CN110957286A - Slice disconnect-type fin subassembly - Google Patents
Slice disconnect-type fin subassembly Download PDFInfo
- Publication number
- CN110957286A CN110957286A CN201911226094.3A CN201911226094A CN110957286A CN 110957286 A CN110957286 A CN 110957286A CN 201911226094 A CN201911226094 A CN 201911226094A CN 110957286 A CN110957286 A CN 110957286A
- Authority
- CN
- China
- Prior art keywords
- fin
- frame
- radiating
- radiating fin
- split
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 15
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 11
- 239000011651 chromium Substances 0.000 claims abstract description 11
- 238000005530 etching Methods 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 10
- 239000003814 drug Substances 0.000 abstract description 9
- 239000007788 liquid Substances 0.000 abstract description 9
- 239000004744 fabric Substances 0.000 abstract description 4
- 238000002791 soaking Methods 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a sheet-shaped separated radiating fin assembly which comprises a frame, wherein N rows of radiating fins in N rows are arranged on the frame at intervals in parallel, each radiating fin is connected with the frame through a connecting frame, each radiating fin is connected with the frame through a semi-etched copper material, each radiating fin is connected with each radiating fin through the semi-etched copper material, and a nickel layer, a chromium layer and a surface cloth layer are sequentially stacked on the surface of each radiating fin. The sheet-shaped separated type radiating fin component is simple in structure and convenient to operate, can solve the problems that burrs are generated in the cutting process and liquid medicine needs to be used for soaking, improves the product quality and improves the working efficiency. This slice disconnect-type fin subassembly uses the product size as the basis promptly when designing, and design single size slightly is lighter than the product size, can not touch the copper layer in follow-up cutting process, can reduce the burr problem that the friction caused and take place, avoids the procedure of liquid medicine etching, has promoted the product quality.
Description
Technical Field
The invention relates to a sheet-shaped separated heat sink assembly which can be used in the technical field of semiconductor packaging.
Background
The radiating fin is a device for radiating heat of an easily-generated electronic element in an electrical appliance, is mostly made of aluminum alloy, brass or bronze into a plate shape, and is in a sheet shape, a plurality of sheet shapes and the like, for example, a CPU (central processing unit) in a computer needs to use a relatively large radiating fin, and power tubes, a power tube and a power amplifier in a television need to use radiating fins. Generally, a layer of heat-conducting silicone grease is coated on the contact surface of an electronic component and a heat sink when the heat sink is in use, so that heat emitted by the component is more effectively conducted to the heat sink and then dissipated to the ambient air through the heat sink.
The existing radiating fin is of an integral structure and is attached to the surface of a colloid in the chip packaging process, the radiating fin is cut into corresponding sizes according to the size of a product in subsequent production, namely, the radiating fin is finally cut into the size matched with the product according to the size of the product, but in the cutting process, due to the thickness of a copper material, burrs are easily generated on the cutting edge after the radiating fin is rubbed with a cutter, the appearance and the use of the product are influenced, so that the burrs need to be etched by using chemical liquid medicine in the process, a surface coating is caused to fall off in the etching process, the appearance is influenced, the bad proportion is caused by 2%, and the process cost is increased by 5%. And a metal layer is formed on the surface of the chip, so that the heat dissipation capability of the chip is improved. This form fin is easy to produce the burr in the cutting process, needs to use liquid medicine soaking to get rid of, can produce the quality influence to fin surface coating and chip itself. Therefore, it is an urgent need to provide a heat sink assembly with a simple structure and improved product quality.
Disclosure of Invention
The present invention is directed to solving the above problems of the prior art, and provides a sheet-type split fin assembly.
The purpose of the invention is realized by the following technical scheme: the utility model provides a slice disconnect-type fin subassembly, includes the frame, parallel gap is provided with N line N row's fin, every on the frame all connect through the connecting frame between the fin, every link to each other through half etching copper product between fin and the frame, every the fin with every the fin all links to each other through half etching copper product, every the surface of fin stacks gradually and is provided with nickel layer, chromium layer and surface subsides cloth layer.
