CN110883856A - Method for integrally cutting FPC (Flexible printed Circuit) and LED (light-emitting diode) lamp strip - Google Patents
Method for integrally cutting FPC (Flexible printed Circuit) and LED (light-emitting diode) lamp strip Download PDFInfo
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- CN110883856A CN110883856A CN201911132769.8A CN201911132769A CN110883856A CN 110883856 A CN110883856 A CN 110883856A CN 201911132769 A CN201911132769 A CN 201911132769A CN 110883856 A CN110883856 A CN 110883856A
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- fpc
- cutting
- release film
- double
- lower die
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
- B26F2001/4427—Cutters therefor; Dies therefor combining cutting and forming operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a method for integrally cutting an FPC (flexible printed circuit) and an LED (light-emitting diode) lamp strip, which comprises the following steps of: FPC cutting pretreatment: cutting one end of the FPC at a pull handle position; fixedly connecting the LED lamp to the FPC obtained in the step S1 by using an SMT technology, wherein one side of a light emitting surface of the LED lamp is the front side of the FPC, and the opposite side is the back side of the FPC; tearing off the protective film on one side of the double-sided adhesive opposite to the release film, and attaching the side of the double-sided adhesive opposite to the release film to the back of the FPC so as to combine the double-sided adhesive with the FPC; placing the product obtained in the step S3 on a lower die table of the shape punching die, and fixing the product through a positioning column of the lower die table and a positioning hole of the product obtained in the step S3 so that the LED lamp strip is positioned in a position avoiding groove of the lower die table; the product obtained in S3 is subjected to a cutting operation from the back side of the FPC using a punching blade of the outline punching die.
Description
Technical Field
The invention relates to the technical field of FPC cutting, in particular to a method for integrally cutting an FPC and an LED light bar.
Background
The LED lamp strip structure of the backlight module is characterized in that an LED lamp is arranged on one side of a Flexible Printed Circuit (FPC), and double-faced adhesive tapes are arranged on the FPC at the tail position of a lamp front lamp of an LED lamp bead and are used for being fixed on a light guide plate and a rubber frame. When FPC cuts, die-cut mould includes cope match-plate pattern and lower bolster, and the cope match-plate pattern is equipped with cuts the sword. The principle is that the LED lamp beads are avoided by arranging the avoiding groove on the lower template, and the cutting knife of the upper template cuts the FPC soft board.
However, the LED lamp beads of the narrow-frame backlight module FPC are very close to the edge of the FPC, and higher requirements are provided for the cutting process. The LED light bar structure suitable for the inverted technology (COF) of the narrow-frame backlight module is as follows: the FPC with the LED is arranged on the front surface, and the FPC with the LED light emitting surface is provided with a double-sided adhesive tape for adhering and fixing on the light guide plate; and the reverse side of the FPC, which is not provided with the LED, is provided with a double-sided adhesive tape for bonding and fixing on the iron frame. The interval between the LED lamp back of present COF technology and FPC flange limit only is 0.2mm, leads to cutting the sword and can weigh LED lamp pearl when cutting, need dodge the design to LED lamp pearl, and dodge LED lamp pearl on the current technology requirement cutting die and need just can cut by the lower sword more than 0.3mm at least, lead to the unable lower sword of cutting die to can't accomplish FPC's appearance and cut.
The existing narrow-edge FPC cutting process is characterized in that two-knife cutting is carried out, refer to patent CN109732701A and patent CN108811329A, the first knife cuts from an LED face, and the second knife cuts from a non-LED face. Or cutting and then pasting (sticking double-sided adhesive tape). The conventional production method of cutting twice and cutting first and then mounting is unstable in size control, an error exists between two cutters, the process is complicated, and the requirements for increasing quality and efficiency cannot be met, so that the problem that how to enable the size and quality of a product to meet the design requirements under the condition of not damaging an LED is solved.
