CN110978119A - Method for cutting shading glue of backlight module - Google Patents
Method for cutting shading glue of backlight module Download PDFInfo
- Publication number
- CN110978119A CN110978119A CN201911238778.5A CN201911238778A CN110978119A CN 110978119 A CN110978119 A CN 110978119A CN 201911238778 A CN201911238778 A CN 201911238778A CN 110978119 A CN110978119 A CN 110978119A
- Authority
- CN
- China
- Prior art keywords
- shading glue
- waste
- hole
- glue
- punching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D9/00—Cutting apparatus combined with punching or perforating apparatus or with dissimilar cutting apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
- B26D7/1845—Means for removing cut-out material or waste by non mechanical means
- B26D7/1863—Means for removing cut-out material or waste by non mechanical means by suction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
- B26F1/14—Punching tools; Punching dies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
- B26F2001/4427—Cutters therefor; Dies therefor combining cutting and forming operations
Abstract
The invention discloses a method for cutting shading glue of a backlight module, which comprises the following steps of S1: transferring and pasting a protective film on the bottom supporting film; s2, punching of a protective film: punching small holes on the protective film, discharging peripheral waste materials around the small holes, and reserving the protective film in the small holes; s3, after the waste of the protective film is discharged, covering the shading glue at the position of the circular hole, and simultaneously rolling the supporting film on the shading glue; s4, punching shading glue at the positions of the small holes: punching the outer circle shape of the small hole of the shading glue at the position of the circular hole, and leaving the circular shading glue of the small hole; s5, removing the waste materials in the shape of the shading glue at the position of the round hole, covering the shading glue at the position of the frame, and simultaneously rolling the base film on the shading glue. S6, punching the appearance of the shading glue and the small holes in the shading glue by using a small hole waste suction mould, wherein the mould has a waste suction function, and waste materials at the small holes are sucked away by the small hole waste suction mould; s7, waste discharge and rolling: and discharging the waste materials at the edge of the shading glue, and rolling to obtain a finished product.
Description
Technical Field
The invention relates to the technical field of cutting, in particular to a method for cutting a backlight module shading glue.
Background
The backlight module is a light source device for ensuring the brightness of the back of the liquid crystal display screen, and the liquid crystal display device is transparent and can not emit light, so the backlight module is needed for assistance. Some indexes such as brightness and uniformity of the backlight module have direct influence on the relevant performance of the liquid crystal display screen. The light leakage prevention is an important link in the quality of the backlight module, the light leakage prevention of the backlight module mainly comprises light shading glue and a peripheral frame, and the light shading glue for preventing light leakage is mainly positioned on the outer layer of the backlight module.
At present, the shading glue for the narrow-frame backlight module with the opening structure can be finished only by multiple times of punching of multiple devices in the flat cutter cutting process, a large amount of manpower is consumed, the utilization rate of the devices is low, and the productivity is low. In addition, the multiple positioning operations of multiple machines also affect the dimensional accuracy of the product.
Disclosure of Invention
The invention mainly solves the technical problem of providing a method for cutting the shading glue of the backlight module. The small hole waste suction die is used for punching and waste extraction, and the punched product is integrally formed, so that the manual inspection difficulty is reduced, and the pressure injury caused by small hole waste is avoided. At least one embodiment of the invention simultaneously improves the production yield and reduces the waste discharge process of the adhesive tape which needs to be attached to the small hole.
The invention discloses a method for cutting a reflector plate of a backlight module, which comprises the following steps:
s1, transferring materials: transferring and pasting a protective film on the bottom supporting film;
s2, punching of a protective film: punching small holes on the protective film, discharging peripheral waste materials around the small holes, and reserving the protective film in the small holes;
s3, after the waste of the protective film is discharged, covering the shading glue at the position of the circular hole, and simultaneously rolling the supporting film on the shading glue;
s4, punching shading glue at the positions of the small holes: punching the outer circle shape of the small hole of the shading glue at the position of the circular hole, and leaving the circular shading glue of the small hole;
s5, removing the waste materials in the shape of the shading glue at the position of the circular hole, covering the shading glue at the position of the frame, and simultaneously rolling the carrier film on the shading glue;
s6, punching the appearance of the shading glue and the small holes in the shading glue by using a small hole waste suction mould, wherein the mould has a waste suction function, and waste materials at the small holes are sucked away by the small hole waste suction mould;
s7, waste discharge and rolling: and discharging the waste materials at the edge of the shading glue, and rolling to obtain a finished product.
In a preferred embodiment, the small hole waste suction mold comprises a knife film and a mold base.