Preferably, each of the heat dissipation fins is made of copper, stainless steel or aluminum.
Preferably, the surface of each radiating fin is plated with nickel, the nickel layer is plated with chrome, and a chrome surface patch covers and connects each radiating fin.
Preferably, the back surface of each of the heat dissipation fins is provided with a roughened area for fitting with a product.
Preferably, the nickel layer and the chromium layer on the surface of each heat sink are equal in size and thickness.
Preferably, each of the fins has a uniform length, width and shape.
Preferably, the shape of the heat sink is square, rectangular or circular.
Preferably, the frame is provided with N rows and N columns of cooling fins, and the first row of cooling fins and the other rows of cooling fins are arranged in parallel at intervals.
Preferably, each of the heat dissipation fins is equally spaced from the frame.
Preferably, the value range of the frame is 187 x 50-250 x 100 mm; the thickness range of the radiating fin is 0.1-0.4 mm.
The technical scheme of the invention has the advantages that: the sheet-shaped separated type cooling fin assembly is simple in structure and convenient to operate, can solve the problems that burrs are generated in the cutting process and liquid medicine needs to be used for soaking, improves the product quality, reduces the production cost of products, improves the working efficiency, and is suitable for being popularized and used in the industry. The flaky separated radiating fin assembly is good in radiating performance, the product size is used as a basis when the flaky separated radiating fin assembly is designed, the designed single size is slightly smaller than the product size, a copper layer cannot be touched in the subsequent cutting process, the burr problem caused by friction can be reduced, the etching procedure of liquid medicine is avoided, and the product quality is improved.
Drawings
Fig. 1 is a schematic structural diagram of a split fin assembly according to the present invention.
Fig. 2 is a cross-sectional view of a split fin assembly of the present invention.
Detailed Description
Objects, advantages and features of the present invention will be illustrated and explained by the following non-limiting description of preferred embodiments. The embodiments are merely exemplary for applying the technical solutions of the present invention, and any technical solution formed by replacing or converting the equivalent thereof falls within the scope of the present invention claimed.
The invention discloses a sheet-shaped separated type heat sink assembly, as shown in fig. 1 and fig. 2, the sheet-shaped separated type heat sink assembly comprises a frame 1, wherein N rows and N columns of heat sinks 2 are arranged on the frame in a parallel clearance mode. Every the interval homogeneous phase of fin and frame equals, every the material of fin is copper product, stainless steel, aluminum product or other metal material. The metal materials such as copper materials have the advantages of good heat conductivity, quick heat dissipation and the like, the thickness range of the heat dissipation sheet is 0.1-0.4 mm, and different thicknesses can be selected according to heat dissipation and product requirements. The number of rows and the number of columns of the radiating fins can also be set in other numerical value setting modes, and in the technical scheme, the number of rows and the number of columns of the radiating fins are not specifically limited.
Every all connect 3, every through the carriage between the fin links to each other through half etching copper product 4 between fin and the frame 1, every the fin and every the fin all links to each other through half etching copper product 4, every the surface of fin stacks gradually and is provided with nickel layer 5, chromium layer 6 and surface subsides cloth layer 7. The surface of each heat radiating fin is plated with nickel, the nickel layer is plated with chrome, and a piece of chromium surface sticking cloth covers and is connected with each heat radiating fin to provide a shape capable of being clamped. The surface of each heat radiating fin is plated with nickel to form an intermediate layer, the nickel layer is plated with chromium to form a surface protection layer, scratching caused by contact friction of the heat radiating fins in the production process is reduced, and the chromium surface patch covers and is connected with each heat radiating fin.
The back of each radiating fin is provided with a coarsening area 8 used for being attached to a product, and the coarsening area can greatly improve the roughness of the raw material copper of the radiating fin. The size and the thickness of the nickel layer and the chromium layer on the surface of each radiating fin are equal. The length, width and shape of each radiating fin are consistent. The shape of the radiating fin can be square, rectangular or other shapes which need to be matched with products. The value range of the frame is 187 x 50-250 x 100mm, and the thickness is 0.1-0.4 mm.
