CN110997854A - 压敏粘接层形成性有机聚硅氧烷组合物及其用途 - Google Patents
压敏粘接层形成性有机聚硅氧烷组合物及其用途 Download PDFInfo
- Publication number
- CN110997854A CN110997854A CN201880051808.9A CN201880051808A CN110997854A CN 110997854 A CN110997854 A CN 110997854A CN 201880051808 A CN201880051808 A CN 201880051808A CN 110997854 A CN110997854 A CN 110997854A
- Authority
- CN
- China
- Prior art keywords
- sensitive adhesive
- pressure
- adhesive layer
- component
- organopolysiloxane composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 196
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 168
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 144
- 239000010410 layer Substances 0.000 claims abstract description 129
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 31
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims abstract description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 50
- 239000003054 catalyst Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 21
- 239000000126 substance Substances 0.000 claims description 17
- 239000007787 solid Substances 0.000 claims description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 13
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 12
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 11
- 229910020388 SiO1/2 Inorganic materials 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 239000012776 electronic material Substances 0.000 claims description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 8
- 229910020485 SiO4/2 Inorganic materials 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000010998 test method Methods 0.000 claims description 4
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims description 2
- 238000001723 curing Methods 0.000 description 86
- -1 polysiloxane Polymers 0.000 description 67
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 33
- 230000001070 adhesive effect Effects 0.000 description 33
- 239000000853 adhesive Substances 0.000 description 31
- 239000004205 dimethyl polysiloxane Substances 0.000 description 21
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 21
- 239000000047 product Substances 0.000 description 20
- 229910052697 platinum Inorganic materials 0.000 description 15
- 238000005259 measurement Methods 0.000 description 13
- 238000000576 coating method Methods 0.000 description 12
- 238000011156 evaluation Methods 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 125000000217 alkyl group Chemical group 0.000 description 10
- 125000004432 carbon atom Chemical group C* 0.000 description 10
- 229920002050 silicone resin Polymers 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 9
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000007809 chemical reaction catalyst Substances 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- 125000000962 organic group Chemical group 0.000 description 6
- 125000004122 cyclic group Chemical group 0.000 description 5
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 238000011282 treatment Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 229910020447 SiO2/2 Inorganic materials 0.000 description 4
- 229910020487 SiO3/2 Inorganic materials 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 230000032683 aging Effects 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000007756 gravure coating Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- 238000004040 coloring Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 125000006038 hexenyl group Chemical group 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 238000007754 air knife coating Methods 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 238000007766 curtain coating Methods 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical compound [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000007763 reverse roll coating Methods 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- GRGVQLWQXHFRHO-AATRIKPKSA-N (e)-3-methylpent-3-en-1-yne Chemical compound C\C=C(/C)C#C GRGVQLWQXHFRHO-AATRIKPKSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- MQSZOZMNAJHVML-UHFFFAOYSA-N 3-phenylbut-1-yn-1-ol Chemical compound OC#CC(C)C1=CC=CC=C1 MQSZOZMNAJHVML-UHFFFAOYSA-N 0.000 description 1
- 229920006353 Acrylite® Polymers 0.000 description 1
- 210000004128 D cell Anatomy 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910004726 HSiO3/2 Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- ZFJFYUXFKXTXGT-UHFFFAOYSA-N [dimethyl(methylsilyloxy)silyl]oxy-[dimethyl(trimethylsilyloxy)silyl]oxy-dimethylsilane Chemical compound C[SiH2]O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C ZFJFYUXFKXTXGT-UHFFFAOYSA-N 0.000 description 1
- NRTJGTSOTDBPDE-UHFFFAOYSA-N [dimethyl(methylsilyloxy)silyl]oxy-dimethyl-trimethylsilyloxysilane Chemical compound C[SiH2]O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C NRTJGTSOTDBPDE-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000013006 addition curing Methods 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GSOLWAFGMNOBSY-UHFFFAOYSA-N cobalt Chemical compound [Co][Co][Co][Co][Co][Co][Co][Co] GSOLWAFGMNOBSY-UHFFFAOYSA-N 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000010485 coping Effects 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 description 1
