CN207897300U - Intelligent gateway radiator structure and intelligent gateway - Google Patents
Intelligent gateway radiator structure and intelligent gateway Download PDFInfo
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- CN207897300U CN207897300U CN201820286099.XU CN201820286099U CN207897300U CN 207897300 U CN207897300 U CN 207897300U CN 201820286099 U CN201820286099 U CN 201820286099U CN 207897300 U CN207897300 U CN 207897300U
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- intelligent gateway
- lower housing
- radiator
- heat emission
- emission hole
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Abstract
The utility model provides a kind of intelligent gateway radiator structure, including the lower housing and upper shell that are connected together and the circuit board in the cavity that upper shell and lower housing are enclosed, circuit board are equipped with chip；The side wall of lower housing is equipped with the first heat emission hole, the side wall of upper shell is equipped with the second heat emission hole, circuit board is equipped with radiator, the side of radiator towards the bottom of lower housing is equipped with several radiating fins, and there are for being connected to the first heat emission hole and the second heat emission hole for cross-ventilated gap between the side of circuit board and the internal chamber wall of lower housing；Intelligent gateway radiator structure provided by the utility model, by the way that the second heat emission hole is arranged in upper shell, the first heat emission hole and setting radiator is arranged in lower housing, there are for supplying cross-ventilated gap between the side of circuit board and the internal chamber wall of lower housing simultaneously, make the air communication channel that cycle is formed between upper shell, lower housing and the external world, effectively increase distributing for heat, improves the service life of intelligent gateway.
Description
Technical field
The utility model belongs to smart home field, is to be related to a kind of intelligent gateway radiator structure and intelligence more specifically
It can gateway.
Background technology
Smart home be using house as platform, using comprehensive wiring technology, network communication technology, security precautions technology, from
Dynamic control technology, audio frequency and video technology integrate the related facility of home life, the efficient housing facilities of component and family's schedule thing
The management system of object promotes house security, convenience, comfort, artistry, and realizes the living environment of environmental protection and energy saving.
Intelligent gateway is the heart of smart home, exported by the acquisition of its realization system information, information input, information,
The functions such as centralized control, coordinated signals；The chip in intelligent gateway in work will produce a large amount of heat, existing intelligent network
Pass is only radiated by opening up heat emission hole in fuselage surrounding, but the radiating mode radiating efficiency is low, seriously affects intelligent network
The service life of pass.
Utility model content
The purpose of this utility model is to provide a kind of intelligent gateway radiator structures, to solve intelligent network in the prior art
Close radiator structure only by fuselage surrounding open up heat emission hole carry out heat dissipation so that radiating efficiency it is low, seriously affect intelligent gateway
Service life the technical issues of.
To achieve the above object, the technical solution adopted in the utility model is：A kind of intelligent gateway radiator structure is provided, is wrapped
Include the lower housing being connected together and upper shell and the electricity in the cavity that the upper shell and the lower housing are enclosed
Road plate, the circuit board are equipped with chip；The side wall of the lower housing is equipped with multiple first heat emission holes, the side of the upper shell
Wall is equipped with multiple second heat emission holes, is provided with radiator on the circuit board, and the radiator is towards the bottom of the lower housing
The side in portion is equipped with several radiating fins, and there are for being connected between the side of the circuit board and the internal chamber wall of the lower housing
First heat emission hole and second heat emission hole are for cross-ventilated gap.
Further, further include shielding case frame and shielding the cover, the chip is in the shielding case frame, the shielding
The cover is covered on the shielding case frame.
Further, further include the first thermally conductive sheet and the second thermally conductive sheet, first thermally conductive sheet be attached at the chip and
Between the shielding case frame, second thermally conductive sheet is attached between the shielding the cover and the radiator.
Further, first heat emission hole extends to the bottom of the lower housing from the side wall of the lower housing.
Further, the side of each radiating fin is opposite with each first heat emission hole respectively, and the radiating fin
Projection width of the piece in first heat emission hole is the one third of the width of first heat emission hole to 2/3rds.
Further, first thermally conductive sheet and the second thermally conductive sheet are silica gel piece.
Further, the radiator back to the side of the radiating fin be equipped with connecting pole, the circuit board with it is described
Radiator is connected by the connecting pole.
Further, each radiating fin is straight sheet.
Further, each radiating fin is wavy.
The advantageous effect of intelligent gateway radiator structure provided by the utility model is：Compared with prior art, this practicality
Novel intelligent gateway radiator structure, by the way that radiator is arranged in intelligent gateway radiator structure inner cavity, the heat for making chip generate
Be transmitted to radiator, several radiating fins being arranged on radiator substantially increase heat dissipation area, can more efficiently into
Row heat dissipation, the second heat emission hole is arranged on upper shell and the first heat emission hole is arranged on lower housing, the heat for making chip generate
It can be distributed well from the first heat emission hole and the second heat emission hole with air-flow, while in the side of circuit board and lower housing
There are for being connected to the first heat emission hole and the second heat emission hole for cross-ventilated gap between internal chamber wall so that upper shell, under
The air communication channel that cycle is formed between shell and the external world, is effectively reduced heat, to increase the use of intelligent gateway
Service life.
