CN219612113U - Etching-free aluminum-based copper-clad plate for common illuminating lamp - Google Patents

Etching-free aluminum-based copper-clad plate for common illuminating lamp Download PDF

Info

Publication number
CN219612113U
CN219612113U CN202320111069.6U CN202320111069U CN219612113U CN 219612113 U CN219612113 U CN 219612113U CN 202320111069 U CN202320111069 U CN 202320111069U CN 219612113 U CN219612113 U CN 219612113U
Authority
CN
China
Prior art keywords
aluminum
layer
clad plate
etching
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202320111069.6U
Other languages
Chinese (zh)
Inventor
罗保
郭伟国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Beigete New Material Co ltd
Original Assignee
Guangdong Beigete New Material Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Beigete New Material Co ltd filed Critical Guangdong Beigete New Material Co ltd
Priority to CN202320111069.6U priority Critical patent/CN219612113U/en
Application granted granted Critical
Publication of CN219612113U publication Critical patent/CN219612113U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

The utility model discloses an aluminum-based copper-clad plate for an etching-free common illuminating lamp, which comprises an aluminum substrate, wherein an insulating adhesive layer is arranged at the top of the aluminum substrate, a heat dissipation layer is arranged on one side of the insulating adhesive layer, which is far away from the aluminum substrate, a voltage-resistant layer is arranged on one side of the heat dissipation layer, which is far away from the insulating adhesive layer, and a circuit copper foil is uniformly arranged on one side of the voltage-resistant layer, wherein the aluminum substrate, the insulating adhesive layer, the heat dissipation layer, the voltage-resistant layer, the circuit copper foil, the oxidation-resistant layer and the wear-resistant layer are arranged.

