CN210324066U - Computer board heat dissipation device and electric control box - Google Patents
Computer board heat dissipation device and electric control box Download PDFInfo
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- CN210324066U CN210324066U CN201921235175.5U CN201921235175U CN210324066U CN 210324066 U CN210324066 U CN 210324066U CN 201921235175 U CN201921235175 U CN 201921235175U CN 210324066 U CN210324066 U CN 210324066U
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- heat dissipation
- computer board
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- board body
- groove
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Abstract
The utility model provides a computer board heat dissipation device and an electric control box body, the computer board heat dissipation device comprises a computer board body and a heat dissipation assembly, the heat dissipation assembly comprises a heat dissipation substrate and heat dissipation fins, the heat dissipation substrate is provided with groove parts, and the heat dissipation fins are hollow; the computer board body is arranged on the heat dissipation substrate and covers the notch of the groove portion, the front side of the computer board body deviates from the groove portion and the heat dissipation fins, the hollow space of the heat dissipation fins is communicated with the inner space of the groove portion, and the heat dissipation medium located on the back side of the computer board body is filled in the groove portion and the hollow space of the heat dissipation fins. The utility model discloses computer board heat abstractor, its fin be hollow structure and with the concave part intercommunication of heat dissipation base plate to pack in the concave part and the cavity space of fin and be located the heat dissipation medium on the computer board body back side, the heat dissipation medium plays the radiating action equally, and can reduce the clearance between fin and the computer board body as far as possible, thereby has improved the radiating efficiency greatly, makes the heat dissipation more even.
Description
Technical Field
The utility model relates to a computer board heat abstractor installs this heat abstractor's automatically controlled box and has this automatically controlled box's cooling water set.
Background
The electronic control box body can generate a large amount of heat during operation, but because the box body needs to be waterproof and dustproof, the sealing performance is high, the heat in the box body cannot be quickly discharged, and particularly, components in the box body generate much heat during operation of a computer board. In the prior art, the computer board usually adopts the radiating fins to dissipate heat, however, because a gap exists between the computer board and the radiating fins, heat can not be quickly conducted to the radiating fins, so that the heat dissipation is uneven and the efficiency is low, the heat in the box body can not be quickly discharged, and the computer board is easy to damage after long-time work.
SUMMERY OF THE UTILITY MODEL
The utility model discloses adopt the fin heat dissipation to the automatically controlled box computer board that exists among the prior art, the inhomogeneous and inefficiency problem of heat dissipation has provided a computer board heat abstractor and automatically controlled box.
In order to solve the above technical problem, the computer board heat dissipation device provided by the present invention adopts the following technical solution to realize: a computer board heat sink comprises a computer board body and a heat dissipation assembly, wherein the heat dissipation assembly comprises:
a heat dissipation substrate having a groove portion formed thereon;
a plurality of heat dissipation fins, which are arranged on the heat dissipation substrate and are positioned on the back surface of the groove part, wherein the heat dissipation fins are hollow and are provided with openings communicated with the hollow spaces, and the openings face the groove part;
the computer board body is arranged on the radiating substrate and covers the notch of the groove part, the front side of the computer board body deviates from the groove part and the radiating fins, the groove part is provided with through holes which are in one-to-one correspondence with the radiating fins so as to communicate the hollow space of the radiating fins with the inner space of the groove part through the openings, and radiating media positioned on the back side of the computer board body are filled in the groove part and the hollow space of the radiating fins.
The heat dissipation medium is in contact with the back side of the computer board body.
The heat dissipation medium is heat dissipation paste.
The heat dissipation substrate is provided with a positioning groove matched with the computer board body, the computer board body is embedded in the positioning groove, and a sealing ring for preventing the heat dissipation medium from overflowing is arranged between the positioning groove and the computer board body.
And a circle of sealing ring mounting groove is formed in the circumferential groove wall of the positioning groove, and the sealing ring is embedded in the sealing ring mounting groove.
The heat dissipation assembly further includes:
the heat radiating fin protective cover is used for preventing the heat radiating fin from being touched, and comprises two oppositely arranged fixed connecting parts and a shielding part connected with the two fixed connecting parts, wherein the fixed connecting parts are fixedly connected on the heat radiating base plate, and the shielding part and the heat radiating base plate are used for clamping the heat radiating fin in the middle.
The cover plate portion has an inclined portion inclined to a side away from the heat radiating fins.
