CN110883428A - Solder composition for jetting dispenser and method for manufacturing electronic substrate - Google Patents
Solder composition for jetting dispenser and method for manufacturing electronic substrate Download PDFInfo
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- CN110883428A CN110883428A CN201910851293.7A CN201910851293A CN110883428A CN 110883428 A CN110883428 A CN 110883428A CN 201910851293 A CN201910851293 A CN 201910851293A CN 110883428 A CN110883428 A CN 110883428A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
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- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The solder composition for a jetting dispenser is a solder composition used when a solder composition is applied by using the jetting dispenser and is soldered by using a laser, the solder composition contains a flux composition and (E) solder powder, the flux composition contains (A) resin, (B) an activator, (C) a solvent and (D) a thixotropic agent, the component (A) contains (A1) rosin resin and (A2) acrylic resin, and the component (C) contains at least 1 selected from (C1) ester compounds formed by dicarboxylic acids with 6-14 carbon atoms and alcohols with 1-3 carbon atoms and (C2) glycol compounds with 2-10 carbon atoms.
Description
Technical Field
The present invention relates to a solder composition for a dispenser for jetting and a method for manufacturing an electronic substrate.
Background
In an electronic device, a solder composition (so-called solder paste) may be used in connecting an electronic component and a wiring substrate. The solder composition is a mixture obtained by kneading solder powder, rosin resin, an activator, a solvent, and the like into a paste. The solder composition is applied to a wiring substrate, and then a reflow process is performed, whereby a solder bump can be formed. Here, although a screen printing method or the like is generally used as an application method, application by various application methods is required, and in recent years, application by a jet dispenser is required. Such a jet dispenser is effective for coating a concave substrate having irregularities, a film substrate which is difficult to print, or the like.
However, when it is intended to apply a solder composition for screen printing using a spray dispenser, for example, there is a problem that the viscosity is too high and the thixotropy is too low, so that the solder composition cannot be applied properly.
In order to solve such a problem, for example, a solder composition for a jetting dispenser containing a flux containing a rosin-based resin, an activator, and a specific solvent and a solder powder is proposed. The solder composition contains (C1) hexanediol as a specific solvent, and at least 1 selected from (C2) ester compounds of a dicarboxylic acid having 8 to 12 carbon atoms and an alcohol having 4 to 12 carbon atoms and (C3) alcohols derived from steamed turpentine (see Japanese patent laid-open No. 2015-047616).
The solder composition for a dispenser disclosed in document 1 has sufficient coatability when coated by a dispenser, and can suppress solder scattering and flux separation.
However, the jet dispenser is used for coating a concave substrate having a concavity and a convexity, a film substrate which is difficult to print, and the like, and in such a case, the reflow process is often not performed. Therefore, laser welding is sometimes performed instead of the reflow soldering process. In addition, in the case of laser welding, defects such as chip component movement after welding, warpage, so-called chip warpage, and scattering of flux are likely to occur.
In this case, flux cleaning is not performed after the laser welding. Therefore, the solder composition must be of a no-clean type. Further, when a no-clean type solder composition is used, flux residue remains on the electronic substrate, and therefore insulation reliability is also required for the flux residue.
Disclosure of Invention
Accordingly, an object of the present invention is to provide a solder composition for laser welding which has sufficient coatability when applied by a spray dispenser, can suppress the occurrence of chip warpage and flux scattering, and does not require flux cleaning, and a method for manufacturing an electronic substrate using the same.
In order to solve the above problems, the present invention provides the following solder composition for a dispenser for jetting and a method for manufacturing an electronic substrate.
Specifically, the solder composition for a jetting dispenser of the present invention is a solder composition for use in applying a solder composition using a jetting dispenser and soldering using a laser, the solder composition comprising a flux composition and (E) a solder powder, the flux composition comprising (A) a resin, (B) an activator, (C) a solvent, and (D) a thixotropic agent, (A) component comprising (A1) a rosin resin and (A2) an acrylic resin, and (C) component comprising at least 1 selected from (C1) an ester compound of a dicarboxylic acid having 6 to 14 carbon atoms and an alcohol having 1 to 3 carbon atoms, and (C2) a glycol compound having 2 to 10 carbon atoms.
In the solder composition for a dispenser for spray according to the present invention, it is preferable that the component (C) contains a solvent other than the component (C1) and the component (C2), and the amount of the solvent is 20 mass% or more and 60 mass% or less based on 100 mass% of the component (C).
In the solder composition for a jetting dispenser according to the present invention, the amount of the component (a1) is preferably 50 mass% or more and 90 mass% or less with respect to 100 mass% of the total amount of the component (a1) and the component (a 2).