Description

Etching-free aluminum-based copper-clad plate for common illuminating lamp
Technical Field
The utility model relates to the technical field of aluminum-based copper-clad plates, in particular to an etching-free aluminum-based copper-clad plate for a common illuminating lamp.
Background
An aluminum-based copper-clad plate, namely an aluminum substrate, is a raw material, is a plate-shaped material prepared by dipping electronic glass fiber cloth or other reinforcing materials with resin, single resin and the like as insulating adhesive layers, coating copper foil on one surface or both surfaces of the plate-shaped material and carrying out hot pressing, and is called a copper-clad laminated aluminum substrate, wherein a circuit is usually manufactured in the production process of a Printed Circuit Board (PCB) in the traditional aluminum-based copper-clad plate production process, such as a Chinese patent with the publication number of CN102152539B, the aluminum-based copper-clad plate is disclosed, a resin precursor solution is coated on the aluminum plate of the aluminum-based copper-clad plate, and a polyimide resin layer filled with high heat conductive filler and containing active hydroxyl side groups is formed on the aluminum plate after baking. The production and manufacturing of the circuit mostly adopt an etching mode, namely, an etching solution is used for etching the copper foil of the non-circuit part on the aluminum-based copper-clad plate to obtain a circuit pattern, the mode increases the later processing cost, and simultaneously reduces the processing efficiency, so that the requirement of a customer cannot be met, and therefore, the aluminum-based copper-clad plate for the etching-free common illuminating lamp is provided, and the problems are solved.
Disclosure of Invention
Aiming at the problems in the prior art, the utility model aims to provide the aluminum-based copper-clad plate for the common illuminating lamp without etching, has the advantage of no need of etching when the aluminum-based copper-clad plate for the common illuminating lamp is used, and solves the problem that the original aluminum-based copper-clad plate for the common illuminating lamp needs to be etched when the aluminum-based copper-clad plate for the common illuminating lamp is used.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the aluminum-based copper-clad plate for the etching-free common illuminating lamp comprises an aluminum substrate, wherein an insulating adhesive layer is arranged at the top of the aluminum substrate, a heat dissipation layer is arranged on one side, away from the aluminum substrate, of the insulating adhesive layer, a voltage-resistant layer is arranged on one side, away from the insulating adhesive layer, of the heat dissipation layer, a circuit copper foil is uniformly arranged on one side, away from the heat dissipation layer, of the voltage-resistant layer, and an oxidation prevention layer is arranged on the outer surface of the circuit copper foil.
Preferably, a wear-resistant layer is arranged on one side, far away from the insulating glue layer, of the aluminum substrate, and the wear-resistant layer is made of a copper alloy film.
Preferably, the aluminum substrate is made of H22 type aluminum material with high softness, and the thickness of the aluminum substrate is 50+/-60 mu m.
Preferably, the thickness of the circuit copper foil is 25+/-2 mu m, and the width of the circuit copper foil is 2.0+/-0.2 mm respectively.
Preferably, the distance between the circuit copper foils is 2.5+/-0.2 mm, and the distance between the circuit copper foils and the board edge is 3.0+/-0.2 mm.
Preferably, the heat dissipation layer is made of graphite heat dissipation sheets, and the voltage-resistant layer is made of crosslinked polyethylene.
Compared with the prior art, the utility model has the following beneficial effects:
according to the utility model, the aluminum base plate, the insulating adhesive layer, the heat dissipation layer, the voltage-resistant layer, the circuit copper foil, the oxidation-resistant layer and the wear-resistant layer are arranged, so that the aluminum base copper-clad plate can be jointly constructed, meanwhile, the copper foil required by the circuit can be directly adhered to the glue surface of the semi-solidified insulating adhesive layer, and is baked for two hours at 165 ℃ after being rolled at a high temperature of 100+/-10 ℃, the cost advantage is obvious, environment-friendly and pollution-free, the insulating adhesive layer is arranged, the insulating property of the aluminum base copper-clad plate can be improved, the electric appliance element can be operated more safely and stably, the heat dissipation layer can conduct heat rapidly, the heat accumulation phenomenon is prevented, the damage of the electric appliance element is avoided, the economic loss is increased, the voltage-resistant layer is arranged, the voltage-resistant performance of the aluminum base copper-clad plate can be improved, the breakdown phenomenon is effectively prevented, the oxidation-resistant layer is arranged, the oxidation resistance of the circuit copper foil can be improved, the aluminum base copper-clad plate does not need to be corroded by substances such as strong alkali or the like on the surface of the aluminum base copper-clad plate before processing, and the common illuminating lamp is used, the original illuminating lamp can be etched, and the requirements of a common customer can be met when the common illuminating lamp is used.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a front view of an aluminum substrate structure of the present utility model;
fig. 3 is an enlarged view of the structure of fig. 2 at a in accordance with the present utility model.
In the figure: 1. an aluminum substrate; 2. an insulating adhesive layer; 3. a heat dissipation layer; 4. a voltage-resistant layer; 5. a circuit copper foil; 6. an oxidation preventing layer; 7. and a wear-resistant layer.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1 to 3, an aluminum-based copper-clad plate for an etching-free general lighting lamp comprises an aluminum substrate 1, an insulating adhesive layer 2 is arranged at the top of the aluminum substrate 1, a heat dissipation layer 3 is arranged at one side of the insulating adhesive layer 2 far away from the aluminum substrate 1, a voltage-resistant layer 4 is arranged at one side of the heat dissipation layer 3 far away from the insulating adhesive layer 2, a circuit copper foil 5 is uniformly arranged at one side of the voltage-resistant layer 4 far away from the heat dissipation layer 3, an oxidation-resistant layer 6 is arranged on the outer surface of the circuit copper foil 5, the oxidation-resistant layer 6 is made of Mitsubishi acrylic resin BR-116, mitsubishi acrylic resin BR-116 is an air-dried acrylic resin, baking is not needed, the Mitsubishi acrylic resin BR-116 has good wettability, is easy to disperse pigment, has high gloss, attractive appearance, outstanding weather resistance, high hardness, excellent solvent resistance, excellent chemical resistance and excellent steaming resistance, the excellent flexibility has excellent adhesiveness to a substrate and excellent thermal decomposition property, so that the oxidation resistance of the circuit copper foil 5 can be improved, an aluminum-based copper-clad plate can be jointly constructed by arranging the aluminum substrate 1, the insulating adhesive layer 2, the heat dissipation layer 3, the voltage-resistant layer 4, the circuit copper foil 5, the oxidation-resistant layer 6 and the wear-resistant layer 7, meanwhile, the copper foil required by a circuit can be directly coated on the adhesive surface of the semi-solidified insulating adhesive layer 2 after being rolled at a high temperature of 100+/-10 ℃ for two hours, the cost advantage is obvious, the environment is protected and pollution-free, the insulating adhesive layer 2 is arranged, the insulating property of the aluminum-based copper-clad plate can be improved, the operation of an electric appliance element is safer and more stable, the heat dissipation layer 3 can conduct heat dissipation rapidly, the heat accumulation phenomenon is prevented, and the electric appliance element is damaged, the aluminum-based copper-clad plate has the advantages that the economic loss is increased, the voltage resistance performance of the aluminum-based copper-clad plate can be improved, the breakdown phenomenon can be effectively prevented, the oxidation resistance of the circuit copper foil 5 can be improved, the wear-resistant layer 7 is arranged, the aluminum-based copper-clad plate can be prevented from being corroded by substances such as strong acid or strong alkali on the surface of the aluminum-based copper-clad plate before processing, the aluminum-based copper-clad plate for the common illuminating lamp is provided with the structure, the aluminum-based copper-clad plate for the common illuminating lamp is used without etching, and the problem that the aluminum-based copper-clad plate for the common illuminating lamp needs etching when being used is solved, so that the requirements of customers can be met.
