stored in advance, and thus can quickly adjust the height of the substrate S immediately below the second coating portion 2B. Further, the substrate processing apparatus 1 can adjust the height of the substrate S directly below the second coating section 2B with high accuracy.
< modification example >
Next, a modified example of the present embodiment will be described.
In the substrate processing apparatus 1 of the modification, when the resist solution is applied to the substrate S, the second applying section 2B detects the height of the substrate S directly below the second applying section 2B, and the elevation actuator 61 is controlled based on the detected height of the substrate S to adjust the inclination of the holding section 4. The substrate processing apparatus 1 of the modification performs feedback control, for example, on the lift actuator 61 so that the height of the substrate S is within a predetermined range, based on the detected height of the substrate S. That is, the substrate processing apparatus 1 of the modified example detects the height of the substrate S by the detection sensor 8, and controls the inclination of the holding portion 4 based on the detected height of the substrate S by the adjusting portion 6.
Thus, for example, even when the height of the substrate S directly below the second coating section 2B changes due to aging, the substrate processing apparatus 1 of the modification can keep the height of the substrate S directly below the second coating section 2B within a predetermined range. Therefore, the substrate processing apparatus 1 of the modified example can uniformly form the resist film.
As shown in fig. 8, the substrate processing apparatus 1 of the modification includes a detection sensor 80 for detecting the height of the substrate S directly below the first coating section 2A. Fig. 8 is a plan view showing a part of a substrate processing apparatus 1 according to a modification.
The substrate processing apparatus 1 of the modification detects the height of the substrate S directly below the first coating section 2A. Then, the substrate processing apparatus 1 of the modification performs, for example, feedback control on the elevation actuator 61 to adjust the inclination of the holding portion 4 so that the height of the substrate S directly below the first coating portion 2A falls within a predetermined range. That is, the substrate processing apparatus 1 of the modification controls the inclination of the holding section 4 directly below the first coating section 2A (predetermined coating section) by using the adjustment section 6.
Thus, for example, even when the height of the substrate S directly below the first coating section 2A changes due to aging, the substrate processing apparatus 1 of the modification can keep the height of the substrate S directly below the first coating section 2A within a predetermined range. Therefore, the substrate processing apparatus 1 of the modified example can uniformly form the resist film.
The substrate processing apparatus 1 of the modification may apply different processing liquids to the first application section 2A and the second application section 2B.
In the substrate processing apparatus 1 according to the modified example, the height of the substrate S immediately below the second coating section 2B may be adjusted so as to fall within a predetermined range by using the pad height adjusting section 7. In this case, the substrate processing apparatus according to the modified example adjusts the height of each lift actuator 61 and the inclination of the holding portion 4 immediately below the first coating portion 2A in the same manner as in the above-described embodiment.
The presently disclosed embodiments are further described in all respects as illustrative and not restrictive. In fact, the above-described embodiments can be implemented in various ways. The above-described embodiments may be omitted, replaced, or changed in various ways without departing from the scope and spirit of the appended claims.

Claims (6)