In the solder composition for a jetting dispenser according to the present invention, the component (B) preferably contains a carboxylic acid having an amino group and an aromatic ring.
In the solder composition for a jetting dispenser according to the present invention, the component (C1) is preferably at least 1 selected from diisopropyl sebacate, dimethyl sebacate, and diethyl sebacate, and the component (C2) is preferably at least 1 selected from 1, 2-pentanediol, 1, 5-pentanediol, 3-methyl-1, 3-butanediol, 1, 2-hexanediol, 1, 6-hexanediol, 1, 7-heptanediol, 2-ethyl-1, 3-hexanediol, 1, 2-octanediol, and 1, 8-octanediol.
The method for manufacturing an electronic substrate of the present invention uses the solder composition for a dispenser for jetting, and includes: a coating step of coating the solder composition on an electrode of a wiring board using a jetting dispenser; a mounting step of mounting an electronic component on the solder composition; and a soldering step of heating the solder composition with a laser to solder-bond the electrode and the electronic component.
In the method for manufacturing an electronic substrate according to the present invention, the output power of the laser beam is 100W or more.
According to the present invention, a solder composition for laser welding which has sufficient coatability when coated by a spray dispenser, can suppress the occurrence of chip warpage and flux scattering, and does not require flux cleaning, and a method for manufacturing an electronic substrate using the same can be provided.
Drawings
Fig. 1 is a schematic diagram showing a jetting dispenser.
Detailed Description
[ solder composition for jetting dispenser ]
First, the solder composition for a dispenser for ejection according to the present embodiment will be described.
The solder composition for a jetting dispenser of the present embodiment contains the flux composition described below and (E) solder powder described below.
[ flux composition ]
The flux composition used in the present embodiment is a component other than the component (E) in the solder composition, and contains a resin (a), an activator (B), a solvent (C), and a thixotropic agent (D).
The amount of the flux composition is preferably 10 mass% or more and 25 mass% or less, more preferably 12 mass% or more and 20 mass% or less, and particularly preferably 12 mass% or more and 18 mass% or less, based on 100 mass% of the solder composition. When the amount of the flux is less than 10 mass% (when the amount of the solder powder is more than 90 mass%), the coating property of the dispenser tends to be insufficient, while when the amount of the flux is more than 25 mass% (when the amount of the solder powder is less than 75 mass%), it tends to be difficult to form a sufficient solder joint when the obtained solder composition is used.
[ (A) component ]
The resin (a) used in the present embodiment contains a rosin-based resin (a1) and an acrylic resin (a 2). By using the component (a1) and the component (a2) in combination in this manner, it is possible to suppress the occurrence of cracks and the like in the flux residue remaining on the electronic substrate. Moreover, moisture and the like can be suppressed from entering the flux residue, and therefore, the insulation reliability of the flux residue can be improved.
Examples of the rosin-based resin (a1) used in the present embodiment include rosins and rosin-modified resins, examples of the rosins include gum rosin, wood rosin, and tall oil rosin, examples of the rosin-modified resin include disproportionated rosin, polymerized rosin, hydrogenated rosin, and derivatives thereof, examples of the hydrogenated rosin include fully hydrogenated rosin, partially hydrogenated rosin, and hydrogenated products of unsaturated organic acid-modified rosins (also referred to as "hydrogenated acid-modified rosins") of modified rosins of unsaturated organic acids such as unsaturated aliphatic monocarboxylic acids such as (meth) acrylic acid, unsaturated aliphatic dibasic acids such as α -unsaturated carboxylic acids such as fumaric acid and maleic acid, and unsaturated carboxylic acids having an aromatic ring such as cinnamic acid).
The acrylic resin (a2) used in the present embodiment is obtained, for example, by homopolymerizing a (meth) acrylate having an alkyl group having 1 to 20 carbon atoms or copolymerizing a monomer containing the (meth) acrylate as a main component. Among such acrylic resins, acrylic resins obtained by polymerizing methacrylic acid with monomers containing a saturated alkyl group having 2 carbon chains of 2 to 20 carbon atoms in a straight chain are particularly preferably used. These acrylic resins may be used alone in 1 kind, or may be used in combination with 2 or more kinds.
In the present embodiment, the blending ratio of the component (a1) and the component (a2) is not particularly limited. (A1) The amount of the component (a) is preferably 50 to 95 mass%, more preferably 55 to 90 mass%, and particularly preferably 60 to 85 mass%, based on 100 mass% of the total amount of the component (a1) and the component (a 2). (A1) When the amount of the component is not less than the lower limit, weldability in the atmosphere can be further improved. When the amount of the component (a1) is not more than the upper limit, the insulation reliability of the flux residue can be further improved.
