CN106612602A - Heat radiation structure and veneer expansion heat radiation method - Google Patents
Heat radiation structure and veneer expansion heat radiation method Download PDFInfo
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- CN106612602A CN106612602A CN201510688637.9A CN201510688637A CN106612602A CN 106612602 A CN106612602 A CN 106612602A CN 201510688637 A CN201510688637 A CN 201510688637A CN 106612602 A CN106612602 A CN 106612602A
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- radiator
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- backboard
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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Abstract
The invention discloses a heat radiation structure and a veneer expansion heat radiation method. The heat radiation structure comprises a subrack system and a backplane heat radiation device. The backplane heat radiation device is arranged on a backplane or in a gap between backplanes in the subrack system, is connected with a veneer heat radiator on a veneer through a heat conducting connector, and is used for expanding the convection heat radiation area of the veneer heat radiator. The heat radiation of the veneer is improved.
Description
Technical field
The present invention relates to technical field of communication equipment, espespecially a kind of radiator structure and a kind of extension radiating of veneer
Method.
Background technology
From 10G, 40G, then to 100G and 400G, with the communication technology advances of light Moore's Law,
The overall cross-capacity of the speed of single port and equipment is all increasing.Main business process chip and light
The power consumption of electric module increasingly increases, and the heat power consumption decrease speed curve of per bit does not catch up with port speed increasing
Long geometry speed, the power consumption of veneer will be extremely considerable, and heat dispersion is poor.The approach of its radiating is main
It is from thermals source such as power consuming devices, to heat eliminating medium, then to fin, finally by radiating via fin
Each air channel cross-ventilation of tooth takes away heat.
As shown in figure 1, in order to realize that more list framves intersect and volume of business, i.e., carrying as far as possible more
Many service boards, improve competitiveness in the industry.The thermal design of traditional veneer is subject to single cavity position and single groove position
The requirement and restriction of width, this is resulted in " height of single plate radiator is subject to inherent limitations ".And veneer
Upper high power consumption business chip and module are limited by the track lengths of high-speed electrical signals causes a large amount of high power consumption devices
Part increasingly closes on, and needing the single plate radiator that the high power consumption chip or module of radiating are carried to interfere causes
Partly " single plate radiator length and width are limited ", extend or hang upside down and be difficult to.And equal wind speed and noise are needed
Under the conditions of asking, " single plate radiator radiating tooth density is restricted again ".Part veneer device can also hinder
Air channel (arrow in Fig. 1 and Fig. 2 represents wind direction), reduces equivalent cross-sectional area.So high power consumption list
The key factor and bottleneck of the increasingly serious radiating pressure that plate is faced is a lack of enough heat loss through convection faces
Product.
Corresponding relation in Fig. 1 and Fig. 2 between reference and component names is：
1 ' subrack system, 3 ' veneers, 4 ' single plate radiators, 5 ' barricade radiators, 10 ' thermals source,
11 ' backboards, 12 ' chips.
In sum, with the development of technology, the heat conduction of veneer of future generation and heat dissipation problem are increasingly serious.
At least there is following difficult point in traditional system single board thermal design：Lack effective area of dissipation, it is impossible to meet more
The radiating requirements of high power consumption veneer.
The content of the invention
In order to solve above-mentioned technical problem, the invention provides a kind of radiator structure, can solve the problem that veneer dissipates
Hot device lacks the problem of enough heat loss through convection areas.
Present invention also offers a kind of veneer extends heat dissipating method.
In order to reach the object of the invention, the invention provides a kind of radiator structure, including：Subrack system；
With backboard heat dissipation equipment, in the space on the backboard in the subrack system or between backboard and
It is connected by heat conduction connector with the single plate radiator on veneer, for the convection current of expanding single plate radiator
Area of dissipation.
Alternatively, equal ther mal network is provided with the barricade radiator of the subrack system, on veneer
A part of single plate radiator is connected by connector with equal ther mal network, equal ther mal network passes through the first sub- heat conduction
Adapter is connected with the backboard heat dissipation equipment；Part II single plate radiator on veneer passes through second
Sub- heat conduction connector is connected with backboard heat dissipation equipment.
Alternatively, the heat conduction connector includes the first sub- heat conduction connector and the second sub- heat conduction connector.
Alternatively, the first sub- heat conduction connector and the second sub- heat conduction connector include plug and socket.
Alternatively, Part I single plate radiator relative to the Part II single plate radiator away from described
Backboard heat dissipation equipment, Part II single plate radiator close on institute relative to the Part I single plate radiator
State backboard heat dissipation equipment.
Alternatively, it is provided with the one of mouth, medium and/or conductive structure part on the veneer PCB of veneer
End is through described by mouth.
Alternatively, the connector is medium or conductive structure part.
Alternatively, the subrack system includes：It is provided with the barricade radiator of equal ther mal network；Veneer
PCB, positioned at the top of barricade radiator and on barricade radiator；Thermal source, positioned at list
The top of plate PCB and on the veneer PCB；Single plate radiator, one-to-one corresponding is arranged on
On thermal source；And backboard.
Alternatively, backboard includes light back board and/or electric backboard, and barricade radiator sets including phase electrical isolation
The first sub- barricade radiator of ground and the second sub- barricade radiator are put, the soaking network settings are in described
On first sub- barricade radiator and/or the second sub- barricade radiator.
Present invention also offers a kind of veneer extends heat dissipating method, the single plate radiator on veneer absorbs veneer
On the heat that produces of thermal source, passed by the heat conduction connector being directly or indirectly connected with single plate radiator
Backboard heat dissipation equipment is passed, the heat loss through convection area for realizing expanding single plate radiator is, the radiating for improving veneer
Property.
Alternatively, Part I single plate radiator absorption is relatively distant from the thermal source generation of backboard heat dissipation equipment
Heat simultaneously passes to connector, and connector transfers heat to again the equal ther mal network on barricade radiator,
Then backboard heat dissipation equipment is passed to by the first sub- heat conduction connector.