Specifically, the side of the aluminum substrate 1 far away from the insulating adhesive layer 2 is provided with the wear-resistant layer 7, the wear-resistant layer 7 is made of a copper alloy film, and the aluminum-based copper-clad plate can be prevented from being corroded by substances such as strong acid or strong alkali on the surface of the aluminum-based copper-clad plate before being processed by arranging the wear-resistant layer 7 to be made of the copper alloy film.
Specifically, the aluminum substrate 1 is made of an H22 type aluminum material with high flexibility, the thickness of the aluminum substrate 1 is 50±60 μm, and the bending resistance of the aluminum substrate 1 can be improved by arranging the aluminum substrate 1 to be made of the H22 type aluminum material with high flexibility, so that the aluminum substrate 1 is not easy to deform in size during processing.
Specifically, the thickness of the wiring copper foil 5 was 25.+ -. 2. Mu.m, and the width of the wiring copper foil 5 was 2.0.+ -. 0.2mm, respectively.
Specifically, the distance between the circuit copper foils 5 is 2.5+ -0.2 mm, and the distance from the circuit copper foils 5 to the board edge is 3.0+ -0.2 mm.
Specifically, the material of the heat dissipation layer 3 is graphite heat dissipation fins, the material of the voltage resistant layer 4 is crosslinked polyethylene, heat can be conducted and dissipated rapidly through the arrangement of the heat dissipation layer 3 which is the graphite heat dissipation fins, heat accumulation phenomenon is prevented from occurring, damage to electrical components is avoided, economic loss is increased, the material of the voltage resistant layer 4 is crosslinked polyethylene, polyethylene (PE) crosslinking technology is one of important means for improving the material performance of the aluminum-based copper-clad plate, the performance of the PE can be improved greatly through crosslinking modification, the comprehensive performances such as mechanical performance, environmental stress cracking resistance, chemical corrosion resistance, creep resistance and electrical performance of the PE are obviously improved, the temperature resistant grade is obviously improved, the heat resistant temperature of the PE is improved from 70 ℃ to more than 100 ℃, the application field of the PE is greatly widened, the voltage resistant performance of the aluminum-based copper-clad plate can be improved, and breakdown phenomenon is effectively prevented.
When the aluminum-based copper-clad plate is used, the aluminum-based copper-clad plate can be jointly constructed through the aluminum substrate 1, the insulating adhesive layer 2, the heat dissipation layer 3, the voltage-resistant layer 4, the circuit copper foil 5, the oxidation-resistant layer 6 and the wear-resistant layer 7, meanwhile, the copper foil required by a circuit can be directly adhered to the adhesive surface of the semi-solidified insulating adhesive layer 2, the copper foil is baked for two hours after being rolled at the high temperature of 100+/-10 ℃, the cost advantage is obvious and environment-friendly, no pollution is caused, the insulating adhesive layer 2 is arranged, the insulating performance of the aluminum-based copper-clad plate can be improved, the electric appliance element can be operated more safely and stably, the heat dissipation layer 3 is arranged, the heat can be conducted and dissipated rapidly, the heat accumulation phenomenon is prevented, the electric appliance element is damaged, the economic loss is increased, the setting of the voltage-resistant layer 4 can be improved, the breakdown phenomenon is effectively prevented, the oxidation-resistant performance of the circuit copper foil 5 can be improved, the wear-resistant layer 7 is arranged, the aluminum-based copper-clad plate can be prevented from being corroded by substances such as copper plate or strong alkali before processing, and the aluminum-based copper-clad plate can be used by matching with the strong acid, and the common illuminating lamp can be used, and the customer can not need to etch when using the aluminum-based copper-clad plate.
Standard parts used in the file of the utility model can be purchased from market, and can be customized according to the description of the specification and the drawings, the specific connection modes of all parts adopt conventional means such as mature bolts, rivets, welding and the like in the prior art, the machinery, the parts and the equipment adopt conventional models in the prior art, the control mode is controlled automatically by a controller, a control circuit of the controller can be realized by simple programming of a person skilled in the art, the utility model belongs to common general knowledge in the art, and the utility model is mainly used for protecting mechanical devices, so the utility model does not explain the control mode and circuit connection in detail.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The aluminum-based copper-clad plate for the etching-free common illuminating lamp comprises an aluminum substrate (1), and is characterized in that: the aluminum substrate is characterized in that the top of the aluminum substrate (1) is provided with an insulating adhesive layer (2), one side, away from the aluminum substrate (1), of the insulating adhesive layer (2) is provided with a heat dissipation layer (3), one side, away from the insulating adhesive layer (2), of the heat dissipation layer (3) is provided with a voltage-resistant layer (4), one side, away from the heat dissipation layer (3), of the voltage-resistant layer (4) is uniformly provided with a circuit copper foil (5), and the outer surface of the circuit copper foil (5) is provided with an oxidation prevention layer (6).
2. The etching-free aluminum-based copper-clad plate for a general illumination lamp according to claim 1, wherein: one side of the aluminum substrate (1) far away from the insulating adhesive layer (2) is provided with a wear-resistant layer (7), and the wear-resistant layer (7) is made of a copper alloy film.
3. The etching-free aluminum-based copper-clad plate for a general illumination lamp according to claim 1, wherein: the aluminum substrate (1) is made of H22 type aluminum material with high softness, and the thickness of the aluminum substrate (1) is 50+/-60 mu m.
4. The etching-free aluminum-based copper-clad plate for a general illumination lamp according to claim 1, wherein: the thickness of the circuit copper foil (5) is 25+/-2 mu m, and the width of the circuit copper foil (5) is 2.0+/-0.2 mm respectively.
5. The etching-free aluminum-based copper-clad plate for a general illumination lamp according to claim 1, wherein: the distance between the circuit copper foils (5) is 2.5 plus or minus 0.2mm, and the distance between the circuit copper foils (5) and the board edge is 3.0 plus or minus 0.2mm.
6. The etching-free aluminum-based copper-clad plate for a general illumination lamp according to claim 1, wherein: the heat dissipation layer (3) is made of graphite heat dissipation sheets, and the voltage-resistant layer (4) is made of crosslinked polyethylene.
CN202320111069.6U 2023-01-14 2023-01-14 Etching-free aluminum-based copper-clad plate for common illuminating lamp Active CN219612113U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320111069.6U CN219612113U (en) 2023-01-14 2023-01-14 Etching-free aluminum-based copper-clad plate for common illuminating lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320111069.6U CN219612113U (en) 2023-01-14 2023-01-14 Etching-free aluminum-based copper-clad plate for common illuminating lamp