The component (a) may contain a resin other than the component (a1) and the component (a2) (component (A3)) within a range not to impair the object of the present invention. When the component (a3) is used, the amount thereof is preferably 30% by mass or less, more preferably 20% by mass or less, and particularly preferably 10% by mass or less, based on 100% by mass of the component (a).
Examples of the component (a3) include styrene-maleic acid resins, epoxy resins, urethane resins, polyester resins, phenoxy resins, terpene resins, and polyalkylene carbonate resins. These components can be used alone in 1 kind, also can be mixed with more than 2 kinds of use.
The amount of the component (a) is preferably 25% by mass or more and 60% by mass or less, more preferably 27% by mass or more and 55% by mass or less, and particularly preferably 30% by mass or more and 52% by mass or less, based on 100% by mass of the flux composition. (A) When the amount of the component is not less than the lower limit, solderability, which is a property of preventing oxidation of the copper foil surface of the solder pad and making the surface of the solder easily wet with molten solder, can be improved and solder balls can be sufficiently suppressed. When the amount of component (a) is not more than the upper limit, the residual flux amount can be sufficiently suppressed.
[ (B) component ]
Examples of the activator (B) used in the present embodiment include: organic acids, non-dissociative activators including non-dissociative halogenated compounds, amine activators, and the like. These activators may be used alone or in combination of 2 or more.
Examples of the organic acid include: monocarboxylic acids, dicarboxylic acids, and the like, as well as other organic acids.
As monocarboxylic acids, there may be mentioned: formic acid, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, enanthic acid, capric acid, lauric acid, myristic acid, pentadecanoic acid, palmitic acid, heptadecanoic acid, stearic acid, methylstearic acid, eicosanoic acid, behenic acid, lignoceric acid, glycolic acid, and the like.
Examples of dicarboxylic acids include: oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, fumaric acid, maleic acid, tartaric acid, diglycolic acid, and the like.
As other organic acids, there may be mentioned: dimer acid, levulinic acid, lactic acid, acrylic acid, benzoic acid, salicylic acid, anisic acid, citric acid, picolinic acid, and the like. In addition, the other organic acid may be a carboxylic acid having an amino group and an aromatic ring.
In the present embodiment, component (B) preferably contains a carboxylic acid having an amino group and an aromatic ring, from the viewpoint of more reliably preventing warpage of the chip. From the same viewpoint, it is preferable to use a carboxylic acid having an amino group and an aromatic ring and a dicarboxylic acid in combination as the component (B).
In the carboxylic acid having an amino group and an aromatic ring, examples of the aromatic ring include a benzene ring and a naphthalene ring.
Examples of the carboxylic acid having an amino group and an aromatic ring include 2-aminobenzoic acid (anthranilic acid), 2-amino-4-methylbenzoic acid, 3-aminobenzoic acid, and 4-aminobenzoic acid.
Examples of the non-dissociative activator containing a non-dissociative halogenated compound include non-salt organic compounds in which halogen atoms are covalently bonded. The halogenated compound may be a compound formed by covalent bonds of chlorine, bromine, and fluorine elements alone, such as chloride, bromide, and fluoride, or a compound having covalent bonds of any 2 or all of chlorine, bromine, and fluorine. In order to improve the solubility in an aqueous solvent, these compounds preferably have a polar group such as a hydroxyl group or a carboxyl group, for example, as in a halogenated alcohol or a halogenated carboxylic acid. Examples of the halogenated alcohol include: bromoalcohols such as 2, 3-dibromopropanol, 2, 3-dibromobutanediol, trans-2, 3-dibromo-2-butene-1, 4-diol (TDBD), 1, 4-dibromo-2-butanol, tribromoneopentyl alcohol, etc.; chlorohydrins such as 1, 3-dichloro-2-propanol and 1, 4-dichloro-2-butanol; fluoroalcohols such as 3-fluorocatechol; other compounds similar to these compounds.
Examples of the halogenated carboxylic acid include: iodocarboxylic acids such as 2-iodobenzoic acid, 3-iodobenzoic acid, 2-iodopropionic acid, 5-iodosalicylic acid, and 5-iodoanthranilic acid; chloro carboxylic acids such as 2-chlorobenzoic acid and 3-chloropropionic acid; bromo-carboxylic acids such as 2, 3-dibromopropionic acid, 2, 3-dibromosuccinic acid, and 2-bromobenzoic acid; other compounds similar to these compounds.