Alternatively, Part II single plate radiator absorbs what the relative thermal source for closing on backboard heat dissipation equipment was produced
Heat, by the second sub- heat conduction connector backboard heat dissipation equipment is passed to.
Alternatively, the Part I single plate radiator one-to-one corresponding sets installed in backboard radiating is relatively distant from
On standby thermal source, the Part II single plate radiator one-to-one corresponding sets installed in backboard radiating is closed on relatively
On standby thermal source.
Alternatively, the described first sub- heat conduction connector and the second sub- heat conduction connector include thermally coupled
Device plug and Thermal connector socket.
Compared with prior art, the present invention provide radiator structure, on the backboard of subrack system or backboard it
Between gap in be provided with the backboard heat dissipation equipment of single plate radiator on connecting single board, single plate radiator leads to
Cross heat conduction connector direct or indirect connection backboard heat dissipation equipment, in this way expanding single plate radiator
Heat loss through convection area, realization improves the thermal diffusivity of veneer.
Traditional Integral electric backboard is complete entirety, and backboard is difficult to design air channel.And light is electrically coupled split
Formula backboard, exchanges optical signal and low speed telecommunication number is each provided with discrete carrying media at a high speed, so in the back of the body
Plate region will appear from some spaces and space, and this is preferably " connector " and " backboard heat dissipation equipment " offer
Sinking path, space and air channel.It is therefore heat abstractor is placed in the space between backboard and veneer is high
Power consumption module, high power consumption device heat (i.e.：The heat of thermal source) it is transmitted on heat abstractor, not only
The area of dissipation in original air channel is adds additional, a heat dissipation region is yet forms both to heat convection area
Low thermal resistance path, can reduce the normal working temperature of veneer core devices；With at least solve background context and
In technology, high power consumption veneer is intensive, and the power consuming devices of carrying or module lack enough heat loss through convection areas
Problem.
Other features and advantages of the present invention will illustrate in the following description, also, partly from froming the perspective of
Become apparent in bright book, or understood by implementing the present invention.The purpose of the present invention is excellent with other
Point can be realized and obtained by specifically noted structure in description, claims and accompanying drawing.
Description of the drawings
Accompanying drawing is used for providing and further understanding technical solution of the present invention, and constitutes one of description
Point, it is used to explain technical scheme together with embodiments herein, do not constitute to the present invention
The restriction of technical scheme.
Fig. 1 is the structural representation of the communication class subrack described in correlation technique and single-board slot；
Fig. 2 is the cross section structure diagram of local veneer in Fig. 1；
Fig. 3 is the sectional structure schematic block diagram of the local veneer of radiator structure of the present invention；
Fig. 4 is the decomposition texture schematic diagram of the radiator structure described in first embodiment of the invention；
Fig. 5 is the decomposition texture schematic diagram of the radiator structure described in second embodiment of the invention；
Fig. 6 is for the partial structural diagram of Thermal connector in radiator structure shown in Fig. 5.
Wherein, the corresponding relation in Fig. 1 and Fig. 2 between reference and component names is：
1 ' subrack system, 3 ' veneers, 4 ' single plate radiators, 5 ' barricade radiators, 10 ' thermals source,
11 ' backboards, 12 ' chips.
Corresponding relation in Fig. 3 to Fig. 6 between reference and component names is：
2 backboard heat dissipation equipments, 3 veneers, 31 by mouth, 32 veneer PCB, 4 single plate radiators,
41 Part I single plate radiators, 42 Part II single plate radiators, 5 barricade radiators, 51
One sub- barricade radiator, 52 second sub- barricade radiators, 6 equal ther mal networks, 711 first sub- heat conduction
Connector plug, 712 first sub- heat conduction connector sockets, 721 second sub- heat conduction connector plugs, 722
Second sub- heat conduction connector socket, 8 connectors, 10 thermals source, 101 close on the thermal source of backboard heat dissipation equipment,
102 away from backboard heat dissipation equipment thermal source, 11 backboards.
Specific embodiment
To make the object, technical solutions and advantages of the present invention become more apparent, below in conjunction with accompanying drawing
Embodiments of the invention are described in detail.It should be noted that in the case where not conflicting, this Shen
Please in embodiment and the feature in embodiment can mutual combination in any.
Many details are elaborated in the following description in order to fully understand the present invention, but, this
Invention can also be different from mode described here to implement using other, therefore, the protection model of the present invention
Enclose and do not limited by following public specific embodiment.
The radiating of radiator structure described in some embodiments of the invention and subrack system is described below in conjunction with the accompanying drawings
Method.
The radiator structure that the present invention is provided, as shown in Figures 3 to 5, including：Subrack system；And backboard
Heat dissipation equipment 2, in the space on the backboard 11 in the subrack system or between backboard 11,
And be connected by heat conduction connector 7 with the single plate radiator 4 on veneer 3, for expanding single plate radiating
The heat loss through convection area of device 4, realization improves the thermal diffusivity of veneer 3.
The radiator structure that the present invention is provided, is provided with the gap on the backboard of subrack system or between backboard
The backboard heat dissipation equipment of the single plate radiator on connecting single board, single plate radiator is direct by heat conduction connector
Or backboard heat dissipation equipment is indirectly connected with, in this way the heat loss through convection area of expanding single plate radiator, real
Now improve the thermal diffusivity of veneer.
In addition, the radiator structure that the above embodiment of the present invention is provided can also have following additional technical characteristic：
Preferably, as shown in Figures 3 to 5, it is provided with the barricade radiator 5 of the subrack system
Equal ther mal network 6, the Part I single plate radiator 41 on veneer 3 is by connector 8 and equal ther mal network 6
It is connected, equal ther mal network 6 is connected by the first sub- heat conduction connector 71 with the backboard heat dissipation equipment 2；
Part II single plate radiator 42 on veneer 3 is set by the second sub- heat conduction connector 72 with backboard radiating
Standby 2 are connected.