- 150000004862 dioxolanes Chemical class 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000005329 float glass Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 239000002649 leather substitute Substances 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- QXLPXWSKPNOQLE-UHFFFAOYSA-N methylpentynol Chemical compound CCC(C)(O)C#C QXLPXWSKPNOQLE-UHFFFAOYSA-N 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000002897 organic nitrogen compounds Chemical class 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004344 phenylpropyl group Chemical group 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000004590 silicone sealant Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical class O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 239000000341 volatile oil Substances 0.000 description 1
- 208000008918 voyeurism Diseases 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/286—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/288—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyketones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/325—Layered products comprising a layer of synthetic resin comprising polyolefins comprising polycycloolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B29/005—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to another layer of paper or cardboard layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/02—Layered products comprising a layer of paper or cardboard next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/12—Coating on the layer surface on paper layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/28—Multiple coating on one surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/21—Anti-static
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/584—Scratch resistance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2451/00—Decorative or ornamental articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/202—LCD, i.e. liquid crystal displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/204—Plasma displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/206—Organic displays, e.g. OLED
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/208—Touch screens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2519/00—Labels, badges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2535/00—Medical equipment, e.g. bandage, prostheses or catheter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2551/00—Optical elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2605/00—Vehicles
- B32B2605/08—Cars
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2605/00—Vehicles
- B32B2605/18—Aircraft
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
- C08G2170/40—Compositions for pressure-sensitive adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本发明提供一种硬化反应性有机聚硅氧烷组合物及其用途，该硬化反应性有机聚硅氧烷组合物的利用硅氢化反应的硬化性及操作作业性优异、且形成牢固地密接于显示装置等基材的压敏粘接层。本发明是一种压敏粘接层形成性有机聚硅氧烷组合物及其用途，该压敏粘接层形成性有机聚硅氧烷组合物是硅氢化反应性的有机聚硅氧烷组合物，(C)有机氢聚硅氧烷中的SiH基相对于(A)具有烯基的有机聚硅氧烷及(B)有机聚硅氧烷树脂中的烯基的量之和的摩尔比(SiH/Vi比)为20～60的量。
Description
技术领域
本发明涉及一种形成压敏粘接层的硬化反应性有机聚硅氧烷组合物。详细而言，本发明涉及一种硬化性优异且形成牢固地密接于显示装置等基材的压敏粘接层的硬化反应性有机聚硅氧烷组合物，尤其涉及一种能设计成透明且具备适度粘接力的光学构件用途中的压敏粘接层形成性有机聚硅氧烷组合物。另外，本发明涉及一种使用该组合物的压敏粘接剂组合物、使用该组合物的层叠体、电子零件或显示装置(包括触摸面板)等用途。
背景技术
聚硅氧烷系压敏粘接剂组合物与丙烯酸系或橡胶系压敏粘接剂组合物相比，电绝缘性、耐热性、耐寒性、对各种被粘接体的粘着性优异，因此，用于耐热性胶带、电绝缘性胶带、热密封带、镀覆遮蔽带等。这些聚硅氧烷系压敏粘接剂组合物根据其硬化机制，分类为加成反应硬化型、缩合反应硬化型、过氧化物硬化型等。因为通过室温放置或加热而快速地硬化，不会产生副产物，所以加成反应硬化型的压敏粘接剂组合物得到普遍使用。
近年来，充分利用聚硅氧烷系压敏粘接剂的所述特性及高透明性，对智能装置等尖端电子装置显示元件领域中的应用进行了研究。这种装置采用将由包含电极层、显示层在内的多层构成的膜夹入透明基材之间的结构，为了电极层、显示层的保护及层间的粘接性改良，期待耐热、耐寒性、透明性高的聚硅氧烷系压敏粘接剂有效地发挥作用。例如，于日本专利特表2014-522436号(专利文献1)或日本专利特表2013-512326(专利文献2)等中公开了光学上透明的硅酮系压敏粘接剂膜及使用其的触摸面板等显示装置的制造。
在这些领域、尤其是光学用途的硅酮系压敏粘接剂膜的领域中，就所获得的显示装置的良率的改善、生产性的改善及品质提高等观点而言，强烈要求硅酮系压敏粘接剂膜的硬化性的改善。另外，以包含折叠式显示器等在内的软性显示器、车载用途的曲面显示器为代表的显示装置多样化，且物理结构变化，相应地，要求可应对显示装置的多样应力变化的具有强层间粘接力的硅酮系压敏粘接剂膜，与以往相比，更强烈要求粘接层与基材的密接性的改善。然而，已有的硅酮系压敏粘接剂组合物及使其硬化而成的硅酮系压敏粘接剂膜在这些特性方面还留有改善的余地。
另一方面，在加成硬化型的聚硅氧烷系压敏粘接剂组合物中，在硅氢化反应的催化剂的存在下，作为主剂的含烯基有机聚硅氧烷、及作为交联剂的有机氢聚硅氧烷中所包含的烯基与键结有硅原子的氢原子(SiH)基的摩尔比(以下，有时称为“SiH/Vi比”)往往在专利文献中以宽泛范围提出(例如，专利文献3～8)。
例如，在专利文献3及专利文献8中提出了一种SiH/Vi比处于0.5～20的范围的粘着剂组合物，教示了该比率超过20的组合物的交联密度提高，无法实现充分的粘接力(粘性)，并提示了在粘着片材的制作中，涂布时的粘着剂组合物的可使用时间缩短(例如，专利文献3的段落0024、专利文献8的段落0028等)。
另外，在专利文献5(段落0029及权利要求29等)中公开了一种SiH/Vi比为1～30的硅酮压敏粘接剂组合物，但其优选范围及实施例所公开的组成限于SiH/Vi比处于1～10的范围。同样地，在专利文献7(段落0025及权利要求6等)中公开了一种SiH/Vi比为1～40的透明性优异的硅酮压敏粘接剂组合物，但其优选范围及实施例所公开的组成限于SiH/Vi比处于1～10的范围。
另外，本案申请人在专利文献4(该文献第3页右上栏)中提出了一种SiH/Vi比处于1～20的范围的硅酮压敏粘接剂，在专利文献6(段落0032及权利要求1等)中提出了一种SiH/Vi比处于2～50的范围的硅酮压敏粘接剂。然而，在专利文献5中，其优选范围及实施例所公开的组成也限于SiH/Vi比处于1～20的范围。
如上所述，不仅在任一专利文献中均未对SiH/Vi比超过20的硅酮压敏粘接剂进行任何具体的公开，而且其记载使得在本领域技术人员进行实际组成设计时，有动机在SiH/Vi比未达20的范围或未达10的范围内设计加成硬化性硅酮压敏粘接剂组合物。因此，这些专利文献对本领域技术人员而言，并非意在记载或教示选择超过20的SiH/Vi比，反而妨碍本领域技术人员选择这种SiH/Vi比。
背景技术文献
专利文献
专利文献1：日本专利特表2014-522436号公报
专利文献2：日本专利特表2013-512326号公报
专利文献3：日本专利特开2004-168808号公报
专利文献4：日本专利特开昭63-022886号公报
专利文献5：日本专利特开平05-214316号公报
专利文献6：日本专利特开2011-012092号公报
专利文献7：日本专利特表2014-522436号公报
专利文献8：日本专利特开2007-326312号公报
发明内容
[发明要解决的问题]
本发明是为了解决所述课题而完成的，目的在于提供一种硬化反应性有机聚硅氧烷组合物，其硬化性优异，且形成牢固地密接于显示装置等基材的压敏粘接层。进而，本发明的目的在于提供一种该硬化反应性有机聚硅氧烷组合物或其硬化物的作为压敏粘接层的用途、作为电子材料或显示装置用构件的用途及具备它们的电子零件或显示装置。
[解决问题的技术手段]