1. A substrate processing apparatus, comprising:
a holding section having a plurality of suction pads for sucking a lower surface of a substrate, for holding the substrate;
a conveying section that conveys the holding section in a conveying direction;
an adjusting portion that adjusts an inclination of the holding portion;
a coating section for coating the substrate with a treatment liquid; and
and a control unit for controlling the inclination of the holding unit directly below the coating unit by the adjustment unit.
2. The substrate processing apparatus according to claim 1, wherein:
further comprising a plurality of pad height adjusting sections capable of adjusting the heights of the plurality of suction pads so that the height of the substrate directly below the coating section is within a predetermined range,
the control unit controls, with the adjustment unit, an inclination of the holding unit directly below another application unit different from the predetermined application unit in a state where the heights of the plurality of adsorption pads are adjusted by the plurality of pad height adjustment units.
3. The substrate processing apparatus according to claim 2, wherein:
the control unit controls the inclination of the holding unit directly below the predetermined application unit with the adjustment unit.
4. The substrate processing apparatus according to any one of claims 1 to 3, wherein:
includes a detection sensor for detecting the height of the substrate directly below the coating section,
the control unit controls the inclination of the holding unit with the adjusting unit based on the height of the substrate stored in the storage unit detected by the detection sensor.
5. The substrate processing apparatus according to any one of claims 1 to 3, wherein:
includes a detection sensor for detecting the height of the substrate directly below the coating section,
the control portion detects the height of the substrate with the detection sensor, and controls the inclination of the holding portion with the adjusting portion based on the detected height of the substrate.
6. A method of processing a substrate, comprising:
a step of holding the substrate by a holding section having a plurality of adsorption pads adsorbing a lower surface of the substrate;
a step of conveying the holding portion in a conveying direction;
coating the substrate with a treatment liquid by a coating section; and
and adjusting the inclination of the holding part directly below the coating part.
CN201910909737.8A 2018-10-04 2019-09-25 Substrate processing apparatus and substrate processing method Pending CN111001539A (en)

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022202396A1 (en) * 2021-03-25 2022-09-29 東京エレクトロン株式会社 Substrate transfer device, coating processing device, substrate transfer method, and substrate transfer program
CN115365060B (en) * 2022-09-02 2023-11-14 安徽艺云玻璃有限公司 Processing glue spraying device for producing and processing toughened glass

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000188317A (en) * 1998-12-22 2000-07-04 Dainippon Screen Mfg Co Ltd Substrate attitude changing device
CN101431008A (en) * 2007-11-06 2009-05-13 东京毅力科创株式会社 Substrate treatment device, coating device and coating method
CN101495244A (en) * 2006-07-27 2009-07-29 东京毅力科创株式会社 Coating method and coater
CN102693901A (en) * 2011-03-22 2012-09-26 东京毅力科创株式会社 Coating film forming apparatus and coating film forming method
CN104882359A (en) * 2014-02-27 2015-09-02 斯克林集团公司 Substrate processing apparatus and substrate processing method
CN106480412A (en) * 2015-08-24 2017-03-08 圆益Ips股份有限公司 Substrate board treatment and substrate processing method using same
CN106556939A (en) * 2015-09-30 2017-04-05 艾美柯技术株式会社 Substrate assembly system, base panel assembly apparatus and substrate assembly method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4033841B2 (en) * 2004-02-12 2008-01-16 東京エレクトロン株式会社 Floating substrate transfer processing method and apparatus
JP4318714B2 (en) * 2006-11-28 2009-08-26 東京エレクトロン株式会社 Coating device
JP5416925B2 (en) * 2008-06-24 2014-02-12 東京応化工業株式会社 Coating device
JP5570464B2 (en) * 2011-03-24 2014-08-13 東京エレクトロン株式会社 Floating coating device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000188317A (en) * 1998-12-22 2000-07-04 Dainippon Screen Mfg Co Ltd Substrate attitude changing device
CN101495244A (en) * 2006-07-27 2009-07-29 东京毅力科创株式会社 Coating method and coater
CN101431008A (en) * 2007-11-06 2009-05-13 东京毅力科创株式会社 Substrate treatment device, coating device and coating method
CN102693901A (en) * 2011-03-22 2012-09-26 东京毅力科创株式会社 Coating film forming apparatus and coating film forming method
CN104882359A (en) * 2014-02-27 2015-09-02 斯克林集团公司 Substrate processing apparatus and substrate processing method
CN106480412A (en) * 2015-08-24 2017-03-08 圆益Ips股份有限公司 Substrate board treatment and substrate processing method using same
CN106556939A (en) * 2015-09-30 2017-04-05 艾美柯技术株式会社 Substrate assembly system, base panel assembly apparatus and substrate assembly method

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