" design of backboard radiator specifically can simultaneously be supported according to air channel situation and space size, flexible configuration
Heat loss through radiation, natural gravity heat pipe heat radiation, liquid are cold, in rack various radiating modes such as air-conditioning and do not affect
Single board design "；The presence or absence of " can specifically be designed with air channel according to subrack, the mode of radiating carries out spirit
Configuration living.When such as there is no air channel, natural gravity formula heat pipe heat radiation hinge laminating casing can be applied,
Liquid SAPMAC method can be adopted.When having air channel, the radiation fin array in road with the wind can be adopted." backboard radiates
Device " is designed in the double-edged two groups of radiators of traditional electricity backboard.On front side of backboard PCB, it is in
The edge of traditional air chute, and plus the backboard air stream introducing of air-guiding hole, apply and backboard reinforcement
The optimal way of the overall fixed page groups of fins of road with the wind.
Certainly, the Part II single plate radiator 42 on veneer 3 also can be by medium and/or conductive structure
Part is (i.e.：Connector 8) it is connected with equal ther mal network 6, the purpose of the application is also capable of achieving, here is not
Repeat again, but should belong in the protection domain of the application.
Further, the heat conduction connector 7 includes (pluggable) first sub- heat conduction connector 71
(pluggable) second sub- heat conduction connector 72, the first sub- heat conduction connector 71 and the second sub- heat conduction
Adapter 72 includes plug and socket；Plug and socket can be simple " heat conduction equipment and equal heat supply network
The extension of network " or structure are protruded, such as heat pipe, soaking plate etc., or the individually device of weldering riveting,
Will not be described here, all should belong in the protection domain of the application.
I.e.：First sub- heat conduction connector plug 711, the first sub- heat conduction connector socket 712, the second son is led
Thermal connector plug 721, the second sub- heat conduction connector socket 722.
Alternatively, Part I single plate radiator 41 is remote relative to the Part II single plate radiator 42
Dissipate relative to the Part I veneer from the backboard heat dissipation equipment 2, Part II single plate radiator 42
Hot device 41 closes on the backboard heat dissipation equipment 2.
Such as：Part II single plate radiator be located at Part I single plate radiator and backboard heat dissipation equipment 2 it
Between.
Wherein, it is provided with the one of mouth 31, medium and/or conductive structure part on the veneer PCB of veneer 3
End is threaded through mouth 31, and medium and/or conductive structure part are perpendicular to veneer PCB32, medium and/or heat conduction
One end connection Part I single plate radiator 4, other end of structural member is threaded through mouth 31 with equal ther mal network
6 are connected.
Furthermore, it is preferable that the quantity of medium and/or conductive structure part, Part I single plate radiator 4
Quantity is identical with the grid line quantity of equal ther mal network 6 and corresponds, and can be provided in by mouth 31
The center of veneer PCB, it is also possible to be provided in the edge of veneer PCB.
Certainly, the quantity of medium and/or conductive structure part, the quantity of Part I single plate radiator 4 and
The grid line quantity of ther mal network 6 also can be differed, and also be capable of achieving the purpose of the application, and here is not limited
It is fixed, also should belong in the protection domain of the application.
The heat-conducting medium of medium including vertical heat transfer, such as heat conduction rubber cushion, heat-conducting silicone grease etc.；Heat conduction is tied
Component, such as directly touch heat pipe, metal bosses etc..
Specifically, as shown in Figures 3 to 5, the subrack system includes：It is provided with equal ther mal network 6
Barricade radiator 5；Veneer PCB, positioned at the top of barricade radiator 5 and installed in barricade
On radiator 5；Thermal source 10, positioned at the top of veneer PCB and on the veneer PCB；
Single plate radiator 4, corresponds and is arranged on thermal source 10；With backboard 11.
Wherein it is possible to using heat pipe, or in groove the scheme such as Surface Mount band glue graphite film as equal ther mal network
Particular technique realization rate, be capable of achieving the purpose of the application, will not be described here, all should belong to this
In the protection domain of application.
Veneer 3 includes the portions such as barricade radiator 5, veneer PCB32, thermal source 10 and single plate radiator 4
Part.
Wherein, backboard 11 includes light back board and/or electric backboard, barricade radiator 5 include mutually electrically every
From the first sub- barricade radiator and the second sub- barricade radiator is configured to, equal ther mal network 6 is arranged at
On one sub- barricade radiator and/or the second sub- barricade radiator, by the heat conduction rubber cushion of the material that is electrically insulated
Heat conduction.
Wherein, it is provided with face in the first sub- barricade radiator and the second sub- barricade radiator
Plate, i.e.,：Barricade radiator is divided into containing panel and the two parts for not containing panel, so in panel
Under the conditions of meeting with thunderbolt or electrostatic experiment, high-tension electricity will not pass through the metallic vertical heat conduction equipment shadow of barricade
The place of working of Chinese percussion instrument part or optical module, two pieces of barricades are respectively by each affiliated screw hole and PCB
It is fixed..
The heat of the single plate radiator that veneer PCB heat loss through convection area is limited is passed respectively with two kinds of approach
Lead in backboard gap on default backboard heat dissipation equipment, equivalent to obtain extra area of dissipation, together
When formed heat dissipation region to increase newly heat convection area low thermal resistance path, be very advantageous in high power consumption veneer
Miniaturization, greatly reduces the difficulty of veneer thermal design, increases the competitiveness of product, will be electromagnetically shielded,
Reliability and radiating management technology and device are ideally combined.