本发明人等对所述课题努力进行研究，结果完成了本发明。即，本发明的目的之一通过如下压敏粘接层形成性有机聚硅氧烷组合物而达成，该压敏粘接层形成性有机聚硅氧烷组合物含有：(A)分子内具有数量平均超过1的烯基的有机聚硅氧烷、(B)有机聚硅氧烷树脂、(C)分子内具有至少2个Si-H键的有机氢聚硅氧烷、及(D)硅氢化反应催化剂，(C)成分的量是(C)成分中的SiH基的量(物质量)相对于(A)成分中的烯基的量(物质量)及(B)成分中的烯基的量(物质量)之和的比(摩尔比)为20～60的量。另外，所述课题可通过该硬化反应性有机聚硅氧烷组合物或其硬化物的作为压敏粘接层的用途、作为电子材料或显示装置用构件的用途及具备它们的电子零件或显示装置而达成。
即，本发明如下所述：
“[1]一种压敏粘接层形成性有机聚硅氧烷组合物，其含有：
(A)分子内具有数量平均超过1的烯基的有机聚硅氧烷、
(B)有机聚硅氧烷树脂、
(C)分子内具有至少2个Si-H键的有机氢聚硅氧烷、及
(D)硅氢化反应催化剂，
(C)成分的量是(C)成分中的SiH基的量(物质量)相对于(A)成分中的烯基的量(物质量)及(B)成分中的烯基的量(物质量)之和的比(摩尔比)为20～60的量。
[2]根据[1]所记载的硬化反应性的压敏粘接层形成性有机聚硅氧烷组合物，其中(C)成分的量是(C)成分中的SiH基的物质量相对于所述(A)成分中及(B)成分中的烯基的物质量之和的比(摩尔比)为22～50的量。
[3]根据[1]或[2]所记载的压敏粘接层形成性有机聚硅氧烷组合物，其特征在于，
(A)成分的至少一部分是(A1)在25℃下具有100,000mPa·s以上的粘度，或者依据JIS K6249中规定的方法测得的塑化度处于50～200的范围的生橡胶状的含烯基有机聚硅氧烷，
(B)成分的至少一部分是(B1)包含R3SiO1/2单元(M单元)及SiO4/2单元(Q单元)，且可具有羟基或水解性基的树脂，式中，R为一价有机基，R的90摩尔％以上为碳数1～6的烷基或苯基，
(A1)成分中的烯基中的乙烯基(CH2＝CH)部分的含量为0.005～0.400重量％的范围，相对于组合物中的(A)成分与(C)成分之和100质量份，(B)成分处于1～500质量份的范围。
[4]根据[3]所记载的压敏粘接层形成性有机聚硅氧烷组合物，其中(A)成分是所述(A1)成分与(A2)25℃下的粘度未达100,000mPa·s的含烯基有机聚硅氧烷的混合物，双方的质量比为50：50～100：0的范围。
[5]根据[1]至[4]中任一项所记载的压敏粘接层形成性有机聚硅氧烷组合物，其还含有至少1种(E)硬化延迟剂。
[6]根据[1]至[5]中任一项所记载的压敏粘接层形成性有机聚硅氧烷组合物，其中从刚制备组合物后起在室温下8小时后的组合物的粘度相对于刚制备组合物后的粘度为1.5倍以内，且能在80～200℃下进行硬化。
[7]根据[1]至[6]中任一项所记载的压敏粘接层形成性有机聚硅氧烷组合物，其中固形物成分中的铂系金属的含量为0.1～200ppm的范围。
[7-1]就低着色性的观点而言，所述铂系金属的含量更优选0.1～100ppm的范围，也可为0.1～50ppm的范围。
[8]根据[1]至[7]中任一项所记载的压敏粘接层形成性有机聚硅氧烷组合物，其特征在于，使该组合物硬化而成的厚度100μm硬化层实质上透明，
且对具备使该组合物硬化而成的厚度50μm硬化层的厚度2mm聚甲基丙烯酸甲酯片材利用依据JIS Z 0237的180°剥离试验方法以拉伸速度300mm/min测得的粘着力为0.02N/25mm以上。
[9]一种压敏粘接剂组合物，其包含根据[1]至[8]中任一项所记载的压敏粘接层形成性有机聚硅氧烷组合物。
[10]一种压敏粘接剂层，其是将根据[1]至[8]中任一项所记载的压敏粘接层形成性有机聚硅氧烷组合物硬化而成。
[11]根据[10]所记载的压敏粘接剂层，其为膜状，且实质上透明。
[12]一种层叠体，其在膜状基材上具备将根据[1]至[8]中任一项所记载的压敏粘接层形成性有机聚硅氧烷组合物硬化而成的压敏粘接剂层。
[13]根据[12]所记载的层叠体，其在1个或2个以上的膜状基材上设置有针对该压敏粘接剂层的剥离层。
[14]根据[12]或[13]的层叠体，其包含：
膜状基材；
第1剥离层，其形成于该膜状基材上；
压敏粘接剂层，其是在该剥离层上涂布根据[1]至[8]中任一项所记载的压敏粘接层形成性有机聚硅氧烷组合物并使其硬化而形成；及
第2剥离层，其层叠于该压敏粘接剂层上。
[15]一种电子材料或显示装置用构件，其是将根据[1]至[8]中任一项所记载的压敏粘接层形成性有机聚硅氧烷组合物硬化而成。
[16]一种电子零件或显示装置，其包含根据[15]所记载的电子材料或显示装置用构件。
[17]一种显示面板或显示器，其包含根据[11]所记载的膜状且实质上透明的压敏粘接剂层。
[18]一种触摸面板，其包含：基材，其在一面上形成有导电层；及压敏粘接剂层，其是将附着于所述基材的导电层或其相反侧的面的根据[1]至[8]中任一项所记载的压敏粘接层形成性有机聚硅氧烷组合物硬化而成。
[19]根据[18]所记载的触摸面板，其中形成有所述导电层的基材是在一面上形成有ITO(Indium Tin Oxides，氧化铟锡)层的树脂膜或玻璃板。”。
[发明的效果]
本发明的压敏粘接层形成性有机聚硅氧烷组合物的利用硅氢化反应的硬化性及粘着性优异，且能够形成能设计成可牢固地密接于显示装置等基材，具有高透明性的压敏粘接层。进而，该硬化反应性有机聚硅氧烷组合物或其硬化物适合用作压敏粘接层、电子材料或显示装置用构件，具备它们的电子零件或显示装置能够形成不易产生压敏粘接膜的硬化不良问题及对显示装置等基材的密接不良问题的压敏粘接层，因此，具有易于工业化，且能够改善所获得的显示装置等层叠体的性能的优点。尤其能够提供一种具备使本发明的有机聚硅氧烷组合物硬化而成的压敏粘接层的显示面板、显示器及触摸面板等显示装置。
附图说明
无
具体实施方式
[压敏粘接层形成性有机聚硅氧烷组合物]
首先，对本发明的压敏粘接层形成性有机聚硅氧烷组合物进行说明。该组合物通过包括硅氢化反应的硬化反应而形成牢固地密接于显示装置等基材的压敏粘接性硬化层，且不易产生硬化不良的问题。以下，对其各构成成分及技术特征SiH/Vi比的范围等进行说明。
如上所述，本发明的有机聚硅氧烷组合物通过硅氢化反应进行硬化而形成具有一定粘着力的压敏粘接层，因此，至少含有以下的(A)～(D)成分。
(A)分子内具有数量平均超过1的烯基的有机聚硅氧烷、
(B)有机聚硅氧烷树脂、及
(C)分子内具有至少2个Si-H键的有机氢聚硅氧烷、及
(D)硅氢化反应催化剂
另外，因为该组合物包含硅氢化反应催化剂，所以就操作作业性的观点而言，优选还含有(E)硬化延迟剂，也可在不违反本发明目的的范围内含有其它添加剂。以下，对各成分进行说明。
(A)成分的含烯基有机聚硅氧烷是该组合物的主剂(基础聚合物)，1分子中含有数量平均超过1的键结于硅原子的烯基，优选的烯基的个数为1分子中为1.5个以上。作为(A)成分的有机聚硅氧烷的烯基，例如可列举：乙烯基、烯丙基、丁烯基、戊烯基、己烯基、庚烯基等碳数2～10的烯基，尤其优选乙烯基或己烯基。作为(A)成分的烯基的键结位置，例如可列举分子链末端及/或分子链侧链。此外，(A)成分可仅包含单一成分，也可为2种以上的不同成分的混合物。
在(A)成分的有机聚硅氧烷中，作为除烯基以外的键结于硅原子的有机基，例如可列举：甲基、乙基、丙基、丁基、戊基、己基、庚基等烷基；苯基、甲苯基、二甲苯基、萘基等芳基；苄基、苯乙基等芳烷基；氯甲基、3-氯丙基、3,3,3-三氟丙基等卤化烷基等，尤其优选甲基、苯基。
作为(A)成分的分子结构，例如优选直链状、具有一部分分支的直链状(支链状)，也可在一部分中包含环状、三维网状。优选主链包含二有机硅氧烷单元的重复且分子链两末端被三有机硅烷氧基封阻的直链状或支链状的二有机聚硅氧烷。此外，提供支链状有机聚硅氧烷的硅氧烷单元是下述T单元或Q单元。
(A)成分的室温下的性状可为油状或生橡胶状，(A)成分的粘度优选在25℃下为50mPa·s以上，尤其优选100mPa·s以上。尤其在硬化性硅酮组合物为溶剂型的情况下，(A)成分的至少一部分优选(A1)在25℃下具有100,000mPa·s以上的粘度，或者依据JIS K6249中规定的方法测得的塑化度(在25℃下对4.2g球状试样施加1kgf负载3分钟时的值)处于50～200的范围、进而优选处于80～180的范围的生橡胶状的含烯基有机聚硅氧烷。
此外，这些含烯基有机聚硅氧烷就防止接点损伤等观点而言，优选减少或去除挥发性或低分子量的硅氧烷低聚物(八甲基四硅氧烷(D4)、十甲基五硅氧烷(D5)等)。其程度可根据所需设计，也可设为未达成分(A)整体的1质量％，各硅氧烷低聚物未达0.1质量％，也可视需要减少至检测极限附近。
所述(A1)成分中的烯基的含量没有特别限定，就本发明的技术效果的观点而言，(A1)成分中的烯基中的乙烯基(CH2＝CH)部分的含量(以下，称为“乙烯基含量”)优选0.005～0.400重量％的范围，尤其优选0.005～0.300重量％的范围。
作为本发明的(A)成分，即使是比所述(A1)成分更低粘度的(A)成分也可以利用，具体而言，可利用(A2)25℃下的粘度未达100,000mPa·s的含烯基有机聚硅氧烷。此处，(A2)成分的粘度以外的例示与(A1)成分相同。尤其是通过将低粘度的(A2)成分与(A1)成分一并使用，存在能够改善作为下述(C)成分的硅氢化反应催化剂的调配时的操作作业性的情况。
就本发明的技术效果的观点而言，优选(A)成分的50质量％以上是作为(A1)成分的高聚合度的含烯基有机聚硅氧烷，尤其优选75～100质量％是(A1)成分。即，在将所述(A1)成分(＝高聚合度的含烯基有机聚硅氧烷)与(A2)成分(＝聚合度低于(A1)成分的含烯基有机聚硅氧烷)一起用作本发明的(A)成分的情况下，双方的质量比为50：50～100：0、更优选为75：25～100：0或75：25～90：10的范围。
(B)有机聚硅氧烷树脂是赋予对基材的粘着力的粘着赋予成分，只要是具有三维结构的有机聚硅氧烷，那么就没有特别限定。例如可列举：包含R2SiO2/2单元(D单元)及RSiO3/2单元(T单元)(式中，R表示相互独立的一价有机基)且具有或不具有羟基或水解性基的树脂、包含T单元单独且具有或不具有羟基或水解性基的树脂、以及包含R3SiO1/2单元(M单元)及SiO4/2单元(Q单元)且具有或不具有羟基或水解性基的树脂等。尤其优选使用(B1)包含R3SiO1/2单元(M单元)及SiO4/2单元(Q单元)且具有羟基或水解性基的树脂(也称为MQ树脂)。此外，羟基或水解性基直接键结于树脂中的T单元或Q单元等的硅，是来自原料硅烷的基或硅烷水解所产生的基。
R的一价有机基优选碳数1～10的一价烃基，可例示：碳数1～10的烷基、碳数2～10的烯基、碳数6～10的芳基、碳数6～10的环烷基、苄基、苯基乙基、及苯基丙基。尤其是优选R的90摩尔％以上是碳数1～6的烷基或苯基，尤其优选R的95～100摩尔％是甲基或苯基。
在(B)有机聚硅氧烷树脂是包含R3SiO1/2单元(M单元)及SiO4/2单元(Q单元)的树脂的情况下，M单元对Q单元的摩尔比优选0.5～2.0。其原因在于，在该摩尔比未达0.5的情况下，存在对基材的粘着力降低的情况，在大于2.0的情况下，构成粘着层的物质的凝集力降低。另外，在不损害本发明的特性的范围内，也可使(B)成分中含有D单元及Q、T单元，(B)成分也可一并使用2种以上的有机聚硅氧烷。该(B)有机聚硅氧烷树脂可具有羟基或水解性基，不管是具有羟基或水解性基的树脂、不具有羟基或水解性基的树脂、或它们的混合物，都能够无限制地使用。在本有机聚硅氧烷树脂具有羟基或水解性基的情况下，通常包含0.1～5.0质量％的羟基或水解性基。此外，就防止接点损伤等观点而言，这些有机聚硅氧烷树脂也可减少或去除低分子量的硅氧烷低聚物。
(C)成分是在分子中具有2个以上Si-H键的有机氢聚硅氧烷，是本发明的有机聚硅氧烷组合物的交联剂。成分(C)的分子结构没有限定，例如可列举直链状、具有一部分分支的直链状、支链状、环状、或者有机聚硅氧烷树脂，优选直链状、具有一部分分支的直链状、或者有机聚硅氧烷树脂。键结有硅原子的氢原子的键结位置没有特别限定，可例示分子链末端、侧链、它们双方。
键结有硅原子的氢原子的含量优选0.1～2.0重量％，更优选0.5～1.7重量％。