The utility model also provides an automatically controlled box, including foretell computer board heat abstractor.
Compared with the prior art, the utility model discloses computer board heat abstractor, its fin be hollow structure and with the concave part intercommunication of heat dissipation base plate to pack in the concave part and the cavity space of fin and be located the heat dissipation medium on the computer board body back side, heat dissipation medium plays the radiating action equally, and can reduce the clearance between fin and the computer board body as far as possible, thereby has improved the radiating efficiency greatly, makes the heat dissipation more even.
Other features and advantages of the present invention will become more apparent from the following detailed description of the invention when read in conjunction with the accompanying drawings.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural view of the electric control box of the present invention;
FIG. 2 is a schematic view of an assembly structure of the heat dissipation device of the computer board of the present invention;
FIG. 3 is an exploded view of FIG. 2;
FIG. 4 is a cross-sectional view of FIG. 2;
fig. 5 is a schematic structural view of the computer board heat dissipation device of the present invention with a protective cover for the heat dissipation sheet.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and embodiments.
Referring to fig. 1, an electronic control box 1, such as an electronic control box of a water cooling unit, of the present embodiment includes a computer board heat dissipation device 100 for dissipating heat of a computer board body. Specifically, as shown in fig. 1, the computer board heat sink 100 is located at the rear side of the electronic control box 1, and the number of the computer board heat sinks 100 may be multiple. Referring to fig. 1 to 4, in combination with fig. 1, the heat dissipating device 100 of the computer board in this embodiment includes a computer board body 110 and a heat dissipating assembly 120, the computer board body 110 is located inside the electronic control box 1, the computer board body 110 is not shown in fig. 1 due to the view angle, the heat dissipating assembly 120 is located outside the electronic control box 1 for discharging heat, the heat dissipating assembly 120 includes a heat dissipating substrate 121 and a heat dissipating fin 122, the heat dissipating substrate 121 serves as a carrier of the heat dissipating fin 122 and is formed with a groove 123, the heat dissipating fin 122 is plural, the heat dissipating fins 122 are preferably arranged in parallel, a heat dissipating space is formed between adjacent heat dissipating fins 122, the heat dissipating fin 122 is arranged on the heat dissipating substrate 121 and is located on the back side of the groove 123, i.e. on the rear side of the groove bottom of the groove 123, the heat dissipating fin 122 is of a hollow structure and, opening 124 faces the recessed portion; the computer board body 110 is disposed on the heat dissipating substrate 121 and covers the opening of the recessed portion 123, the front side of the computer board body 110 (i.e., the side on which the electrical device is located) is away from the recessed portion 123 and the heat dissipating fins 122, the recessed portion 123 is provided with through holes corresponding to the heat dissipating fins 122 one to one, so as to communicate the hollow space of the heat dissipating fins 122 with the inner space of the recessed portion 123 through the openings 124 thereof, and the heat dissipating medium 125 located on the back side of the computer board body 110 is filled in the recessed portion 123 and the hollow space of the heat dissipating fins 122. The heat dissipation medium also plays a role in heat dissipation, and the gap between the heat dissipation plate and the computer board body 110 can be reduced as much as possible, so that the heat dissipation efficiency is greatly improved, and the heat dissipation medium 125 is filled to make the heat dissipation more uniform.
Specifically, the heat sink 122 may be integrally molded or welded with the heat dissipating substrate 121, the computer board body 110 is fastened to the heat dissipating substrate 121 by a plurality of screws, and the area of the computer board body 110 is larger than the area of the groove portion 123, so as to completely cover the groove portion 123.
To further sufficiently dissipate heat, the heat dissipating medium 125 is in contact with the back surface side of the computer board body 110, as shown in fig. 4.
In the embodiment, the heat dissipating medium 125 is a heat dissipating paste, and since the heat dissipating paste is easily softened by heat, in order to prevent the heat dissipating paste from overflowing from the groove portion 123, a sealing ring 126 for preventing the heat dissipating paste from overflowing from the groove portion 123 is disposed between the groove portion 123 and the computer board body 110, as shown in fig. 3 and 4.
Specifically, as shown in fig. 2 and fig. 3, in order to position the computer board body 110, a positioning groove 128 adapted to the computer board body 110 is disposed on the heat dissipation substrate 121, and the computer board body 110 is embedded in the positioning groove 128. Since the computer board body 110 is to cover the groove portion 123, the area enclosed by the positioning groove 128 is larger than the area of the groove portion 123, i.e. the positioning groove 128 is located at the periphery of the groove portion 123.
