CN110994116B - Heat radiation structure and antenna module of antenna - Google Patents
Heat radiation structure and antenna module of antenna Download PDFInfo
- Publication number
- CN110994116B CN110994116B CN201911354103.7A CN201911354103A CN110994116B CN 110994116 B CN110994116 B CN 110994116B CN 201911354103 A CN201911354103 A CN 201911354103A CN 110994116 B CN110994116 B CN 110994116B
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- 230000005855 radiation Effects 0.000 title claims description 8
- 230000017525 heat dissipation Effects 0.000 claims abstract description 75
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 238000009434 installation Methods 0.000 claims abstract description 12
- 238000007789 sealing Methods 0.000 claims description 23
- 230000001681 protective effect Effects 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 8
- 238000001125 extrusion Methods 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 210000002421 cell wall Anatomy 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000004512 die casting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a heat dissipation structure of an antenna, wherein the antenna comprises a circuit board and a control chip arranged on the circuit board; the heat dissipation base is provided with a bottom wall and an installation cavity for accommodating the antenna; the bottom wall comprises a first substrate, an annular enclosing plate extending from the first substrate to the direction close to the antenna and extending into the mounting cavity, and a second substrate covering the annular enclosing plate; the radiating fin unit comprises a first radiating fin fixed on the first substrate and extending from the first substrate to the direction far away from the mounting cavity, and a second radiating fin located in the annular enclosing plate, fixed on the second substrate and extending from the second substrate to the direction far away from the mounting cavity; the length of the second radiating fin is greater than that of the first radiating fin; the control chip is mounted on the second substrate. The invention improves the heat dissipation efficiency of the position of the control chip on the basis of ensuring that the whole thickness is not changed. The invention also provides an antenna assembly.
Description
[ technical field ] A method for producing a semiconductor device
The present disclosure relates to heat dissipation structures, and particularly to a heat dissipation structure of an antenna and an antenna assembly.
[ background of the invention ]
With the gradual commercialization of the next generation mobile communication technology (5G) in the present year, operators and equipment manufacturers have made higher requirements on the base station antenna, and the miniaturization, light weight and low cost become important assessment indexes of the quality of the base station antenna.
The existing base station antenna comprises an antenna, a base and radiating fins, wherein the antenna is installed in an inner cavity of the base, and the radiating fins are installed outside the base; as shown in fig. 1-2, the antenna includes a circuit board 11 and a control chip 12 mounted on the circuit board 11, and during use, the control chip outputs more heat. However, the height of the antenna base is one of the factors affecting the miniaturization of the antenna base, and in order to ensure the miniaturization of the overall height of the base station antenna, the height of the heat dissipation fins mounted on the base is short, which results in insufficient heat dissipation at the position of the control chip, and further affects the use of the base station antenna.
[ summary of the invention ]
One objective of the present invention is to provide a heat dissipation structure of an antenna, which improves the heat dissipation efficiency of the position of a control chip on the basis of ensuring that the overall thickness is not changed.
It is another object of the present invention to provide an antenna assembly.
One of the purposes of the invention is realized by adopting the following technical scheme:
a heat dissipation structure of an antenna comprises a circuit board and a control chip arranged on the circuit board, wherein the heat dissipation structure of the antenna comprises a heat dissipation base and a heat dissipation fin unit; the heat dissipation base is provided with a bottom wall and an installation cavity which is positioned on one side of the bottom wall and used for accommodating the antenna; the heat dissipation fin unit is positioned on the other side of the bottom wall; the bottom wall comprises a first substrate, an annular enclosing plate and a second substrate, wherein the annular enclosing plate extends from the first substrate to the direction close to the antenna and extends into the mounting cavity, and the second substrate is covered on one side, far away from the first substrate, of the annular enclosing plate and is parallel to the first substrate; the radiating fin unit comprises a first radiating fin fixed on the first substrate and extending from the first substrate to a direction far away from the mounting cavity, and a second radiating fin positioned in the annular enclosing plate and fixed on the second substrate; the second radiating fins extend from the second base plate to the direction far away from the mounting cavity, and the length of the second radiating fins is greater than that of the first radiating fins; the control chip is mounted on the second substrate.