As the amine activator, there may be mentioned: amines (such as polyamines including ethylenediamine), amine salts (such as amines including trimethylolamine, cyclohexylamine, and diethylamine, and organic acid salts and inorganic acid salts (such as hydrochloric acid, sulfuric acid, and hydrobromic acid) of amino alcohols), amino acids (such as glycine, alanine, aspartic acid, glutamic acid, and valine), and amide compounds. Specific examples thereof include: diphenylguanidine hydrobromide, cyclohexylamine hydrobromide, diethylamine salts (hydrochloride, succinate, adipate, sebacate, etc.), triethanolamine, monoethanolamine, and hydrobromide salts of these amines, and the like.
The amount of component (B) is preferably 1 mass% or more and 15 mass% or less, and more preferably 0.5 mass% or more and 10 mass% or less, based on 100 mass% of the flux composition. (B) When the amount of the component is not less than the lower limit, the solder ball can be more reliably suppressed. When the amount of component (B) is not more than the upper limit, the insulating property of the flux composition can be ensured.
[ (C) ingredient ]
The solvent (C) used in the present embodiment contains at least 1 selected from the components (C1) and (C2) described below.
(C1) The component is an ester compound of a dicarboxylic acid having 6 to 14 carbon atoms and an alcohol having 1 to 3 carbon atoms.
Among the ester compounds, ester compounds of a dicarboxylic acid having 8 to 12 carbon atoms and an alcohol having 1 to 3 carbon atoms are more preferable, ester compounds of a dicarboxylic acid having 10 carbon atoms and an alcohol having 2 to 3 carbon atoms are further more preferable, and ester compounds of a dicarboxylic acid having 10 carbon atoms and an alcohol having 3 carbon atoms are particularly preferable. Specific examples thereof include diisopropyl sebacate, dimethyl sebacate, and diethyl sebacate.
(C2) The component is a diol compound having 2 to 10 carbon atoms.
Among the diol compounds, a diol compound having 4 to 10 carbon atoms is more preferable, a diol compound having 6 to 8 carbon atoms is further preferable, a diol compound having 7 to 8 carbon atoms is further more preferable, and a diol compound having 8 carbon atoms is particularly preferable. Specific examples thereof include pentanediol (e.g., 1, 2-pentanediol, 1, 5-pentanediol, and 3-methyl-1, 3-butanediol), hexanediol (e.g., 1, 2-hexanediol, and 1, 6-hexanediol), heptanediol (e.g., 1, 7-heptanediol), and octanediol (e.g., 2-ethyl-1, 3-hexanediol, 1, 2-octanediol, and 1, 8-octanediol).
The component (C) may contain a solvent ((C3) component) other than the component (C1) and the component (C2) within a range not to impair the object of the present invention. When the component (C3) is used, the amount thereof is preferably 60% by mass or less, more preferably 50% by mass or less, still more preferably 30% by mass or less, and particularly preferably 10% by mass or less, based on 100% by mass of the component (C). (C3) When the amount of the component is not more than the upper limit, the warpage of the chip and the scattering of the flux can be more reliably suppressed. The amount of the component (C3) is not limited to the lower limit, but is preferably 20 mass% or more, for example.
Examples of the component (C3) include diethylene glycol, dipropylene glycol, triethylene glycol, hexanediol, methyl carbitol, butyl carbitol, phenyl glycol, diethylene glycol mono-2-ethylhexyl ether, and diethylene glycol mono-hexyl ether. Among these components, diethylene glycol monohexyl ether is more preferable from the viewpoint of coatability with a spray dispenser. These components can be used alone in 1 kind, also can be mixed with more than 2 kinds of use.
(C) The amount of the component is preferably 30 mass% or more and 65 mass% or less, and more preferably 40 mass% or more and 60 mass% or less, with respect to 100 mass% of the flux composition. (C) When the amount of the component is not less than the lower limit, the viscosity and thixotropy of the solder composition can be easily adjusted to appropriate ranges. On the other hand, when the blending amount of the component (C) is not more than the upper limit, the solvent is less likely to remain in the flux residue remaining when the solder composition is melted. Furthermore, the flux residue contains tackiness, and thus, it is possible to prevent a problem that electric leakage occurs due to adhesion of dust and dirt floating in the air.
[ (D) component ]
Examples of the thixotropic agent (D) used in the present embodiment include hydrogenated castor oil, amides, kaolin, colloidal silica, organobentonite, and glass frit. These thixotropic agents may be used alone in 1 kind, or may be used in combination of 2 or more kinds.