作为键结于硅原子的有机基，可例示：甲基、乙基、丙基、丁基、辛基等碳原子数1～8的烷基；苯基、甲苯基等芳基；苄基、苯乙基等芳烷基；3-氯丙基、3,3,3-三氟丙基等卤化烷基；优选它们的合计数的50摩尔％以上是碳原子数1～8的烷基或苯基。就制造容易性及与所述优选的(A)成分、(B)成分的相容性的方面而言，其它有机基优选甲基或苯基。
在本发明的(C)成分是作为有机聚硅氧烷树脂的有机氢聚硅氧烷的情况下，可例示：包含通式：R'3SiO1/2所表示的硅氧烷单元、通式：R'2HSiO1/2所表示的硅氧烷单元及式：SiO4/2所表示的硅氧烷单元的有机聚硅氧烷共聚物；包含通式：R'2HSiO1/2所表示的硅氧烷单元及式：SiO4/2所表示的硅氧烷单元的有机聚硅氧烷共聚物；包含通式：R'2HSiO1/2所表示的硅氧烷单元及式：R”SiO3/2所表示的硅氧烷单元的有机聚硅氧烷共聚物；包含通式：R'HSiO2/2所表示的硅氧烷单元及通式：R'SiO3/2所表示的硅氧烷单元或式：HSiO3/2所表示的硅氧烷单元的有机聚硅氧烷共聚物；以及这些有机聚硅氧烷的两种以上的混合物。此外，式中的R'是碳数1～8的烷基、芳基、芳烷基、或卤化烷基，可例示与前述同样的基。
作为(C)成分，具体而言，可例示：三(二甲基氢硅烷氧基)甲基硅烷、四(二甲基氢硅烷氧基)硅烷、两末端经三甲基硅烷氧基封阻的甲基氢聚硅氧烷、两末端经三甲基硅烷氧基封阻的二甲基硅氧烷-甲基氢硅氧烷共聚物、两末端经二甲基氢硅烷氧基封阻的二甲基硅氧烷-甲基氢硅氧烷共聚物、环状甲基氢低聚硅氧烷、环状甲基氢硅氧烷-二甲基硅氧烷共聚物、分子链两末端经三甲基硅烷氧基封阻的甲基氢硅氧烷-二苯基硅氧烷共聚物、分子链两末端经三甲基硅烷氧基封阻的甲基氢硅氧烷-二苯基硅氧烷-二甲基硅氧烷共聚物、三甲氧基硅烷的水解缩合物、包含(CH3)2HSiO1/2单元及SiO4/2单元的共聚物、包含(CH3)2HSiO1/2单元、SiO4/2单元及(C6H5)SiO3/2单元的共聚物、包含(CH3)2HSiO1/2单元及CH3SiO3/2单元的共聚物、及它们的2种以上的混合物。
在直链状的情况下，尤其优选分子结构式：RTMe2SiO(Me2SiO)q(H Me SiO)r SiMe2RT(7)
(式中，Me是甲基，RT是甲基或氢原子，q、r是满足0.3≦r/(q+r)≦1、10≦(q+r)≦200的关系的数)所表示的甲基氢聚硅氧烷。此外，也可一并使用2种以上不同的所述(C)成分。
同样地，也可例示如下所述的有机硅氧烷。此外，式中，Me、Ph分别表示甲基、苯基，m是1～100的整数，n是1～50的整数，b、c、d、e分别是正数，其中，一分子中的b、c、d、e的合计为1。
HMe2SiO(Ph2SiO)mSiMe2H
HMePhSiO(Ph2SiO)mSiMePhH
HMePhSiO(Ph2SiO)m(MePhSiO)nSiMePhH
HMePhSiO(Ph2SiO)m(Me2SiO)nSiMePhH
(HMe2SiO1/2)b(PhSiO3/2)c
(HMePhSiO1/2)b(PhSiO3/2)c
(HMePhSiO1/2)b(HMe2SiO1/2)c(PhSiO3/2)d
(HMe2SiO1/2)b(Ph2SiO2/2)c(PhSiO3/2)d
(HMePhSiO1/2)b(Ph2SiO2/2)c(PhSiO3/2)d
(HMePhSiO1/2)b(HMe2SiO1/2)c(Ph2SiO2/2)d(PhSiO3/2)e
[SiH/Vi比]
本发明的组合物通过具有实现其技术效果的高SiH/Vi比而被赋予特征。即，关于本发明的组合物中的(C)成分的使用量，组合物中的(C)成分中的键结有硅原子的氢原子(SiH)基的物质量相对于(A)成分中的烯基的量(物质量)及(B)成分中的烯基的量(物质量)之和、即摩尔比为20～60的范围，也可为22～50的范围、25～40的范围。
SiH基的量需要为所述下限、即20以上，优选超过20，更优选22以上。如果SiH基的量低于所述下限，那么存在组合物的硬化性降低而导致硬化不良的情况，且存在无法实现改善与基材的密接性这一技术效果的情况。另一方面，如果SiH基的量超过所述上限，那么存在出现未反应而残留的硬化剂的量变多、硬化物变脆等硬化物性上的不良影响或产生气体等问题的情况。
关于组合物的硬化不良的改善效果，考虑如下。因为本发明的有机聚硅氧烷组合物需要形成压敏粘接性的硬化层，所以一般将有机聚硅氧烷树脂及含有烯基且具有高聚合度的有机聚硅氧烷作为主成分。与用于硅酮系密封剂等的硅氧烷聚合度低的乙烯基聚硅氧烷等相比，这些成分往往分子内的烯基的含量少，组合物中的烯基的密度易于降低。认为此时在添加下述(D)硅氢化反应催化剂的情况下，如果使用聚合度低于(A1)成分的含烯基有机聚硅氧烷，那么在这些低聚合度的硅氧烷中，分子内的烯基的密度相对地提高，因此，存在硅氢化反应在聚合度低于(A1)成分的含烯基有机聚硅氧烷的附近局部地进行的情况，存在组合物中的硬化反应产生偏靠而导致硬化不良及低硬化性的情况。此外，尤其是压敏粘接剂层一般在工业上在1分钟～10分钟以内硬化，多数情况下难以采用长时间的硬化制程以使反应均匀地进行。
然而，认为通过将SiH的含量设计成如上所述SiH/Vi比为20以上、优选为22以上的大幅过量，即使在组合物中产生烯基的密度相对低的部分，硅氢化反应也变得易于迅速地进行，不产生硬化不良及硬化延迟的问题地形成组合物整体均匀地交联的压敏粘接层。
进而，在本发明中，由于SiH的含量设计成大幅过量，所以存在如下情况：未反应的键结有硅原子的氢原子(SiH)大量残留于交联后的压敏粘接层中，通过与存在于基材表面上的羟基等的相互作用，而使压敏粘接层与基材表面间进一步产生键结力。由此，认为对基材的密接性得以改善。
关于质量比，就本发明的技术效果、尤其是作为压敏粘接层利用的观点而言，优选相对于组合物中的(A)成分与(C)成分之和100质量份，(B)成分为1～500质量份，更优选30～400质量份。其原因在于，在(B)成分的含量未达所述下限的情况或超过所述上限的情况下，存在粘着力不充分的情况。
[硅氢化反应催化剂]
本发明的有机聚硅氧烷组合物包含硅氢化反应催化剂。作为硅氢化反应催化剂，可例示铂系催化剂、铑系催化剂、钯系催化剂，就能够显著地促进本组合物的硬化的方面而言，优选铂系催化剂。作为该铂系催化剂，可例示铂细粉末、氯铂酸、氯铂酸的醇溶液、铂-烯基硅氧烷络合物、铂-烯烃络合物、铂-羰基络合物，尤其优选铂-烯基硅氧烷络合物。作为该烯基硅氧烷，可例示：1,3-二乙烯基-1,1,3,3-四甲基二硅氧烷、1,3,5,7-四甲基-1,3,5,7-四乙烯基环四硅氧烷；用选自由腈类、酰胺类、二氧戊环类、及环丁砜类所组成的群中的基、乙基、苯基等取代这些烯基硅氧烷的甲基的一部分而成的烯基硅氧烷；用烯丙基、己烯基等取代这些烯基硅氧烷的乙烯基而成的烯基硅氧烷。尤其就该铂-烯基硅氧烷络合物的稳定性良好的方面而言，优选1,3-二乙烯基-1,1,3,3-四甲基二硅氧烷。此外，作为促进硅氢化反应的催化剂，也可使用铁、钌、铁/钴等非铂系金属催化剂。
在本发明中，硅氢化反应催化剂的含量没有特别限制，是相对于组合物中的固形物成分的合计量，铂系金属量为0.1～200pm范围的范围，也可为0.1～150ppm、0.1～100ppm的范围，还可为0.1～50ppm的范围。此处，铂系金属是包含铂、铑、钯、钌、铱的VIII族的金属元素，在实用上优选硅氢化反应催化剂的配位基除外的铂金属的含量为所述范围。此外，固形物成分是指在使本发明的有机聚硅氧烷组合物进行硬化反应的情况下形成硬化层的成分(主要为主剂、粘接赋予成分、交联剂、催化剂及其它非挥发性成分)，不包含加热硬化时挥发的溶剂等挥发性成分。
在本发明的有机聚硅氧烷组合物中的铂系金属的含量为50ppm以下(45ppm以下、35ppm以下、30ppm以下、25ppm以下或20ppm以下)的情况下，存在硬化后、或者暴露于加热或紫外线等高能量线时，尤其能够抑制透明压敏粘接层变色或着色的情况。另一方面，就有机聚硅氧烷组合物的硬化性的观点而言，铂系金属的含量为0.1ppm以上，如果低于该下限，那么存在导致硬化不良的情况。
(E)成分是硬化延迟剂，是为了抑制组合物中的烯基与(C)成分中的SiH基的交联反应，延长常温下的可使用时间，提高保存稳定性而调配的。因此，在实用上是对本发明的压敏粘接层形成性有机聚硅氧烷组合物而言接近必须的成分。
具体而言，(E)成分可例示乙炔系化合物、烯炔化合物、有机氮化合物、有机磷化合物、肟化合物。具体而言，可例示：3-甲基-1-丁炔-3-醇、3,5-二甲基-1-己炔-3-醇、3-甲基-1-戊炔-3-醇、1-乙炔基-1-环己醇、苯基丁炔醇等炔醇；3-甲基-3-戊烯-1-炔、3,5-二甲基-1-己炔-3-炔等烯炔化合物；1,3,5,7-四甲基-1,3,5,7-四乙烯基环四硅氧烷、1,3,5,7-四甲基-1,3,5,7-四己烯基环四硅氧烷等甲基烯基环硅氧烷；苯并三唑。
就组合物的硬化行为的观点而言，本发明的压敏粘接层形成性有机聚硅氧烷组合物在制备组合物后在室温下8小时后粘度的增大为1.5倍以内，优选可在80～200℃下进行硬化。就操作作业性、适用期、硬化后的特性的观点而言，重要的是抑制稠化，其原因在于，即使包含大幅过量的(C)成分，且铂系金属量的含量任意地低，也能够通过在一定以上的高温(80～200℃)下硬化而确保硬化性。此外，这种组合物能够通过选择所述各成分以及硅氢化催化剂与(E)成分的优选组合及调配量而实现。
本发明的有机聚硅氧烷组合物也可除了所述优选的(A)成分及(B)成分以外包含有机溶剂作为溶剂。关于有机溶剂，考虑涂布作业性等而调整其种类及调配量。作为有机溶剂，例如可列举：甲苯、二甲苯、苯等芳香族烃系溶剂；庚烷、己烷、辛烷、异烷烃等脂肪族烃系溶剂；乙酸乙酯、乙酸异丁酯等酯系溶剂；二异丙醚、1,4-二恶烷等醚系溶剂；三氯乙烯、全氯乙烯、二氯甲烷等氯化脂肪族烃系溶剂；溶剂挥发油等；也可根据对片状基材的润湿性等而将2种以上组合。有机溶剂调配量以能够将(A)成分～(C)成分的混合物均匀地涂布于片状基材表面的量为宜，例如，相对于(A)成分、(B)成分及(C)成分的合计每100质量份，为5～3000质量份。
本发明的有机聚硅氧烷组合物可在不损害本发明的技术效果的范围内，任意地包含除所述成分以外的成分。例如可包含：粘接促进剂；聚二甲基硅氧烷或聚二甲基二苯基硅氧烷等非反应性有机聚硅氧烷；酚系、醌系、胺系、磷系、亚磷酸酯系、硫系、或硫醚系等抗氧化剂；三唑系或二苯甲酮系等光稳定剂；磷酸酯系、卤素系、磷系、或锑系等难燃剂；包含阳离子系界面活性剂、阴离子系界面活性剂、或非离子系界面活性剂等的1种以上的抗静电剂等。此外，除了这些成分以外，也可任意调配颜料、染料、无机微粒子等，但理想为不调配损害透明性等光学特性、或导致压敏粘接层着色的任意成分。
本发明的有机聚硅氧烷组合物的制备方法没有特别限定，通过将各个成分均质地混合而进行。可视需要添加溶剂，也可使用公知的搅拌机或混练机，在0～200℃的温度下混合而制备。
本发明的有机聚硅氧烷组合物通过涂布于基材上而形成涂膜，通过在80～200℃的温度条件下、优选在90～190℃的温度条件下进行加热而制成硬化物。作为涂布方法，可例示凹版涂布、胶版涂布、胶版凹版、辊式涂布、逆辊涂布、气刀涂布、淋幕式涂布、及缺角轮涂布。
[压敏粘接性及粘着力的范围]
本发明的有机聚硅氧烷组合物的特征在于，通过硅氢化反应使该组合物硬化而成的硬化层是压敏粘接性。本发明的压敏粘接层能够在与SiH/Vi比未达20的硅酮压敏粘接剂同等的范围内设计粘接力，且粘接层与基材的密接性优异，因此，在实用上，可根据所需置换公知的硅酮压敏粘接剂加以利用。
具体而言，其特征在于，对具备使本发明的有机聚硅氧烷组合物硬化而成的厚度50μm硬化层的厚度2mm聚甲基丙烯酸甲酯片材利用依据JIS Z 0237的180°剥离试验方法以拉伸速度300mm/min测得的粘着力为0.02N/25mm以上。此外，所述厚度(50μm)是成为用来客观地定义本发明硬化层的粘着力的基准的硬化层本身的厚度，当然，本发明的有机聚硅氧烷组合物并不限于厚度50μm，能够作为任意厚度的硬化层或压敏粘接层使用。
关于厚度50μm硬化层，如果粘着力未达所述下限，那么作为压敏粘接层的功能不充分。此外，通过使用下述成分，一般能够设计所述粘着力处于0.02～35N/25mm的范围的压敏粘接层。