First specific embodiment as shown in Figure 3 and Figure 4：In light communication system, same rate's rank
The veneer of single cavity position, can make the other subrack of ad eundem have bigger capacity, possess device systems powerful
The market competitiveness.And the size and power consumption of line side optical module are larger, single cavity position is equivalent to defining mould
The height of the attached fin of block.And the device such as high power consumption Business Processing chip and FPGA is equal on plate answers
Miscellaneous thermal design and to PCB surface product and air channel occupancy so that the optical module of high power consumption can not possibly pass through again
Fin extends and projecting mode, more fin areas of reentrying.The present embodiment 1 is by application
Compatible alleviation radiating difficult problem problem of the present invention to traditional electricity backboard, it is specific as follows：
In the present embodiment 1, Part I single plate radiator 41 and medium and/or conductive structure part connect；
Medium and/or conductive structure part need guiding through radiating by mouth 31, and the first sub- barricade on veneer PCB
The equal ther mal network 6 carried on device 51 is connected；The sub- heat conduction connector plug of equal ther mal network 6 and first
711 are connected；Under in working order, the sub- heat conduction connection of the first sub- heat conduction connector plug 711 and first
Device socket 712 is connected, and the first sub- heat conduction connector socket 712 is connected with backboard heat dissipation equipment 2；
In the present embodiment, " Part I single plate radiator 41 " is preferably the optical module of a superelevation power consumption
The fin for carrying, this block fin is subject to as stated in the Background Art the limit of height, length and width and density simultaneously
System.But inconvenience arranges heat conduction equipment in top surface, because if designing heat conduction equipment in top surface, first
Constructive interference may be caused to chip and module or its single plate radiator, next is likely to reduced equivalent air channel
Cross-sectional area, so by " the first sub- barricade radiator 51 " and supporting Thermal connector is (i.e.：It is situated between
Matter and/or conductive structure part) conduct heat to " backboard heat dissipation equipment ".The thermal source emphasis of the present embodiment
Radiated using the first sinking path.
In the present embodiment, " medium and/or conductive structure part " preferably employs two metal bosses and one piece
The combination application of square high efficiency heat conduction rubber cushion, high-efficiency heat conduction rubber cushion of the heat conductivity higher than 5 is in structure design
In led to metal bosses are good with ensureing " Part I single plate radiator 41 " by rational decrement
Heat.Realize the positive optical module of veneer to loose side " the first sub- barricade radiator 51 " with this scheme
Realize vertical heat transfer.
In the present embodiment, " equal ther mal network 6 " employs 5 embedded heat pipes.Emulated according to veneer heat
Cloud atlas result, expands to heat entirely as soaking means using embedded heat pipe from transverse and longitudinal both direction
Radiating and is transmitted to " the first sub- heat conduction connector plug 711 " barricade radiator water plane.
In the present embodiment, " the first sub- heat conduction connector plug 711 " be connected with backboard heat dissipation equipment "
One sub- heat conduction connector socket 712 " is supported the use.In embodiment, the specific design that plug is adopted is
One piece of built-in small soaking plate, it is plug that the structure of soaking plate is projected.Because soaking plate is by barricade
Radiator load, the aspect different with electrical connector veneer PCB places and supporting body, so this enforcement
The stress of the heat conduction connector plug in example will not be impacted to the contact of electric connector.
In the present embodiment, " the first sub- heat conduction connector socket 712 " be connected with " equal ther mal network 6 " "
One sub- heat conduction connector plug 711 " is supported the use.In embodiment, the first sub- heat conduction connector socket
712 employ the structural member directly touched with heat pipe, and the accurate level of the first sub- heat conduction connector plug 711
Positioning.When the first sub- heat conduction connector plug 711 is inserted, on the first sub- heat conduction connector socket 712
The screw spring-compressed of corner, there is provided certain pulling force, compresses soaking plate to ensure that the sub- heat conduction of heat first connects
Connect the inner plane of device socket 712 and the first sub- outerplanar of heat conduction connector plug 711 has good heat transfer.
In the present embodiment, " backboard heat dissipation equipment 2 " decision design is in traditional electricity backboard double-edged two
In group single plate radiator.On front side of backboard, in the edge of traditional air chute, and plus the back of the body of air-guiding hole
Plate air stream is introduced, and applies the with the wind road page groups of fins integrally fixed with backboard reinforcement.In the back of the body
The gap of plate PCB rear sides and casing, because acquiescence is without air channel, using natural gravity formula heat pipe heat radiation page
Piece is fitted casing, and the coolant in heat pipe is heated evaporation endothermic, and transpiration to fin condenses heat release, by weight
Power affects to flow back to heat pipe single plate radiator bottommost.
" Part II single plate radiator 42 ", " the second sub- heat conduction in the present embodiment, in universal component
Connector plug 721 ", " the second sub- heat conduction connector socket 722 " are because without demand, it is possible to
Application is not configured.Such as universal component description, first, second is only used for distinguishing two kinds of different sinking paths,
The present embodiment is only single to adopt the first sinking path, i.e., led by barricade radiator away from the component of backboard
Sinking path of the heat to backboard.
In the present embodiment, " veneer PCB " is thermal source and its attached limits such as chip, high power consumption optical module
The supporting body of high limit for width fin.To illustrate that specific position opened the design requirement of mouth, strictly speaking not
It is the part of correlation technique, only illustrates connection and assembly relation and use.It is supporting in the technical program
Veneer need not carry out extra complicated thermal design, reduce its layout difficulty.
In the present embodiment, " veneer PCB opened mouth " is to be set according to overall thermal on " veneer PCB "
Meter, the hollow out designed during pre-layout passes through mouth.By the size of mouth, reference shape " Part I
The specific design of single plate radiator 41 ".By the quantity and the quantity Matching of boss of mouth.
In the present embodiment, " the first sub- barricade radiator 51 " is in traditional bulk shielding plate radiator 5
On separate structurally and electrically go up in independent two parts without panel, area is larger, be mainly used in radiate portion
Point.The part is compared traditional barricade radiator and distinguished at 3 points, and first, the selection of material is more prone to
In fin material；Second, there is thickening than traditional barricade radiator；3rd, barricade radiator
Equal thermal design is done according to simulation result.
In such scheme, " the second sub- barricade radiator 52 " is in traditional bulk shielding plate radiator 5
On separate structurally and electrically go up in independent two parts with panel part.When panel is radiated high-pressure electrostatic
When, because " the first sub- barricade radiator 51 " and " the second sub- barricade radiator 52 " is completely isolated,
So the high-tension electricity of panel does not interfere with " Part I single plate radiator 41 " and " Part II veneer dissipates
The modular circuit place of working that hot device 42 " mutually closes on.The segmenting structure and electrical isolation of barricade radiator be
One of realization rate and technical characteristic of " subrack system " radiating Reliability Assurance.