(D) The amount of the component (c) is preferably 0.1 to 7 mass%, more preferably 0.5 to 5 mass%, based on 100 mass% of the flux composition. When the amount of the thixotropic agent is not less than the lower limit, sufficient thixotropy can be obtained and dripping can be sufficiently suppressed. When the amount of the thixotropic agent is not more than the upper limit, excessive thixotropy and coating failure do not occur.
[ other ingredients ]
In the flux composition used in the present embodiment, other additives may be added as necessary in addition to the component (a), the component (B), the component (C), and the component (D). Examples of the other additives include an antioxidant, a defoaming agent, a modifier, a matting agent, and a foaming agent.
[ (E) ingredient ]
The solder powder (E) used in the present embodiment is preferably composed of only a lead-free solder powder, but may be a lead-containing solder powder. As the solder alloy in the solder powder, an alloy containing tin as a main component is preferable. Further, as the second element of the alloy, there can be mentioned: silver, copper, zinc, bismuth, antimony, and the like. Further, other elements (third and above elements) may be added to the alloy as necessary. As other elements, there may be mentioned: copper, silver, bismuth, antimony, aluminum, indium, and the like.
Specific examples of the lead-free solder powder include: Sn/Ag, Sn/Ag/Cu, Sn/Ag/Bi, Sn/Ag/Cu/Bi, Sn/Sb, Sn/Zn/Bi, Sn/Zn/Al, Sn/Ag/Bi/In, Sn/Ag/Cu/Bi/In/Sb, In/Ag, and the like.
The average particle diameter of the solder powder is preferably 1 μm or more and 40 μm or less, more preferably 10 μm or more and 35 μm or less, and particularly preferably 15 μm or more and 25 μm or less. When the average particle diameter is within the above range, it is possible to cope with the recent printed wiring board in which the pitch of the bonding pads is gradually narrowed. The average particle diameter can be measured by a dynamic light scattering particle diameter measuring apparatus.
[ method for producing solder composition ]
The solder composition for a jetting dispenser of the present invention can be produced by mixing the above-described flux composition with the above-described (E) solder powder in the above-described given ratio and stirring and mixing.
[ method for producing electronic substrate ]
Next, a method for manufacturing an electronic substrate according to the present embodiment will be described.
The method for manufacturing an electronic substrate according to the present embodiment is a method for manufacturing an electronic substrate using the solder composition for a dispenser, and includes a coating step, a mounting step, and a soldering step, which are described below.
In the coating step, the solder composition is coated on the electrodes of the wiring substrate using a spray dispenser.
The wiring substrate may be a rigid substrate or a flexible substrate. The base material of the wiring board is not particularly limited, and a known base material can be suitably used.
Examples of the metal of the wiring include copper, silver, and gold. The wiring may be formed by vapor deposition, plating, or the like.
The coating device used here is a spray dispenser 1 as shown in fig. 1. The jetting dispenser 1 has a cartridge 11, a nozzle 12, a needle 13, and a valve 14. In the case of discharging the solder composition by the jetting dispenser 1, the solder composition is first supplied from the pouring cylinder 11 and filled into the nozzle 12. Then, the needle 13 is pressed downward in fig. 1 by the valve 14, and the solder composition in the nozzle 12 is discharged.
The solder composition for a dispenser for jetting according to the present embodiment is excellent in coatability, and can be coated well with such a dispenser for jetting.
In the mounting step, an electronic component is mounted on the solder composition.
Examples of the electronic component include a chip and a package.
As the mounting device, a known mounting device can be used.
In the soldering step, the solder composition is heated by a laser beam to solder-bond the electrode and the electronic component.
The type of the laser light source of the laser used for welding is not particularly limited, and may be appropriately used according to the wavelength corresponding to the metal absorption band. Examples of the laser light source include: solid laser (ruby, glass, YAG, etc.), semiconductor laser (GaAs, InGaAsP, organic matter, etc.), liquid laser (dye, etc.), and gas laser (He-Ne, Ar, CO)2Quasi-molecule, etc.).
The laser irradiation conditions are not particularly limited. E.g. spot diameter
Preferably 0.1mm to 2 mm. The irradiation time is preferably 0.1 seconds to 5 seconds.
The output power of the laser is not particularly limited. The output power of the laser is preferably 100W or more, and more preferably 150W or more. In the present embodiment, since the solder composition for a dispenser for jetting described above is used, even when the output power of the laser is not less than the lower limit, the occurrence of chip warpage and flux scattering can be sufficiently suppressed.