As an improved mode, the number of the first radiating fins is multiple, and the multiple first radiating fins are parallel to each other and distributed at intervals; the number of the second radiating fins is multiple, and the multiple second radiating fins are parallel to each other and distributed at intervals.
As a modification, ends of the first heat dissipating fins and the second heat dissipating fins remote from the bottom wall are flush with each other.
As an improvement, a plurality of bosses are arranged on the surface of the second substrate facing the mounting cavity at intervals, and mounting grooves are formed on the bosses in a recessed manner in the direction of the second substrate; the circuit board is abutted to the boss, and the control chip is contained in the mounting groove.
As a modification, the surface of the boss facing the circuit board is covered with a first heat conduction layer; the cell wall of mounting groove covers there is the second heat-conducting layer.
As an improvement mode, the heat dissipation base is made of aluminum alloy.
The second purpose of the invention is realized by adopting the following technical scheme:
an antenna assembly comprising an antenna, a protective cover and a heat dissipating structure for the antenna as described above; the heat dissipation base is provided with an opening for communicating the installation cavity with the outside, and the opening can be used for the antenna to enter and exit; the protective cover is connected with the heat dissipation base and covers the opening; and a sealing element is arranged between the protective cover and the heat dissipation base.
As an improved mode, the heat dissipation base is provided with an embedded groove extending circumferentially around the opening; the sealing element is embedded in the embedded groove; the safety cover includes the safety cover body and by the peripheral extrusion wall that downwardly extending formed of safety cover body, the extrusion wall inserts in the inlay groove and the extrusion sealing member.
As an improvement mode, the sealing element is a sealing ring, and the cross section of the embedded groove is annular; the cross-sectional shape of the pressing wall is the same as the cross-sectional shape of the insert groove.
Compared with the prior art, the second substrate which is arranged in the mounting cavity relative to the first substrate is arranged on the bottom wall of the heat dissipation base, and the second heat dissipation fins and the control chip are respectively arranged on two sides of the second substrate, so that the mounting depth of the second heat dissipation fins is prolonged by adopting the space of the mounting cavity, the depth of the second heat dissipation fins corresponding to the control chip is increased on the basis of ensuring that the whole thickness is unchanged, the length of the second heat dissipation fins is prolonged, and the heat dissipation efficiency of the position of the control chip is further improved.
[ description of the drawings ]
Fig. 1 is a schematic structural diagram of a conventional antenna;
FIG. 2 is an enlarged view of a portion A of FIG. 1 according to the present invention;
FIG. 3 is a sectional view of an antenna assembly of the present invention in a disassembled configuration;
FIG. 4 is a schematic diagram of a disassembled structure of the antenna assembly of the present invention;
fig. 5 is a sectional view of an assembled structure of the antenna assembly of the present invention.
In the figure: 10. an antenna; 11. a circuit board; 12. a control chip; 20. a heat dissipation base; 21. a bottom wall; 211. a first substrate; 212. an annular coaming; 213. a second substrate; 22. an opening; 23. a mounting cavity; 24. embedding a groove; 30. a heat dissipating fin unit; 31. a first heat radiation fin; 32. a second heat radiation fin; 40. a boss; 50. mounting grooves; 60. a protective cover; 61. a protective cover body; 62. extruding the wall; 70. a seal member; 80. a gap.
[ detailed description ] embodiments
The invention is further described with reference to the following figures and embodiments.
It should be noted that all directional indicators (such as upper, lower, left, right, front, back, inner, outer, top, bottom … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components in a specific posture (as shown in the figure), and if the specific posture is changed, the directional indicator is changed accordingly.