Traditional fin is the monolithic structure, according to the size of a dimension of product, finally cut into the fin with the supporting size of product, but in the middle of the process of cutting, because of the thickness of copper product itself, with the cutter friction back easily produce the burr on the cutting edge, influence outward appearance and product use, so need use chemical liquid medicine in the process and etch the burr, cause coming off of surface coating again in the etching process, both influenced the outward appearance and caused bad proportion 2%, increase the process cost again and rise 5%. This slice disconnect-type fin subassembly structure uses the product size as the basis promptly during the design, and design single size slightly is lighter than the product size, can not touch the copper layer in follow-up cutting process, reduces the burr problem that the friction caused and takes place, and the procedure of the liquid medicine etching of avoiding has promoted product quality and reduction in production cost.
This technical scheme has solved present fin operation nature not good, and the cutting back burr is many, and the cladding material is easily dropped by the extrusion, need use chemical liquid medicine scheduling problem in the production process.
The invention has various embodiments, and all technical solutions formed by adopting equivalent transformation or equivalent transformation are within the protection scope of the invention.
Claims (10)
1. A slice disconnect-type fin subassembly which characterized in that: including frame (1), parallel gap is provided with N row N and lists fin (2), every on the frame all connect (3), every through the carriage between the fin link to each other through half etching copper product (4) between fin and frame (1), every the fin with every the fin all links to each other through half etching copper product (4), every the surface of fin stacks gradually and is provided with nickel layer (5), chromium layer (6) and surface rubberized layer (7).
2. The fin-like split fin assembly of claim 1, wherein: and each radiating fin is made of copper material, stainless steel or aluminum material.
3. The fin-like split fin assembly of claim 1, wherein: the surface of each radiating fin is plated with nickel, the nickel layer is plated with chrome, and the chromium surface patch covers and is connected with each radiating fin.
4. The fin-like split fin assembly of claim 1, wherein: the back of each radiating fin is provided with a coarsening area (8) used for being attached to a product.
5. The fin-like split fin assembly of claim 1, wherein: the size and the thickness of the nickel layer and the chromium layer on the surface of each radiating fin are equal.
6. The fin-like split fin assembly of claim 1, wherein: the length, width and shape of each radiating fin are consistent.
7. The fin-like split fin assembly of claim 1, wherein: the radiating fins are square, rectangular or circular.
8. The fin-like split fin assembly of claim 1, wherein: n rows and N columns of radiating fins are arranged on the frame, and the first row of radiating fins and the other rows of radiating fins are arranged in parallel at intervals.
9. The fin-like split fin assembly of claim 1, wherein: and the distance between each radiating fin and the frame is equal.
10. The fin-like split fin assembly of claim 1, wherein: the value range of the frame is 187 x 50-250 x 100 mm; the thickness range of the radiating fin is 0.1-0.4 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911226094.3A CN110957286A (en) | 2019-12-04 | 2019-12-04 | Slice disconnect-type fin subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911226094.3A CN110957286A (en) | 2019-12-04 | 2019-12-04 | Slice disconnect-type fin subassembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110957286A true CN110957286A (en) | 2020-04-03 |
Family