关于厚度50μm硬化层，尤其就作为显示装置用压敏粘接层使用的观点而言，所述条件下的粘着力优选1.0N/25mm以上，更优选2.0N/25mm以上。
[与硬化层的透明性、色调或着色、变色相关的特性]
本发明的有机聚硅氧烷组合物优选实质上透明。具体而言，作为显示装置用压敏粘接层，在实用上，使本发明的有机聚硅氧烷组合物硬化而成的厚度10～1000μm的膜状硬化物需要在目视下透明，更客观地说，包含厚度100μm硬化层的显示装置用压敏粘接层的波长450nm的光的透过率在将空气的值设为100％的情况下为80％以上，优选为90％以上，也可设计成95％以上。
本发明的有机聚硅氧烷组合物通过任意地减少硬化层中的铂系金属的含量等，可设计成除了所述透明性以外，即使在长时间暴露于高温或紫外线等高能量线的情况下，其色调也不会大幅变化，不会损害透明性。具体而言，可设计成使本发明的有机聚硅氧烷组合物硬化而成的厚度100μm硬化层在其刚硬化后利用JIS Z 8729中规定的L＊a＊b＊表色系统测得的b＊值为0.15以下，进而为0.10以下。具有该b＊值意味着硬化层实质上透明，且未被着色为黄色。
本发明的硬化层可设计成即使在长时间暴露于高温或紫外线等高能量线的情况下，其色调也不会大幅变化，尤其不会产生黄变的问题。具体而言，可设计成无论在进行以下哪一个评价的情况下，使本发明的有机聚硅氧烷组合物硬化而成的厚度100μm硬化层在评价前后的利用JIS Z 8729中规定的L＊a＊b＊表色系统测得的b＊值的变化(Δb＊)均为0.20以下、0.15以下。此外，Δb＊是数值变化的绝对值。
(1)加热老化评价：对硬化层进行105℃-300小时的老化
(2)高能量线照射：对硬化层在室温下在试样上照射紫外光75小时，该紫外光使用365nm下的强度为12mW/cm2且254nm下的强度为3.5mW/cm2的水银灯(例如，牛尾电机制造的Optical ModuleX等)
[作为压敏粘接剂层的用途]
本发明的硬化物尤其能够用作实质上透明的压敏粘接剂层。此处，实质上透明意指在形成厚度10～1000μm的膜状硬化物的情况下，在目视下透明，关于大致厚度100μm的膜状硬化物，波长450nm的光的透过率在将空气的值设为100％的情况下为80％以上，优选90％以上，也容易设计成95％以上。另外，为了提高与被粘接体的密接性，也可对压敏粘接剂层或基材的表面进行底涂处理、电晕处理、蚀刻处理、等离子体处理等表面处理。但是，本发明的压敏粘接剂层如上所述与显示装置等基材的密接性优异，因此，可视需要添加这些步骤进而提高与被粘接体的密接性，也可通过省略这些步骤而实现更高的生产效率。
本发明的硬化性有机聚硅氧烷组合物能够通过在涂布于剥离衬垫后，在所述温度条件下进行加热而硬化，将剥离衬垫剥离并与膜状基材、带状基材、或片状基材(以下，称为“膜状基材”)贴合；或通过涂布于膜状基材后，在所述温度条件下进行加热而硬化，在所述基材的表面上形成压敏粘接剂层。在这些膜状基材上具备将本发明的有机聚硅氧烷组合物硬化而成的硬化层、尤其是膜状压敏粘接剂层的层叠体可用于胶带、创可贴、低温支撑体、转印膜、标签、徽章及装饰或说明用的标示。进而，将本发明的有机聚硅氧烷组合物硬化而成的硬化层可用于汽车零件、玩具、电子电路、或键盘的组装。或者，将本发明的有机聚硅氧烷组合物硬化而成的硬化层、尤其是膜状压敏粘接剂层可用于层叠触摸屏或平板显示器的构建及利用。
作为基材的种类，可例示板纸、瓦楞纸、粘土涂层纸、聚烯烃层压纸、尤其是聚乙烯层压纸、合成树脂膜/片材、天然纤维布、合成纤维布、人工皮革布、金属箔。尤其优选合成树脂膜/片材，作为合成树脂，可例示聚酰亚胺、聚乙烯、聚丙烯、聚苯乙烯、聚氯乙烯、聚偏二氯乙烯、聚碳酸酯、聚对苯二甲酸乙二酯、环聚烯烃、尼龙。在尤其要求耐热性的情况下，优选聚酰亚胺、聚醚醚酮、聚萘二甲酸乙二酯(PEN)、液晶聚芳酯、聚酰胺酰亚胺、聚醚砜等耐热性合成树脂的膜。另一方面，在显示装置等要求视认性的用途中，优选透明基材、具体而言聚丙烯、聚苯乙烯、聚偏二氯乙烯、聚碳酸酯、聚对苯二甲酸乙二酯、PEN等透明材料。
所述基材优选膜状或片状。其厚度并不特别限制，能够根据用途以所需的厚度设计。进而，为了提高支撑膜与压敏粘接层的密接性，也可使用经底涂处理、电晕处理、蚀刻处理、等离子体处理的支撑膜。另外，膜状基材的与压敏粘接层面相反的面也可经防划痕、防污、防指纹附着、防眩、抗反射、抗静电等处理等表面处理。
作为对基材的涂布方法，能够无限制地使用凹版涂布、胶版涂布、胶版凹版、使用胶版转印辊式涂布机等的辊式涂布、逆辊涂布、气刀涂布、使用淋幕式平面涂装机等的淋幕式涂布、缺角轮涂布、迈耶棒式涂布、其它公知的用于形成硬化层的方法。
涂布量能够根据显示装置等用途而以所需的厚度设计，在尤其用作透明压敏粘接层的情况下，作为硬化后的压敏粘接层的厚度，为1～1,000μm，也可为5～900μm，还可为10～800μm，但并不限定于这些厚度。
在将本发明的有机聚硅氧烷组合物硬化而成的硬化层是压敏粘接剂层、尤其是实质上透明的压敏粘接剂膜的情况下，该硬化层优选作为以可剥离的状态粘着于具备具有剥离涂布能力的剥离层的膜基材上的层叠体膜处理。剥离层有时也被称为剥离衬垫、脱模层或者剥离涂布层，优选地，可为硅酮系剥离剂、氟系剥离剂、醇酸系剥离剂、或氟硅酮系剥离剂等具有剥离涂布能力的剥离层，也可在基材表面上物理性地形成微细凹凸，或是不易附着于本发明的压敏粘接层的基材其本身。尤其在本发明的层叠体中，作为剥离层，优选使用使氟硅酮系剥离剂硬化而成的剥离层。
将本发明的有机聚硅氧烷组合物硬化而成的硬化物作为电子材料、显示装置用构件或换能器用构件(包括传感器、扬声器、致动器、及发电机用)有用，该硬化物的优选用途是电子零件或显示装置的构件。尤其膜形状的硬化物、尤其是实质上透明的压敏粘接剂膜适合作为显示面板或显示器用的构件，尤其在能够通过用指尖等接触画面而操作机器、尤其是电子机器的所谓触摸面板用途中尤其有用。
尤其将本发明的有机聚硅氧烷组合物硬化而成的压敏粘接层能够实现与以往的硅酮压敏粘接层同等的压敏粘接特性，且能够不产生硬化不良或硬化性降低的问题地改善与显示装置等基材的密接性。
[显示面板或显示器用的构件]
将本发明的有机聚硅氧烷组合物硬化而成的硬化物能够用于层叠触摸屏或平板显示器的构建及利用，关于其具体使用方法，能够无特别限制地使用压敏粘接剂层(尤其是硅酮PSA(pressure sensitive adhesive，压敏胶))的公知的使用方法。
例如，将本发明的有机聚硅氧烷组合物硬化而成的硬化物能够作为所述日本专利特表2014-522436号(专利文献1)或日本专利特表2013-512326(专利文献2)等中公开的光学上透明的硅酮系压敏粘接剂膜或者粘着剂层而用于触摸面板等显示装置的制造。具体而言，将本发明的有机聚硅氧烷组合物硬化而成的硬化物能够无特别限制地用作专利文献2所记载的粘着层或粘着膜。
作为一例，本发明的触摸面板可为包含传导性塑料膜等基材、及硬化层的触摸面板，其中传导性塑料膜等基材在一面上形成有导电层，硬化层是将附着于形成有该导电层一侧或其相反侧的面的本发明的硬化性有机聚硅氧烷组合物硬化而成。该基材优选片状或膜状基材，可例示树脂膜或玻璃板。另外，所述传导性塑料膜也可为在一面上形成有ITO层的树脂膜或玻璃板、尤其是聚对苯二甲酸乙二酯膜。这些内容公开于所述日本专利特表2013-512326(专利文献2)等中。
除此以外，将本发明的有机聚硅氧烷组合物硬化而成的硬化物可用作触摸面板等显示装置的制造中所使用的偏光板用粘接膜，也可用作日本专利特开2013-065009号公报所记载的触摸面板与显示器模块间的贴合所使用的压敏粘接层。
[产业上的可利用性]
作为本发明的硬化反应性有机聚硅氧烷组合物、将其硬化而成的硬化物的用途，除了上文的公开内容以外，无任何制约，具备将该组合物硬化而成的硬化物的压敏粘接膜可用于电视接收机、计算机用显示器、便携式信息终端用显示器、监视用显示器、摄像机、数码相机、手机、便携式信息终端、汽车等的仪表盘用显示器、各种设备、装置、机器的仪表盘用显示器、自动售票机、现金自动存取款机、车载用显示装置、车载用透过型屏幕等用以显示文字或符号、图像的各种显示装置。这种显示装置的表面形状可为曲面状或弯曲形状而非平面，除了各种平板显示器(FPD)以外，也可例示用于汽车(包括电动汽车)或航空器等的曲面显示器或曲面透过型屏幕。进而，这些显示装置能够显示用来在屏幕或显示器上执行功能或程序的图标、或电子邮件、程序等的通知显示、汽车导航装置、音响装置、空调装置等各种装置的操作按钮，也可附加能够通过用手指触碰这些图标或通知显示、操作按钮而进行输入操作的触摸面板功能。作为装置，可应用于CRT(Cathode Ray Tube，阴极射线显像管)显示器、液晶显示器、等离子体显示器、有机EL(Electroluminance，电致发光)显示器、无机EL显示器、LED(Light Emitting Diode，发光二极管)显示器、表面电解显示器(SED)、场发射型显示器(FED)等显示装置、或利用这些显示装置的触摸面板。
将本发明的有机聚硅氧烷组合物硬化而成的压敏粘接层可实质上透明，因为不会产生硬化不良或硬化性降低的问题，且与各种显示装置等基材的密接性优异，所以能够良好地用于显示内容的视认性及操作性长时间良好的车辆用显示装置、尤其是具备曲面屏幕或曲面显示器且任意地具有触摸面板功能的车辆用显示装置。例如，在日本专利特开2017-047767号公报、日本专利特开2014-182335号公报、日本专利特开2014-063064号公报、日本专利特开2013-233852号公报等中公开了具备曲面状显示面的车辆用显示装置，本发明的压敏粘接层能够作为这些文献中的要求透明性的粘接层或粘着层的一部分或全部而良好地应用或置换。进而，当然，针对其它公知的曲面状显示装置，本发明的压敏粘接层形成性有机聚硅氧烷组合物也能够将现在使用的要求透明性的粘接层或粘着层置换而利用，为了进一步活用本发明的压敏粘接剂的优点，优选利用公知的方法调整显示装置的设计或构件的厚度。
此外，也可基于这些显示器表面的防划痕、防污、防指纹附着、抗静电、抗反射、防偷窥等目的而使用具备本发明的压敏粘接层的透明膜状基材。
实施例
以下，记述本发明的实施例及比较例。此外，各实施例、比较例中“硬化”意指通过各个硬化条件，各组合物完全硬化。
(硬化反应性有机聚硅氧烷组合物的制备)
使用表1所示的各成分，制备各实施例及比较例所示的硬化反应性有机聚硅氧烷组合物。
(粘着力测定)
将各组合物以硬化后的厚度成为50μm的方式涂布于PET(polyethyleneterephthalate，聚对苯二甲酸乙二酯)膜(东丽股份有限公司制造，产品名Lumirror(注册商标)#50-T60，厚度50μm)，并在120℃下使其硬化。将该试样切断为宽20mm，使用辊将粘着层面贴合于PMMA板(Paltec制造，ACRYLITE L001，50×120×2mm)或玻璃板(Paltec制造，浮法玻璃，JIS R3202，75×150×3mm)而制成试片。在使用PMMA板的情况下，在室温下放置30分钟后，在使用玻璃板的情况下，在100℃下进行老化至80小时为止，使用Orientec公司制造的RTC-1210拉伸试验机，依据JIS Z0237利用180°剥离试验方法以拉伸速度300mm/min测定粘着力(将20mm宽下的测定换算为表示单位N/25mm)。针对各组合物进行3次同样的粘着力测定试验，并示出其平均值。
表1中示出了硬化反应性有机聚硅氧烷组合物的材料。此外，各成分的粘度或塑化度是利用以下的方法在室温下进行测定的。
[粘度]
粘度(mPa·s)是使用依据JIS K7117-1的旋转粘度计测得的值，运动粘度(mm2/s)是利用依据JIS Z8803的乌氏粘度计测得的值。
[塑化度]
塑化度由依据JIS K 6249中规定的方法测得的值(将在25℃下对4.2g球状试样施加1kgf负载3分钟时的厚度读至1/100mm，并使该数值变成100倍)表示。
表1硬化反应性有机聚硅氧烷组合物的成分[表1]
注)表1中的各％表示重量％。
(实施例1)