It will also be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Referring to fig. 1-5, the present invention provides a heat dissipation structure of an antenna, wherein the antenna 10 includes a circuit board 11 and a control chip 12 disposed on the circuit board 11; the heat dissipation structure of the antenna comprises a heat dissipation base 20 and a heat dissipation fin unit 30; the heat dissipation base 20 has a bottom wall 21, and is provided with a mounting cavity 23 located at one side of the bottom wall 21 for accommodating the antenna 10, preferably, the mounting cavity 23 can completely accommodate the antenna 10 therein; the radiating fin unit 30 is positioned on the other side of the bottom wall 21; the bottom wall 21 includes a first substrate 211, an annular shroud 212 extending from the first substrate 211 in a direction close to the antenna 10 and extending into the mounting cavity 23, and a second substrate 213 covering a side of the annular shroud 212 away from the first substrate 211 and parallel to the first substrate 211, it being understood that the second substrate 213 is located in the mounting cavity 23; it should be noted that "annular" of the annular enclosing plate 212 means that the extending track of the annular enclosing plate 212 is in an end-to-end closed structure, and is not limited to square, circular, etc.; the radiating fin unit 30 comprises a first radiating fin 31 fixed on the first substrate 211 and extending from the first substrate 211 to a direction away from the mounting cavity 23, and a second radiating fin 32 located in the annular shroud 212 and fixed on the second substrate 213; the second heat dissipation fins 32 extend from the second base plate 213 to a direction away from the mounting cavity 23, and the length of the second heat dissipation fins 32 is greater than that of the first heat dissipation fins 31; the control chip 12 is mounted on the second substrate 213; so set up, through forming the second base plate 213 that is located the installation cavity 23, and fix second radiating fin 32 and control chip 12 respectively in the both sides of second base plate 213, so, adopt the space of installation cavity 23 to prolong the installation depth of second radiating fin 32, thereby can be on the unchangeable basis of ensureing whole thickness, increase the degree of depth with the corresponding second radiating fin 32 of control chip 12, prolong the length of second radiating fin 32, and then improve the radiating efficiency of control chip 12 position.
It should be noted that the first heat dissipation fin 31 is in contact with the first substrate 211, and the second heat dissipation fin 32 is in contact with the second substrate 213, so that heat generated by the antenna 10 can be transferred to the first heat dissipation fin 31 and the second heat dissipation fin 32 through the heat dissipation base 20.
Specifically, the heat dissipation base 20, the first heat dissipation fins 31 and the second heat dissipation fins 32 may be integrally formed by die casting or formed by CNG machining.
As an improvement of the present invention, a plurality of first heat dissipating fins 31 and a plurality of second heat dissipating fins 32 may be provided, which may further improve the heat dissipating effect; as a further improvement of the present invention, a plurality of first heat dissipating fins 31 may be arranged in parallel and at intervals, and a plurality of second heat dissipating fins 32 may be arranged in parallel and at intervals, so that the first heat dissipating fins 31 and the second heat dissipating fins 32 may be ensured to be in sufficient contact with the outside air, respectively, to ensure heat dissipating efficiency.
As a further improvement of the present invention, the ends of the first heat dissipating fins 31 and the second heat dissipating fins 32 away from the bottom wall 21 are flush with each other; thus, the heights of the first heat dissipation fins 31 and the second heat dissipation fins 32 are maximized on the basis of ensuring that the overall height is unchanged, and the optimal heat dissipation efficiency is obtained.
Specifically, a plurality of bosses 40 are arranged on the surface of the second substrate 213 facing the mounting cavity 23 at intervals, and at this time, a gap 80 is formed between adjacent bosses 40, and the gap 80 is convenient for line debugging or other component mounting of the antenna 10; more specifically, the boss 40 is recessed toward the second substrate 213 to form a mounting groove 50; the circuit board 11 is abutted to the boss 40, and the control chip 12 is accommodated in the mounting groove 50, so that the mounting height of the control chip 12 can be reduced to make up the height of the boss 40, and the overall height is controlled.
It should be noted that, in the actual production, the size of the mounting groove 50 can be processed according to the size of the control chip 12, and the most preferable scheme is that the mounting groove 50 completely accommodates the control chip 12; moreover, the number and the opening positions of the mounting slots 50 can be determined according to the number and the positions of the control chips 12, and the mounting slots 50 and the control chips 12 can be arranged in a one-to-one correspondence manner.