The specific design type of the backboard of this scheme is " traditional Integral electric backboard ".
The description of embodiment and invention equipment scheme is understood for convenience, the characteristic point enumerated in the present embodiment：
1) number of source of heat release：One single source；
2) the group number of Thermal connector：It is 1 group, overall non-dismountable；
3) type of backboard radiator；Groups of fins (front)+natural gravity heat pipe radiating fin (afterwards)；
4) vertical heat transfer is embodied as type：Heat conduction rubber cushion+metal bosses；
5) horizontal soaking equipment is embodied as type：Heat pipe；
6) the specific design type of backboard：Traditional Integral electric backboard；
7) the reference configuration design of Thermal connector：The plank frame part of soaking plate (plug)+heat pipe connection
(socket).
Second specific embodiment as shown in Figure 5：In fiber optic communication systems, as the electric backboard signal of telecommunication is walked
The inherent limitations of line length, the equipment framework containing traditional type Integral electric backboard will have a strong impact on business sheet
The quantity of plate and the cross-capacity of equipment.Light back board by with huge technology and the market demand, in order to keep away
Exempt from Insertion Loss, the matrix type for being easy to veneer and backboard connects, light back board will may be in greatly just with service board
The embodiment 2 that commissure connects, " light back board × 4 (veneer PCB and the orthogonal local of light back board) ", this reality
The all parallel business boards in the frame front of example 2 are applied all with 4 pieces of frame back side light back board in corresponding light connects
Orthogonal connection at device.Light back board can be optical fiber flexible board, or the photoelectricity containing light waveguide-layer
PCB, due to not carrying power consuming devices, itself does not generate heat again, by with huge space empty between light back board
Gap.
And in the veneer of light communication system, while by the thermal source containing multiple superelevation power consumptions, both containing same
The customer side optical module of speed grade, and the usual power consumption highest of the light repeat plate containing line side optical module.
The single cavity position design for realizing the veneer will be provided with overwhelming the powerful market competitiveness of formula, but with huge
Thermal design difficulty.There are three groups of radiating difficult problem devices, " the first thermal source " is non-hot plug in the present embodiment
High power consumption optical module, " Secondary Heat Source " is nearly backboard high power consumption business chip, and " the 3rd thermal source " is face
Plate hot-pluggable optical module array.Illustrate with aforementioned legacy equipment inferior position, single cavity position is designed equivalent to restriction
The height of the attached fin of heat dissipation problem device.And high power consumption Business Processing on the plate of higher rate grade
The complicated thermal design of the device such as chip and FPGA is integrated and to PCB surface product and the occupancy in air channel, tradition
Mode substantially cannot complete design.The present embodiment by using this, on the one hand in above-mentioned light back board
The backboard heat dissipation equipment in road with the wind is designed in gap, is on the other hand transmitted to the heat of above-mentioned main heating source
On the backboard heat dissipation equipment of light back board, the core that above-mentioned thermal source lacks heat loss through convection area can be successfully solved
A difficult problem.
In the present embodiment equipment connecting relation, " Part I single plate radiator 41 " and " medium and/or
Conductive structure part " connects；" medium and/or conductive structure part " needs guiding through the " logical of " veneer " pre-layout
Cross mouth ", it is connected with " the equal ther mal network 6 " that carried on " the first sub- barricade radiator 51 "；
" equal ther mal network 6 " is connected with " the first sub- heat conduction connector plug 711 "；Under in working order, " the
One sub- heat conduction connector plug 711 " and " 5, the first sub- heat conduction connector socket 712 " are connected, " the
One sub- heat conduction connector socket 712 " is connected with " backboard heat dissipation equipment 2 "." Part II veneer radiates
Device 42 ", and " the second sub- heat conduction connector plug 721 " connection；Under in working order, " second is sub
Heat conduction connector plug 721 " and " the second thermally coupled socket " connect；" the second thermally coupled socket " and
" backboard heat dissipation equipment 2 " connects.Another " Part I single plate radiator 41 " and another " Jie
Matter and/or conductive structure part " is connected, and another " medium and/or conductive structure part " needs guiding through " veneer
Carried on another " by mouth " of PCB " pre-layouts, and " the second sub- barricade radiator 52 "
" equal ther mal network 6 " be connected.
The present embodiment heat dissipating method explanation include, the first approach：" Part I single plate radiator 41 "
Collect the heat that " the first thermal source " is distributed；By " medium and/or conductive structure part " general " first
The heat that point single plate radiator 41 " is collected conducts " the soaking on " the first sub- barricade radiator 51 "
Network 6 ", by " equal ther mal network 6 ", while realizing soaking and distribute heat, then by after-heat
Constituted by " the first sub- heat conduction connector plug 711 " and " the first sub- heat conduction connector socket 712 "
Thermal connector, pass on " the backboard heat dissipation equipment " between the three-dimensional backboard of photoelectricity, realize heat pass
Pass；Second approach：The heat that " Part II single plate radiator 42 " collection " Secondary Heat Source " gives out,
Constituted by " the second sub- heat conduction connector plug 721 " and " the second sub- heat conduction connector socket 722 "
Heat conduction connector is by the heat transfer on " the backboard heat dissipation equipment 2 " between three-dimensional backboard.In addition,
It should be noted that the present embodiment is because there is three thermals source, also including a sinking path for flexibly arranging：
Another " Part I single plate radiator 41 " collects the heat of the 3rd cooling heat source, " is situated between by another
Matter and/or conductive structure part " is transmitted to above-mentioned heat " equal on " the second sub- barricade radiator 52 "
Ther mal network 6 " carries out soaking, and then the heat-conducting glue pad by being electrically insulated is transmitted to the second sub- barricade radiating
Until passing to backboard heat dissipation equipment 2 in the heat conduction connector installed on device 52, again by the first approach
Radiated.