Further, a circle of sealing ring installation groove (for view reasons, not shown) is formed on the circumferential groove wall of the positioning groove 128, and the sealing ring 126 is embedded in the sealing ring installation groove.
In order to protect the heat sink and prevent the heat sink from being damaged by accidental touch, referring to fig. 5, in this embodiment, the heat sink protection cover 120 further includes a heat sink protection cover 127, where the heat sink protection cover 127 includes two opposite fixing portions 127A and a shielding portion 127B connecting the two fixing portions 127A, for reasons of view, only one fixing portion 127A is shown in fig. 5, the other fixing portion 127A is symmetrically disposed with the fixing portion, the fixing portion 127A is fixedly connected to the heat sink base plate 121, and the heat sink 122 is sandwiched between the shielding portion 127B and the heat sink base plate 121, so as to protect the heat sink 122. Specifically, the fixing portion 127A is fixed to the heat dissipating substrate 121 by fastening with screws in this embodiment, but may be welded or fixed in other forms.
Since the heat sink protection cover 127 may shield the heat sink 122 from the air and heat, in order to avoid this problem, the cover plate 127B has an inclined portion I and an inclined portion II inclined toward the side away from the heat sink 122, as shown in fig. 5, the two cover plate portions 127B similar to the inclined portions are splayed as a whole, so that a heat dissipation space is reserved between the cover plate and the heat sink 122, thereby facilitating heat dissipation.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or that equivalents may be substituted for elements thereof; such modifications and substitutions do not depart from the spirit and scope of the present invention, which is claimed.
Claims (8)
1. A computer board heat sink comprises a computer board body and a heat dissipation assembly, and is characterized in that the heat dissipation assembly comprises:
a heat dissipation substrate having a groove portion formed thereon;
a plurality of heat dissipation fins, which are arranged on the heat dissipation substrate and are positioned on the back surface of the groove part, wherein the heat dissipation fins are hollow and are provided with openings communicated with the hollow spaces, and the openings face the groove part;
the computer board body is arranged on the radiating substrate and covers the notch of the groove part, the front side of the computer board body deviates from the groove part and the radiating fins, the groove part is provided with through holes which are in one-to-one correspondence with the radiating fins so as to communicate the hollow space of the radiating fins with the inner space of the groove part through the openings, and radiating media positioned on the back side of the computer board body are filled in the groove part and the hollow space of the radiating fins.
2. The computer board heat sink according to claim 1,
the heat dissipation medium is in contact with the back side of the computer board body.
3. The computer board heat sink according to claim 2,
the heat dissipation medium is heat dissipation paste.
4. The computer board heat sink according to claim 3,
the heat dissipation substrate is provided with a positioning groove matched with the computer board body, the computer board body is embedded in the positioning groove, and a sealing ring for preventing the heat dissipation medium from overflowing is arranged between the positioning groove and the computer board body.
5. The computer board heat sink according to claim 4,
and a circle of sealing ring mounting groove is formed in the circumferential groove wall of the positioning groove, and the sealing ring is embedded in the sealing ring mounting groove.
6. The computer board heat sink according to any one of claims 1 to 5,
the heat dissipation assembly further includes:
the heat radiating fin protective cover is used for preventing the heat radiating fin from being touched, and comprises two oppositely arranged fixed connecting parts and a shielding part connected with the two fixed connecting parts, wherein the fixed connecting parts are fixedly connected on the heat radiating base plate, and the shielding part and the heat radiating base plate are used for clamping the heat radiating fin in the middle.
7. The computer board heat sink according to claim 6,
the shielding part is provided with an inclined part inclined to the side far away from the radiating fin.
8. An automatically controlled box, its characterized in that:
the computer board heat sink comprising any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921235175.5U CN210324066U (en) | 2019-08-01 | 2019-08-01 | Computer board heat dissipation device and electric control box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921235175.5U CN210324066U (en) | 2019-08-01 | 2019-08-01 | Computer board heat dissipation device and electric control box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210324066U true CN210324066U (en) | 2020-04-14 |
Family
ID=70127673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921235175.5U Active CN210324066U (en) | 2019-08-01 | 2019-08-01 | Computer board heat dissipation device and electric control box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210324066U (en) |
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2019
- 2019-08-01 CN CN201921235175.5U patent/CN210324066U/en active Active
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