Furthermore, two opposite sides of a non-cutting area of a base of the small hole waste suction mold are provided with positioning columns, and a groove is formed in the reverse side of the small hole waste suction mold. Specifically, the aperture through-hole that the useless mould was inhaled to the aperture link up the recess, the recess is equipped with the gas pocket, the gas pocket is used for connecting the trachea and adsorbs the waste material to make the aperture waste material that openly cuts pass through the recess is discharged. The base film is a PET low-adhesive film or a release film.
Drawings
The invention and its advantages will be better understood by studying the following detailed description of specific embodiments, given by way of non-limiting example, and illustrated in the accompanying drawings, in which:
FIG. 1 is a flowchart illustrating a method for cutting a light shielding adhesive of a backlight module according to an embodiment of the invention.
FIG. 2 is a perspective view of a small orifice waste aspiration mold in accordance with an embodiment of the present invention.
FIG. 3 is a rear view of a small orifice aspiration waste mold of an embodiment of the present invention.
Fig. 4 is a structural view of a conventional light shielding paste.
Detailed Description
Referring to the drawings, wherein like reference numbers refer to like elements throughout, the principles of the present invention are illustrated in an appropriate environment. The following description is based on illustrated embodiments of the invention and should not be taken as limiting the invention with regard to other embodiments that are not detailed herein.
The word "embodiment" is used herein to mean serving as an example, instance, or illustration. In addition, the articles "a" and "an" as used in this specification and the appended claims may generally be construed to mean "one or more" unless specified otherwise or clear from context to be directed to a singular form.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in functional relationship to each other. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Further, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise direct contact of the first and second features through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
Examples
First, referring to fig. 1-3, a method for cutting a light shielding adhesive of a backlight module according to an embodiment of the present invention is described, which includes the following steps:
s1, transferring materials: transferring and pasting a protective film on the bottom supporting film;
s2, punching of a protective film: punching small holes on the protective film, discharging peripheral waste materials around the small holes, and reserving the protective film in the small holes;
s3, after the waste of the protective film is discharged, covering the shading glue at the position of the circular hole, and simultaneously rolling the supporting film on the shading glue;
s4, punching shading glue at the positions of the small holes: punching the outer circle shape of the small hole of the shading glue at the position of the circular hole, and leaving the circular shading glue of the small hole;
s5, removing the waste materials in the shape of the shading glue at the position of the circular hole, covering the shading glue at the position of the frame, and simultaneously rolling the carrier film on the shading glue;
s5, punching the appearance of the shading glue and the small holes in the shading glue by using the small hole waste suction mould 1, wherein the mould has a waste suction function, and waste materials at the small holes are sucked away by the small hole waste suction mould 1;
s6, waste discharge and rolling: and discharging the waste materials at the edge of the shading glue, and rolling to obtain a finished product.
The small hole waste suction mold 1 comprises a cutter film 2 and a mold base 3. And positioning columns 4 are arranged on two opposite sides of a non-cutting area of the mold base 3, and grooves 6 are formed in the reverse side of the small hole waste suction mold 1. Specifically, the aperture through-hole 7 that the useless mould was inhaled to the aperture link up recess 6, recess 6 is equipped with gas pocket 8, gas pocket 8 is used for connecting the trachea and carries out the waste material and adsorb to make the aperture waste material that openly cuts pass through recess 6 drains away.
Claims (5)
1. A method for cutting shading glue of a backlight module is characterized by comprising the following steps:
s1, transferring materials: transferring and pasting a protective film on the bottom supporting film;
s2, punching of a protective film: punching small holes on the protective film, discharging peripheral waste materials around the small holes, and reserving the protective film in the small holes;
s3, after the waste of the protective film is discharged, covering the shading glue at the position of the circular hole, and simultaneously rolling the supporting film on the shading glue;
s4, punching shading glue at the positions of the small holes: punching the outer circle shape of the small hole of the shading glue at the position of the circular hole, and leaving the circular shading glue of the small hole;
s5, removing the waste materials in the shape of the shading glue at the position of the circular hole, covering the shading glue at the position of the frame, and simultaneously rolling the carrier film on the shading glue;
s6, punching the appearance of the shading glue and the small holes in the shading glue by using a small hole waste suction mould, wherein the mould has a waste suction function, and waste materials at the small holes are sucked away by the small hole waste suction mould;
s7, waste discharge and rolling: and discharging the waste materials at the edge of the shading glue, and rolling to obtain a finished product.
2. The method for cutting the light shielding glue of a backlight module as claimed in claim 1, wherein: the small hole waste suction mold comprises a cutter film and a mold base.
3. The method for cutting the light shielding glue of a backlight module as claimed in claim 2, wherein: the two opposite sides of the non-cutting area of the base of the small hole waste suction mold are provided with positioning columns, and the reverse side of the small hole waste suction mold is provided with a groove.
4. The method for cutting the light shielding glue of a backlight module according to any one of claim 3, wherein: the small hole through hole of the small hole waste suction mold is communicated with the groove, the groove is provided with an air hole, and the air hole is used for connecting an air pipe to adsorb waste materials, so that the small hole waste materials cut on the front side are discharged through the groove.