In the present embodiment, the wiring board on which the electronic component is mounted is directly coated without cleaning the flux residue. In the present embodiment, the solder composition for a jetting dispenser of the present embodiment is used, and therefore, generation of cracks and the like in the flux residue can be suppressed. In addition, moisture or the like enters the flux residue to cause cracks, and thus the insulation of the flux residue may be lowered. In contrast, in the present embodiment, since moisture or the like can be suppressed from entering the flux residue, the insulation reliability of the flux residue can be improved.
The solder composition for a dispenser for spray and the method for manufacturing an electronic substrate according to the present invention are not limited to the above-described embodiments, and modifications, improvements, and the like within a range in which the object of the present invention can be achieved are included in the present invention.
Examples
The present invention will be described in more detail with reference to examples and comparative examples, but the present invention is not limited to these examples. Materials used in examples and comparative examples are shown below.
((A1) component)
Rosin resin: hydrogenated acid-modified rosin (softening point: 130 ℃ C.), trade name "KE-604", manufactured by Mitsuwa chemical industries, Ltd
((A2) component)
Acrylic resin: the acrylic resin obtained in Synthesis example 1
(component (B))
An organic acid A: succinic acid
Organic acid B: glutaric acid
An organic acid C: 2-Aminobenzoic acid (anthranilic acid)
((C1) component)
Solvent A: diisopropyl sebacate, manufactured by Fengguo oil Co., Ltd
Solvent B: diethyl sebacate, manufactured by Fengkou oil Co., Ltd
((C2) component)
Solvent C: octanediol (2-ethyl-1, 3-hexanediol), product of Kyowa fermentation chemical Co., Ltd
And (3) solvent D: 1, 7-Heptadiol, manufactured by Tokyo chemical industries, Ltd
((C3) component)
Solvent E: diethylene glycol monohexyl ether (DEH), manufactured by Nippon emulsifier Co., Ltd
α, Gamma-Terpineol, trade name "Terphineol C", solvent G, made by Nippon terpene Chemicals, diethylene glycol Mono 2-ethylhexyl Ether (EHDG), and Nippon emulsifier Co., Ltd
Solvent H: dibutyl maleate, manufactured by Daba chemical industries, Ltd
Solvent I: sebacic acid bis (2-ethylhexyl) ester
(component (D))
Thixotropic agent A: trade name "SLPACKS ZHH", manufactured by Nippon Kabushiki Kaisha
Thixotropic agent B: hydrogenated Castor oil, product name "HIMAKO", manufactured by KF tracing Co., Ltd
((E) component)
Solder powder: the average grain diameter is 18 mu m, the melting point of the solder is 216-220 ℃, and the solder composition is 96.5Sn/3.0Ag/0.5Cu
(other Components)
Antioxidant: trade name "IRGANOX 245", manufactured by BASF corporation
[ Synthesis example 1]
In a 500mL 4-necked flask equipped with a stirrer, a reflux tube and a nitrogen introduction tube, 200g of diethylene glycol monohexyl ether was charged and heated to 110 ℃.
Further, 0.2 mass% of dimethyl 2, 2' -azobis (2-methylpropionate) (product name: V-601, manufactured by Wako pure chemical industries, Ltd.) as an azo radical initiator was added to 300g of a mixture of 10 mass% of methacrylic acid, 51 mass% of 2-ethylhexyl methacrylate, and 39 mass% of dodecyl acrylate, and the mixture was dissolved to prepare a solution.
Subsequently, this solution was added dropwise to the above 4-necked flask over 1.5 hours, and the obtained substance was stirred at 110 ℃ for 1 hour to complete the reaction, thereby obtaining an acrylic resin. The acrylic resin had a weight average molecular weight (Mw) of 7800, an acid value of 40mgKOH/g and a glass transition temperature of-47 ℃.
[ example 1]
26 mass% of a rosin-based resin, 10 mass% of an acrylic resin, organic acid a1 mass%, organic acid B3 mass%, organic acid C1 mass%, solvent a40 mass%, solvent C14 mass%, thixotropic agent A3 mass%, thixotropic agent B1 mass%, and antioxidant 1 mass% were charged into a container, and mixed using a mill mixer to obtain a flux composition.
The obtained flux composition 12.5 mass% and solder powder 87.5 mass% (total 100 mass%) were put into a container and mixed by a kneader to prepare a solder composition having a composition shown in table 1 below.
[ examples 2 to 7]
Solder compositions were obtained in the same manner as in example 1, except that the respective materials were blended in the compositions shown in table 1 below.