The purpose of this utility model, which also resides in, provides a kind of intelligent gateway, to solve intelligent gateway in the prior art only
Make radiating efficiency low by opening up heat emission hole in fuselage surrounding and radiate, seriously affects the skill of the service life of intelligent gateway
Art problem.
To achieve the above object, the technical solution adopted in the utility model is：A kind of intelligent gateway is provided, including above-mentioned
Intelligent gateway radiator structure.
The advantageous effect of intelligent gateway provided by the utility model is：Compared with prior art, the utility model intelligence
Gateway, by using above-mentioned intelligent gateway radiator structure, in the second heat emission hole of upper shell setting, setting first dissipates on lower housing
Hot hole and radiator is set in intelligent gateway radiator structure cavity, while in the internal chamber wall of the side of circuit board and lower housing
Between there are for being connected to the first heat emission hole and the second heat emission hole for cross-ventilated gap, make upper shell, lower housing and
The air communication channel of cycle is formed between the external world, can greatly improve radiating efficiency, to increase the use longevity of intelligent gateway
Life.
Description of the drawings
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only that this practicality is new
Some embodiments of type for those of ordinary skill in the art without having to pay creative labor, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is the configuration schematic diagram for the intelligent gateway that the utility model embodiment provides；
Fig. 2 is the dimensional structure diagram one for the lower housing that the utility model embodiment provides；
Fig. 3 is the dimensional structure diagram two for the lower housing that the utility model embodiment provides；
Fig. 4 is the dimensional structure diagram for the upper shell that the utility model embodiment provides；
Fig. 5 is the dimensional structure diagram for the radiator that the utility model embodiment provides；
Fig. 6 is the internal structure schematic diagram one for the intelligent gateway that the utility model embodiment provides；
Fig. 7 is the internal structure schematic diagram two for the intelligent gateway that the utility model embodiment provides；
Fig. 8 is the partial structural diagram for the intelligent gateway that the utility model embodiment provides
Wherein, each reference numeral in figure：
1- lower housings；The first heat emission holes of 11-；12- shackle members；2- upper shells；The second heat emission holes of 21-；3- circuit boards；4- cores
Piece；5- radiators；51- radiating fins；52- connecting poles；6- shielding case frames；7- shields the cover；The first thermally conductive sheets of 8-；9- second is led
Backing
Specific implementation mode
In order to make technical problem to be solved in the utility model, technical solution and advantageous effect be more clearly understood, with
Lower combination accompanying drawings and embodiments, the present invention will be further described in detail.It should be appreciated that specific reality described herein
It applies example to be only used to explain the utility model, is not used to limit the utility model.
It should be noted that when element is referred to as " being fixed on " or " being set to " another element, it can be directly another
On one element or it is connected on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" "inner", "outside" is that orientation based on ... shown in the drawings or position are closed
System, is merely for convenience of describing the present invention and simplifying the description, does not indicate or imply the indicated device or element is necessary
With specific orientation, with specific azimuth configuration and operation, therefore should not be understood as limiting the present invention.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more this feature.The meaning of " plurality " is two or two in the description of the present invention,
More than, unless otherwise specifically defined.
Also referring to Fig. 1 to Fig. 8, now intelligent gateway radiator structure provided by the utility model is illustrated.Intelligence
The side wall of gateway radiator structure, including the lower housing 1 and upper shell 2 that are connected together, lower housing 1 is equipped with multiple first heat emission holes
11, the side wall of upper shell 2 is equipped with multiple second heat emission holes 21, is arranged in the cavity that upper shell 2 is enclosed with lower housing 1
Circuit board 3, circuit board 3 are equipped with chip 4, while being additionally provided with radiator 5 on circuit board 3, and radiator 5 is towards lower housing 1
The side of bottom is provided with several radiating fins 51, and there are for even between the side and the internal chamber wall of lower housing 1 of circuit board 3
Logical first heat emission hole 11 and the second heat emission hole 21 are for cross-ventilated gap.
It is scattered to be arranged second compared with prior art on upper shell 2 for intelligent gateway radiator structure provided by the utility model
The first heat emission hole 11 is arranged on lower housing 1 and is stayed between the side of circuit board 3 and the internal chamber wall of lower housing 1 for hot hole 21
The first heat emission hole 11 of connection and the second heat emission hole 21 are useful for for cross-ventilated gap, upper shell 2, lower housing 1 and outer
Form the air communication channel of cycle between boundary, in the heat transfer to radiator 5 that chip 4 generates, several on radiator 5 dissipate
Hot fin 51 increase radiator 5 heat dissipation area, radiate heat into the air of surrounding, and upper shell 2, lower housing 1 with
And the air recycled between the external world constantly takes away the heat of the generation of chip 4 by way of convection current, to be effectively reduced heat,
Extend the service life of intelligent gateway.