ID=69979708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911226094.3A Pending CN110957286A (en) | 2019-12-04 | 2019-12-04 | Slice disconnect-type fin subassembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110957286A (en) |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1585115A (en) * | 2003-08-22 | 2005-02-23 | 矽品精密工业股份有限公司 | Semiconductor sealer with radiating structure |
| CN1685498A (en) * | 2002-09-30 | 2005-10-19 | 先进互连技术有限公司 | Thermal enhanced package for block mold assembly |
| US20060091527A1 (en) * | 2004-10-27 | 2006-05-04 | Siliconware Precision Industries Co., Ltd. | Semiconductor package with heat sink and method for fabricating same |
| CN101009254A (en) * | 2006-01-23 | 2007-08-01 | 旭宏科技有限公司 | Heat radiator for wafer encapsulation and its making method |
| TW200737449A (en) * | 2006-03-21 | 2007-10-01 | Advanced Semiconductor Eng | Semiconductor chip package and heat slug |
| US20080122070A1 (en) * | 2006-11-24 | 2008-05-29 | Siliconware Precision Industries Co., Ltd. | Heat dissipating semiconductor package and fabrication method therefor |
| CN101207044A (en) * | 2006-12-18 | 2008-06-25 | 矽品精密工业股份有限公司 | Heat dissipation type semiconductor package part and method for making the same |
| CN101207045A (en) * | 2006-12-18 | 2008-06-25 | 矽品精密工业股份有限公司 | Heat dissipation type semiconductor package part and method for making the same |
| CN102856273A (en) * | 2012-09-06 | 2013-01-02 | 日月光半导体制造股份有限公司 | Semiconductor assembly structure with radiating fin and assembling method thereof |
| CN104377179A (en) * | 2013-08-15 | 2015-02-25 | 日月光半导体制造股份有限公司 | Semiconductor packaging piece and manufacturing method thereof |
| CN105325067A (en) * | 2013-06-19 | 2016-02-10 | 日进材料股份有限公司 | Conductive heat-dissipating sheet, and electrical parts and electronic devices comprising same |
| CN105470199A (en) * | 2015-12-09 | 2016-04-06 | 华天科技（西安）有限公司 | Separation method for package part with cooling fins |
| CN107146777A (en) * | 2017-05-27 | 2017-09-08 | 江苏长电科技股份有限公司 | One kind exempts from cutting encapsulating structure and its manufacturing process |
| CN211125626U (en) * | 2019-12-04 | 2020-07-28 | 矽品科技（苏州）有限公司 | Slice disconnect-type fin subassembly |
-
2019
- 2019-12-04 CN CN201911226094.3A patent/CN110957286A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1685498A (en) * | 2002-09-30 | 2005-10-19 | 先进互连技术有限公司 | Thermal enhanced package for block mold assembly |
| CN1585115A (en) * | 2003-08-22 | 2005-02-23 | 矽品精密工业股份有限公司 | Semiconductor sealer with radiating structure |
| US20060091527A1 (en) * | 2004-10-27 | 2006-05-04 | Siliconware Precision Industries Co., Ltd. | Semiconductor package with heat sink and method for fabricating same |
| CN101009254A (en) * | 2006-01-23 | 2007-08-01 | 旭宏科技有限公司 | Heat radiator for wafer encapsulation and its making method |
| TW200737449A (en) * | 2006-03-21 | 2007-10-01 | Advanced Semiconductor Eng | Semiconductor chip package and heat slug |
| US20080122070A1 (en) * | 2006-11-24 | 2008-05-29 | Siliconware Precision Industries Co., Ltd. | Heat dissipating semiconductor package and fabrication method therefor |
| CN101207044A (en) * | 2006-12-18 | 2008-06-25 | 矽品精密工业股份有限公司 | Heat dissipation type semiconductor package part and method for making the same |
| CN101207045A (en) * | 2006-12-18 | 2008-06-25 | 矽品精密工业股份有限公司 | Heat dissipation type semiconductor package part and method for making the same |
| CN102856273A (en) * | 2012-09-06 | 2013-01-02 | 日月光半导体制造股份有限公司 | Semiconductor assembly structure with radiating fin and assembling method thereof |
| CN105325067A (en) * | 2013-06-19 | 2016-02-10 | 日进材料股份有限公司 | Conductive heat-dissipating sheet, and electrical parts and electronic devices comprising same |
| CN104377179A (en) * | 2013-08-15 | 2015-02-25 | 日月光半导体制造股份有限公司 | Semiconductor packaging piece and manufacturing method thereof |
| CN105470199A (en) * | 2015-12-09 | 2016-04-06 | 华天科技（西安）有限公司 | Separation method for package part with cooling fins |
| CN107146777A (en) * | 2017-05-27 | 2017-09-08 | 江苏长电科技股份有限公司 | One kind exempts from cutting encapsulating structure and its manufacturing process |
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