Since the antenna 10 is horizontal, in order to ensure that the control chip 12 can be smoothly inserted into the mounting groove 50, the bottom of the mounting groove 50 is preferably processed to be horizontal.
As a further improvement of the present invention, the surface of the boss 40 facing the circuit board 11 is covered with a first heat conduction layer, and in practical use, it is most preferable that the first heat conduction layer completely covers the boss 40; correspondingly, the wall of the mounting groove 50 is covered with a second heat conduction layer, and the second heat conduction layer is connected with the first heat conduction layer; in this way, after the antenna 10 is installed in the installation cavity 23, the antenna array of the antenna 10 is in contact with the first heat conduction layer, and heat of the antenna array of the antenna 10 is transferred to the heat dissipation base 20 through the first heat conduction layer; the control chip 12 contacts the second heat conducting layer, the heat generated by the control chip 12 is directly transferred to the heat dissipation base 20 through the second heat conducting layer, and at this time, the arrangement of the first heat conducting layer and the second heat conducting layer can improve the heat conduction capability of the antenna 10 and the heat dissipation structure of the antenna, thereby improving the heat dissipation efficiency. It should be noted that the second heat conduction layer is connected to the first heat conduction layer, so that the heat generated by the control chip 12 can be transferred to the first heat conduction layer after being transferred to the second heat conduction layer, and then transferred to the heat dissipation base 20.
The first heat conduction layer can be a heat conduction silicone layer or a heat conduction adhesive tape layer; the second heat conduction layer can also be a heat conduction silicone layer or a heat conduction adhesive tape layer.
Furthermore, the mounting groove 50 is matched with the control chip 12, so that the control chip 12 and the second heat conduction layer can be completely contacted, and the heat emitted by the control chip 12 of the antenna 10 can be effectively transferred.
Specifically, the heat dissipation base 20 is made of aluminum alloy, which has high heat conductivity and can transfer most of heat to the first heat dissipation fins 31 and the second heat dissipation fins 32, thereby ensuring the heat dissipation effect; it should be noted that the heat dissipation base 20 can be made of other materials with high thermal conductivity.
Referring to fig. 3-5, the present invention further discloses an antenna assembly, which includes an antenna 10, a protective cover 60, and the heat dissipation structure of the antenna; an opening 22 is formed in the heat dissipation base 20, and the opening 22 is communicated with the mounting cavity 23 and the outside; wherein, the opening 22 is accessible for the antenna 10, so that the antenna 10 is installed in the installation cavity 23 through the opening 22; the protective cover 60 is connected with the heat dissipation base 20 and covers the opening 22, so that the antenna 10 can be protected; a sealing member 70 is provided between the protective cover 60 and the heat dissipation base 20 to improve the sealing effect so as to prevent moisture and the like from entering the installation cavity 23.
As an improvement of the present invention, the heat dissipation base 20 is provided with an embedded groove 24 extending circumferentially around the opening 22; the sealing member 70 is embedded in the embedding groove 24, and it can be understood that the embedding groove 24 is provided with a notch, and the sealing member 70 enters the embedding groove 24 through the notch; the protective cover 60 includes a protective cover body 61 and a pressing wall 62 formed by extending downward from the periphery of the protective cover body 61, the pressing wall 62 is inserted into the insertion groove 24 and presses the sealing member 70, so that the sealing member 70 is contacted with the pressing wall 62 and the heat dissipation base 20 respectively more closely by pressing, and a better sealing effect is achieved; furthermore, the engagement structure of the pressing wall 62 and the groove wall of the insertion groove 24 can further prevent moisture from entering the installation cavity 23.
Specifically, the sealing element 70 is a sealing ring, and the cross section of the embedding groove 24 is annular; the cross-sectional shape of the pressing wall 62 is the same as that of the caulking groove 24, so that a complete sealing effect is achieved for the circumferential direction of the opening 22; it should be noted that the above-mentioned "ring" refers to a structure with an extending track closed end to end, and is not limited to a circle, an ellipse, a square, etc.