5. The method for cutting the light shielding glue of a backlight module as claimed in claim 1, wherein: the base film is a PET low-adhesive film or a release film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911238778.5A CN110978119A (en) | 2019-12-06 | 2019-12-06 | Method for cutting shading glue of backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911238778.5A CN110978119A (en) | 2019-12-06 | 2019-12-06 | Method for cutting shading glue of backlight module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110978119A true CN110978119A (en) | 2020-04-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911238778.5A Pending CN110978119A (en) | 2019-12-06 | 2019-12-06 | Method for cutting shading glue of backlight module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110978119A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111730681A (en) * | 2020-07-22 | 2020-10-02 | 太仓展新胶粘材料股份有限公司 | Preparation method of OCA optical cement with round hole having shading black edge and die cutting device |
| WO2022036854A1 (en) * | 2020-08-19 | 2022-02-24 | 太仓展新胶粘材料股份有限公司 | Preparation method for optically clear adhesive (oca) having light-shielding edge |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4301200A1 (en) * | 1993-01-19 | 1994-07-21 | Illig Maschinenbau Adolf | Steel belt cutting tool for trimming vacuum formed mouldings |
| JPH07242082A (en) * | 1994-03-08 | 1995-09-19 | Dainippon Printing Co Ltd | Continuous form with card |
| CN2933762Y (en) * | 2006-05-12 | 2007-08-15 | 德昌事务用品有限公司 | Automatic chip removing device inside cutter mold |
| KR20100078237A (en) * | 2008-12-30 | 2010-07-08 | 주식회사 우진정공 | Adhesion structure for push of punching press |
| CN203875959U (en) * | 2014-05-27 | 2014-10-15 | 东莞劲胜精密组件股份有限公司 | Punching die |
| US20150000494A1 (en) * | 2011-10-07 | 2015-01-01 | Cito-System Gmbh | Device for perforating and/or fluting and/or punching for rotary presses, in particular for rotary printing presses |
| CN105778803A (en) * | 2016-03-09 | 2016-07-20 | 深圳市智优精密制造有限公司 | Production process of mobile phone camera back adhesive |
| CN109968446A (en) * | 2019-04-02 | 2019-07-05 | 深圳市山本光电股份有限公司 | A kind of punching cutting process of shading glue |
| CN110126018A (en) * | 2019-04-02 | 2019-08-16 | 深圳市山本光电股份有限公司 | A kind of punching cutting process of the diffusion barrier with shading glue |
-
2019
- 2019-12-06 CN CN201911238778.5A patent/CN110978119A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4301200A1 (en) * | 1993-01-19 | 1994-07-21 | Illig Maschinenbau Adolf | Steel belt cutting tool for trimming vacuum formed mouldings |
| JPH07242082A (en) * | 1994-03-08 | 1995-09-19 | Dainippon Printing Co Ltd | Continuous form with card |
| CN2933762Y (en) * | 2006-05-12 | 2007-08-15 | 德昌事务用品有限公司 | Automatic chip removing device inside cutter mold |
| KR20100078237A (en) * | 2008-12-30 | 2010-07-08 | 주식회사 우진정공 | Adhesion structure for push of punching press |
| US20150000494A1 (en) * | 2011-10-07 | 2015-01-01 | Cito-System Gmbh | Device for perforating and/or fluting and/or punching for rotary presses, in particular for rotary printing presses |
| CN203875959U (en) * | 2014-05-27 | 2014-10-15 | 东莞劲胜精密组件股份有限公司 | Punching die |
| CN105778803A (en) * | 2016-03-09 | 2016-07-20 | 深圳市智优精密制造有限公司 | Production process of mobile phone camera back adhesive |
| CN109968446A (en) * | 2019-04-02 | 2019-07-05 | 深圳市山本光电股份有限公司 | A kind of punching cutting process of shading glue |
| CN110126018A (en) * | 2019-04-02 | 2019-08-16 | 深圳市山本光电股份有限公司 | A kind of punching cutting process of the diffusion barrier with shading glue |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111730681A (en) * | 2020-07-22 | 2020-10-02 | 太仓展新胶粘材料股份有限公司 | Preparation method of OCA optical cement with round hole having shading black edge and die cutting device |
| CN111730681B (en) * | 2020-07-22 | 2020-11-17 | 太仓展新胶粘材料股份有限公司 | Preparation method of OCA optical cement with round hole having shading black edge and die cutting device |
| WO2022036854A1 (en) * | 2020-08-19 | 2022-02-24 | 太仓展新胶粘材料股份有限公司 | Preparation method for optically clear adhesive (oca) having light-shielding edge |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200410 |
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| RJ01 | Rejection of invention patent application after publication |