CN110983337A

CN110983337A - Surface roughening treatment method for etching solution and aluminum substrate

Info

Publication number: CN110983337A
Application number: CN201911407178.7A
Authority: CN
Inventors: 潘政成; 卢力; 欧文雄
Original assignee: Jiangmen Huarui Aluminium Substrate Co Ltd
Current assignee: Jiangmen Huarui Aluminium Substrate Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-04-10

Abstract

The invention discloses an etching liquid medicine which comprises the following raw materials in parts by weight: 10-20 parts of organic acid and 70-90 parts of deionized water. The etching liquid medicine is used for etching the aluminum substrate, has a good roughening effect on the aluminum substrate, can remove oil, and simplifies an oil removing process; the etching liquid medicine can be removed only by heating, has no toxic action on the periphery at high temperature and has good environmental protection property. The aluminum substrate roughening treatment method adopts the etching liquid medicine to perform etching roughening, the process is simple, the roughening effect is good, redundant etching liquid medicine can be volatilized and removed by heating, the removing process is simple, and an alkali washing and neutralizing process is not needed.

Description

Surface roughening treatment method for etching solution and aluminum substrate

Technical Field

The invention belongs to the field of aluminum substrate manufacturing, and particularly relates to a surface roughening treatment method for etching liquid medicine and an aluminum substrate.

Background

The aluminum-based copper-clad plate is commonly called as an aluminum substrate, has excellent electrical performance, heat dissipation, electromagnetic shielding, high voltage resistance, bending processing and other performances, and is mainly applied to the related industries of high-power LED illumination, power supplies, television backlight sources, automobiles, computers, air conditioner frequency conversion modules, avionics, communication, medical treatment, audio equipment and the like.

Modern electronic products are gradually developing towards miniaturization, high integration and high performance, the power density of printed circuit boards is also increasing, and the heat dissipation of the circuit boards becomes a difficult problem. The high-thermal-conductivity PCB is manufactured by pressing an aluminum substrate, a film, a copper foil and a steel plate in the industry, so that the problem of heat dissipation of a circuit board is effectively solved. Before the aluminum substrate and the film are pressed, the surface of the aluminum substrate needs to be roughened so as to prevent a series of problems of plate explosion, layering, high pressure resistance and the like caused by poor combination of the aluminum substrate and the film in the production process. At present, the surface roughening method of the aluminum substrate includes plate grinding, wire drawing, anodic oxidation treatment, nano treatment and the like. For the treatment modes of plate grinding, wire drawing and anodic oxidation, the surface roughness consistency of the treated aluminum substrate is poor, the roughening effect is not ideal, the nano treatment mode has higher cost, the flow is complex and the production period is long; the adoption of acidic etching liquid medicine has the disadvantages of difficult control of etching, unsatisfactory coarsening effect, and complicated process because of the need of alkali washing to remove redundant acidic components. Therefore, an etching solution with good roughening effect is needed.

Disclosure of Invention

In view of the above, the invention provides an etching solution with good roughening effect.

In order to achieve the purpose, the technical scheme adopted by the invention is as follows:

an etching liquid medicine comprises the following raw materials in parts by weight: 10-20 parts of organic acid and 70-90 parts of deionized water.

In one embodiment of the present invention, the organic acid is at least one of formic acid or acetic acid.

Formic acid or acetic acid is used as an acidic component, the boiling point is lower than 120 ℃, and in the subsequent moisture drying process, the moisture is dried at 120 ℃ to ensure that the residual formic acid or acetic acid is volatilized.

In one embodiment of the invention, the feed comprises the following raw materials in parts by weight: 10-12 parts of acetic acid and 88-90 parts of deionized water.

Acetic acid is used as an acid component, so that the coarsening effect is good.

In one embodiment of the invention, the feed comprises the following raw materials in parts by weight: 10 parts of acetic acid and 90 parts of deionized water.

When the acetic acid is 10 parts and the deionized water is 90 parts, the roughening effect is optimal, and the peak width and the peak height of the roughened surface of the aluminum substrate are distributed concentratedly.

The invention also provides a roughening treatment method for the surface of the aluminum substrate, and the aluminum substrate is etched by using the etching liquid medicine.

In one embodiment of the present invention, the roughened surface of the aluminum substrate is washed with water and dried after the etching.

Compared with the prior art, the invention has the following beneficial effects:

the etching liquid medicine is used for etching the aluminum substrate, has a good roughening effect on the aluminum substrate, can remove oil, and simplifies an oil removing process; the etching liquid medicine can be removed only by heating, has no toxic action on the periphery at high temperature and has good environmental protection property. The aluminum substrate roughening treatment method has the advantages of simple process, good roughening effect, simple removal process and no need of an alkali washing neutralization process, and redundant etching liquid can be volatilized and removed by heating.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

Example 1

The embodiment provides an etching solution, which comprises the following raw materials in parts by weight: 10 parts of acetic acid and 90 parts of deionized water.

The roughening treatment method for the surface of the aluminum substrate is used for etching the aluminum substrate by using the etching liquid, and the etching temperature is 25-50 ℃.

And after the etching is finished, washing and drying the roughened surface of the aluminum substrate.

Example 2

The embodiment provides an etching solution, which comprises the following raw materials in parts by weight: 20 parts of acetic acid and 70 parts of deionized water.

Example 3

The embodiment provides an etching solution, which comprises the following raw materials in parts by weight: 10 parts of formic acid and 90 parts of deionized water.

Example 4

The embodiment provides an etching solution, which comprises the following raw materials in parts by weight: acetic acid 12 parts and deionized water 88 parts.

Comparative example 1

The embodiment provides an etching solution, which comprises the following raw materials in parts by weight: 10 parts of hydrochloric acid and 90 parts of deionized water.

The aluminum substrates roughened in examples 1 to 4 and comparative example 1 were subjected to slicing analysis, the analysis standard was referred to the copper foil roughness IPC standard, and the test results are shown in table 1.

TABLE 1 results of slicing analysis of roughened aluminum substrates of examples 1-4 and comparative example 1

As can be seen from table 1, the roughened surface of the aluminum substrates of examples 1 to 4 of the present invention has more concentrated peak height and peak width distribution and good roughening effect compared to the roughened surface of the aluminum substrate of comparative example 1, and after being pressed with a PP sheet, the roughened surface of the aluminum substrate is well combined and is not easy to crack or delaminate.

Various other modifications and changes may occur to those skilled in the art, such as those described above, and other embodiments, and it is intended that all such modifications and changes fall within the scope of the appended claims.

Claims

1. The etching liquid medicine is characterized by comprising the following raw materials in parts by weight: 10-20 parts of organic acid and 70-90 parts of deionized water.

2. The etching solution of claim 1, wherein the organic acid is at least one of formic acid or acetic acid.

3. The method for predicting the drug target according to claim 1, which is characterized by comprising the following raw materials in parts by weight: 10-12 parts of acetic acid and 88-90 parts of deionized water.

4. The drug target prediction method of claim 3, which is characterized by comprising the following raw materials in parts by weight: 10 parts of acetic acid and 90 parts of deionized water.

5. A method for roughening the surface of an aluminum substrate, wherein the aluminum substrate is etched by using the etching solution according to any one of claims 1 to 4.

6. The method of claim 5, wherein the roughened surface of the aluminum substrate is washed with water and dried after the etching.