In the present embodiment, " Part I single plate radiator " is that the optical module of a superelevation power consumption is carried
Fin, this block fin is subject to as stated in the Background Art height, the restriction of length and width and density simultaneously.But
Again the inconvenient top surface in veneer arranges the heat conduction equipment to " backboard heat dissipation equipment ", because if on top
Heat conduction equipment is designed in face, may cause constructive interference to chip and module or its single plate radiator first, its
It is secondary to be likely to reduced equivalent air channel cross-sectional area, so by " the first barricade radiator " and supporting
Thermal connector is conducted heat to " backboard heat dissipation equipment ".The first thermal source application first of the present embodiment dissipates
Hot approach is radiated.
In the present embodiment, " connector 8 " employs directly tactile heat pipe, the square sides of many heat pipes and " company
Fitting 8 " is joined directly together, and is strained and fixed by screw, to ensure good heat conduction.Realized with this scheme
Vertical heat transfer of positive first thermal source of veneer to loose side " the first sub- barricade radiator ".
In the present embodiment, " equal ther mal network 6 " employs 4 embedded heat pipes.Emulated according to veneer heat
Cloud atlas result, expands to heat entirely as soaking means using embedded heat pipe from transverse and longitudinal both direction
Radiating and is transmitted to 4 " the first sub- heat conduction connector plugs 711 " barricade radiator water plane.
In the present embodiment, " the first sub- heat conduction connector plug × 4 " be connected with backboard heat dissipation equipment "
One sub- heat conduction connector socket × 4 " support the use.In embodiment, the specific design that plug is adopted is one
Block built-in small soaking plate adds circular cone heat pipe, and the protrusion of circular cone heat pipe is plug.It should be noted that
Thermal connector plug can be welded and easily dismantled with low-melting alloy, and because Thermal connector is to lean on
Barricade radiator load, and carries the optical connector aspect different with the veneer of electric connector places and holds
Carrier, so the stress of the Thermal connector plug in the present embodiment will not be to optical connector and electric connector
Contact is impacted.
In the present embodiment, " the first sub- heat conduction connector socket 712 " be connected with " equal ther mal network 6 " "
One sub- heat conduction connector plug 711 " is supported the use.In embodiment, socket employs direct heat pipe
Sleeve, and plug can accurate horizontal location and good heat transfer.
In the present embodiment, " backboard heat dissipation equipment " designs the gap between the light back board of embodiment frame
In.The area of dissipation in several square metres of air channels can be increased.Due to for reference only, only draw in figure whole
The one of which fin of backboard heat dissipation equipment.
In the present embodiment, " Part II single plate radiator " is the chip or light of a superelevation power consumption
The fin that module group is carried, this block fin is subject to as stated in the Background Art height simultaneously, length and width and close
The restriction of degree.But it is because near backboard, second approach of the inventive method can be adopted to be radiated.
In the present embodiment, " the second sub- heat conduction connector plug " is the heat pipe that a fin extends.
With the same structure type of the first sub- heat conduction connector plug.
In the present embodiment, " the second sub- heat conduction connector socket " is the heat pipe sleeve of a ting model.With
The same structure type of first sub- heat conduction connector socket.
In the present embodiment, " veneer PCB " is thermal source and its attached limits such as chip, high power consumption optical module
The supporting body of high limit for width fin.Strictly speaking it is not phase to illustrate the design requirement of specific position perforate
The part of pass technology, only illustrates connection and assembly relation and uses.In the technical program, explanation is needed
Be radiating the first approach below veneer PCB, the second approach is above veneer PCB.
In the present embodiment, " by mouth " is according to overall thermal design, during pre-layout on " veneer PCB "
The cutout openings of design, by the quantity and the quantity Matching of straight touch heat pipe platform of mouth.
In the present embodiment, " the first sub- barricade radiator " is divided on traditional bulk shielding plate radiator
Go out structurally and electrically go up in independent two parts without panel, area is larger, be mainly used in radiate part.
The difference of traditional barricade radiator is compared in the part at 3 points, and first, the selection of material is more likely to
Fin material；Second, there is thickening than traditional barricade radiator；3rd, barricade radiator root
Equal thermal design is done according to simulation result.
In the present embodiment, " the second sub- barricade radiator " is divided on traditional bulk shielding plate radiator
Go out and structurally and electrically go up the part with panel in independent two parts.When panel is radiated high-pressure electrostatic,
Because " the first barricade radiator " and " the second sub- barricade radiator " completely isolated, panel
High-tension electricity do not interfere with and " Part I single plate radiator " and " Part II single plate radiator " phase
The modular circuit place of working closed on.The segmenting structure and electrical isolation of barricade radiator is three-dimensional backboard
One of realization rate and technical characteristic of " radiator structure " Reliability Assurance.In the present embodiment, and
The difference of embodiment 1 is that the area ratio of segmentation is larger, and while for carrying out the equal of the 3rd thermal source
Heat and radiating.
In the present embodiment, " Part I single plate radiator " refers to panel hot-pluggable optical module array certainly
The fin and cage body of band.
In the present embodiment, " connector " is using 4 metal bosses and 4 heat conduction rubber cushions.
" equal ther mal network 6 " carries out soaking and radiating using Surface Mount band glue graphite film material in the present embodiment.
Using such scheme, in the frame of light back board or novel solid formula backboard, a kind of new heat is constituted
PRACTICE OF DESIGN is replaced.Present device is constituted by a series of components with apparent component and interconnected relationship,
And a kind of method with distinct technical characteristic and brand-new various sinking paths, solves single board chip or mould
The limited problem of block single plate radiator heat loss through convection area.
The description of embodiment and invention equipment scheme is understood for convenience, the characteristic point enumerated in the present embodiment：
1) number of source of heat release：3, the first thermal source is " superelevation power consumption line side module ", and second is hot
Source is " main business chip ", and the 3rd thermal source is " the pluggable customer side optical mode block array of panel ".
2) the group number of heat conduction connector, the first 4 groups of heat conduction connector, the second 1 group of heat conduction connector,
For detachable；
3) type of backboard heat dissipation equipment；The three-dimensional backboard of photoelectricity, designs general in the gap between light back board
Logical page single plate radiator.
4) vertical heat transfer is embodied as type：Heat pipe is directly touched；
5) horizontal soaking equipment is embodied as type：First sub- barricade radiator is led by heat pipe level
Heat and soaking；Second sub- barricade radiator is by the horizontal heat conduction of graphite film and soaking.
6) the specific design type of backboard：The light back board orthogonal with business board；
7) specific design of Thermal connector, Thermal connector plug is soaking plate plus pointed conical heat pipe, and heat is even
Connect the heat pipe sleeve that device socket is structure matching.
Obviously, those skilled in the art should be understood that each part of the above-mentioned embodiment of the present invention or each
Feature can be implemented with general design and method, from applying angle, can material selection, concrete
Realization rate, the apparatus and method category of the present patent application with independent assortment, can be belonged to using feature.
Two kinds of sinking paths that this method is included can also only select one of which to use according to practical situation, but only
Using a kind of this method that is considered as according to actual special or simplify situation, do not represent it and have any different or solely
Special and the present processes technical characteristic.
The heat dissipating method of the subrack system that the present invention is provided, the single plate radiator 4 on veneer 3 absorbs veneer
The heat that thermal source 10 on 3 is produced, by being connected with the heat conduction that single plate radiator is directly or indirectly connected
Device 7 passes to backboard heat dissipation equipment 2, realizes the heat loss through convection area of expanding single plate radiator 4, improves
The thermal diffusivity of veneer 3.
The heat dissipating method of the subrack system that the present invention is provided, between the backboard of subrack system is got angry between backboard
The backboard heat dissipation equipment of the single plate radiator being provided with gap on connecting single board, to expanding single plate radiator
Heat loss through convection area, improve the thermal diffusivity of veneer.
Preferably, Part I single plate radiator is (i.e.：Part I single plate radiator 41) absorb relative
Away from backboard heat dissipation equipment 2 thermal source 10 produce heat and pass to medium and/or conductive structure part,
Medium and/or conductive structure part transfer heat to again the equal ther mal network 6 on barricade radiator 5, then
Backboard heat dissipation equipment 2 is passed to by the first sub- heat conduction connector 71；Part II single plate radiator is (i.e.：
Part II single plate radiator 42) absorb the heat that the relative thermal source 10 for closing on backboard heat dissipation equipment 2 is produced
Amount, by the second sub- heat conduction connector 72 backboard heat dissipation equipment 2 is passed to.
Preferably, the Part I single plate radiator one-to-one corresponding sets installed in backboard radiating is relatively distant from
On standby thermal source, Part II single plate radiator is corresponded to be arranged on and closes on backboard heat dissipation equipment relatively
On thermal source.
Preferably, the described first sub- heat conduction connector and the second sub- heat conduction connector include thermally coupled
Device plug and Thermal connector socket.
Wherein, preferably close on backboard heat dissipation equipment 2 subrack system single plate radiator 4 laterally or
The single plate radiator 4 and backboard heat dissipation equipment of the subrack system of backboard heat dissipation equipment 2 are located remotely from longitudinal direction
Between 2.
The present invention be by using communication subrack in tradition electricity backboard and/or light back board present in solid between
Gap and space, the extra backboard heat dissipation equipment of configuration, and by veneer high power consumption device and module (i.e.：It is single
Plate radiator) heat the radiating of above-mentioned backboard be conducted to by the pluggable Thermal connector of special thermal design set
It is standby so that veneer obtains extra heat loss through convection area, so as to improve big power consuming devices and module on veneer
The difficult problem of heat conduction and radiating.
Present invention mainly solves the increasingly difficult heat dissipation problem of communication system veneer, can be applied not only to existing
Stage high power consumption Novel electric backboard, also apply be applicable to following corresponding light back board three-dimensional with electric composition of backboards
On back board system, it is ensured that the thermal design of optimization high power consumption veneer, it is easy to the miniaturization of communication apparatus or veneer.
In sum, the radiator structure that the present invention is provided, on the backboard of subrack system or between backboard between
The backboard heat dissipation equipment of the single plate radiator being provided with gap on connecting single board, single plate radiator passes through heat conduction
Adapter direct or indirect connection backboard heat dissipation equipment, in this way expanding single plate radiator to wandering
Hot area, realization improves the thermal diffusivity of veneer.
Traditional Integral electric backboard is complete entirety, and backboard is difficult to design air channel.And light is electrically coupled split
Formula backboard, exchanges optical signal and low speed telecommunication number is each provided with discrete carrying media at a high speed, so in the back of the body
Plate region will appear from some spaces and space, and this is preferably " connector " and " backboard heat dissipation equipment " offer
Sinking path, space and air channel.It is therefore heat abstractor is placed in the space between backboard and veneer is high
Power consumption module, high power consumption device heat (i.e.：The heat of thermal source) it is transmitted on heat abstractor, not only
The area of dissipation in original air channel is adds additional, a heat dissipation region is yet forms both to heat convection area
Low thermal resistance path, can reduce the normal working temperature of veneer core devices；With at least solve background context and
In technology, high power consumption veneer is intensive, and the power consuming devices of carrying or module lack enough heat loss through convection areas
Problem.
In describing the invention, term " installation ", " connected ", " connection ", " fixation " etc.
All should be interpreted broadly, for example, " connection " can be fixedly connected, or be detachably connected,
Or be integrally connected；Can be joined directly together, it is also possible to be indirectly connected to by intermediary.For ability
For the those of ordinary skill in domain, above-mentioned term in the present invention concrete can be as the case may be understood
Implication.
In the description of this specification, term " one embodiment ", " some embodiments ", " concrete
The description of embodiment " etc. mean to combine the specific features that the embodiment or example describe, structure, material or
Feature is contained at least one embodiment of the present invention or example.In this manual, to above-mentioned term
Schematic representation be not necessarily referring to identical embodiment or example.And, the specific features of description,
Structure, material or feature can in an appropriate manner be tied in any one or more embodiments or example
Close.
Although disclosed herein embodiment as above, described content is only to readily appreciate the present invention
And the embodiment for adopting, it is not limited to the present invention.Technology people in any art of the present invention
Member, without departing from disclosed herein spirit and scope on the premise of, can be in the form implemented and thin
Any modification and change, but the scope of patent protection of the present invention are carried out on section, still must be with appended right
The scope that claim is defined is defined.
Claims (10)
1. a kind of radiator structure, it is characterised in that include：
Subrack system；With
Backboard heat dissipation equipment (2), on the backboard (11) in the subrack system or backboard (11)
Between space in and be connected by heat conduction connector (7) with the single plate radiator (4) on veneer (3)
Connect, for the heat loss through convection area of expanding single plate radiator (4).
2. radiator structure according to claim 1, it is characterised in that the shielding of the subrack system
Equal ther mal network (6), the Part I single plate radiator on veneer (3) are provided with plate radiator (5)
(41) it is connected with equal ther mal network (6) by connector, equal ther mal network (6) is by the first sub- heat conduction
Adapter (71) is connected with the backboard heat dissipation equipment (2)；Part II list on veneer (3)
Plate radiator (42) is connected by the second sub- heat conduction connector (72) with backboard heat dissipation equipment (2).
3. radiator structure according to claim 2, it is characterised in that the heat conduction connector (7)
Including the first sub- heat conduction connector (71) and the second sub- heat conduction connector (72)；
Wherein, the first sub- heat conduction connector (71) and the second sub- heat conduction connector (72) include plug
And socket.
4. radiator structure according to claim 2, it is characterised in that the Part I veneer dissipates
Hot device (41) relative to the Part II single plate radiator (42) away from the backboard heat dissipation equipment (2),
The Part II single plate radiator (42) is closed on relative to the Part I single plate radiator (41)
The backboard heat dissipation equipment (2).
5. radiator structure according to claim 2, it is characterised in that the veneer PCB of veneer (3)
(32) it is provided with mouth (31) on, one end of the connector (8) is through described by mouth (31)；
Wherein, the connector (8) is medium and/or conductive structure part.
6. the radiator structure according to any one of claim 2 to 5, it is characterised in that the son
Frame system includes：
It is provided with the barricade radiator (5) of equal ther mal network (6)；
Veneer PCB (32), positioned at the top of barricade radiator (5) and installed in barricade radiating
On device (5)；
Thermal source (10), positioned at the top of veneer PCB (32) and installed in the veneer PCB (32)
On；
Single plate radiator (4), corresponds and is arranged on thermal source (10)；With
Backboard (11).
7. radiator structure according to claim 6, it is characterised in that backboard (11) includes the light back of the body
Plate and/or electric backboard, barricade radiator (5) is configured to the first sub- barricade radiating including phase electrical isolation
Device and the second sub- barricade radiator, the equal ther mal network (6) is arranged at the described first sub- barricade radiating
On device and/or the second sub- barricade radiator.
8. a kind of veneer extends heat dissipating method, it is characterised in that the single plate radiator (4) on veneer (3)
Absorb the heat that the thermal source on veneer (3) is produced, by with the direct or indirect phase of single plate radiator (4)
The heat conduction connector of connection passes to backboard heat dissipation equipment (2), realizes expanding single plate radiator (4)
Heat loss through convection area, the thermal diffusivity for improving veneer.
9. veneer according to claim 8 extends heat dissipating method, it is characterised in that Part I list
Plate radiator (41) absorbs the heat of thermal source (10) generation for being relatively distant from backboard heat dissipation equipment (2) simultaneously
Connector is passed to, connector transfers heat to again the equal ther mal network on barricade radiator, then leads to
Cross the first sub- heat conduction connector and pass to backboard heat dissipation equipment (2).
10. veneer according to claim 8 extends heat dissipating method, it is characterised in that Part II
Single plate radiator (41) absorbs the heat that the relative thermal source (10) for closing on backboard heat dissipation equipment (2) is produced,
Backboard heat dissipation equipment (2) is passed to by the second sub- heat conduction connector.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510688637.9A CN106612602A (en) | 2015-10-21 | 2015-10-21 | Heat radiation structure and veneer expansion heat radiation method |
| PCT/CN2016/102044 WO2017067418A1 (en) | 2015-10-21 | 2016-10-13 | Heat dissipation structure and method for cooling veneer in extending way |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510688637.9A CN106612602A (en) | 2015-10-21 | 2015-10-21 | Heat radiation structure and veneer expansion heat radiation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106612602A true CN106612602A (en) | 2017-05-03 |
Family
ID=58556709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510688637.9A Pending CN106612602A (en) | 2015-10-21 | 2015-10-21 | Heat radiation structure and veneer expansion heat radiation method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106612602A (en) |
| WO (1) | WO2017067418A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI820348B (en) * | 2019-09-12 | 2023-11-01 | 美商太谷康奈特提威提公司 | Heat exchange assembly for a communication system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114497931B (en) * | 2020-10-28 | 2023-06-27 | 中国科学院理化技术研究所 | High temperature superconducting filter system |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201187731Y (en) * | 2008-01-07 | 2009-01-28 | 丽鸿科技股份有限公司 | LED light guide board and heat radiating device thereof |
| CN102612300B (en) * | 2012-02-23 | 2015-07-29 | 华为技术有限公司 | A kind of radio frequency remoto module and assemble method, base station and communication system |
| CN202918632U (en) * | 2012-10-15 | 2013-05-01 | 中航华东光电有限公司 | Double-sided cooling structure of multi-power components and electronic device thereof |
-
2015
- 2015-10-21 CN CN201510688637.9A patent/CN106612602A/en active Pending
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2016
- 2016-10-13 WO PCT/CN2016/102044 patent/WO2017067418A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI820348B (en) * | 2019-09-12 | 2023-11-01 | 美商太谷康奈特提威提公司 | Heat exchange assembly for a communication system |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017067418A1 (en) | 2017-04-27 |
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Application publication date: 20170503 |