将成分A-b的乙烯基官能性聚二甲基硅氧烷20.5重量份、成分A-c的乙烯基官能性聚二甲基硅氧烷0.004重量份、成分B的MQ硅酮树脂60.3重量份、成分C的两末端经三甲基硅烷氧基封阻的甲基氢聚硅氧烷0.20重量份、成分E-a的硬化延迟剂0.050重量份、甲苯19.2重量份在室温下充分混合，在混合物中添加成分D-b的铂系硅氢化反应催化剂0.10重量份，制成硬化反应性有机聚硅氧烷组合物。(C)成分中的SiH基相对于(A)成分中的烯基的量的摩尔比(SiH/Vi比)为29，铂金属相对于固形物成分的含量为10ppm。
使该组合物在硬化温度120℃下硬化3分钟，通过上文(粘着力测定)所示的方法测定对PMMA板的粘着力，将其评价结果等示于表2中。
(实施例2)
将成分A-a的乙烯基官能性聚二甲基硅氧烷25.6重量份、成分A-c的乙烯基官能性聚二甲基硅氧烷0.04重量份、成分B的MQ硅酮树脂56.4重量份、成分C的两末端经三甲基硅烷氧基封阻的甲基氢聚硅氧烷0.34重量份、成分E-b的硬化延迟剂0.21重量份、甲苯17.6重量份在室温下充分混合，在混合物中添加成分D-b的铂系硅氢化反应催化剂0.90重量份，制成硬化反应性有机聚硅氧烷组合物。SiH/Vi比为30，铂金属相对于固形物成分的含量为100ppm。
使该组合物在硬化温度120℃下硬化2分钟，通过上文(粘着力测定)所示的方法在100℃下进行老化至80小时为止，并测定对玻璃板的粘着力，将其评价结果等示于表3中。
(实施例3)
将成分A-a的乙烯基官能性聚二甲基硅氧烷25.6重量份、成分A-c的乙烯基官能性聚二甲基硅氧烷0.74重量份、成分B的MQ硅酮树脂56.4重量份、成分C的两末端经三甲基硅烷氧基封阻的甲基氢聚硅氧烷0.57重量份、成分E-b的硬化延迟剂0.21重量份、甲苯17.6重量份在室温下充分混合，在混合物中添加成分D-a的铂系硅氢化反应催化剂0.90重量份，制成硬化反应性有机聚硅氧烷组合物。SiH/Vi比为30，铂金属相对于固形物成分的含量为100ppm。
使该组合物在硬化温度120℃下硬化2分钟，通过上文(粘着力测定)所示的方法在100℃下进行老化至80小时为止，并测定对玻璃板的粘着力，将其评价结果等示于表3中。
(实施例4)
将成分A-a的乙烯基官能性聚二甲基硅氧烷21.6重量份、成分A-c的乙烯基官能性聚二甲基硅氧烷0.04重量份、成分B的MQ硅酮树脂63.2重量份、成分C的两末端经三甲基硅烷氧基封阻的甲基氢聚硅氧烷0.20重量份、成分E-b的硬化延迟剂0.20重量份、甲苯14.9重量份在室温下充分混合，在混合物中添加成分D-b的铂系硅氢化反应催化剂0.90重量份，制成硬化反应性有机聚硅氧烷组合物。SiH/Vi比为21.7，铂金属相对于固形物成分的含量为100ppm。
使该组合物在硬化温度120℃下硬化3分钟，通过上文(粘着力测定)所示的方法测定对PMMA板的粘着力，将其评价结果等示于表2中。
(实施例5)
将成分A-b的乙烯基官能性聚二甲基硅氧烷20.5重量份、成分A-c的乙烯基官能性聚二甲基硅氧烷0.16重量份、成分B的MQ硅酮树脂60.3重量份、成分C的两末端经三甲基硅烷氧基封阻的甲基氢聚硅氧烷0.20重量份、成分E-a的硬化延迟剂0.050重量份、甲苯19.2重量份在室温下充分混合，在混合物中添加成分D-a的铂系硅氢化反应催化剂0.20重量份，制成硬化反应性有机聚硅氧烷组合物。SiH/Vi比为24.3，铂金属相对于固形物成分的含量为22ppm。
使该组合物在硬化温度120℃下硬化3分钟，通过上文(粘着力测定)所示的方法测定对PMMA板的粘着力，将其评价结果等示于表2中。
(实施例6)
将成分A-b的乙烯基官能性聚二甲基硅氧烷20.5重量份、成分A-c的乙烯基官能性聚二甲基硅氧烷0.01重量份、成分B的MQ硅酮树脂60.3重量份、成分C的两末端经三甲基硅烷氧基封阻的甲基氢聚硅氧烷0.20重量份、成分E-a的硬化延迟剂0.050重量份、甲苯19.2重量份在室温下充分混合，在混合物中添加成分D-b的铂系硅氢化反应催化剂0.20重量份，制成硬化反应性有机聚硅氧烷组合物。SiH/Vi比为30.9，铂金属相对于固形物成分的含量为22ppm。
使该组合物在硬化温度120℃下硬化3分钟，通过上文(粘着力测定)所示的方法测定对PMMA板的粘着力，将其评价结果等示于表2中。
(参考例)
将成分A-a的乙烯基官能性聚二甲基硅氧烷21.6重量份、成分A-c的乙烯基官能性聚二甲基硅氧烷0.74重量份、成分B的MQ硅酮树脂63.2重量份、成分C的两末端经三甲基硅烷氧基封阻的甲基氢聚硅氧烷0.20重量份、成分E-b的硬化延迟剂0.20重量份、甲苯14.9重量份在室温下充分混合，在混合物中添加成分D-a的铂系硅氢化反应催化剂0.90重量份，制成硬化反应性有机聚硅氧烷组合物。SiH/Vi比为11.7，铂金属相对于固形物成分的含量为100ppm。
使该组合物在硬化温度120℃下硬化3分钟，通过上文(粘着力测定)所示的方法测定对PMMA板的粘着力，结果粘着力为20.5N/25mm。
(比较例1)
将成分A-b的乙烯基官能性聚二甲基硅氧烷20.5重量份、成分A-c的乙烯基官能性聚二甲基硅氧烷1.064重量份、成分B的MQ硅酮树脂60.3重量份、成分C的两末端经三甲基硅烷氧基封阻的甲基氢聚硅氧烷0.20重量份、成分E-a的硬化延迟剂0.050重量份、甲苯19.2重量份在室温下充分混合，在混合物中添加成分D-b的铂系硅氢化反应催化剂0.10重量份，制成硬化反应性有机聚硅氧烷组合物。SiH/Vi比为10，铂金属相对于固形物成分的含量为10ppm。
使该组合物在硬化温度120℃下硬化3分钟，通过上文(粘着力测定)所示的方法测定对PMMA板的粘着力，将其评价结果等示于表2中。
(比较例2)
将成分A-a的乙烯基官能性聚二甲基硅氧烷25.6重量份、成分A-c的乙烯基官能性聚二甲基硅氧烷0.74重量份、成分B的MQ硅酮树脂56.4重量份、成分C的两末端经三甲基硅烷氧基封阻的甲基氢聚硅氧烷0.21重量份、成分E-b的硬化延迟剂0.21重量份、甲苯17.6重量份在室温下充分混合，在混合物中添加成分D-a的铂系硅氢化反应催化剂0.90重量份，制成硬化反应性有机聚硅氧烷组合物。SiH/Vi比为10.7，铂金属相对于固形物成分的含量为100ppm。
使该组合物在硬化温度120℃下硬化2分钟，通过上文(粘着力测定)所示的方法在100℃下进行老化至80小时为止，测定对玻璃板的粘着力，将其评价结果等示于表3中。
(比较例3)
将成分A-a的乙烯基官能性聚二甲基硅氧烷25.6重量份、成分A-c的乙烯基官能性聚二甲基硅氧烷0.04重量份、成分B的MQ硅酮树脂56.4重量份、成分C的两末端经三甲基硅烷氧基封阻的甲基氢聚硅氧烷0.21重量份、成分E-b的硬化延迟剂0.21重量份、甲苯17.6重量份在室温下充分混合，在混合物中添加成分D-a的铂系硅氢化反应催化剂0.90重量份，制成硬化反应性有机聚硅氧烷组合物。SiH/Vi比为18.4，铂金属相对于固形物成分的含量为100ppm。
使该组合物在硬化温度120℃下硬化2分钟，通过上文(粘着力测定)所示的方法在100℃下进行老化至80小时为止，测定对玻璃板的粘着力，将其评价结果等示于表3中。
表2膜厚50μm的硬化层对PMMA板的粘着力[表2]
| 组合物 | 实施例1 | 实施例4 | 实施例5 | 实施例6 | 比较例1 |
| SiH/Vi比 | 29 | 21.7 | 24.3 | 30.9 | 10 |
| 粘着力(N/25mm) | 20.5 | 20.7 | 21.7 | 22.0 | 16.9 |
表3膜厚50μm的硬化层对玻璃板的粘着力(在100℃下进行老化后)[表3]
如表2所示，实施例的各组合物及使用其的硬化层尤其在硬化催化剂量少时(铂量10ppm或22ppm)的硬化性优异。另外，如表3所示，实施例的组合物对玻璃等极性表面的粘着性优异。另外，如表2等的实施例的组合物的粘着力及参考例的粘着力所示，本发明的组合物能够在与SiH/Vi比未达20的硅酮压敏粘接剂同等的范围内设计粘着力，在实用上能够实现充分的粘着力。
Claims (19)
1.一种压敏粘接层形成性有机聚硅氧烷组合物，其含有：
(A)分子内具有数量平均超过1的烯基的有机聚硅氧烷、
(B)有机聚硅氧烷树脂、
(C)分子内具有至少2个Si-H键的有机氢聚硅氧烷、及
(D)硅氢化反应催化剂，
(C)成分的量是(C)成分中的SiH基的量(物质量)相对于(A)成分中的烯基的量(物质量)及(B)成分中的烯基的量(物质量)之和的比(摩尔比)为20～60的量。
2.根据权利要求1所述的压敏粘接层形成性有机聚硅氧烷组合物，其中(C)成分的量是(C)成分中的SiH基的物质量相对于所述(A)成分中及(B)成分中的烯基的物质量之和的比(摩尔比)为22～50的量。
3.根据权利要求1或2所述的压敏粘接层形成性有机聚硅氧烷组合物，其特征在于，
(A)成分的至少一部分是(A1)在25℃下具有100,000mPa·s以上的粘度，或者依据JISK6249中规定的方法测得的塑化度处于50～200的范围的生橡胶状的含烯基有机聚硅氧烷，
(B)成分的至少一部分是(B1)包含R3SiO1/2单元(M单元)及SiO4/2单元(Q单元)，且可具有羟基或水解性基的树脂，式中，R为一价有机基，R的90摩尔％以上为碳数1～6的烷基或苯基，
(A1)成分中的烯基中的乙烯基(CH2＝CH)部分的含量为0.005～0.400重量％的范围，相对于组合物中的(A)成分与(C)成分之和100质量份，(B)成分处于1～500质量份的范围。
4.根据权利要求3所述的压敏粘接层形成性有机聚硅氧烷组合物，其中(A)成分是所述(A1)成分与(A2)25℃下的粘度未达100,000mPa·s的含烯基有机聚硅氧烷的混合物，双方的质量比为50：50～100：0的范围。
5.根据权利要求1至4中任一项所述的压敏粘接层形成性有机聚硅氧烷组合物，其还含有至少1种(E)硬化延迟剂。
6.根据权利要求1至5中任一项所述的压敏粘接层形成性有机聚硅氧烷组合物，其中从刚制备组合物后起在室温下8小时后的组合物的粘度相对于刚制备组合物后的粘度为1.5倍以内，且能在80～200℃下进行硬化。
7.根据权利要求1至6中任一项所述的压敏粘接层形成性有机聚硅氧烷组合物，其中固形物成分中的铂系金属的含量为0.1～200ppm的范围。
8.根据权利要求1至7中任一项所述的压敏粘接层形成性有机聚硅氧烷组合物，其特征在于，使该组合物硬化而成的厚度100μm硬化层实质上透明，且对具备使该组合物硬化而成的厚度50μm硬化层的厚度2mm聚甲基丙烯酸甲酯片材利用依据JIS Z 0237的180°剥离试验方法以拉伸速度300mm/min测得的粘着力为0.02N/25mm以上。
9.一种压敏粘接剂组合物，其包含根据权利要求1至8中任一项所述的压敏粘接层形成性有机聚硅氧烷组合物。
10.一种压敏粘接剂层，其是将根据权利要求1至8中任一项所述的压敏粘接层形成性有机聚硅氧烷组合物硬化而成。
11.根据权利要求10所述的压敏粘接剂层，其为膜状，且实质上透明。
12.一种层叠体，其在膜状基材上具备将根据权利要求1至8中任一项所述的压敏粘接层形成性有机聚硅氧烷组合物硬化而成的压敏粘接剂层。
13.根据权利要求12所述的层叠体，其在1个或2个以上的膜状基材上设置有针对该压敏粘接剂层的剥离层。
14.根据权利要求12或13所述的层叠体，其包含：
膜状基材；
第1剥离层，其形成于该膜状基材上；
压敏粘接剂层，其是在该剥离层上涂布根据权利要求1至8中任一项所述的压敏粘接层形成性有机聚硅氧烷组合物并使其硬化而形成；及
第2剥离层，其层叠于该压敏粘接剂层上。
15.一种电子材料或显示装置用构件，其是将根据权利要求1至8中任一项所述的压敏粘接层形成性有机聚硅氧烷组合物硬化而成。
16.一种电子零件或显示装置，其包含根据权利要求15所述的电子材料或显示装置用构件。
17.一种显示面板或显示器，其包含根据权利要求11所述的膜状且实质上透明的压敏粘接剂层。
18.一种触摸面板，其包含：基材，其在一面上形成有导电层；及压敏粘接剂层，其是将附着于所述基材的导电层或其相反侧的面的根据权利要求1至8中任一项所述的压敏粘接层形成性有机聚硅氧烷组合物硬化而成。
19.根据权利要求18所述的触摸面板，其中形成有所述导电层的基材是在一面上形成有ITO层的树脂膜或玻璃板。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017133255 | 2017-07-07 | ||