Publications (1)

Publication Number Publication Date
CN219612113U true CN219612113U (en) 2023-08-29

Family

ID=87741726

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320111069.6U Active CN219612113U (en) 2023-01-14 2023-01-14 Etching-free aluminum-based copper-clad plate for common illuminating lamp

Country Status (1)

Country Link
CN (1) CN219612113U (en)

Similar Documents

Publication Publication Date Title
JP5947400B2 (en) Method for manufacturing metal printed circuit board
WO2018107924A1 (en) Flexible circuit board and preparation method, and solar photovoltaic assembly
CN110809360A (en) Double-sided flexible circuit board and manufacturing method thereof
JP2007081237A (en) Circuit board, thin film solar battery and its manufacturing method
CN219612113U (en) Etching-free aluminum-based copper-clad plate for common illuminating lamp
CN206497882U (en) Nano metal substrate for ultra fine-line FPC and COF material
CN206490052U (en) Nano metal base material for ultra fine-line FPC and COF material
CN204894663U (en) Flexible aluminium base copper -clad plate
CN216217692U (en) FPC circuit board of aluminium system LED
JP2004009357A (en) Metal vapor-deposited/metal plated laminated film and electronic part using the same
CN106560458A (en) Production process for thinned touch screen glass
CN206790770U (en) Aluminium-based copper-clad laminate
CN110087399A (en) A kind of circuit base plate Flexible Production technique
CN217904979U (en) Electromagnetic wave shielding film
CN113966079B (en) LED flexible circuit board and preparation method thereof
CN101868118A (en) High-frequency circuit substrate and production method thereof
CN113597243A (en) Electromagnetic shielding film
CN207783277U (en) Aluminium base heat dissipation high temperature resistance multilayer backboard
CN214125626U (en) Multilayer structure copper-clad plate
WO2012009839A1 (en) Single-sided circuit board and manufacturing method thereof
CN111954368A (en) Thermoelectric separation filling electroplated double-sided metal substrate and manufacturing method thereof
CN219536383U (en) High temperature resistant effectual PCB board
CN220139810U (en) Novel aluminum-based double-sided aluminum foil-coated plate
CN220528275U (en) Flexible metal-clad plate and flexible circuit board
CN214592122U (en) Ceramic-based high-frequency circuit board

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant