CN110970338A - 输送单元及同时装载平行间隔一水平距离的处理管的方法 - Google Patents

输送单元及同时装载平行间隔一水平距离的处理管的方法 Download PDF

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Publication number
CN110970338A
CN110970338A CN201910951071.2A CN201910951071A CN110970338A CN 110970338 A CN110970338 A CN 110970338A CN 201910951071 A CN201910951071 A CN 201910951071A CN 110970338 A CN110970338 A CN 110970338A
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CN
China
Prior art keywords
fork
carrier
elements
vertical guide
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910951071.2A
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English (en)
Chinese (zh)
Inventor
罗兰·瑞吉尔
拉尔夫·瑞茲
夕巴斯汀·哈柏特斯·舒茲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centrotherm International AG
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Centrotherm International AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centrotherm International AG filed Critical Centrotherm International AG
Publication of CN110970338A publication Critical patent/CN110970338A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H01J37/32779—Continuous moving of batches of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32788—Means for moving the material to be treated for extracting the material from the process chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201910951071.2A 2018-10-01 2019-10-08 输送单元及同时装载平行间隔一水平距离的处理管的方法 Pending CN110970338A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018216878.4 2018-10-01
DE102018216878.4A DE102018216878A1 (de) 2018-10-01 2018-10-01 Transporteinheit für paralleles Einfahren oder Ausfahren von Substratträgern, in parallele Prozessrohre und Verfahren zum gleichzeitigen Beladen von parallelen, horizontal beabstandeten Prozessrohren

Publications (1)

Publication Number Publication Date
CN110970338A true CN110970338A (zh) 2020-04-07

Family

ID=68172171

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910951071.2A Pending CN110970338A (zh) 2018-10-01 2019-10-08 输送单元及同时装载平行间隔一水平距离的处理管的方法

Country Status (3)

Country Link
CN (1) CN110970338A (de)
DE (1) DE102018216878A1 (de)
WO (1) WO2020069989A1 (de)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040115032A1 (en) * 2002-11-15 2004-06-17 Rainer Ostermann Apparatus for vacuum treating two dimensionally extended substrates and method for manufacturing such substrates
CN101625963A (zh) * 2008-07-07 2010-01-13 细美事有限公司 衬底处理设备以及用于为该设备转移衬底的方法
CN102171116A (zh) * 2008-08-22 2011-08-31 Otb太阳能有限公司 用于传送基板承载器的传送器组件和方法
CN102763210A (zh) * 2010-02-19 2012-10-31 周星工程股份有限公司 基板处理系统及基板传送方法
TW201308482A (zh) * 2011-05-12 2013-02-16 Roth & Rau Ag 基板加工設備中的基板傳輸模組、載入和卸載系統、以及基板傳輸方法
JP2018014427A (ja) * 2016-07-21 2018-01-25 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラム
CN107995998A (zh) * 2015-04-02 2018-05-04 商先创国际股份有限公司 晶舟以及晶圆用等离子体处理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4728246A (en) * 1986-05-16 1988-03-01 Thermco Systems, Inc. Wafer boat transfer tool
JPS63128710A (ja) * 1986-11-19 1988-06-01 Mitsubishi Electric Corp 反応炉
US5248253A (en) * 1992-01-28 1993-09-28 Digital Equipment Corporation Thermal processing furnace with improved plug flow
US6565304B2 (en) * 2001-04-24 2003-05-20 Amtech Systems, Incorporated Wafer boat elevator system and method
KR101649299B1 (ko) * 2010-05-31 2016-08-19 (주) 엔피홀딩스 선형 기판이송장치를 갖는 기판처리시스템
DE102011109444A1 (de) 2011-08-04 2013-02-07 Centrotherm Photovoltaics Ag Abstandselement für Platten eines Waferbootes
NL2016334B1 (en) * 2016-02-29 2017-09-11 Tempress Ip B V Horizontal furnace system and method for handling wafer boats, and wafer boat.

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040115032A1 (en) * 2002-11-15 2004-06-17 Rainer Ostermann Apparatus for vacuum treating two dimensionally extended substrates and method for manufacturing such substrates
CN101625963A (zh) * 2008-07-07 2010-01-13 细美事有限公司 衬底处理设备以及用于为该设备转移衬底的方法
CN102171116A (zh) * 2008-08-22 2011-08-31 Otb太阳能有限公司 用于传送基板承载器的传送器组件和方法
CN102763210A (zh) * 2010-02-19 2012-10-31 周星工程股份有限公司 基板处理系统及基板传送方法
TW201308482A (zh) * 2011-05-12 2013-02-16 Roth & Rau Ag 基板加工設備中的基板傳輸模組、載入和卸載系統、以及基板傳輸方法
CN107995998A (zh) * 2015-04-02 2018-05-04 商先创国际股份有限公司 晶舟以及晶圆用等离子体处理装置
JP2018014427A (ja) * 2016-07-21 2018-01-25 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラム

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Publication number Publication date
WO2020069989A1 (de) 2020-04-09
DE102018216878A1 (de) 2020-04-02

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