Further, also referring to Fig. 3 to Fig. 5, one as intelligent gateway radiator structure provided by the utility model
Kind specific implementation mode further includes shielding case frame 6 and shielding the cover 7, and chip 4 is set in shielding case frame 6, and shielding case frame 6 is arranged
On circuit board 3, shielding the cover 7 is covered on shielding case frame 6；By the way that shielding case frame 6 and shielding the cover 7 is arranged, avoid in intelligence
The signal of chip 4 is disturbed during energy gateway work.
Further, referring to Fig. 1, a kind of specific implementation as intelligent gateway radiator structure provided by the utility model
Mode further includes the first thermally conductive sheet 8 and the second thermally conductive sheet 9, and the first thermally conductive sheet 8 is attached between chip 4 and shielding case frame 6, the
Two thermally conductive sheets 9 are attached between shielding the cover 7 and radiator 5；By the way that the first thermally conductive sheet 8 and the second thermally conductive sheet 9 is arranged, make chip
4 heats generated can more efficiently be transmitted to radiator 5, to increase distributing for heat, improve the use of intelligent gateway
Service life.
Further, refering to fig. 1 to Fig. 3, one kind as intelligent gateway radiator structure provided by the utility model is specific
Embodiment, the first heat emission hole 11 extend to the bottom of lower housing 1 from the side wall of lower housing 1, are reached in the intensity of guarantee lower housing 1
To under conditions of requirement, by the set-up mode, make outside air can not only be out of, lower housing 1 side wall and intelligent gateway
Chamber forms cross-ventilation, while can also form cross-ventilation from the bottom of lower housing 1 and the inner cavity of intelligent gateway, therefore effectively
Ground improves distributing for heat, increases the service life of intelligent gateway.
Further, referring to Fig. 8, a kind of specific implementation as intelligent gateway radiator structure provided by the utility model
The side of mode, each radiating fin 51 is opposite with each first heat emission hole 11 respectively, and radiating fin 51 is in the first heat emission hole 11
Projection width be the first heat emission hole 11 width one third to 2/3rds；When outside air passes through the first heat emission hole 11
When flowing to intelligent gateway inner cavity, outside air blows to each radiating fin 51, to take away the heat on radiating fin 51, simultaneously
Gap between each adjacent radiating fin 51 forms air communication channel with the first heat emission hole 11, is convenient for the stream of outside air
It is logical, to take away the heat in intelligent gateway radiator structure inner cavity, effectively improve distributing for heat.
Preferably, projection width of each radiating fin 51 in the first heat emission hole 11 is the two of the width of the first heat emission hole 11
/ mono-, further increase radiating efficiency.
Further, a kind of specific implementation mode as intelligent gateway radiator structure provided by the utility model, first
Thermally conductive sheet 8 and the second thermally conductive sheet 9 are silica gel piece；Silica gel piece has good electric insulating quality, high tenacity, higher thermal diffusivity
Energy and anti-aging characteristic, therefore the first thermally conductive sheet 8 and the second thermally conductive sheet 9 are silica gel piece, not only have longer use
Service life, while there is excellent heat dissipation performance, substantially increase the transmission of heat and distribute.
Further, refering to Fig. 5 to Fig. 7, one kind as intelligent gateway radiator structure provided by the utility model is specific
Embodiment, radiator 5 are equipped with connecting pole 52 backwards to the side of radiating fin 51, and circuit board 3 passes through connecting pole 52 with radiator 5
Connection；By the way that connecting pole 52 is arranged, radiator 5 is set to be closely attached with circuit board 3, therefore the heat that chip 4 generates can be more
Add and is efficiently transferred on radiator 5.
Further, it please refers to Fig.1 and Fig. 5, a kind of tool as intelligent gateway radiator structure provided by the utility model
Body embodiment, each radiating fin 51 are straight sheet；Radiating fin 51 is arranged to straight sheet, forms effective circulation passage,
The circulation for easily facilitating air, so as to more efficiently radiate.
Further, a kind of specific implementation mode as intelligent gateway radiator structure provided by the utility model, it is each
Radiating fin 51 is wavy；Radiating fin 51 is arranged to wavy, heat dissipation area is increased, so as to be more effectively carried out
Heat dissipation.