Disclosure of Invention
The invention mainly solves the technical problem of providing a method for integrally cutting an FPC (flexible printed circuit) and an LED (light-emitting diode) lamp strip, which comprises the following steps:
s1, FPC cutting pretreatment: cutting one end of the FPC at a pull handle position;
s2, fixedly connecting the LED lamp to the FPC obtained in S1 by utilizing an SMT technology, wherein one side where the light emitting surface of the LED lamp is located is the front side of the FPC, and the opposite side is the back side of the FPC;
s3, tearing off the protective film on the side, opposite to the release film, of the double-faced adhesive tape, and respectively attaching the opposite sides of the double-faced adhesive tape and the release film to the front side and the back side of the FPC to enable the double-faced adhesive tape to be combined with the FPC;
s4, placing the product obtained in the step S3 on a lower die table of an outline punching die, and fixing the product through a positioning column of the lower die table and a positioning hole of the product obtained in the step S3 to enable the LED lamp strip to be located in a position avoiding groove of the lower die table;
and S5, cutting the product obtained in the step S3 from the back surface of the FPC by using a punching knife of an outer shape punching die, wherein the punching knife comprises a plurality of blades.
In a preferred embodiment, after the step S1, the cut FPC area is smaller than the cut mark area of the outline cutting die.
In a preferred embodiment, a PE protection film and a release film are respectively attached to both sides of the double-sided adhesive tape, and the release film is provided with a positioning hole.
In a preferred embodiment, a first PE protection film and a release film are respectively attached to two sides of the double-sided tape, a second PE protection film is attached to the outer side of the release film, and a positioning hole is formed in the second PE protection film.
In a preferred embodiment, before the step S5, the second PE protection film attached to the outer side of the release film is torn off.
In a preferred embodiment, a double-sided tape cutting step is provided before the step of S2, and the cutting step includes: cutting an opening in the release film, wherein the opening is used for adhering the LED light bar by the double faced adhesive tape; and cutting the release film to enable the shape of the cut release film to be consistent with the shape of the FPC after the step S2.
In a preferred embodiment, in step S5, the upper die blade of the punching blade moves downward to press against the lower die table.
In a preferred embodiment, after the upper die blade of the punching cutter is pressed with the lower die table, the horizontal position of the upper die blade of the punching cutter is higher than the bottom of the lower die table, and the height difference between the upper die blade and the lower die table is not less than the thickness of the release film.
In a preferred embodiment, after the step S5 is completed, the piercing cutter is reset; the servo punching machine manipulator places the cut FPC in the blanking area.
Drawings
The invention and its advantages will be better understood by studying the following detailed description of specific embodiments, given by way of non-limiting example, and illustrated in the accompanying drawings, in which:
fig. 1 is a flowchart of a method for integrally cutting an FPC and an LED light bar in embodiment 1 of the present invention.
Fig. 2 is a schematic view of the FPC structure of embodiment 1 of the present invention.
Fig. 3 is a schematic diagram of FPC alignment in embodiment 1 of the present invention.
Fig. 4 is a schematic view of a double-sided adhesive tape structure on the front surface of the FPC in embodiment 1 of the present invention.
Fig. 5 is a schematic view of a double-sided adhesive tape structure on the back surface of the FPC in embodiment 1 of the present invention.
Detailed Description
Referring to the drawings, wherein like reference numbers refer to like elements throughout, the principles of the present invention are illustrated in an appropriate environment. The following description is based on illustrated embodiments of the invention and should not be taken as limiting the invention with regard to other embodiments that are not detailed herein.
The word "embodiment" is used herein to mean serving as an example, instance, or illustration. In addition, the articles "a" and "an" as used in this specification and the appended claims may generally be construed to mean "one or more" unless specified otherwise or clear from context to be directed to a singular form.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Further, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise direct contact of the first and second features through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
Example 1
First, referring to fig. 1-2, a method for integrally cutting an FPC and an LED light bar in embodiment 1 of the present invention is described, which includes the following steps:
s1, FPC1 cutting pretreatment: one end of the FPC1 is pulled to the position 2 for cutting; after the step S1, the cut FPC1 area is smaller than the cut mark area 3 of the outline cutting die;
s2, fixedly connecting the LED lamp to the FPC obtained in S1 by utilizing an SMT technology, wherein one side where the light emitting surface of the LED lamp is located is the front side of the FPC, and the opposite side is the back side of the FPC;
s3, removing the protective film 52 on the side, opposite to the release film 51, of the double-sided adhesive tape 5, and respectively attaching the opposite sides of the double-sided adhesive tape 5 and the release film 51 to the front surface and the back surface of the FPC to enable the double-sided adhesive tape 5 to be combined with the FPC;
s4, placing the product obtained in the step S3 on a lower die table of an outline punching die, and fixing the product through a positioning column of the lower die table and a positioning hole of the product obtained in the step S3 to enable the LED lamp strip to be located in a position avoiding groove of the lower die table;
and S5, cutting the product obtained in the step S3 from the back surface of the FPC by using a punching knife of an outer shape punching die, wherein the punching knife comprises a plurality of blades.