| JP2017-133255 | 2017-07-07 | ||
| PCT/JP2018/024553 WO2019009175A1 (ja) | 2017-07-07 | 2018-06-28 | 感圧接着層形成性オルガノポリシロキサン組成物およびその使用 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110997854A true CN110997854A (zh) | 2020-04-10 |
Family
ID=64950058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880051808.9A Pending CN110997854A (zh) | 2017-07-07 | 2018-06-28 | 压敏粘接层形成性有机聚硅氧烷组合物及其用途 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20200224069A1 (zh) |
| EP (1) | EP3650515A4 (zh) |
| JP (1) | JP7174696B2 (zh) |
| KR (1) | KR102515709B1 (zh) |
| CN (1) | CN110997854A (zh) |
| TW (1) | TWI779061B (zh) |
| WO (1) | WO2019009175A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114196374A (zh) * | 2022-01-13 | 2022-03-18 | 万华化学集团股份有限公司 | 适用于tpu膜通用型固化的高af屏粘合力有机硅压敏胶、制备方法及其应用 |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7003479B2 (ja) * | 2017-08-08 | 2022-01-20 | 王子ホールディングス株式会社 | 基材付き粘着テープ |
| WO2020026844A1 (ja) * | 2018-08-01 | 2020-02-06 | 信越化学工業株式会社 | シリコーン粘着剤組成物及びこれを用いた粘着テープ又は粘着フィルム |
| US11987731B2 (en) | 2018-08-10 | 2024-05-21 | Dow Toray Co., Ltd. | Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same |
| EP3875543A4 (en) * | 2018-10-30 | 2022-08-10 | Dow Toray Co., Ltd. | CURABLE REACTIVE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND USES OF COMPOSITION AND CURED PRODUCT |
| US11384344B2 (en) | 2018-12-17 | 2022-07-12 | The Broad Institute, Inc. | CRISPR-associated transposase systems and methods of use thereof |
| KR102378701B1 (ko) * | 2019-04-22 | 2022-03-24 | 삼성에스디아이 주식회사 | 실리콘계 점착성 보호 필름 및 이를 포함하는 광학 부재 |
| WO2020248181A1 (en) * | 2019-06-13 | 2020-12-17 | Dow Silicones Corporation | Silicone pressure sensitive adhesive composition and preparation and use thereof in protective films for ultrasonic fingerprint sensors |
| KR102669320B1 (ko) * | 2019-07-03 | 2024-05-28 | 다우 실리콘즈 코포레이션 | 플루오로실리콘 첨가제를 함유하는 실리콘 감압 접착제 조성물 및 이의 제조 및 사용 방법 |
| EP4015216A4 (en) * | 2019-08-13 | 2023-08-16 | Dow Toray Co., Ltd. | ORGANOPOLYSILOXA COMPOSITION WITH SELF-ADHESIVE COATING PROPERTIES AND USE OF SUCH COMPOSITION |
| JPWO2021029413A1 (zh) * | 2019-08-13 | 2021-02-18 | ||
| CN114269875B (zh) * | 2019-08-13 | 2024-05-14 | 陶氏东丽株式会社 | 压敏粘接层形成性聚有机硅氧烷组合物及其使用 |
| WO2021081822A1 (en) * | 2019-10-30 | 2021-05-06 | Dow Silicones Corporation | Solventless polyorganosiloxane pellets and processes for the preparation and use thereof |
| EP4051748A4 (en) * | 2019-10-31 | 2023-08-16 | Dow Silicones Corporation | SILICIONE-BASED PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND METHODS OF PREPARING AND USING IT |
| TW202132466A (zh) | 2019-12-27 | 2021-09-01 | 日商陶氏東麗股份有限公司 | 硬化性熱熔聚矽氧組成物、其硬化物、及含有上述組成物或硬化物之積層體 |
| JP7427552B2 (ja) * | 2020-07-10 | 2024-02-05 | 日東電工株式会社 | シリコーン系粘着剤及び粘着テープ |
| WO2022030120A1 (ja) * | 2020-08-06 | 2022-02-10 | ダウ・東レ株式会社 | 硬化性シリコーン組成物およびその硬化物 |
| FR3114412A1 (fr) * | 2020-09-22 | 2022-03-25 | Valeo Comfort And Driving Assistance | Dispositif d’affichage |
| TW202248394A (zh) * | 2021-05-31 | 2022-12-16 | 日商陶氏東麗股份有限公司 | 顯示裝置、尤其是觸覺顯示裝置及其設計方法 |
| CN113885235B (zh) * | 2021-10-09 | 2023-07-25 | 武汉华星光电半导体显示技术有限公司 | 显示装置及显示方法 |
| KR20240113301A (ko) | 2023-01-13 | 2024-07-22 | 알에프디바이스주식회사 | 하이브리드 방식의 5g 무선 주파수 필터링 장치 |
| KR20240113303A (ko) | 2023-01-13 | 2024-07-22 | 알에프디바이스주식회사 | 하이브리드 방식의 5g 무선 주파수 필터링 방법 |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4774297A (en) * | 1986-07-15 | 1988-09-27 | Toray Silicone, Co., Ltd. | Silicone pressure-sensitive adhesive composition |
| JPS6433176A (en) * | 1986-11-28 | 1989-02-03 | Toray Silicone Co | Pressure-sensitive silicone adhesive composition |
| CN101616995A (zh) * | 2006-12-28 | 2009-12-30 | 道康宁东丽株式会社 | 无溶剂的形成固化的防粘涂层的有机基聚硅氧烷组合物和具有固化的防粘涂层的片材形式的基底 |
| US20100279050A1 (en) * | 2009-04-30 | 2010-11-04 | Nitto Denko Corporation | Laminated film and process for producing semiconductor device |
| CN102656243A (zh) * | 2010-03-16 | 2012-09-05 | 乐金华奥斯有限公司 | 粘结薄膜及触控面板 |
| JP2013139515A (ja) * | 2011-12-29 | 2013-07-18 | Dow Corning Toray Co Ltd | シリコーン系感圧接着剤組成物、積層体およびシリコーン粘着テープ |
| US20140031734A1 (en) * | 2012-01-04 | 2014-01-30 | Momentive Performance Materials Inc. | Silicone adhesive compositions |
| CN103764784A (zh) * | 2011-06-02 | 2014-04-30 | 道康宁公司 | 厚膜压敏粘合剂及由其制得的层合结构 |
| CN104411733A (zh) * | 2012-06-29 | 2015-03-11 | 株式会社可乐丽 | (甲基)丙烯酸类树脂组合物的制造方法 |
| JP2015160922A (ja) * | 2014-02-28 | 2015-09-07 | フジコピアン株式会社 | 自己貼着性フィルム |
| CN104946172A (zh) * | 2014-03-31 | 2015-09-30 | 信越化学工业株式会社 | 压敏粘合剂组合物、压敏粘合偏振片和液晶显示装置 |
| CN102753641B (zh) * | 2010-01-13 | 2015-10-07 | 道康宁东丽株式会社 | 基于硅酮的可剥离粘合剂组合物 |
| WO2016139955A1 (ja) * | 2015-03-05 | 2016-09-09 | 東レ・ダウコーニング株式会社 | シリコーン系感圧接着剤、およびシリコーン系感圧接着層を有する積層体 |
| WO2016200562A1 (en) * | 2015-06-08 | 2016-12-15 | Momentive Performance Materials Inc. | Silicone pressure sensitive adhesive compositions and protective films containing the same |
| US20180037013A1 (en) * | 2015-03-05 | 2018-02-08 | Dow Corning Toray Co., Ltd. | Curable organopolysiloxane composition, a use thereof, and a laminate prepared from the composition |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5110882A (en) * | 1986-11-28 | 1992-05-05 | Dow Corning Toray Silicone Company, Ltd. | Silicone pressure-sensitive adhesive composition |