The utility model also provides a kind of intelligent gateway, including above-mentioned intelligent gateway radiator structure；By using above-mentioned intelligence
Can gateway radiator structure, the second heat emission hole 21 is set in upper shell 2, on lower housing 1 first heat emission hole 11 is set and in intelligence
Radiator 5 can be set in gateway radiator structure cavity, at the same between the side of circuit board 3 and the internal chamber wall of lower housing 1 there are
For being connected to the first heat emission hole 11 and the second heat emission hole 21 for cross-ventilated gap, make upper shell 2, lower housing 1 and outer
The air communication channel of cycle is formed between boundary, can greatly improve radiating efficiency, to increase the service life of intelligent gateway.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
All any modification, equivalent and improvement etc., should be included in the utility model made by within the spirit and principle of utility model
Protection domain within.
Claims (10)
1. intelligent gateway radiator structure, including the lower housing and upper shell that are connected together and set on the upper shell with it is described under
The circuit board in cavity that shell is enclosed, the circuit board are equipped with chip；It is characterized in that：The side wall of the lower housing
Multiple first heat emission holes are equipped with, the side wall of the upper shell is equipped with multiple second heat emission holes, is provided on the circuit board
The side of radiator, the radiator towards the bottom of the lower housing is equipped with several radiating fins, the side of the circuit board
There are for being connected to first heat emission hole and second heat emission hole for air pair between the internal chamber wall of the lower housing
The gap of stream.
2. intelligent gateway radiator structure as described in claim 1, it is characterised in that：Further include shielding case frame and shielding the cover,
The chip is set in the shielding case frame, and the shielding the cover is covered on the shielding case frame.
3. intelligent gateway radiator structure as claimed in claim 2, it is characterised in that：Further include the first thermally conductive sheet and the second heat conduction
Piece, first thermally conductive sheet are attached between the chip and the shielding case frame, and second thermally conductive sheet is attached at the screen
It covers between the cover and the radiator.
4. intelligent gateway radiator structure as described in claim 1, it is characterised in that：First heat emission hole is from the lower housing
Side wall extend to the bottom of the lower housing.
5. intelligent gateway radiator structure as described in claim 1, it is characterised in that：The side of each radiating fin respectively with
Each first heat emission hole is opposite, and projection width of the radiating fin in first heat emission hole is first heat dissipation
The one third of the width in hole is to 2/3rds.
6. intelligent gateway radiator structure as claimed in claim 3, it is characterised in that：First thermally conductive sheet and the second thermally conductive sheet
It is silica gel piece.
7. intelligent gateway radiator structure as described in claim 1, it is characterised in that：The radiator back is to the radiating fin
Side be equipped with connecting pole, the circuit board connect with the radiator by the connecting pole.
8. intelligent gateway radiator structure as described in claim 1, it is characterised in that：Each radiating fin is straight sheet.
9. intelligent gateway radiator structure as described in claim 1, it is characterised in that：Each radiating fin is wavy.
10. intelligent gateway, it is characterised in that：Including such as claim 1-9 any one of them intelligent gateway radiator structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820286099.XU CN207897300U (en) | 2018-02-28 | 2018-02-28 | Intelligent gateway radiator structure and intelligent gateway |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820286099.XU CN207897300U (en) | 2018-02-28 | 2018-02-28 | Intelligent gateway radiator structure and intelligent gateway |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207897300U true CN207897300U (en) | 2018-09-21 |
Family
ID=63540866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820286099.XU Active CN207897300U (en) | 2018-02-28 | 2018-02-28 | Intelligent gateway radiator structure and intelligent gateway |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207897300U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110994116A (en) * | 2019-12-24 | 2020-04-10 | 瑞声精密制造科技(常州)有限公司 | Heat radiation structure and antenna module of antenna |
| CN115297375A (en) * | 2022-09-30 | 2022-11-04 | 常州燕润能源科技有限公司 | Internet of things gateway based on environment monitoring and working method |
-
2018
- 2018-02-28 CN CN201820286099.XU patent/CN207897300U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110994116A (en) * | 2019-12-24 | 2020-04-10 | 瑞声精密制造科技(常州)有限公司 | Heat radiation structure and antenna module of antenna |
| CN110994116B (en) * | 2019-12-24 | 2022-02-11 | 瑞声精密制造科技(常州)有限公司 | Heat radiation structure and antenna module of antenna |
| CN115297375A (en) * | 2022-09-30 | 2022-11-04 | 常州燕润能源科技有限公司 | Internet of things gateway based on environment monitoring and working method |
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| GR01 | Patent grant | ||
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| CP03 | Change of name, title or address |
Address after: 518000 R & D room 3501, block a, building 7, Vanke Cloud City Phase I, Xingke 1st Street, Xili community, Xili street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Tubatu Group Co.,Ltd. Address before: 1001-a, 10th floor, bike technology building, No.9, Keke Road, high tech Zone, Nanshan District, Shenzhen, Guangdong 518000 Patentee before: SHENZHEN BINCENT TECHNOLOGY Co.,Ltd. |