As shown in fig. 4, a PE protection film 52 and a release film 51 are respectively attached to both sides of the double-sided tape 5 attached to the front surface of the FPC, and the release film 51 is provided with a first positioning hole 4.
As shown in fig. 5, a first PE protection film 52 and a release film 51 are respectively attached to two sides of the double-sided tape 5 attached to the back surface of the FPC, a second PE protection film 53 is attached to the outer side of the release film 51, and a positioning hole is formed in the second PE protection film 53. Before the step S5, the second PE protective film 53 on the back surface of the FPC is peeled off.
In step S5, the upper die blade of the punching knife moves downward and is pressed against the lower die table. After the upper die blade of the punching cutter is pressed with the lower die table, the horizontal position of the upper die blade of the punching cutter is higher than the bottom of the lower die table, and the height difference between the upper die blade and the lower die table is equal to the thickness of the release film 51.
Example 2
The method for integrally cutting the FPC and the LED light bar in embodiment 2 of the present invention will be described below with respect to the differences between embodiment 2 and embodiment 1. A step of cutting a double-sided tape 5 is provided before the step of S2, the step of cutting including: cutting an opening in the release film 51, wherein the opening is used for adhering the LED light bar by the double-sided adhesive tape; and cutting the release film 51 to make the shape of the cut release film 51 consistent with the shape of the FPC after the step S2.
Claims (9)
1. A method for integrally cutting an FPC (flexible printed circuit) and an LED (light-emitting diode) lamp strip is characterized by comprising the following steps:
s1, FPC cutting pretreatment: cutting one end of the FPC at a pull handle position;
s2, fixedly connecting the LED lamp to the FPC obtained in S1 by utilizing an SMT technology, wherein one side where the light emitting surface of the LED lamp is located is the front side of the FPC, and the opposite side is the back side of the FPC;
s3, tearing off the protective film on the side, opposite to the release film, of the double-faced adhesive tape, and respectively attaching the opposite sides of the double-faced adhesive tape and the release film to the front side and the back side of the FPC to enable the double-faced adhesive tape to be combined with the FPC;
s4, placing the product obtained in the step S3 on a lower die table of an outline punching die, and fixing the product through a positioning column of the lower die table and a positioning hole of the product obtained in the step S3 to enable the LED lamp strip to be located in a position avoiding groove of the lower die table;
and S5, cutting the product obtained in the step S3 from the back surface of the FPC by using a punching knife of an outer shape punching die, wherein the punching knife comprises a plurality of blades.
2. The method for integrally cutting the FPC and the LED light bar according to claim 1, wherein: after the step S1, the area of the cut FPC is smaller than the area of the cut trace of the outline cutting die.
3. The method for integrally cutting the FPC and the LED light bar according to claim 1, wherein: and a PE protective film and a release film are respectively stuck to two sides of the double faced adhesive tape, and a positioning hole is formed in the release film.
4. The method for integrally cutting the FPC and the LED light bar according to claim 1, wherein: a first PE protective film and a release film are respectively pasted on two sides of the double faced adhesive tape, a second PE protective film is pasted on the outer side of the release film, and positioning holes are formed in the second PE protective film.
5. The method for integrally cutting the FPC and the LED light bar according to claim 4, wherein: before the step S5, the second PE protection film attached to the outer side of the release film is torn off.