The sealing ring can also adopt a plurality of sheet sealing gaskets, and the plurality of sealing gaskets are fully paved in the embedding groove for 24 circles.
Claims (8)
1. A heat radiation structure of an antenna comprises a circuit board and a control chip arranged on the circuit board, and is characterized in that the heat radiation structure of the antenna comprises a heat radiation base and a heat radiation fin unit; the heat dissipation base is provided with a bottom wall and an installation cavity which is positioned on one side of the bottom wall and used for accommodating the antenna; the heat dissipation fin unit is positioned on the other side of the bottom wall; the bottom wall comprises a first substrate, an annular enclosing plate and a second substrate, wherein the annular enclosing plate extends from the first substrate to the direction close to the antenna and extends into the mounting cavity, and the second substrate is covered on one side, far away from the first substrate, of the annular enclosing plate and is parallel to the first substrate; the radiating fin unit comprises a first radiating fin fixed on the first substrate and extending from the first substrate to a direction far away from the mounting cavity, and a second radiating fin positioned in the annular enclosing plate and fixed on the second substrate; the second radiating fins extend from the second base plate to the direction far away from the mounting cavity, and the length of the second radiating fins is greater than that of the first radiating fins; the control chip is mounted on the second substrate;
a plurality of bosses are arranged on the surface of the second substrate facing the mounting cavity at intervals, and mounting grooves are formed in the bosses in a recessed mode in the direction of the second substrate; the circuit board is abutted against the boss, and the control chip is accommodated in the mounting groove; a gap is formed between the adjacent bosses.
2. The heat dissipation structure of claim 1, wherein the number of the first heat dissipation fins is multiple, and the multiple first heat dissipation fins are parallel to each other and are distributed at intervals; the number of the second radiating fins is multiple, and the multiple second radiating fins are parallel to each other and distributed at intervals.
3. The heat dissipation structure of antenna according to claim 1, wherein ends of the first and second heat dissipation fins remote from the bottom wall are flush with each other.
4. The heat dissipation structure of an antenna according to claim 1, wherein a surface of the boss facing the circuit board is covered with a first heat conductive layer; the cell wall of mounting groove covers there is the second heat-conducting layer.
5. The heat dissipation structure of claim 1, wherein the heat dissipation base is made of an aluminum alloy.
6. An antenna assembly comprising an antenna, a protective cover and a heat dissipating structure of the antenna according to any one of claims 1 to 5; the heat dissipation base is provided with an opening for communicating the installation cavity with the outside, and the opening can be used for the antenna to enter and exit; the protective cover is connected with the heat dissipation base and covers the opening; and a sealing element is arranged between the protective cover and the heat dissipation base.
7. The antenna assembly of claim 6, wherein the heat-dissipating base defines a recessed slot extending circumferentially around the opening; the sealing element is embedded in the embedded groove; the safety cover includes the safety cover body and by the peripheral extrusion wall that downwardly extending formed of safety cover body, the extrusion wall inserts in the inlay groove and the extrusion sealing member.
8. The antenna assembly of claim 7, wherein the sealing member is a sealing ring, and the cross section of the recessed groove is annular; the cross-sectional shape of the pressing wall is the same as the cross-sectional shape of the insert groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911354103.7A CN110994116B (en) | 2019-12-24 | 2019-12-24 | Heat radiation structure and antenna module of antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911354103.7A CN110994116B (en) | 2019-12-24 | 2019-12-24 | Heat radiation structure and antenna module of antenna |
Publications (2)
| Publication Number | Publication Date |
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| CN110994116A CN110994116A (en) | 2020-04-10 |
| CN110994116B true CN110994116B (en) | 2022-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911354103.7A Active CN110994116B (en) | 2019-12-24 | 2019-12-24 | Heat radiation structure and antenna module of antenna |
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| CN (1) | CN110994116B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN110994116A (en) | 2020-04-10 |
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