| EP0537784B1 (en) | 1991-10-18 | 1995-03-01 | Dow Corning Corporation | Silicone pressure sensitive adhesives having enhanced adhesion to low energy substrates |
| JP4180353B2 (ja) | 2002-11-18 | 2008-11-12 | 信越化学工業株式会社 | シリコーン粘着剤組成物及び粘着テープ |
| JP5553395B2 (ja) | 2006-06-08 | 2014-07-16 | 信越化学工業株式会社 | シリコーン粘着層を含む積層体 |
| JP2011012092A (ja) | 2009-06-30 | 2011-01-20 | Dow Corning Toray Co Ltd | 付加反応硬化型シリコーン感圧接着剤組成物、それを用いた感圧接着フィルムおよび感圧接着フィルムの製造方法 |
| JP5683848B2 (ja) * | 2009-07-01 | 2015-03-11 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物、該組成物からなる硬化層を備えたシート状物品およびその製造方法 |
| KR101095690B1 (ko) | 2009-07-29 | 2011-12-20 | 창원대학교 산학협력단 | 3축 로봇 및 이를 이용한 갠트리형 공작 시스템 |
| JP2012093985A (ja) * | 2010-10-27 | 2012-05-17 | Nitto Denko Corp | タッチ入力機能を有する表示パネル装置と該表示パネル装置のための光学ユニット、並びにその製造方法 |
| CN102999200A (zh) | 2011-09-18 | 2013-03-27 | 宸鸿科技(厦门)有限公司 | 触控显示装置及其制造方法 |
| JP6024035B2 (ja) | 2012-05-08 | 2016-11-09 | 株式会社ユピテル | 車載用表示装置 |
| JP2014063064A (ja) | 2012-09-21 | 2014-04-10 | Dainippon Printing Co Ltd | 車載用表示装置、及び車載用透過型曲面スクリーン |
| JP2014182335A (ja) | 2013-03-21 | 2014-09-29 | Dainippon Printing Co Ltd | 粘着層付き車載用曲面スクリーン部材、車載用曲面スクリーン及び車載用表示装置 |
| US20160329562A1 (en) * | 2014-12-16 | 2016-11-10 | Sanyo Electric Co., Ltd. | Negative electrode active material for nonaqueous electrolyte secondary batteries and nonaqueous electrolyte secondary battery containing negative electrode active material |
| JPWO2016163069A1 (ja) * | 2015-04-10 | 2018-02-01 | 東レ・ダウコーニング株式会社 | フルオロアルキル基含有硬化性オルガノポリシロキサン組成物、その硬化物および当該硬化物を備えた電子部品または表示装置 |
| JP6409715B2 (ja) | 2015-09-01 | 2018-10-24 | 株式会社デンソー | 車両用表示装置 |
-
2018
- 2018-06-28 WO PCT/JP2018/024553 patent/WO2019009175A1/ja unknown
- 2018-06-28 JP JP2019527660A patent/JP7174696B2/ja active Active
- 2018-06-28 CN CN201880051808.9A patent/CN110997854A/zh active Pending
- 2018-06-28 US US16/628,961 patent/US20200224069A1/en not_active Abandoned
- 2018-06-28 KR KR1020207002254A patent/KR102515709B1/ko active IP Right Grant
- 2018-06-28 EP EP18827418.7A patent/EP3650515A4/en active Pending
- 2018-07-04 TW TW107123217A patent/TWI779061B/zh active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4774297A (en) * | 1986-07-15 | 1988-09-27 | Toray Silicone, Co., Ltd. | Silicone pressure-sensitive adhesive composition |
| JPS6433176A (en) * | 1986-11-28 | 1989-02-03 | Toray Silicone Co | Pressure-sensitive silicone adhesive composition |
| CN101616995A (zh) * | 2006-12-28 | 2009-12-30 | 道康宁东丽株式会社 | 无溶剂的形成固化的防粘涂层的有机基聚硅氧烷组合物和具有固化的防粘涂层的片材形式的基底 |
| US20100279050A1 (en) * | 2009-04-30 | 2010-11-04 | Nitto Denko Corporation | Laminated film and process for producing semiconductor device |
| CN102753641B (zh) * | 2010-01-13 | 2015-10-07 | 道康宁东丽株式会社 | 基于硅酮的可剥离粘合剂组合物 |
| CN102656243A (zh) * | 2010-03-16 | 2012-09-05 | 乐金华奥斯有限公司 | 粘结薄膜及触控面板 |
| CN103764784A (zh) * | 2011-06-02 | 2014-04-30 | 道康宁公司 | 厚膜压敏粘合剂及由其制得的层合结构 |
| JP2013139515A (ja) * | 2011-12-29 | 2013-07-18 | Dow Corning Toray Co Ltd | シリコーン系感圧接着剤組成物、積層体およびシリコーン粘着テープ |
| US20140031734A1 (en) * | 2012-01-04 | 2014-01-30 | Momentive Performance Materials Inc. | Silicone adhesive compositions |
| CN104411733A (zh) * | 2012-06-29 | 2015-03-11 | 株式会社可乐丽 | (甲基)丙烯酸类树脂组合物的制造方法 |
| JP2015160922A (ja) * | 2014-02-28 | 2015-09-07 | フジコピアン株式会社 | 自己貼着性フィルム |
| CN104946172A (zh) * | 2014-03-31 | 2015-09-30 | 信越化学工业株式会社 | 压敏粘合剂组合物、压敏粘合偏振片和液晶显示装置 |
| WO2016139955A1 (ja) * | 2015-03-05 | 2016-09-09 | 東レ・ダウコーニング株式会社 | シリコーン系感圧接着剤、およびシリコーン系感圧接着層を有する積層体 |
| US20180037013A1 (en) * | 2015-03-05 | 2018-02-08 | Dow Corning Toray Co., Ltd. | Curable organopolysiloxane composition, a use thereof, and a laminate prepared from the composition |
| WO2016200562A1 (en) * | 2015-06-08 | 2016-12-15 | Momentive Performance Materials Inc. | Silicone pressure sensitive adhesive compositions and protective films containing the same |
Non-Patent Citations (3)
| Title |
|---|
| YUSONG QI等: "Synthesis and Properties of Ultraviolet/Moisture Dual-", 《WILEY INTERSCIENCE》 * |
| 关锦文 主编: "《移动互联网技术应用基础》", 31 January 2015, 广州：华南理工大学出版社 * |
| 李连春 等: "非功能性压敏胶在智能手机中的应用", 《粘接》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114196374A (zh) * | 2022-01-13 | 2022-03-18 | 万华化学集团股份有限公司 | 适用于tpu膜通用型固化的高af屏粘合力有机硅压敏胶、制备方法及其应用 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7174696B2 (ja) | 2022-11-17 |
| WO2019009175A1 (ja) | 2019-01-10 |
| KR102515709B1 (ko) | 2023-04-03 |
| TW201906978A (zh) | 2019-02-16 |
| KR20200028400A (ko) | 2020-03-16 |
| US20200224069A1 (en) | 2020-07-16 |
| JPWO2019009175A1 (ja) | 2020-05-21 |
| TWI779061B (zh) | 2022-10-01 |
| EP3650515A4 (en) | 2021-04-28 |
| EP3650515A1 (en) | 2020-05-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110997854A (zh) | 压敏粘接层形成性有机聚硅氧烷组合物及其用途 | |
| CN112703240B (zh) | 压敏粘接层形成性聚有机硅氧烷组合物及其使用 | |
| CN112673073B (zh) | 压敏粘接层形成性聚有机硅氧烷组合物及其使用 | |
| CN112654687B (zh) | 压敏粘接层形成性聚有机硅氧烷组合物及其使用 | |
| CN113286863B (zh) | 有机硅粘合剂组合物及其用途 | |
| JP7491655B2 (ja) | シリコーン感圧接着剤組成物およびその用途 | |
| KR102615831B1 (ko) | 경화 반응성 오가노폴리실록산 조성물, 이를 이용한 감압 접착제 조성물 및 그 사용 | |
| CN116507428A (zh) | 有机硅粘合剂组合物以及其用途 | |
| CN115777004B (zh) | 固化性有机硅组合物及其固化物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200410 |