[ comparative examples 1 to 5]
Solder compositions were obtained in the same manner as in example 1, except that the respective materials were blended in the compositions shown in table 1 below.
< evaluation of solder composition >
Evaluation of the solder composition (chip warpage, coating accuracy, voids, solder flying test, appearance of the flux residue after insulation reliability test) was performed by the following method. The obtained results are shown in table 1.
(1) Chip warpage
A glass epoxy substrate and chip parts (size: 0.6 mm. times.0.3 mm) were prepared. On an electrode surrounded by a solder resist corresponding to a chip component of the glass epoxy substrate, a solder composition was applied by using a dispenser for jetting, and the chip component was mounted. Then, laser welding was performed under the following 2 laser irradiation conditions, to obtain test substrates.
(i) Laser irradiation conditions 1
Laser wavelength: 808nm
The diameter of the light spot: phi 1.6mm
Irradiation time: 0.5 second
Output power: 10W
(ii) Laser irradiation Condition 2
Laser wavelength: 940nm
The diameter of the light spot: phi 1.6mm
Irradiation time: 0.5 second
Output power: 185W
The obtained test substrate was visually observed, and the chip warpage was evaluated according to the following criteria.
A: the incidence of chip warpage is 1% or less.
B: the incidence of chip warpage is more than 1% and less than 3%.
C: the incidence of chip warpage is more than 3% and less than 5%.
D: the incidence of chip warpage is greater than 5%.
(2) Coating accuracy
Using a cylinder with a diameter
The nozzle dispenser of (1) was designed to discharge 100 dots (25 dots. times.4 rows) at equal intervals on a substrate (size: 50 mm. times.50 mm, thickness: 0.5mm) within a range of 50 mm. times.15 mm at a distance of 2mm from the nozzle tip to the substrate and a coating time per 1 dot of 0.09 seconds, thereby obtaining a test substrate.
The obtained test substrate was visually observed, and coating accuracy was evaluated according to the following criteria.
B: the linearity of the discharge was good.
D: the linearity of the discharge was disturbed.
(3) Voids
A glass epoxy substrate and chip components (size: 0.6 mm. times.0.3 mm) were prepared. A solder composition was applied to an electrode surrounded by a solder resist corresponding to a chip component of the glass epoxy substrate by using a dispenser for spraying, and the chip component was mounted thereon. Then, laser welding was performed (wavelength: 940nm, spot diameter: Φ 1.6mm, irradiation time: 0.5 second output: 185W) to obtain a test substrate. The surface state of the test substrate was observed with an X-ray transmission device (product name: SMX-160E, manufactured by Shimadzu corporation), and the ratio of the total area of the voids to the area where the solder joint was formed (area ratio of the voids) was measured. In addition, the maximum value of the area ratio of the void in the pad at 20 of each test substrate was obtained with respect to the occurrence of the void. Then, voids were evaluated according to the following criteria.
B: the maximum value of the area ratio of the voids is 15% or less.
C: the maximum value of the area ratio of the voids is more than 15% and not more than 20%.
D: the maximum value of the area ratio of the voids is more than 20%.
(4) Solder splash
In order to examine the scattering state of flux caused by laser irradiation of the solder composition, the flux was observed at a rate of 25cm2Scattering of flux (pieces/25 cm)2). Then, the scattering of the flux was evaluated according to the following criteria.
A: the amount of scattered flux was 0 particles/25 cm2。
B: the amount of scattered flux was 1 piece/25 cm2Above 10 pieces/25 cm2The following.
C: the amount of scattered flux was 11 particles/25 cm2Above 25/25 cm2The following.
D: the flying of the flux is more than 25 pieces/25 cm2。
(5) Appearance of flux residue after insulation reliability test
A glass epoxy substrate and chip components (size: 0.6 mm. times.0.3 mm) were prepared. A solder composition was applied to an electrode surrounded by a solder resist corresponding to a chip component of the glass epoxy substrate by using a dispenser for spraying, and the chip component was mounted thereon. Then, laser welding was performed (wavelength: 940nm, spot diameter: Φ 1.6mm, irradiation time: 0.5 second, output: 185W) to obtain a test substrate. The insulation reliability test was performed on the test substrate for 1000 hours under conditions of a temperature of 85 ℃ and a relative humidity of 85%, and the flux residue in the test substrate after the insulation reliability test was observed with a magnifying glass. Then, the appearance of the flux residue after the insulation reliability test was evaluated according to the following criteria.
B: the flux residue is free of cracks.
D: the flux residue had cracks.