6. The method for integrally cutting the FPC and the LED light bar according to any one of claims 3 or 4, wherein: a double-sided tape cutting step is arranged before the step of S2, wherein the cutting step includes: cutting an opening in the release film, wherein the opening is used for adhering the LED light bar by the double faced adhesive tape; and cutting the release film to enable the shape of the cut release film to be consistent with the shape of the FPC after the step S2.
7. The method for integrally cutting the FPC and the LED light bar according to claim 1, wherein: in step S5, the upper die blade of the punching knife moves downward and is pressed against the lower die table.
8. The method for integrally cutting the FPC and the LED light bar according to claim 7, wherein: after the upper die blade of the punching cutter is pressed with the lower die table, the horizontal position of the upper die blade of the punching cutter is higher than the bottom of the lower die table, and the height difference between the upper die blade and the lower die table is not less than the thickness of the release film.
9. The method for integrally cutting the FPC and the LED light bar according to claim 1, wherein: after the step S5 is completed, the punching blade is reset; the servo punching machine manipulator places the cut FPC in the blanking area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911132769.8A CN110883856A (en) | 2019-11-19 | 2019-11-19 | Method for integrally cutting FPC (Flexible printed Circuit) and LED (light-emitting diode) lamp strip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911132769.8A CN110883856A (en) | 2019-11-19 | 2019-11-19 | Method for integrally cutting FPC (Flexible printed Circuit) and LED (light-emitting diode) lamp strip |
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| CN110883856A true CN110883856A (en) | 2020-03-17 |
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| CN201911132769.8A Pending CN110883856A (en) | 2019-11-19 | 2019-11-19 | Method for integrally cutting FPC (Flexible printed Circuit) and LED (light-emitting diode) lamp strip |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111800944A (en) * | 2020-06-19 | 2020-10-20 | 上达电子（深圳）股份有限公司 | Manufacturing method of anti-warping FPC |
| CN112020225A (en) * | 2020-07-29 | 2020-12-01 | 厦门爱谱生电子科技有限公司 | Method for manufacturing narrow-frame flexible circuit board |
| CN113894867A (en) * | 2021-09-30 | 2022-01-07 | 苏州市腾鑫精密材料科技有限公司 | Adhesive tape sticking method for flexible circuit board covering film |
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| JPH05206603A (en) * | 1992-01-28 | 1993-08-13 | Sumitomo Electric Ind Ltd | Flexible printed wiring board |
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| CN104456451A (en) * | 2014-12-25 | 2015-03-25 | 合肥宝龙达光电技术有限公司 | Whole pasting method for light bar and double faced adhesive tape |
| CN108319072A (en) * | 2017-12-26 | 2018-07-24 | 江西合力泰科技有限公司 | A kind of FPC board manufacturing methods and backlight module for backlight module |
| CN108811329A (en) * | 2018-05-21 | 2018-11-13 | 江西合力泰科技有限公司 | A kind of method that FPC and FPC double faced adhesive tapes are integrally cut |
| CN109483642A (en) * | 2018-09-21 | 2019-03-19 | 厦门鑫联信智能系统集成有限公司 | A kind of FPC finished product double-sided adhesive exempts to tear the clicking technique of release film |
| CN109732701A (en) * | 2018-08-29 | 2019-05-10 | 深圳市宝明科技股份有限公司 | A kind of narrow side FPC die cutting die and clicking technique |
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2019
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| JPH05206603A (en) * | 1992-01-28 | 1993-08-13 | Sumitomo Electric Ind Ltd | Flexible printed wiring board |
| CN102991082A (en) * | 2012-12-29 | 2013-03-27 | 深圳市帝显电子有限公司 | Full-automatic matrix four-side self-adhesive glue coating device and self-adhesive glue coating method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111800944A (en) * | 2020-06-19 | 2020-10-20 | 上达电子（深圳）股份有限公司 | Manufacturing method of anti-warping FPC |
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| CN112020225A (en) * | 2020-07-29 | 2020-12-01 | 厦门爱谱生电子科技有限公司 | Method for manufacturing narrow-frame flexible circuit board |
| CN113894867A (en) * | 2021-09-30 | 2022-01-07 | 苏州市腾鑫精密材料科技有限公司 | Adhesive tape sticking method for flexible circuit board covering film |
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