From the results shown in table 1, it was confirmed that when the solder composition of the present invention was used (examples 1 to 7), the solder composition had sufficient coatability when applied by a spray dispenser, and the occurrence of chip warpage and flux scattering was suppressed. In addition, it was confirmed that, even when the solder composition of the present invention was used, the flux residue after the insulation reliability test was free from cracks and the insulation reliability was high, and therefore, flux cleaning was not necessary.
Claims (13)
1. A solder composition for a jetting dispenser, which is used when the solder composition is applied by the jetting dispenser and soldering is performed by laser,
the solder composition comprises a solder composition and (E) solder powder, wherein the solder composition comprises (A) a resin, (B) an activator, (C) a solvent and (D) a thixotropic agent,
the component (A) contains (A1) a rosin resin and (A2) an acrylic resin,
the component (C) contains at least 1 selected from (C1) an ester compound formed by dicarboxylic acid with 6-14 carbon atoms and alcohol with 1-3 carbon atoms, and (C2) diol compound with 2-10 carbon atoms.
2. The solder composition for jetting dispensers according to claim 1, wherein,
the component (A2) is an acrylic resin obtained by polymerizing methacrylic acid and monomers containing a monomer having a 2-20 carbon-chain saturated alkyl group.
3. The solder composition for jetting dispensers according to claim 1, wherein,
the component (C1) is an ester compound of a dicarboxylic acid having 8 to 12 carbon atoms and an alcohol having 1 to 3 carbon atoms,
the component (C2) is a diol compound having 4-10 carbon atoms.
4. The solder composition for jetting dispensers according to claim 1, wherein,
the component (C1) is an ester compound of a dicarboxylic acid having 8 to 12 carbon atoms and an alcohol having 1 to 3 carbon atoms,
the component (C2) is a diol compound having 6 to 8 carbon atoms.
5. The solder composition for jetting dispensers according to claim 1, wherein,
the component (C1) is an ester compound of a dicarboxylic acid having 10 carbon atoms and an alcohol having 3 carbon atoms,
the component (C2) is a diol compound having 8 carbon atoms.
6. The solder composition for jetting dispensers according to claim 1, wherein,
the component (C) contains a solvent other than the component (C1) and the component (C2),
the amount of the other solvent is 20 to 60 mass% based on 100 mass% of the component (C).
7. The solder composition for jetting dispensers according to claim 1, wherein,
the amount of the component (a1) is 50 to 90 mass% based on 100 mass% of the total amount of the component (a1) and the component (a 2).
8. The solder composition for jetting dispenser according to any one of claims 1 to 3, wherein,
the component (B) contains a carboxylic acid having an amino group and an aromatic ring.
9. The solder composition for jetting dispenser according to any one of claims 1 to 7, wherein,
the component (B) contains a carboxylic acid having an amino group and an aromatic ring, and a dicarboxylic acid.
10. The solder composition for jetting dispenser according to any one of claims 1 to 7, wherein,
the amount of the component (A) is 25 to 60 mass% based on 100 mass% of the flux composition,
the amount of the component (B) is 0.1 to 15 mass% based on 100 mass% of the flux composition,
the amount of the component (C) is 30 to 65 mass% based on 100 mass% of the flux composition.
11. The solder composition for jetting dispenser according to any one of claims 1 to 7, wherein,
the component (C1) is at least 1 selected from diisopropyl sebacate, dimethyl sebacate and diethyl sebacate,
the component (C2) is at least 1 selected from the group consisting of 1, 2-pentanediol, 1, 5-pentanediol, 3-methyl-1, 3-butanediol, 1, 2-hexanediol, 1, 6-hexanediol, 1, 7-heptanediol, 2-ethyl-1, 3-hexanediol, 1, 2-octanediol, and 1, 8-octanediol.
12. A method for manufacturing an electronic substrate using the solder composition for a jetting dispenser according to any one of claims 1 to 11, comprising:
a coating step of coating the solder composition on an electrode of a wiring substrate using a jetting dispenser;
a mounting step of mounting an electronic component on the solder composition; and
and a soldering step of heating the solder composition with a laser to solder-bond the electrode and the electronic component.
13. The method of manufacturing an electronic substrate according to claim 12,
the output power of the laser is 100W or more.
Applications Claiming Priority (4)
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| JP2018-168993 | 2018-09-10 | ||
| JP2018168993 | 2018-09-10 | ||
| JP2019147420A JP6864046B2 (en) | 2018-09-10 | 2019-08-09 | Method for manufacturing solder composition for jet dispenser and electronic board |
| JP2019-147420 | 2019-08-09 |
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| CN110883428A true CN110883428A (en) | 2020-03-17 |
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